ultra low-power high performance three-axis “nano” accelerometer
Preliminary data
Features
■ Wide supply voltage, 1.71 V to 3.6 V
■ Independent IOs supply (1.8 V) and supply
voltage compatible
■ Ultra low-power consumption
■ ±2g/±4g/±6g/±8g/±16g dynamically selectable
full-scale
2
■ I
C/SPI digital output interface
■ 16-bit data output
■ Programmable embedded state machines
■ Embedded temperature sensor
■ Embedded self-test
■ Embedded FIFO
■ 10000 g high shock survivability
■ ECOPACK
®
RoHS and “Green” compliant
of measuring accelerations with output data rates
from 3.125 Hz to 1.6 kHz.
The self-test capability allows the user to check
the functioning of the sensor in the final
application.
The device can be configured to generate
interrupt signals activated by user defined motion
patterns.
The LIS3DSH has an integrated first in, first out
(FIFO) buffer allowing the user to store data for
host processor intervention reduction.
LGA-16
(3x3x1 mm)
Applications
■ Motion controlled user interface
■ Gaming and virtual reality
■ Pedometer
■ Intelligent power saving for handheld devices
■ Display orientation
■ Click/double click recognition
■ Impact recognition and logging
■ Vibration monitoring and compensation
Description
The LIS3DSH is an ultra low-power high
performance three-axis linear accelerometer
belonging to the “nano” family with embedded
state machine that can be programmed to
implement autonomous applications.
The LIS3DSH has dynamically selectable full
scales of ±2g/±4g/±6g/±8g/±16g and it is capable
The LIS3DSH is available in a small thin plastic
land grid array package (LGA) and it is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Table 1.Device summary
Order
codes
LIS3DSH-40 to +85LGA-16Tray
LIS3DSHTR-40 to +85LGA-16
Temperature
range [° C]
Package Packaging
Tape and
reel
October 2011Doc ID 022405 Rev 11/53
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
2. Verified by wafer level test and measurement of initial offset and sensitivity.
3. Typical zero-g level offset value after MSL3 preconditioning.
4. Self-test output change” is defined as: OUTPUT[mg]
Sensitivity change vs.
temperature
Typical zerooffset accuracy
g level change
Zerovs. temperature
Acceleration noise
An
density
Self test positive
ST
difference
Operating
temperature range
g level
(4)
(a)
.
-40+85°C
- OUTPUT[mg]
(1)
Max.Unit
150
140
590
(CNTL5 ST2, ST1 bits=00)
ug/
sqrt(Hz)
mg
a. The product is factory calibrated at 2.5 V. The operational power supply range is from 1.71 V to 3.6 V.
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LIS3DSHMechanical and electrical specifications
3.2 Electrical characteristics
@ Vdd = 2.5 V, T = 25 °C unless otherwise noted
(b)
.
(3)
(1)
(2)
1.71Vdd+0.1V
1.6 kHz ODR225µA
3.125 Hz ODR11µA
2µA
Max.Unit
Table 4.Electrical characteristics
SymbolParameterTest conditionsMin.Typ.
VddSupply voltage1.712.53.6V
Vdd_IOI/O pins supply voltage
IddA
IddPdn
VIHDigital high level input voltage0.8*Vdd_IOV
VILDigital low level input voltage0.2*Vdd_IOV
VOHHigh level output voltage0.9*Vdd_IOV
VOLLow level output voltage0.1*Vdd_IOV
TopOperating temperature range-40+85
1. The product is factory calibrated at 2.5 V. The operational power supply range is from 1.71 V to 3.6 V.
2. Typical specifications are not guaranteed.
3. It is possible to remove Vdd maintaining Vdd_IO without blocking the communication buses, in this condition the
measurement chain is powered off.
Current consumption in Active
mode
Current consumption in powerdown/standby mode
°C
b. The product is factory calibrated at 2.5 V. The operational power supply range is from 1.71 V to 3.6 V.
Doc ID 022405 Rev 113/53
Mechanical and electrical specificationsLIS3DSH
t
t
t
t
t
t
t
t
3.3 Communication interface characteristics
3.3.1 SPI - serial peripheral interface
Subject to general operating conditions for Vdd and Top.
Table 5.SPI slave timing values
(1)
Val u e
SymbolParameter
Min.Max.
tc(SPC)SPI clock cycle100ns
fc(SPC)SPI clock frequency10MHz
tsu(CS)CS setup time6
th(CS)CS hold time8
tsu(SI)SDI input setup time5
th(SI)SDI input hold time15
tv(SO)SDO valid output time50
th(SO)SDO output hold time9
tdis(SO)SDO output disable time50
Unit
ns
1. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not
tested in production.
(c)
c(SP C)
h(CS)
LSB IN
h(SO )
LSB OUT
dis(SO )
Figure 3.SPI slave timing diagram
CS
(2)
su (CS)
SPC
(2)
su (SI)
(2)
SD I
(2)
SD O
2. When no communication is on-going, data on SDO is driven by internal pull-up resistor.
h(SI)
MSB IN
v(SO )
MSB OUT
(2)
(2)
(2)
(2)
c. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output ports.
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LIS3DSHMechanical and electrical specifications
t
t
t
t
t
t
t
t
t
t
t
t
3.3.2 I2C - inter IC control interface
Subject to general operating conditions for Vdd and Top.
Table 6.I2C slave timing values
SymbolParameter
I2C standard mode
(1)
I2C fast mode
(1)
Unit
Min.Max.Min.Max.
f
(SCL)
t
w(SCLL)
t
w(SCLH)
t
su(SDA)
t
h(SDA)
t
r(SDA) tr(SCL)
t
f(SDA) tf(SCL)
t
h(ST)
t
su(SR)
t
su(SP)
t
w(SP:SR)
SCL clock frequency01000400kHz
SCL clock low time4.71.3
SCL clock high time4.00.6
SDA setup time250100ns
SDA data hold time0.013.450.010.9µs
SDA and SCL rise time1000
SDA and SCL fall time300
START condition hold time40.6
Repeated START condition
setup time
4.70.6
STOP condition setup time40.6
Bus free time between STOP
and START condition
4.71.3
1. Data based on standard I2C protocol requirement, not tested in production.
2. Cb = total capacitance of one bus line, in pF.
Figure 4.I2C slave timing diagram
(d)
20 + 0.1C
20 + 0.1C
µs
(2)
b
(2)
b
300
ns
300
µs
START
SDA
f(SDA)
r(SDA)
su(SDA)
h(SDA)
SCL
w(SCLL)
w(SCLH)
r(SCL)
f(SCL)
h(ST)
d. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both ports.
Doc ID 022405 Rev 115/53
su(SR)
su(SP)
w(SP:SR)
REPEATED
START
START
STOP
Mechanical and electrical specificationsLIS3DSH
3.4 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 7.Absolute maximum ratings
SymbolRatingsMaximum valueUnit
VddSupply voltage-0.3 to 4.8V
Vdd_IOI/O pins supply voltage-0.3 to 4.8V
Vin
A
POW
A
UNP
T
T
STG
ESDElectrostatic discharge protection 2 (HBM)kV
Input voltage on any control pin
(CS, SCL/SPC, SDA/SDI/SDO, SDO/SEL)
Acceleration (any axis, powered, Vdd = 2.5 V)
Acceleration (any axis, unpowered)
Operating temperature range-40 to +85°C
OP
Storage temperature range-40 to +125°C
-0.3 to Vdd_IO +0.3V
3000 for 0.5 msg
10000 for 0.1 msg
3000 for 0.5 msg
10000 for 0.1 msg
Note:Supply voltage on any pin should never exceed 4.8 V
This is a mechanical shock sensitive device, improper handling can cause permanent
damage to the part.
This is an ESD sensitive device, improper handling can cause permanent damage to
the part.
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LIS3DSHMechanical and electrical specifications
3.5 Terminology
3.5.1 Sensitivity
Sensitivity describes the gain of the sensor and can be determined e.g. by applying 1 g
acceleration to it. As the sensor can measure DC accelerations this can be done easily by
pointing the axis of interest towards the center of the earth, noting the output value, rotating
the sensor by 180 degrees (pointing to the sky) and noting the output value again. By doing
so, ±1 g acceleration is applied to the sensor. Subtracting the larger output value from the
smaller one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This
value changes very little over temperature and also time. The sensitivity tolerance describes
the range of sensitivities of a large population of sensors.
3.5.2 Zero-g level
Zero-g level offset (TyOff) describes the deviation of an actual output signal from the ideal
output signal if no acceleration is present. A sensor in a steady-state on a horizontal surface
measures 0 g in X axis and 0 g in Y axis, whereas the Z axis measures 1 g. The output is
ideally in the middle of the dynamic range of the sensor (content of OUT registers 00h, data
expressed as 2’s complement number). A deviation from the ideal value in this case is called
Zero-g offset. Offset is to some extent a result of stress to MEMS sensor and therefore the
offset can slightly change after mounting the sensor onto a printed circuit board or exposing
it to extensive mechanical stress. Offset changes little over temperature, see “Zero-g level
change vs. temperature”. The Zero-g level tolerance (TyOff) describes the standard
deviation of the range of Zero-g levels of a population of sensors.
3.6 Functionality
3.6.1 Self-test
Self-test allows to check the sensor functionality without moving it. The self-test function is
off when the self-test bit (ST) is programmed to ‘0‘. When the self-test bit is programmed to
‘1’, an actuation force is applied to the sensor, simulating a definite input acceleration. In this
case the sensor outputs exhibit a change in their DC levels which are related to the selected
full-scale through the device sensitivity. When self-test is activated, the device output level is
given by the algebraic sum of the signals produced by the acceleration acting on the sensor
and by the electrostatic test-force. If the output signals change within the amplitude
specified in Table 3, then the sensor is working properly and the parameters of the interface
chip are within the defined specifications.
3.7 Sensing element
A proprietary process is used to create a surface micro-machined accelerometer. The
technology allows to carry out suspended silicon structures which are attached to the
substrate in a few points called anchors and are free to move in the direction of the sensed
acceleration. To be compatible with the traditional packaging techniques, a cap is placed on
top of the sensing element to avoid blocking the moving parts during the moulding phase of
the plastic encapsulation.
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Mechanical and electrical specificationsLIS3DSH
When an acceleration is applied to the sensor the proof mass displaces from its nominal
position, causing an imbalance in the capacitive half bridge. This imbalance is measured
using charge integration in response to a voltage pulse applied to the capacitor.
At steady-state the nominal value of the capacitors are a few pF and when an acceleration is
applied, the maximum variation of the capacitive load is in the fF range.
3.8 IC interface
The complete measurement chain is made up of a low-noise capacitive amplifier which
converts the capacitive unbalancing of the MEMS sensor into an analog voltage that is
finally available to the user through an analog-to-digital converter.
The acceleration data may be accessed through an I
device particularly suitable for direct interfacing with a microcontroller.
The LIS3DSH features a Data-Ready signal (RDY) which indicates when a new set of
measured acceleration data is available, therefore simplifying data synchronization in the
digital system that uses the device.
2
C/SPI interface, therefore making the
3.9 Factory calibration
The IC interface is factory calibrated for sensitivity (So) and Zero-g level (TyOff).
The trimming values are stored inside the device in a non volatile memory. Any time the
device is turned on, the trimming parameters are downloaded into the registers to be used
during the active operation. This allows to use the device without further calibration.
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LIS3DSHApplication hints
4 Application hints
Figure 5.LIS3DSH electrical connection
Vdd
TOP VIEW
6
SDA/SDI/SDO
1416
SEL/SDO
13
INT1/DRDY
9
9
8
CS
INT 2
AM10211V1
10µF
100nF
GND
Digital signal from/to signal controller.Signal’s levelsare defined by proper selection of Vdd_IO
Vdd_IO
SCL/SPC
NC
NC
1
5
5
The device core is supplied through the Vdd line while the I/O pins are supplied through the
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 µF) should be placed
as near as possible to pin 14 of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Figure 5). It is possible to remove Vdd maintaining Vdd_IO
without blocking the communication bus, in this condition the measurement chain is
powered off.
The functionality of the device and the measured acceleration data is selectable and
accessible through the I
2
C or SPI interfaces. When using the I2C, CS must be tied high.
4.1 Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com
Doc ID 022405 Rev 119/53
.
Digital main blocksLIS3DSH
5 Digital main blocks
5.1 State machine
The LIS3DSH embeds two state machines able to run a user defined program.
The program is made up of a set of instructions that define the transition to successive
states. Conditional branches are possible.
From each state (n) it is possible to have transition to the next state (n+1) or to reset state.
Transition to reset point happens when “RESET condition” is true; Transition to the next step
happens when “NEXT condition” is true.
Interrupt is triggered when output/stop/continue state is reached.
Each state machine allows to implement gesture recognition in a flexible way, free-fall,
wake-up, 4D/6D orientation, pulse counter and step recognition, click/double click,
shake/double shake, face-up/face-down, turn/double turn:
●Code and parameters are loaded by the host into dedicated memory areas for the state
program
●State program with timing based on ODR or decimated time
●Possibility of conditional branches
Table 8.LIS3DSH state machines: sequence of state to execute an algorithm
START
State 1
reset
next
reset
State 2
next
reset
State 3
next
reset
State n
OUTPUT/STOP/CONTINUE
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INT set
AM10212V1
LIS3DSHDigital main blocks
5.2 FIFO
LIS3DSH embeds an acceleration data FIFO for each of the three output channels, X, Y,
and Z. This allows a consistent power saving for the system, since the host processor does
not need to continuously poll data from the sensor, but it can wake up only when needed
and burst the significant data out from the FIFO. This buffer can work according to four
different modes: Bypass mode, FIFO mode, Stream mode and Stream-to-FIFO mode. Each
mode is selected by the FIFO_MODE bits. Programmable Watermark level, FIFO_empty or
FIFO_Full events can be enabled to generate dedicated interrupts on the INT1/2 pin.
5.2.1 Bypass mode
In Bypass mode, the FIFO is not operational and for this reason it remains empty. For each
channel only the first address is used. The remaining FIFO slots are empty.
5.2.2 FIFO mode
In FIFO mode, data from X, Y, and Z channels are stored in the FIFO. A Watermark interrupt
can be enabled in order to be raised when the FIFO is filled to the level specified by the
internal register. The FIFO continues filling until it is full. When full, the FIFO stops collecting
data from the input channels.
5.2.3 Stream mode
In Stream mode, data from the X, Y, and Z measurement are stored in the FIFO. A
Watermark interrupt can be enabled and set as in the FIFO mode. The FIFO continues filling
until it’s full. When full, the FIFO discards the older data as the new arrive.
5.2.4 Stream-to-FIFO mode
In Stream-to_FIFO mode, data from the X, Y, and Z measurement are stored in the FIFO. A
Watermark interrupt can be enabled in order to be raised when the FIFO is filled to the level
specified by the internal register. The FIFO continues filling until it’s full. When full, the FIFO
discards the older data as the new arrive. Once trigger event occurs, the FIFO starts
operating in FIFO mode.
5.2.5 Retrieve data from FIFO
FIFO data is read through the OUT_X, OUT_Y and OUT_Z registers. When the FIFO is in
Stream, Trigger or FIFO mode, a read operation to the OUT_X, OUT_Y or OUT_Z registers
provides the data stored in the FIFO. Each time data is read from the FIFO, the oldest X, Y,
and Z data are placed in the OUT_X, OUT_Y and OUT_Z registers and both single read and
read_burst operations can be used.
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Digital interfacesLIS3DSH
6 Digital interfaces
The registers embedded inside the LIS3DSH may be accessed through both the I2C and
SPI serial interfaces. The latter may be SW configured to operate either in 3-wire or 4-wire
interface mode.
The serial interfaces are mapped onto the same pins. To select/exploit the I
CS line must be tied high (i.e. connected to Vdd_IO).
Table 9.Serial interface pin description
Pin namePin description
SPI enable
CS
SCL
SPC
SDA
SDI
SDO
I2C/SPI mode selection (1: SPI idle mode / I2C communication
enabled; 0: SPI communication mode / I2C disabled)
2
I
C serial clock (SCL)
SPI serial port clock (SPC)
2
I
C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
2
C interface, the
SEL
SDO
I2C address selection
SPI serial data output (SDO)
6.1 I2C serial interface
The LIS3DSH I2C is a bus slave. The I2C is employed to write data into registers whose
content can also be read back.
The relevant I
Table 10.Serial interface pin description
TransmitterThe device which sends data to the bus
ReceiverThe device which receives data from the bus
Master
There are two signals associated with the I2C bus: the serial clock line (SCL) and the serial
data line (SDA). The latter is a bi-directional line used for sending and receiving the data
to/from the interface. Both lines must be connected to Vdd_IO through an external pull-up
resistor. When the bus is free, both lines are high.
2
The I
C interface is compliant with fast mode (400 kHz) I2C standards as well as with normal
mode.
2
C terminology is given in the table below.
TermDescription
The device which initiates a transfer, generates clock signals and terminates a
transfer
SlaveThe device addressed by the master
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LIS3DSHDigital interfaces
6.1.1 I2C operation
The transaction on the bus is started through a start (ST) signal. A start condition is defined
as a HIGH to LOW transition on the data line while the SCL line is held HIGH. After this has
been transmitted by the master, the bus is considered busy. The next byte of data
transmitted after the start condition contains the address of the slave in the first 7 bits and
the eighth bit tells whether the master is receiving data from the slave or transmitting data to
the slave. When an address is sent, each device in the system compares the first seven bits
after a start condition with its address. If they match, the device considers itself addressed
by the master.
The slave address (SAD) associated to the LIS3DSH is 00111xxb whereas the xx bits are
modified by the SEL/SDO pin in order to modify the device address. If the SEL pin is
connected to the voltage supply, the address is 0011101b, otherwise the address is
0011110b if the SEL pin is connected to ground. This solution permits to connect and
address two different accelerometers to the same I
Data transfer with acknowledge is mandatory. The transmitter must release the SDA line
during the acknowledge pulse. The receiver must then pull the data line LOW so that it
remains stable low during the HIGH period of the acknowledge clock pulse. A receiver which
has been addressed is obliged to generate an acknowledge after each byte of data
received.
2
The I
C embedded inside the LIS3DSH behaves as a slave device and the following
protocol must be adhered to. After the start condition (ST) a slave address is sent, once a
slave acknowledge (SAK) has been returned, an 8-bit sub-address (SUB) is transmitted: the
7 LSb represents the actual register address while the ADD_INC bit (CTRL_REG6) defines
the address increment.
2
C lines.
The slave address is completed with a read/write bit. If the bit is ‘1’ (Read), a repeated start
(SR) condition must be issued after the two sub-address bytes; if the bit is ‘0’ (Write), the
master transmits to the slave with direction unchanged. Table 11 explains how the
SAD+Read/Write bit pattern is composed, listing all the possible configurations.
Table 11.SAD+Read/Write patterns
CommandSAD[6:2]SAD[1] = SELSAD[0] = SELR/WSAD+R/W
Read0011110100111101
Write0011110000111100
Read0011101100111011
Write0011101000111010
Table 12.Transfer when master is writing one byte to slave
MasterSTSAD + WSUBDATASP
SlaveSAKSAKSAK
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Digital interfacesLIS3DSH
Table 13.Transfer when master is writing multiple bytes to slave:
MasterSTSAD + WSUBDATADATASP
SlaveSAKSAKSAKSAK
Table 14.Transfer when master is receiving (reading) one byte of data from slave:
MasterSTSAD + WSUBSRSAD + RNMAKSP
SlaveSAKSAKSAKDATA
Table 15.Transfer when master is receiving (reading) multiple bytes of data from slave
Master ST SAD+WSUBSR SAD+RMAKMAKNMAK SP
SlaveSAKSAKSAK DATADATADATA
Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number
of bytes transferred per transfer is unlimited. Data is transferred with the Most Significant bit
(MSb) first. If a receiver can’t receive another complete byte of data until it has performed
some other function, it can hold the clock line, SCL LOW, to force the transmitter into a wait
state. Data transfer only continues when the receiver is ready for another byte and releases
the data line. If a slave receiver doesn’t acknowledge the slave address (i.e. it is not able to
receive because it is performing some real time function) the data line must be left HIGH by
the slave. The master can then abort the transfer. A LOW to HIGH transition on the SDA line
while the SCL line is HIGH is defined as a STOP condition. Each data transfer must be
terminated by the generation of a STOP (SP) condition.
In the presented communication format, MAK is Master acknowledge and NMAK is No
Master Acknowledge.
6.2 SPI bus interface
The LIS3DSH SPI is a bus slave. The SPI allows to write and read the registers of the
device.
The serial interface interacts with the outside world with 4 wires: CS, SPC, SDI and SDO.
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LIS3DSHDigital interfaces
Figure 6.Read and write protocol
CS
SPC
SDI
DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
AM10129V1
SDO
RW
MS
AD5 AD4 AD3 AD2 AD1 AD0
CS is the serial port enable and it is controlled by the SPI master. It goes low at the start of
the transmission and goes back high at the end. SPC is the serial port clock and it is
controlled by the SPI master. It is stopped high when CS is high (no transmission). SDI and
SDO are respectively the serial port data input and output. Those lines are driven at the
falling edge of SPC and should be captured at the rising edge of SPC.
Both the read register and write register commands are completed in 16 clock pulses or in
multiples of 8 in case of multiple bytes read/write. Bit duration is the time between two falling
edges of SPC. The first bit (bit 0) starts at the first falling edge of SPC after the falling edge
of CS while the last bit (bit 15, bit 23, ...) starts at the last falling edge of SPC just before the
rising edge of CS.
bit 0: RW
bit. When 0, the data DI(7:0) is written into the device. When 1, the data DO(7:0)
from the device is read. In the latter case, the chip drives SDO at the start of bit 8.
bit 1-7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written into the device (MSb first).
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
In multiple read/write commands further blocks of 8 clock periods are added. When the
ADD_INC(CTRL_REG6) bit is ‘0’, the address used to read/write data remains the same for
every block. When the ADD_INC bit is ‘1’, the address used to read/write data is increased
at every block.
The function and the behavior of SDI and SDO remain unchanged.
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Digital interfacesLIS3DSH
6.2.1 SPI read
Figure 7.SPI read protocol
CS
SPC
SDI
RW
MS
AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7 DO6 DO5 DO4 DO3DO2 DO1 DO0
AM10130V1
The SPI Read command is performed with 16 clock pulses. Multiple byte read command is
performed adding blocks of 8 clock pulses at the previous one.
bit 0: READ bit. The value is 1.
bit 1-7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
bit 16-... : data DO(...-8). Further data in multiple byte reading.
ODR<3:0> is used to set Power Mode and ODR selection. In Table 24 (output data rate
selection Table 22) all frequencies available are reported.
Table 24.CTRL4 ODR configuration
ODR3ODR2ODR1ODR0ODR selection
0000Power down
00013.125 Hz
00106.25 Hz
001112.5 Hz
010025 Hz
010150 Hz
0110100 Hz
0111400 Hz
1000800 Hz
10011600 Hz
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Register descriptionLIS3DSH
The BDU bit is used to inhibit the output registers update until both upper and lower register
parts are read. In default mode (BDU=‘0’) the output register values are updated
continuously. If for any reason it is not sure whether to read faster than the output data rate it
is recommended to set the BDU bit to ‘1’. In this way the content of output registers is not
updated until both MSb and LSb are read avoiding the reading of values related to a
different sample time.
Synchronization for external Host Controller interrupt based on output data
0=no action waiting from host; 1=action from host based on output data
Data overrun indicates not read data from output register when next data samples
measure start; 0=no overrun, 1=data overrun data overrun bit is reset when next
sample is ready
DRDY
data ready from output register
0=data not ready, 1=data ready
8.18 VFC_1 (1Bh)
Vector coefficient register 1 for DIff filter.
Table 44.Vector filter coefficient register 1 default value
00000000
8.19 VFC_2 (1Ch)
Vector coefficient register 2 for DIff filter.
Table 45.Vector filter coefficient register 2 default value
00000000
8.20 VFC_3 (1Dh)
Vector coefficient register 3 for FSM2 filter.
Table 46.Vector filter coefficient register 3 default value
00000000
8.21 VFC_4 (1Eh)
Vector coefficient register 4 for DIff filter.
Table 47.Vector filter coefficient register 4 default value
00000000
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LIS3DSHRegister description
8.22 THRS3 (1Fh)
Threshold value e register.
Table 48.Threshold value register 3 default value
00000000
8.23 OUT_X (28h - 29h)
X-axis output register.
Table 49.OUT_X_L register default value
00000000
Table 50.OUT_X_H register default value
00000000
8.24 OUT_Y (2Ah - 2Bh)
Y-axis output register.
Table 51.OUT_Y_L register default value
00000000
Table 52.OUT_Y_H register default value
00000000
8.25 OUT_Z (2Ch - 2Dh)
Z-axis output register.
Table 53.OUT_Z_L register default value
00000000
Table 54.OUT_Z_H register default value
00000000
Doc ID 022405 Rev 139/53
Register descriptionLIS3DSH
8.26 FIFO_CTRL (2Eh)
FIFO control register.
Table 55.FIFO control register
FMODE2FMODE1FMODE0WTMP4WTMP3WTMP2WTMP1WTMP4
FMODE2:FMODE0 = FIFO Mode Selection.
WTMP4:WTMP0 = FIFO Watermark pointer; FIFO deep if the Watermark is enabled.
Table 56.FIFO mode selection
FMODE2FMODE1FMODE0Mode
000Bypass Mode. FIFO turned off
001FIFO Mode. Stop collecting data
when FIFO is full.
010Stream Mode. If the FIFO is full
the new sample overwrites the
older one
011Stream mode until trigger is de-
100Bypass mode until trigger is de-
101Not Used
110Not Used.
111Bypass mode until trigger is de-
The FIFO trigger is the INT2 source.
8.27 FIFO_SRC (2Fh)
FIFO SRC control register.
Table 57.FIFO_SRC register
WTM
OVRN_
FIFO
asserted, then FIFO mode
asserted, then Stream mode
asserted, then FIFO mode
EMPTYFSS4FSS3FSS2FSS1FSS0
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LIS3DSHRegister description
Table 58.FIFO_SRC register description
WTMWatermark status.
0=FIFO filling is lower than WTM level; 1=FIFO filling is equal or higher than WTM
level
OVRN_FIFOOverrun bit status. 0=FIFO is not completely filled; 1=FIFO is completely filled
EMPTYFIFO empty bit.
0=FIFO not empty; 1=FIFO empty)
FSS4-FSS0FIFO stored data level
8.28 CTRL_REG1 (21h)
SM1 control register.
Table 59.SM1 control register
HYST2_1HYST1_1HYST0_1-SM1_PIN--SM1_EN
Table 60.SM1 control register structure
HYST2_1
HYST1_1
HYST0_1
SM1_PIN
SM1_EN
Hysteresis unsigned value to be added or subtracted from threshold value in SM1
Default value=000
0=SM1 interrupt routed to INT1, 1=SM1 interrupt routed to INT2 pin
Default value=0
0=SM1 disabled, 1=SM1 enabled
Default value=0
8.29 STx_1 (40h-4Fh)
State machine 1 code register STx_1 (x = 1-16).
State machine 1 system register is made up of 16, 8- bit registers to implement 16-step opcode.
8.30 TIM4_1 (50h)
8-bit general timer (unsigned value) for SM1 operation timing.
Table 61.Timer4 default value
00000000
8.31 TIM3_1 (51h)
8-bit general timer (unsigned value) for SM1 operation timing.
Doc ID 022405 Rev 141/53
Register descriptionLIS3DSH
Table 62.Timer3 default value
00000000
8.32 TIM2_1 (52h - 53h)
16-bit general timer (unsigned value) for SM1 operation timing.
Table 63.TIM2_1_L default value
00000000
Table 64.TIM2_1_H default value
00000000
8.33 TIM1_1 (54h - 55h)
16-bit general timer (unsigned value) for SM1 operation timing.
Table 65.TIM1_1_L default value
00000000
Table 66.TIM1_1_H default value
00000000
8.34 THRS2_1 (56h)
Threshold value for SM1 operation.
Table 67.THRS2_1 default value
00000000
8.35 THRS1_1 (57h)
Threshold value for SM1 operation.
Table 68.THRS1_1 default value
00000000
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LIS3DSHRegister description
8.36 MASK1_B (59h)
Axis and sign mask (swap) for SM1 motion detection operation.
Table 69.MASK1_B axis and sign mask register
P_XN_XP_YN_YP_ZN_ZP_VN_V
Table 70.MASK1_B register structure
P_X
N_X0=X - disabled, 1=X – enabled
0=X + disabled, 1=X + enabled
P_Y
N_Y0=Y- disabled, 1=Y – enabled
P_Z
N_Z0=Z - disabled, 1=Z – enabled
P_V
N_V0=V - disabled, 1=V – enabled
0=Y+ disabled, 1=Y + enabled
0=Z + disabled, 1=Z + enabled
0=V + disabled, 1=V + enabled
8.37 MASK1_A (5Ah)
Axis and sign mask (default) for SM1 motion detection operation.
Table 71.MASK1_A axis and sign mask register
P_XN_XP_YN_YP_ZN_ZP_VN_V
Table 72.MASK1_A register structure
P_X
N_X0=X - disabled, 1=X – enabled
P_Y
N_Y0=Y - disabled, 1=Y – enabled
0=X + disabled, 1=X + enabled
0=Y + disabled, 1=Y + enabled
P_Z
N_Z0=Z - disabled, 1= Z – enabled
P_V
N_V0=V - disabled, 1=V – enabled
0=Z + disabled, 1=Z + enabled
0=V + disabled, 1=V + enabled
8.38 SETT1 (5Bh)
Setting of threshold, peak detection and flags for SM1 motion detection operation.
Doc ID 022405 Rev 143/53
Register descriptionLIS3DSH
Table 73.SETT1 register structure
P_DETTHR3_SA ABS--THR3_MAR_TAMSITR
Table 74.SETT1 register description
P_DET
THR3_SA
ABS
THR3_MA
R_TAM
SITR
8.39 PR1 (5Ch)
Program and reset pointer for SM1 motion detection operation.
Default value: 0
0=no action, 1=threshold 3 limit value for axis and sign mask reset (MASK2_A)
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LIS3DSHRegister description
Table 97.SETT2 register description
R_TAM
SITR
Next condition validation flag. Default value:0
0=no valid next condition found, 1=valid next condition found and reset
Default value: 0
0=no actions, 1=program flow can be modified by STOP and CONT commands
8.54 PR2 (7Ch)
Program and reset pointer for SM2 motion detection operation.
Table 98.PR2 register
PP3PP2PP1PP0RP3RP2RP1RP0
Table 99.PR2 register description
PP3-PP0
RP3-RP0SM2 reset pointer address
SM2 program pointer address
8.55 TC2 (7Dh-7E)
16-bit general timer (unsigned output value) for SM2 operation timing.
Table 100. TC2_L default value
00000000
Table 101. TC2_H default value
00000000
8.56 OUTS2 (7Fh)
Output flags on axis for interrupt SM2 management.
Table 102. OUTS2 register
P_XN_XP_YN_YP_ZN_ZP_VN_V
Read action of this register, depending on the flag affects SM2 interrupt functions.
Table 103. OUTS2 register description
P_X
N_X0=X - no show, 1=X – show
0=X + no show, 1=X + show
Doc ID 022405 Rev 149/53
Register descriptionLIS3DSH
Table 103. OUTS2 register description
P_Y
N_Y0=Y - no show, 1=Y – show
0=Y + no show, 1=Y + show
P_Z
N_Z0=Z - no show, 1=Z – show
P_V
N_V0=V - no show, 1=V – show
0=Z + no show, 1=Z + show
0=V + no show, 1=V + show
8.57 PEAK2 (1Ah)
Peak detection value register for SM2 operation.
Table 104. PEAK2 default value
00000000
Peak detected value for next condition SM2.
8.58 DES2 (78h)
Decimation counter value register for SM2 operation.
Table 105. DES2 default value
00000000
Registers marked as ‘Reserved’ must not be changed. The writing to those registers may
cause permanent damages to the device.
The content of the registers that are loaded at boot should not be changed. They contain the
factory calibration values. Their content is automatically restored when the device is
powered up.
50/53Doc ID 022405 Rev 1
LIS3DSHPackage information
9 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 12. LGA-16: mechanical data and package dimensions
Dimensions
Ref.
A11.0000.0394
A20.7850.0309
A30.2000.0079
D1 2.850 3.000 3.150 0.1122 0.1181 0.1240
E12.850 3.000 3.150 0.1122 0.1181 0.1240
L11.000 1.0600.0394 0.0417
L22.000 2.0600.07870.0811
N10.5000.0197
N21.0000.0394
M0.040 0.100 0.160 0.0016 0.0039 0.0063
P10.8750.0344
P21.2750.0502
T10.2900.350 0.410 0.0114 0.0138 0.0161
T20.190 0.250 0.310 0.0075 0.0098 0.0122
d0.1500.0059
k0.0500.0020
mminch
Min. Typ. M ax. M in. Typ. M ax.
Land Grid Array Package
Outline and
mechanical data
LGA-16 (3x3x1.0mm)
7983231
Doc ID 022405 Rev 151/53
Revision historyLIS3DSH
10 Revision history
Table 106. Document revision history
DateRevisionChanges
26-Oct-20111Initial release.
52/53Doc ID 022405 Rev 1
LIS3DSH
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