ST LIS332AX User Manual

LIS332AX
MEMS inertial sensor:
3-axis ±2 g absolute analog-output ultracompact accelerometer
Features
Single voltage supply operation
Excellent stability over temperature
Absolute 0-g level and sensitivity
Factory-trimmed device sensitivity and
0-g level
Power-down mode
Embedded self-test
10000 g high shock survivability
ECOPACK® RoHS and “Green” compliant
(see Section 7)
Applications
Tilting applications
Free-fall detection
Gaming
Anti-theft systems
Inertial navigation and motion tracking
LGA-16
The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit trimmed to better match the sensing element characteristics.
The LIS332AX has a full-scale of capable of measuring accelerations over a maximum bandwidth of 2.0 kHz. The device bandwidth may be reduced by using external capacitors. The self-test capability allows the user to check the functioning of the system.
ST is already in the field with several hundred million sensors which have received excellent acceptance from the market in terms of quality, reliability and performance.
(3x3x1.0mm)
±2 g, and is
Description
The LIS332AX is an ultracompact low-power 3­axis linear accelerometer that includes a sensing element and an IC interface to provide an analog signal to the external world.
The sensing element, capable of detecting the
The LIS332AX is provided in a plastic land grid array (LGA) package.
Several years ago ST successfully pioneered the use of this package for accelerometers. Today, ST has the widest manufacturing capability and strongest expertise in the world for production of sensors in plastic LGA packages.
acceleration, is manufactured using a dedicated process developed by ST to produce inertial sensors and actuators in silicon.

Table 1. Device summary

February 2010 Doc ID 16932 Rev 1 1/14
Part number Temperature range, ° C Package Packing
LIS332AX -40°C to +85°C LGA-16 Tray
LIS332AXTR -40°C to +85°C LGA-16 Tape and reel
www.st.com
14
Contents LIS332AX
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin connections and description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3 Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.4 Output impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.2 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.3 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.2 Output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/14 Doc ID 16932 Rev 1
LIS332AX Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

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1.1 Pin connections and description

Figure 2. Pin connection

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Doc ID 16932 Rev 1 3/14
Block diagram and pin description LIS332AX

Table 2. Pin description

Pin # Pin name Function
1 NC Internally not connected
2 res Connect to Vdd
3 NC Not connected
4 ST Self-test (logic 0: normal mode; logic 1: self-test mode)
5 PD Power-down (logic 0: normal mode; logic 1: power-down mode)
6 GND 0 V supply
7 NC Not connected
8 NC Not connected
9 Voutz Output voltage Z channel
10 NC Not connected
11 Vouty Output voltage Y channel
12 NC Not connected
13 Voutx Output voltage X channel
14 NC Not connected
15 res Connect to Vdd
16 Vdd Power supply
4/14 Doc ID 16932 Rev 1
LIS332AX Mechanical and electrical specifications

2 Mechanical and electrical specifications

2.1 Mechanical characteristics

@ Vdd=3 V, T=25 °C unless otherwise noted

Table 3. Mechanical characteristics

Symbol Parameter Test condition Min. Typ.
(4)
(4)
(6)
(2)
Delta from +25 °C ±0.01 %/°C
T = 25°C 1.25-3.5% 1.25 1.25+3.5% V
Delta from +25 °C ±0.2 mg/°C
Best fit straight line ±0.5 % FS
Vdd=3 V 100 µg/
T = 25 °C X axis
T = 25 °C Y axis
T = 25 °C Z axis
X, Y, Z axis 2.0 kHz
(7)
(Vst=Logic1)
=2.0 kHz. Sensor bandwidth=1/(2*π*32kΩ*C
RES
Ar Acceleration range
So Sensitivity
SoDr
Sensitivity change vs. temperature
(3)
Voff Zer o-g level
OffDr
Zero-g level change vs. temperature
NL Non linearity
CrossAx Cross-axis
Acceleration noise
An
density
Self-test output
Vt
voltage change
Fres
Top
Sensing element resonant frequency
Operating temperature range
(5)
Wh Product weight 30 mgram
1. Typical specifications are not guaranteed
2. Guaranteed by wafer level test and measurement of initial offset and sensitivity
3. Zero-g level and Sensitivity are absolute to supply voltage
4. Guaranteed by design
5. Contribution to the measuring output of an inclination/acceleration along any perpendicular axis
6. “Self-test output voltage change” is defined as Vout
7. Minimum resonance frequency F
(a)
(1)
Max. Unit
±2.0 g
0.363 - 5% 0.363 0.363 + 5% V/g
±2 %
40 550 mV
40 550 mV
40 550 mV
-40 +85 °C
-Vout
(Vst=Logic0)
LOAD
), with C
LOAD
>2.5 nF
Hz
a. The product is factory calibrated at 3 V. The operational power supply range is specified in Table 4.
Doc ID 16932 Rev 1 5/14
+ 9 hidden pages