ultra low-power high performance 3-axis “femto” accelerometer
LGA-14
(2.0x2.0x1 mm)
Features
■ Wide supply voltage, 1.71 V to 3.6 V
■ Independent IOs supply (1.8 V) and supply
voltage compatible
■ Ultra low-power mode consumption down to 2
µA
■ ±2g/±4g/±8g/±16g dynamically selectable full-
scale
2
■ I
C/SPI digital output interface
■ 2 independent programmable interrupt
generators for free-fall and motion detection
■ 6D/4D orientation detection
■ “Sleep to wake” and “return to sleep” function
■ Freefall detection
■ Motion detection
■ Embedded temperature sensor
■ Embedded FIFO
■ ECOPACK
Applications
■ Motion activated functions
■ Display orientation
■ Shake control
■ Pedometer
■ Gaming and virtual reality input devices
■ Impact recognition and logging
®
RoHS and “Green” compliant
LIS2DH
MEMS digital output motion sensor:
Description
The LIS2DH is an ultra low-power high
performance three-axis linear accelerometer
belonging to the “femto” family, with digital I
serial interface standard output.
The LIS2DH has dynamically user selectable full
scales of ±2g/±4g/±8g/±16g and it is capable of
measuring accelerations with output data rates
from 1 Hz to 5.3 kHz.
The self-test capability allows the user to check
the functioning of the sensor in the final
application.
The device may be configured to generate
interrupt signals by two independent inertial
wake-up/free-fall events as well as by the position
of the device itself.
The LIS2DH is available in small thin plastic land
grid array package (LGA) and is guaranteed to
operate over an extended temperature range from
C serial data (SDA)
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
SPI serial data output (SDO)
I2C less significant bit of the device address (SA0)
SPI enable
I2C/SPI mode selection (1: SPI idle mode / I2C communication
enabled; 0: SPI communication mode / I2C disabled)
12-14ResConnect to GND
Doc ID 022516 Rev 19/49
Mechanical and electrical specificationsLIS2DH
2 Mechanical and electrical specifications
2.1 Mechanical characteristics
@ Vdd = 2.5 V, T = 25 °C unless otherwise noted
Table 3.Mechanical characteristics
SymbolParameterTest conditionsMin.Typ.
FS bit set to 00±2.0
FS bit set to 01±4.0
g level
(3),(4)
(2)
FS bit set to 10±8.0
FS bit set to 11±16.0
FS bit set to 00;
Normal mode
FS bit set to 00;
High Resolution mode
FS bit set to 00;
Low power mode
FS bit set to 01;
Normal mode
FS bit set to 01;
High Resolution mode
FS bit set to 01;
Low power mode
FS bit set to 10;
Normal mode
FS bit set to 10;
High Resolution mode
FS bit set to 10;
Low power mode
FS bit set to 11;
Normal mode
FS bit set to 11;
High Resolution mode
FS bit set to 11;
Low power mode
FS bit set to 000.01%/°C
FS bit set to 00±40mg
FSMeasurement range
SoSensitivity
TCSo
Ty Of f
Sensitivity change vs
temperature
Typical zerooffset accuracy
(a)
4
1
16
8
2
32
16
4
64
48
12
192
(1)
Max.Unit
g
mg/digit
mg/digit
mg/digit
mg/digit
a. The product is factory calibrated at 2.5 V. The operational power supply range is from 1.71V to 3.6 V.
10/49Doc ID 022516 Rev 1
LIS2DHMechanical and electrical specifications
Table 3.Mechanical characteristics (continued)
SymbolParameterTest conditionsMin.Typ.
g level change
TCOff
Vst
To p
1. Typical specifications are not guaranteed.
2. Verified by wafer level test and measurement of initial offset and sensitivity.
3. Typical zero-g level offset value after MSL3 preconditioning.
4. Offset can be eliminated by enabling the built-in high pass filter.
5. The sign of “Self-test output change” is defined by CTRL_REG4 ST bit, for all axes.
“Self-test output change” is defined as the absolute value of:
6.
OUTPUT[LSb]
7. After enabling ST, correct data is obtained after two samples (Low power mode / Normal mode) or after eight samples (high
resolution mode).
Zerovs temperature
Self-test
output change
(5),(6),(7)
Operating
temperature range
(Self test enabled)
Max delta from 25 °C±0.5m
FS bit set to 00
X axis; Normal mode
FS bit set to 00
Y axis; Normal mode
FS bit set to 00
Z axis; Normal mode
17360LSb
17360LSb
17360LSb
-40+85°C
- OUTPUT[LSb]
(Self test disabled)
. 1LSb=4mg at 10bit representation, ±2 g Full-scale
(1)
Max.Unit
g/°C
2.2 Temperature sensor characteristics
@ Vdd =2.5 V, T=25 °C unless otherwise noted
Table 4.Temperature sensor characteristics
SymbolParameterMin.Typ.
TSDr
TODRTemperature refresh rateODR
Top Operating temperature range-40+85°C
1. Typical specifications are not guaranteed.
2. 8-bit resolution.
3. Refer to Table 28: Data rate configuration.
Temperature sensor output
change vs temperature
(b)
(1)
Max.Unit
1digit/°C
(3)
Hz
(2)
b. The product is factory calibrated at 2.5 V. Temperature sensor operation is guaranteed in the range 2 V - 3.6 V
Doc ID 022516 Rev 111/49
Mechanical and electrical specificationsLIS2DH
2.3 Electrical characteristics
@ Vdd = 2.5 V, T = 25 °C unless otherwise noted
Table 5.Electrical characteristics
SymbolParameterTest conditionsMin.Typ.
VddSupply voltage1.712.53.6V
Vdd_IOI/O pins supply voltage
Idd
Idd
Current consumption
in Normal mode
Current consumption
in Normal mode
(2)
50 Hz ODR11µA
1 Hz ODR2µA
(c)
(1)
1.71Vdd+0.1V
Max.Unit
IddLP
IddPdn
VIHDigital high level input voltage0.8*Vdd_IOV
VILDigital low level input voltage0.2*Vdd_IOV
VOHHigh level output voltage0.9*Vdd_IOV
VOLLow level output voltage0.1*Vdd_IOV
TopOperating temperature range-40+85
1. Typical specification are not guaranteed.
2. It is possible to remove Vdd maintaining Vdd_IO without blocking the communication busses, in this condition the
measurement chain is powered off.
Current consumption
in low-power mode
Current consumption in powerdown mode
50 Hz ODR6µA
0.5µA
°C
c. The product is factory calibrated at 2.5 V. The operational power supply range is from 1.71 V to 3.6 V.
12/49Doc ID 022516 Rev 1
LIS2DHMechanical and electrical specifications
SPC
CS
SDI
SDO
t
su(CS)
t
v(SO)
t
h(SO)
t
h(SI)
t
su(SI)
t
h(CS)
t
dis(SO)
t
c(SPC)
MSB IN
MSB OUT
LSB OUT
LSB IN
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
2.4 Communication interface characteristics
2.4.1 SPI - serial peripheral interface
Subject to general operating conditions for Vdd and Top.
Table 6.SPI slave timing values
(1)
Val u e
SymbolParameter
Unit
MinMax
tc(SPC)SPI clock cycle100ns
fc(SPC)SPI clock frequency10MHz
tsu(CS)CS setup time5
th(CS)CS hold time20
tsu(SI)SDI input setup time5
th(SI)SDI input hold time15
ns
tv(SO)SDO valid output time50
th(SO)SDO output hold time5
tdis(SO)SDO output disable time50
1. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not
tested in production
(d)
Figure 3.SPI slave timing diagram
3. When no communication is on-going, data on SDO is driven by internal pull-up resistors
d. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both Input and output port.
Doc ID 022516 Rev 113/49
Mechanical and electrical specificationsLIS2DH
SPC
CS
SDI
SDO
t
su(CS)
t
v(SO)
t
h(SO)
t
h(SI)
t
su(SI)
t
h(CS)
t
dis(SO)
t
c(SPC)
MSB IN
MSB OUT
LSB OUT
LSB IN
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
2.4.2 I2C - Inter IC control interface
Subject to general operating conditions for Vdd and top.
Table 7.I2C slave timing values
SymbolParameter
I2C standard mode
(1)
I2C fast mode
MinMaxMinMax
(1)
Unit
f
(SCL)
t
w(SCLL)
t
w(SCLH)
t
su(SDA)
t
h(SDA)
t
r(SDA) tr(SCL)
t
f(SDA) tf(SCL)
t
h(ST)
t
su(SR)
t
su(SP)
t
w(SP:SR)
SCL clock frequency01000400kHz
SCL clock low time4.71.3
SCL clock high time4.00.6
SDA setup time250100ns
SDA data hold time03.450.010.9µs
SDA and SCL rise time1000
SDA and SCL fall time300
START condition hold time40.6
Repeated START condition
setup time
4.70.6
STOP condition setup time40.6
Bus free time between STOP
and START condition
4.71.3
1. Data based on standard I2C protocol requirement, not tested in production.
2. Cb = total capacitance of one bus line, in pF.
Figure 4.I
2
C Slave timing diagram
(e)
20 + 0.1C
20 + 0.1C
µs
(2)
b
(2)
b
300
ns
300
µs
e. Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both port.
14/49Doc ID 022516 Rev 1
LIS2DHMechanical and electrical specifications
This is a mechanical shock sensitive device, improper handling can cause permanent
damage to the part
This is an ESD sensitive device, improper handling can cause permanent damage to
the part
2.5 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 8.Absolute maximum ratings
SymbolRatingsMaximum valueUnit
VddSupply voltage-0.3 to 4.8V
Vdd_IOI/O pins Supply voltage-0.3 to 4.8V
Vin
A
POW
A
UNP
T
T
STG
ESDElectrostatic discharge protection 2 (HBM)kV
Input voltage on any control pin
(CS, SCL/SPC, SDA/SDI/SDO, SDO/SA0)
Acceleration (any axis, powered, Vdd = 2.5 V)
Acceleration (any axis, unpowered)
Operating temperature range-40 to +85°C
OP
Storage temperature range-40 to +125°C
-0.3 to Vdd_IO +0.3V
3000 g for 0.5 ms
10000 g for 0.1 ms
3000 g for 0.5 ms
10000 g for 0.1 ms
Note:Supply voltage on any pin should never exceed 4.8 V
Doc ID 022516 Rev 115/49
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