ST L99MC6 User Manual
Features
■ 3 independently self configuring high-/low-side
channels
■ 3 low-side channels
■ R
■ Current limit of each output at min. 0.6 A
■ PWM direct mode
■ Bulb mode with recovery mode
■ LED mode with slew rate control
■ Bridge mode with crosscurrent protection
■ SPI interface for data communication
■ Temperature warning
■ All outputs overtemperature protected
■ All outputs short-circuit protected
■ Configurable open-load detection in off mode
■ V
■ Very low current consumption in standby mode
=0.7 Ω (typ) at Tj = 25 °C
ON
supply voltage 3.0 V to 5.25 V
CC
5 µA (typ)
■ Internal clamp diodes
■ HS switches operate down to 3 V crank voltage
Applications
■ Relay driver
■ LED driver
■ Motor driver
■ Mirror adjustment
Table 1. Device summary
L99MC6
Configurable 6-channel device
PowerSSO-16
Description
The L99MC6 IC is a highly flexible monolithic
medium current output driver that incorporates 3
dedicated low-side outputs (channels 4 to 6) and
3 independently self configuring outputs
(channels 1 to 3) that can be used as either lowside or high-side drivers in any combination. The
L99MC6 can control inductive loads,
incandescent bulbs or LEDs.
The L99MC6 can be used in a half bridge
configuration with crosscurrent protection.
The channel 2 can be controlled directly via the
IN/PWM pin for PWM applications. The IN/PWM
signal can be applied to any other output.
The integrated 16-bit standard serial peripheral
interface (SPI) controls all outputs and provides
diagnostic information: normal operation, openload in off-state, overcurrent, temperature
warning, overtemperature.
Order codes
Package
Part number (tube) Part number (tape & reel)
PowerSSO-16 L99MC6-LF L99MC6TR-LF
November 2009 Doc ID 16523 Rev 1 1/55
www.st.com
1
Contents L99MC6
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1 Application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.2 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.1 Dual power supply: VS and V
2.1.1 Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.2 Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.3 Inductive loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4 Diagnostic functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4.1 Direct input IN/PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.4.2 Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . 14
2.4.3 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.4.4 Overload detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5 Bridge mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.6 LED mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.7 Bulb mode (programmable soft start function to drive loads with higher
inrush current) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
CC
3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4 ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.1 Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . . 19
6 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.1 Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.2 Undervoltage detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.3 Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7 SPI electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.1 DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/55 Doc ID 16523 Rev 1
L99MC6 Contents
7.2 AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.3 Dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7.4 SPI timing parameter definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
8 Functional description of the SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8.1 Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8.1.1 Serial clock (SCK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8.1.2 Serial data input (SDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8.1.3 Serial data output (SDO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8.1.4 Chip select not (CSN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8.2 SPI communication flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.2.1 General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.2.2 Command byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.2.3 Global status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.3 Write operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
8.4 Read operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
8.5 Read and Clear Status operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8.6 Read Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
9 SPI control and status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
9.1 RAM memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
9.2 ROM memory map (access with OC0 and OC1 set to ‘1’) . . . . . . . . . . . . 34
9.3 Control and status registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
9.3.1 Channel configuration decoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
9.3.2 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
9.4 Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
9.4.1 Example 1:Switch on channel 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
9.4.2 Example 2: Bridge mode configuration . . . . . . . . . . . . . . . . . . . . . . . . . 38
9.4.3 Example 3: Open-load detection in off-state in bridge configuration . . . 40
10 Maximum demagnetization energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
11 Application examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
12 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
12.1 PowerSSO-16 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Doc ID 16523 Rev 1 3/55
Contents L99MC6
13 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
13.1 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
13.2 PowerSSO-16 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
13.3 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Appendix A Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
4/55 Doc ID 16523 Rev 1
L99MC6 List of tables
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 4. ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 5. Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 6. Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 7. Undervoltage detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 8. Channels. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 9. DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 10. AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 11. Dynamic characteristic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 12. Command byte - general description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 13. Data byte - general description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 14. Command byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 15. Operating code definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 16. Global status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 17. Global status register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 18. Command byte for Write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 19. Command byte for Read mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 20. Command byte for Read and Clear Status operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 21. Command byte for Read Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 22. RAM memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 23. ROM memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 24. Control register 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 25. Control register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 26. Control register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 27. Status register 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 28. Status register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 29. Channel configuration decoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 30. Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 31. Command byte - example 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 32. Data byte - example 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 33. Data byte description - example 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 34. Command byte 1 - example 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 35. Data byte 1 - example 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 36. Data byte description 1 - example 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 37. Command byte 2 - example 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 38. Data byte 2 - example 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 39. Data byte description 2 - example 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 40. Command byte 1 - example 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 41. Data byte 1 - example 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 42. Data byte description 1 - example 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 43. Command byte 2 - example 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 44. Data byte 2 - example 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 45. Data byte description 2 - example 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 46. Auto and mutual thermal resistance - footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 47. Auto and mutual thermal resistance - 2 cm
Table 48. Auto and mutual thermal resistance - 8 cm
2
of Cu heatsink. . . . . . . . . . . . . . . . . . . . . . . . 48
2
of Cu heatsink. . . . . . . . . . . . . . . . . . . . . . . . 49
Doc ID 16523 Rev 1 5/55
List of tables L99MC6
Table 49. PowerSSO-16 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Table 50. Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Table 51. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
6/55 Doc ID 16523 Rev 1
L99MC6 List of figures
List of figures
Figure 1. Application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 2. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 3. Configuration diagram (top view) not in scale. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 4. Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 5. Output voltage clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 6. Example of bridge configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 7. Example of programmable soft start function for inductive loads and incandescent bulbs. 16
Figure 8. Serial input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 9. Serial input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 10. Output turn on/off delays and slew rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 11. Clock polarity and clock phase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 12. SPI frame structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 13. Indication of the global error flag on DO when CSN is low and SCK is stable . . . . . . . . . . 31
Figure 14. Bridge mode drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 15. Open-load in bridge mode drawing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 16. Configurable switch HSD - maximum turn-off current versus inductance. . . . . . . . . . . . . . 42
Figure 17. Configurable switch LSD - maximum turn-off current versus inductance . . . . . . . . . . . . . . 43
Figure 18. Fixed LSD switch - maximum turn-off current versus inductance. . . . . . . . . . . . . . . . . . . . 44
Figure 19. L99MC6 as driver for incandescent bulb, LEDs and high-side or low-side relays . . . . . . . 45
Figure 20. L99MC6 as motor driver (for example, for mirror adjustment) . . . . . . . . . . . . . . . . . . . . . . 46
Figure 21. L99MC6 as driver for unipolar stepper motor driver, relay and LEDs . . . . . . . . . . . . . . . . . 47
Figure 22. PowerSSO-16 PC board
Figure 23. PowerSSO-16 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 24. PowerSSO-16 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 25. PowerSSO-16 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Doc ID 16523 Rev 1 7/55
Introduction L99MC6
1 Introduction
1.1 Application diagram
Figure 1. Application diagram
V
Bat
VREG
Charge
Pump
Vcc
PWM / IN
Active reverse
polarity protection
Dri ver and
Protections
Config. OUT1
Dri ver and
Protections
Config. OUT2
OL
M
OL
Microcontroller
CSN
SCK
DI
DO
CONTROL
LOGIC
SPI
GND
Dri ver and
Protections
Config. OUT3
Dri ver and
Protections
LSD OUT4
Dri ver and
Protections
LSD OUT5
Driver and
Protections
LSD OUT6
OL
OL
OL
OL
8/55 Doc ID 16523 Rev 1
L99MC6 Introduction
1.2 Block diagram and pin description
Figure 2. Block diagram
VCC
IN/PWM
CSN
SCK
DI
DO
Charge
Pump
VCC
SPI
VCP
VDr ive1-3
Open Load Drain [Out1]
ON/OF F [ Out1]
Short Circuit [Out1]
Open Load Source [Out1]
Open Load Drain [Out2]
ON/OF F [ Out2]
Short Circuit [Out2]
Open Load Source [Out2]
Open Load Drain [Out3]
ON/OF F [ Out3]
Short Circuit [Out3]
Open Load Source [Out3]
CONTROL LOGIC
Open Load Drain [Out4]
ON/OF F [ Out4]
Short Circuit [Out4]
Open Load Drain [Out5]
ON/OF F [ Out5]
Short Circuit [Out5]
Open Load Drain [Out6]
ON/OF F [ Out6]
VOLD 1
VOLS 1
VOLD 2
VDr ive1-3
VDr ive1-3
OL
OL
DRN1
SRC1
DRN2
=1
VOLS2
VOLD 3
VOLS 3
VOLD 4
VOLD 5
VDr ive1-3
VCC
VCC
OL
OL
OL
SRC2
DRN3
SRC3
DRN4
DRN5
0
VOLD 6
VCC
OL
DRN6
Short Circuit [Out6]
GND
Doc ID 16523 Rev 1 9/55
Introduction L99MC6
Table 2. Pin functions
Pin Symbol Function
1 / TAB GND
6IN/PWM
8VCC
3 SRC1 Source of configurable channel 1
4 DRN1 Drain of self configurable channel 1, in HS mode also V
5 DRN2 Drain of self configurable channel 2
15 SRC2 Source of self configurable channel 2
12 DRN3 Drain of self configurable channel 3
13 SRC3 Source of self configurable channel 3
2 DRN4 Drain of channel 4
16 DRN5 Drain of channel 5
14 DRN6 Drain of channel 6
11 DI
Ground:
Reference potential
IN/PWM direct mode:
Direct input for channel 2. Other channels can be driven in PWM mode via SPI.
Logic voltage supply 3.3 V/5 V:
For this input a ceramic capacitor as close as possible to GND is recommended
supply
S
SPI data in:
The input requires CMOS logic levels and receives serial data from the
microcontroller. The data is a 16-bit control word and the most significant bit
(MSB, bit 7) is transferred first.
SPI data out:
9DO
The diagnosis data is available via the SPI and this tristate-output. The output
remains in tristate, if the chip is not selected by the input CSN (CSN = high).
SPI chip select not (active low):
7CSN
This input is low active and requires CMOS logic levels. The serial data transfer
between the L99MC6 and microcontroller is enabled by pulling the input CSN to
low-level.
SPI serial clock input:
10 SCK
This input controls the internal shift register of the SPI and requires CMOS logic
levels.
10/55 Doc ID 16523 Rev 1
L99MC6 Introduction
Figure 3. Configuration diagram (top view) not in scale
GND
1
16
DRN5
DRN4
SRC1
DRN1
DRN2
PWM/IN
CSN
VCC
The tab must be connected to GND
2
3
4
PowerSSO-16
5
6
7
8
TAB = GN D
15
14
13
12
11
8
9
SRC2
DRN6
SRC3
DRN3
DI
SCK
DO
Doc ID 16523 Rev 1 11/55
Description L99MC6
2 Description
2.1 Dual power supply: VS and V
The supply voltage VCC (3.3 V/5 V) supplies the whole device. In case of power-on (VCC
increases from undervoltage to V
internally generated power-on reset (POR). If the voltage V
minimum threshold (V
POR ON
impedance) and the status registers are cleared (see Figure 4).
Figure 4. Power-on reset
V
V
POR OFF
V
POR ON
All Status Registers are cleared
POR OFF
= 2.4 V, typical), the outputs are switched-off (high-
CC
CC
= 2.7 V, typical) the circuit is initialized by an
decreases under the
CC
V
POR hyst.
IC is disabled
2.1.1 Channels
The channels 1 to 3 are self configuring high-side or low-side n-channel mosfets. This
flexibility allows the user to connect loads in high-side or low-side configuration in any
combination.
In order to provide low R
charge pump (CP) to drive the internal gate voltage(s) is implemented. If the charge pump is
activated (ENCP1 = 1, DISCP2 = 0, see Section 9.3: Control and status registers), the
internal charge-pump uses V
V
is used to drive all channels.
CC
The channels 4 to 6 are n-channel low-side drivers. The source of the respective mosfet are
internally connected to the device GND.
Caution: For any high-side configuration, channel 1 must be used as a high-side switch.
If channel 1 is configured as low-side, the charge pump has to be deactivated to avoid
charge pump current from the drain.
Caution: The charge pump may not be deactivated (see Section 9.3: Control and status registers) if
one of the channels is in high-side configuration, while a short-circuit from the source to the
battery is present. If these conditions occur, the voltage of the shorted source is applied to
the VCC pin.
values for high-side configured switches (channels 1 to 3), a
dson
from the drain of channel 1, as its power source. Otherwise
S
12/55 Doc ID 16523 Rev 1
L99MC6 Description
2.2 Standby mode
The standby mode of the L99MC6 is activated by SPI command (EN bit of CTRL 0 reset to
0, see Section 9.3.2: Register description). The inputs and outputs are switched-off. The
status registers are cleared and the control registers are reset to their default values.
In the standby mode the current consumption is 5 µA (typical value). A SPI command is
needed to switch the L99MC6 in normal mode.
2.3 Inductive loads
Each switch is built by a power DMOS transistor. For low-side configured outputs an internal
zener clamp from the drain to gate with a breakdown of 31 V minimum provides for fast turnoff of inductive loads.
For high-side configured outputs, an internal zener clamp with a breakdown of -15 V
maximum provides for fast turn-off of inductive loads (Figure 5).
The maximum clamping energy is specified in Chapter 10.
Figure 5. Output voltage clamping
Low Side Configuration
Drain Clamp
Voltage
(V
DRN_CL1-6)
= 35V)
V
GND
Output Current
S
Drain Voltage
2.4 Diagnostic functions
All diagnostic functions (overload, open-load, temperature warning and thermal shutdown)
are internally filtered and the condition has to be valid for at least 32 µs (open-load: typ.
400 µs, respectively) before the corresponding status bit in the status registers are set. The
filters are used to improve the noise immunity of the device. Open-load and temperature
warning function are intended for information purpose and do not change the state of the
output drivers. On contrary, the overload and thermal shutdown condition disable the
corresponding driver (overload) or all drivers (thermal shutdown), respectively. Without
setting the overcurrent recovery bit in the input data register to logic high, the microcontroller
has to clear the overcurrent status bit to reactivate the corresponding driver. (All switches
have a corresponding overcurrent recovery bit) If this bit is set, the device automatically
switches-on the outputs again after a short recovery time. With this feature the device can
drive loads with start-up currents higher than the overcurrent limits (that is inrush current of
incandescent lamps, cold resistance of motors and heaters, Figure 7).
Time
GND
Source Clamp
Voltage
(V
SRC_CL1-3)
= -19V)
High Side Configuration
Output Current
V
S
Time
Source Voltage
Doc ID 16523 Rev 1 13/55
Description L99MC6
2.4.1 Direct input IN/PWM
The IN/PWM input allows channel 2 to be enabled without the use of SPI. The IN/PWM pin
is OR-ed with the SPI command bit. This pin can be left open if the channel 2 is controlled
only via the SPI. This input has an internal pull-down.
The IN/PWM signal can also be applied to any other switches by the activation of the PWM
mode.
This input is suited for non-inductive loads that are pulse width modulated. This allows PWM
control without further use of the SPI.
2.4.2 Temperature warning and thermal shutdown
If the junction temperature rises above T
detectable via the SPI. If the junction temperature increases above the second threshold
T
, the thermal shutdown bit is set and power DMOS transistors of all output stages are
jSD
switched-off to protect the device. Temperature warning flag and thermal shutdown bits are
latched. In order to reactivate the output stages, the junction temperature must decrease
below T
jSD-TjSDHYS
and the thermal shutdown bit has to be cleared by the
microcontroller.
2.4.3 Open-load detection in off-state
The open-load detection monitors the load at each output stage in off mode. A current
source of 150 µA (I
OLD1-6
, I
OLS 1-3
) is connected between drain and source or GND. An
open-load failure is detected if the drain or source voltage reaches an internal V
for at least 3 ms (t
). The corresponding open-load bit is set in the status register. In
dOL typ.
LED mode the open-load detection is disabled and the current source is switched-off, which
avoids a turn-on of the LEDs in off-state.
2.4.4 Overload detection
In case of an overcurrent condition, a flag is set in the corresponding status register. If the
overcurrent signal is valid for at least t
corresponding driver is switched-off to reduce the power dissipation and to protect the
integrated circuit. If the overcurrent recovery bit of the output is zero the microcontroller has
to clear the status bit to reactivate the corresponding driver.
ISC
a temperature warning flag is set and is
j TW
OLD/S
= 32 µs, the overcurrent flag is set and the
(2.0 V)
2.5 Bridge mode
The L99MC6 can be configured as bridge driver. Up to three half bridges can be used. In
Bridge mode the device is crosscurrent protected by an internal delay time. If one driver (LS
or HS) is turned-off the activation of the other driver of the same half bridge is automatically
delayed by the crosscurrent protection time. After the crosscurrent protection time is expired
the slew rate limited switch-off phase of the driver is changed to a fast turn-off phase and the
opposite driver is turned-on with slew-rate limitation. Due to this behavior it is always
guaranteed that the previously activated driver is totally turned-off before the opposite driver
starts to conduct.
Due to the built-in reverse diodes of the output transistors, inductive loads can be driven at
the outputs without external free-wheeling diodes.
14/55 Doc ID 16523 Rev 1
L99MC6 Description
The following combination must be used: channel 1 + 4, channel 2 + 5, channel 3 + 6
(Figure 6).
A V
voltage exceeding the low-side clamping voltage (V
S
DRN_CL1-6
) , while the high one of
the high-side drivers is turned on, may cause a destruction of the device.
Caution: In bridge mode using channels 2 and 5, the IN/PWM pin has to be grounded. Therefore
PWM mode on other channels is not possible.
Figure 6. Example of bridge configuration
V
5V
DD
Out1
VS12V
IN/PWM
GND
SCK
CSN
DO
DI
SPI
GND
=1
Control
Out2
M
Out3
M
Out4
Out5
Out6
2.6 LED mode
Open-load detection in off-state can be deactivated to avoid the turn on of the LEDs by the
current source (150 µA typ.) when the channel is switched-off.
Moreover, it is possible to select a high slew rate to support PWM operations with small duty
cycle (see Section 9.3.1: Channel configuration decoding).
Doc ID 16523 Rev 1 15/55
Description L99MC6
2.7 Bulb mode (programmable soft start function to drive loads with higher inrush current)
Loads with start-up currents higher than the overcurrent limits (for example inrush current of
lamps, start current of motors and cold resistance of heaters) can be driven by using the
programmable soft start function (that is overcurrent recovery mode). Each driver has a
corresponding overcurrent recovery bit. If this bit is set, the device automatically switches-on
the outputs again after a fixed recovery time. The PWM modulated current provides
sufficient average current to power up the load (for example heat up the bulb) until the load
reaches operating condition (Figure 6).
The device itself cannot distinguish between a real overload and a non linear load like a light
bulb. A real overload condition can only be qualified by time. As an example the
microcontroller can switch-on light bulbs by setting the overcurrent recovery bit for the first
50 ms. After clearing the recovery bit, the output is automatically disabled if the overload
condition still exits.
Figure 7. Example of programmable soft start function for inductive loads and incandescent
Load Current
bulbs
Unlimited Inrush Current
Load Current
Unlimited Inrush Current
Limited Inrush Current in
overcurrent recovery
mode with inductive load
t
Limited Inrush Current in
overcurrent recovery mode
with incandescent bulb
t
16/55 Doc ID 16523 Rev 1
L99MC6 Absolute maximum ratings
3 Absolute maximum ratings
Stressing the device above the rating listed in Ta bl e 3 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the operating sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics™ SURE program and other relevant quality
document.
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
DC supply voltage -0.3 to 28 V
VS (DRN1 HS
config)
V
CC
DI, DO, SCK,
CSN, IN
Single pulse t
configuration with R
Single pulse t
Stabilized supply voltage, logic supply -0.3 to 5.5 V
Digital input/output voltage -0.3 to VCC + 0.3 V
< 400 ms in HS or LS
max
< 400 ms in bridge mode V
max
load min
= 40 Ω
(1)
40 V
DRN_CL1-6
V
DRN 1-6 Output current capability ±1,65 A
SRC 1-3 Output current capability ±1,65 A
GND Current capability 3,30 A
T
j
1. The device requires a minimum load impedance of 40 Ω to sustain a load dump pulse of 40 V according to
the ISO 7637 pulse 5b.
Operating junction temperature -40 to 150 °C
All maximum ratings are absolute ratings. Leaving the limitation of any of these values may
cause an irreversible damage of the integrated circuit.
Doc ID 16523 Rev 1 17/55
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