ST L99DZ70XP User Manual

L99DZ70XP

Door actuator driver

Features

■One full bridge for 6 A load (Ron = 150 mΩ)

■Two half bridges for 3 A load (Ron = 300 mΩ)

■Two half bridges for 0.75 A load (Ron = 1600 mΩ)

■One highside driver for 6 A load (Ron = 90 mΩ)

■Two configurable highside drivers for up to

1.5 A load (Ron = 500 mΩ) or 0.4 A (Ron = 1800 mΩ)

■Two highside drivers for 0.5 A load (Ron = 1600 mΩ)

■Programmable softstart function to drive loads with higher inrush currents as current limitation value

■Very low current consumption in standby mode

(IS < 6 µA typ; Tj ≤ 85 °C; ICC < 5 µA typ; Tj ≤ 85 °C)

■Current monitor output for all highside drivers

■Device contains temperature warning and protection

■Openload detection for all outputs

■Over-current protection for all otputs

■Separated half bridges for door lock motor

■PWM control of all outputs

■Charge pump output for reverse polarity protection

■STM standard serial peripheral interface (STSPI 3.0)

■Control block for electrochromic element

PowerSSO-36

Applications

■Door actuator driver with 6 bridges for double door lock control, mirror fold and mirror axis control, highside driver for mirror defroster, bulbs and LEDs (replacement for L9950). Control block with external MOS transistor for charging / discharging of electrochromic glass.

Description

The L99DZ70XP is a microcontroller driven multifunctional door actuator driver for automotive applications. Up to five DC motors and five grounded resistive loads can be driven with six half bridges and five highside drivers. An electrochromic mirror glass can be controlled using the integrated SPI-driven module in conjunction with an external MOS transistor. The integrated SPI controls all operating modes (forward, reverse, brake and high impedance). Also all diagnostic information is available via SPI read.

Table 1.	Device summary
	Package		Order codes
		Tube		Tape and reel
	PowerSSO-36	L99DZ70XP		L99DZ70XPTR
November 2010		Doc ID 15162 Rev 3	1/47
				www.st.com

Contents	L99DZ70XP

Contents

1	Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . .		. 6
2	Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		10
	2.1	Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	10
	2.2	ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	10
	2.3	Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	11
	2.4	Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	11

2.4.1 Outputs OUT1 - OUT11, ECV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2.5 SPI - Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3	Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		24
	3.1	Dual power supply: VS and VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	24
	3.2	Wake up and active mode / standby mode . . . . . . . . . . . . . . . . . . . . . . .	24
	3.3	Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	24
	3.4	Diagnostic functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	24
	3.5	Overvoltage and undervoltage detection at VS . . . . . . . . . . . . . . . . . . . .	25
	3.6	Overvoltage and undervoltage detection at VCC . . . . . . . . . . . . . . . . . . .	25
	3.7	Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . .	25
	3.8	Inductive loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	25
	3.9	Open load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	26
	3.10	Over-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	26
	3.11	Current monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	26
	3.12	PWM inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	26
	3.13	Cross-current protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	27

3.14Programmable soft-start function to drive loads with higher inrush current

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.15 Controller for electrochromic glass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

4	Functional description of the SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		29
	4.1	General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	29

4.1.1 Chip Select Not (CSN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4.1.2 Serial Data In (DI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

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L99DZ70XP	Contents

4.1.3 Serial Clock (CLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4.1.4 Serial Data Out (DO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4.1.5 SPI communication flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

4.2 Command byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

4.2.1 Operation code definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

4.3 Global status byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4.4 Address mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

5	SPI - control and status registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		34
	5.1	Control register 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	34
	5.2	Control register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	35
	5.3	Control register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	36
	5.4	Control register 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	37
	5.5	Status register 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	38
	5.6	Status register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	39
	5.7	Status register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	40
	5.8	Configuration register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	41
6	Packages thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		42
7	Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		43
	7.1	ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	43
	7.2	PowerSSO-36 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	43
	7.3	PowerSSO-36 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	45
8	Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		46

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List of tables	L99DZ70XP

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Pin definition and functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 4. ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 5. Operating junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 6. Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 7. Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 8. Overvoltage and under voltage detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 9. Current monitor output CM / PWM 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 10. Charge pump output CP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Table 11. On-resistance and switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Table 12. Current monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 13. Electrochrome control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 14. Delay time from standby to active mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 15. Inputs: CSN, CLK, PWM1/2 and DI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 16. SDI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 17. DO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 18. DO timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 19. CSN timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 20. SPI frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Table 21. Operation code definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Table 22. Global status byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Table 23. RAM memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Table 24. ROM memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Table 25. Control register 0 (read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 26. Control register 1 (read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Table 27. Control register 2 (read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Table 28. Control register 3 (read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Table 29. Status register 0 (read) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Table 30. Status register 1 (read) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Table 31. Status register 2 (read) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Table 32. Configuration register (read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 33. PowerSSO-36 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Table 34. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

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L99DZ70XP	List of figures

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 3. Electrochrome control block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 4. SPI - Transfer timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 5. SPI - Input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 6. SPI - DO valid data delay time and valid time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 7. SPI - DO enable and disable time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 8. SPI - driver turn on/off timing, minimum CSN HI time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 9. Example of programmable soft-start function for inductive loads . . . . . . . . . . . . . . . . . . . . 27 Figure 10. Write and read SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 11. Global error flag definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Figure 12. Packages thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Figure 13. PowerSSO-36 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Figure 14. PowerSSO-36 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Figure 15. PowerSSO-36 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

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Block diagram and pin description	L99DZ70XP

1 Block diagram and pin description

Figure 1. Block diagram

						VBAT
			STD18NF03L
				10k		100k
			VS	CP
L99PM62GXP	100µF					300mΩ
		100nF							M
							OUT1
			Charge			1600mΩ
								M
			Pump				OUT2
VCC						1600mΩ
			VCC					M
							OUT3
						150mΩ
							M
			ST SPI			150mΩ	OUT4
					& Diagnostic		OUT5
		DI				300mΩ	OUT6
	1k		SPI Interface				M
		DO				500/1800mΩ
	1k
		CLK						10 Watt
	1k						OUT7
		CSN
	1k					500/1800mΩ			progr. Bulb or LED Mode
					Interface			10 Watt
							OUT8
		PWM1				90mΩ
	1k
SPC560D					Driver		OUT11
			Standby				OUT9
						1600mΩ
							OUT10
						1600mΩ	STD18NF03L		All components to be
							ECDR (VS)
						EC Glass			placed together as close
									as possible
						Control Block
		CM/PWM2	CM			6BIT SPI controlled
		1k	MUX				5 nF	100 nF
						1600mΩ	ECV (VS)
					GND

Table 2.	Pin definition and functions
Pin	Symbol	Function
		Ground: reference potential.
1, 18, 19, 36	GND	Important: For the capability of driving the full current at the outputs all pins
		of GND must be externally connected!
		Highside driver output 11.
		The output is built by a highside switch and is intended for resistive loads,
		therefore the internal reverse diode from GND to the output is missing. For
2, 35	OUT11	ESD reason a diode to GND is present, but the energy which can be
		dissipated is limited. The highside driver is a power DMOS transistor with an
		internal parasitic reverse diode from the output to VS (bulk-drain-diode). The
		output is over-current protected.
		Important: for the capability of driving the full current at the outputs both pins
		of OUT11 must be externally connected!

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L99DZ70XP			Block diagram and pin description
	Table 2.	Pin definition and functions (continued)
	Pin	Symbol	Function
			Halfbridge outputs 1,2,3.
	3	OUT1,	The output is built by a highside and a lowside switch, which are internally
	4	OUT2,	connected. The output stage of both switches is a power DMOS transistor.
	5	OUT3	Each driver has an internal parasitic reverse diode (bulk-drain-diode:
			highside driver from output to VS, lowside driver from GND to output). This
			output is over-current protected.
			Power supply voltage (external reverse protection required).
	6, 7, 14, 15,		For this input a ceramic capacitor as close as possible to GND is
	23, 24, 28,	VS	recommended.
	29		Important: For the capability of driving the full current at the outputs all pins
			of VS must be externally connected!
			Serial data input.
	8	DI	The input requires CMOS logic levels and receives serial data from the
			microcontroller. The data is a 24 bit control word and the most significant bit
			(MSB, bit 23) is transferred first.
			Current monitor output/PWM2 input.
		CM/	Depending on the selected multiplexer bits of the control register this output
	9		sources an image of the instant current through the corresponding highside
		PWM2	driver with a ratio of 1/10.000 or 1/2000. This pin is bidirectional. The
			microcontroller can overdrive the current monitor signal to provide a second
			PWM input for the outputs OUT5, OUT8 and OUT10.
			Chip Select Not input / Testmode.
	10	CSN	This input is low active and requires CMOS logic levels. The serial data
			transfer between L99DZ70 and the microcontroller is enabled by pulling the
			input CSN to low level.
			Serial data output.
	11	DO	The diagnosis data is available via the SPI and this tristate-output. The
			output will remain in tristate, if the chip is not selected by the input CSN
			(CSN = high)
			Supply voltage.
	12	VCC	For this input a ceramic capacitor as close as possible to GND is
			recommended.
			Serial clock input.
	13	CLK	This input controls the internal shift register of the SPI and requires CMOS
			logic levels.
	16,17	OUT4,	Halfbridge outputs 4,5,6: see OUT1 (pin 3).
	20,21	OUT5,	Important: For the capability of driving the full current at the outputs both
	22	OUT6	pins of OUT4 (OUT5, respectively) must be externally connected!
			Electrocromic driver output.
			If the electrochrome mode is selected this pin is used to control the gate of
	25	ECDR	an external MOSFET, otherwise it remains in high-impedance state.
			Note: It is possible to connect the pin to VS as in L9950/53/54 applications,
			as long as the electrochome mode is not enabled via SPI.
			Charge pump output.
	26	CP	This output is provided to drive the gate of an external n-channel power
			MOS used for reverse polarity protection (see Figure 1.).

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Block diagram and pin description				L99DZ70XP
	Table 2.	Pin definition and functions (continued)
	Pin	Symbol	Function
			PWM1 input.
	27	PWM1	This input signal can be used to control the drivers OUT1-4, OUT6-7, OUT9
			and OUT11 and ECV by an external PWM signal.
			Highside driver outputs 7,8: see OUT9.
	30	OUT7,	By selection of one of the 2 power DMOS at same output is it possible to
	31	OUT8,	supply a bulb with low on-resistance or a LED with higher on-resistance in a
			different application.
			Electrochrome voltage input and lowside driver output.
	32	ECV	This input senses voltage in electrocrome mode for charge monitoring.
			The lowside switch provides a fast discharge of electrocromic mirror and can
			be used 'stand alone' as lowside switch beside electrocromic mode.
			Highside driver output 9.
			The output is built by a highside switch and is intended for resistive loads,
	33	OUT9	hence the internal reverse diode from GND to the output is missing. For
			ESD reason a diode to GND is present but the energy which can be
			dissipated is limited. The highside driver is a power DMOS transistor with an
			internal parasitic reverse diode from the output to VS (bulk-drain-diode). The
			output is over-current and open load protected.
			Highside driver output 10: see OUT9.
	34	OUT10	Important: beside the bit10 in control register 1 this output can be switched
			on setting bit1 for electrocromic control mode with higher priority.

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L99DZ70XP	Block diagram and pin description

Figure 2. Configuration diagram (top view)

GND 1

OUT11 2

OUT1 3

OUT2 4

OUT3 5

Vs 6

Vs 7

DI 8

CM / PWM2 9

CSN 10

DO 11

Vcc 12

CLK 13

Vs 14

Vs 15

OUT4 16

OUT4 17

GND 18

PowerSSO-36

36	GND
35	OUT11
34	OUT10
33	OUT9
32	ECV
31	OUT8
30	OUT7
29	Vs
28	Vs
27	PWM1
26	CP
25	ECDR
24	Vs
23	Vs
22	OUT6
21	OUT5
20	OUT5
19	GND

Note:

All pins with the same name must be externally connected.

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Electrical specifications	L99DZ70XP

2 Electrical specifications

2.1Absolute maximum ratings

Stressing the device above the rating listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document.

	Table 3.	Absolute maximum ratings
	Symbol		Parameter	Value	Unit
		Vs	DC supply voltage	-0.3...28	V
			Single pulse tmax < 400 ms	40	V
		Vcc	Stabilized supply voltage, logic supply	-0.3 to 5.5	V
	VDI, VDO, VCLK,		Digital input / output voltage	-0.3 to VCC + 0.3	V
	VCSN, VPWM
		VCM	Current monitor output	-0.3 to VCC + 0.3	V
		VCP	Charge pump output	-25 .. VS + 11	V
	VOUTn, ECDR, ECV		Static output voltage (n= 1 to 11)	-0.3 to VS + 0.3	V
	IOUT,2,3,9,10,		Output current	±1.25	A
		ECV
	IOUT1,6,7,8,		Output current	±5	A
	IOUT4,5,11		Output current	±10	A

2.2ESD protection

Table 4.	ESD protection
	Parameter	Value	Unit
All pins		± 2 (1)	kV
Output pins: OUT1 - OUT6, ECV		± 4 (2)	kV

1.HBM according to MIL 883C, Method 3015.7 or EIA/JESD22-A114-A.

2.HBM with all unzapped pins grounded.

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L99DZ70XP	Electrical specifications

2.3Thermal data

Table 5.	Operating junction temperature
Symbol	Parameter			Value				Unit
Tj	Operating junction temperature			-40 to 150				°C
Table 6.	Temperature warning and thermal shutdown
Symbol	Parameter			Min.	Typ.	Max.		Unit
TjTW ON	Temperature warning threshold junction	Tj		130		150		°C
	temperature
TjSD ON	Thermal shutdown threshold junction	Tj				170		°C
	temperature	increasing
TjSD OFF	Thermal shutdown threshold junction	Tj		150				°C
	temperature	decreasing
TjSD HYS	Thermal shutdown hysteresis				5			°K

2.4Electrical characteristics

VS = 8 to 16V, VCC= 4.5 to 5.3V, Tj = - 40 to 150°C, unless otherwise specified.

The voltages are referred to GND and currents are assumed positive, when the current flows into the pin.

Table 7.	Supply
Item	Symbol	Parameter	Test condition	Min.	Typ.	Max.	Unit
7.1	VS	Operating voltage range		7		28	V
			VS = 16 V, VCC = 5.3 V
7.2		VS DC supply current	active mode		7	20	mA
			OUT1 - OUT11, ECV,
			ECDR floating
	IS		VS = 16 V, VCC = 0 V
			standby mode
7.3		VS quiescent supply	OUT1 - OUT11, ECV,		4	12	µA
			ECDR floating
		current
			Ttest = -40°C, 25°C
7.4(1)			Ttest = 85°C		6	25

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Electrical specifications							L99DZ70XP
	Table 7.	Supply (continued)
	Item	Symbol	Parameter	Test condition	Min.	Typ.		Max.	Unit
				VS = 16 V, VCC = 5.3 V
	7.5		VCC DC supply current	CSN = VCC, active mode		1		3	mA
				OUT1 - OUT11, ECV,
				ECDR floating
				VS = 16 V,
		I		VCC = 5.3 VCSN = VCC
		CC		standby mode
	7.6(2)		VCC quiescent supply			3		6
				OUT1 - OUT11, ECV,					µA
			current	ECDR floating
				Ttest = -40°C, 25°C
	7.7(1)			Ttest = 85°C		5		10

1.This parameter is guaranteed by design.

2.CM/ PWM 2 = VCC or 0 V.

Table 8.	Overvoltage and under voltage detection
Item	Symbol	Parameter	Test condition	Min.	Typ.	Max.	Unit
8.1	VSUV on	VS UV-threshold voltage	VS increasing	5.6		7.2	V
8.2	VSUV off	VS UV-threshold voltage	VS decreasing	5.2		6.1	V
8.3	VSUV hyst	VS UV-hysteresis	VSUV ON - VSUV OFF		0.5		V
8.4	VSOV off	VS OV-threshold voltage	VS increasing	18		24.5	V
8.5	VSOV on	VS OV-threshold voltage	VS decreasing	17.5		23.5	V
8.6	VSOV hyst	VS OV-hysteresis	VSOV OFF - VSOV ON		1		V
8.7	VPOR off	Power-on-reset threshold	VCC increasing			2.9	V
8.8	VPOR on	Power-on-reset threshold	VCC decreasing	2.0			V
8.9	VPOR hyst	Power-on-reset hysteresis	VPOR OFF - VPOR ON		0.11		V

Table 9.		Current monitor output CM / PWM 2
Item	Symbol		Parameter	Test condition	Min.	Typ.	Max	Unit
9.1	VCM		Functional voltage		0		VCC-1V	V
			range
			Current monitor
			output ratio:			1
9.2			ICM / IOUT1,4,5,6,11
				0V <= VCM <= 4V		-----------------
			and 7,8			10.000
	ICM,r
			(low on-resistance)
				VCC=5V
			ICM / IOUT2,3,9,10			1
9.3			and 7,8			------------
						2000,
			(high on-resistance)

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L99DZ70XP

Electrical specifications

Table 9.

Current monitor output CM / PWM 2 (continued)

Item

Symbol

Parameter

Test condition

Min.

Typ.

Max

Unit

Current monitor

IOut,min= 500mA

accuracy

9.4

accICMOUT1,4,5,6,

IOut4,5,11max= 5.9A

IOut1,6 max= 2.9A

11and 7, 8

VCM <=

IOut7,8 max= 1.3A

4% +

8% +

ICM acc

(low on-res.)

3.8V,

1%FS

(1)

(1)

VCC = 5V

2%FS

accICMOUT2,3,9,10,

IOut,min= 100 mA

IOut2,3 max= 0.6 A

9.5

and 7, 8

IOut9,10max= 0.4 A

(high on-res.)

IOut8 max= 0.3 A

1. FS (full scale)= IOUTmax * ICM,r .

Table 10.

Charge pump output CP

Item

Symbol

Parameter

Test condition

Min.

Typ.

Max

Unit

10.1

Charge pump output

VS = 8V, ICP = -60µA

VS+6

VS+13

V

10.2

VCP

VS = 10V, ICP = -80µA

VS+8

VS+13

V

voltage

10.3

VS >=12V, ICP = -100µA

VS+10

VS+13

V

10.4

ICP

Charge pump output

VCP = VS+10V,

95

150

300

µA

current

VS =13.5V

2.4.1Outputs OUT1 - OUT11, ECV

Table 11.		On-resistance and switching times
Item		Symbol	Parameter	Test condition	Min.	Typ.	Max.	Unit
				VS = 13.5 V,
11.1				Tj = 25 °C,		300	400	mΩ
		rON OUT1,	On-resistance to	IOUT1,6 = ± 1.5 A
		rON OUT6	supply or GND	VS = 13.5 V,
11.2				Tj = 125 °C,		450	600	mΩ
				IOUT1,6 = ± 1.5 A
				VS = 13.5 V,
11.3				Tj = 25 °C,		1600	2200	mΩ
		rON OUT2,	On-resistance to	IOUT2,3 = ± 0.4A
		rON OUT3	supply or GND	VS = 13.5 V,
11.4				Tj = 125 °C,		2500	3400	mΩ
				IOUT2,3 = ± 0.4 A

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Electrical specifications								L99DZ70XP
	Table 11.		On-resistance and switching times (continued)
	Item		Symbol	Parameter	Test condition	Min.	Typ.	Max.	Unit
					VS = 13.5 V,
	11.5				Tj = 25 °C,		150	200	mΩ
			rON OUT4,	On-resistance to	IOUT4,5 = ± 3.0 A
			rON OUT5	supply or GND	VS = 13.5 V,
	11.6				Tj = 125 °C,		225	300	mΩ
					IOUT4,5 = ± 3.0 A
					VS = 13.5 V,
	11.7				Tj = 25 °C,		1600	2200	mΩ
			rON OUT9,	On-resistance	IOUT9,10 = -0.4 A
			rON OUT10	to supply	VS = 13.5 V,
	11.8				Tj = 125 °C,		2500	3400	mΩ
					IOUT9,10 = -0.4 A
					VS = 13.5 V,
	11.9				Tj = 25 °C,		90	130	mΩ
			rON OUT11	On-resistance	IOUT11 = -3.0 A
				to supply	VS = 13.5 V,
	11.10				Tj = 125 °C,		130	180	mΩ
					IOUT11 = -3.0 A
					VS = 13.5 V,
	11.11			On-resistance to	Tj = 25 °C,		500	700	mΩ
				supply in low mode	IOUT7,8 = - 0.8 A
				(control register 1
					VS = 13.5 V,
				bits 12 to15: 0101)
	11.12				Tj = 125 °C,		700	950	mΩ
			rON OUT7		IOUT7,8 = - 0.8 A
			rON OUT8		VS = 13.5 V,
	11.13			On-resistance to	Tj = 25 °C,		1800	2400	mΩ
				supply in high mode	IOUT7,8 = - 0.2 A
				(control register 1
					VS = 13.5 V,
				bits 12 to15: 1010)
	11.14				Tj = 125 °C,		2500	3400	mΩ
					IOUT7,8 = - 0.2 A
					VS = 13.5 V,
	11.15				Tj = 25 °C,		1600	2200	mΩ
			rON ECV	On-resistance to	IOUTECV = + 0.4 A
				GND	VS = 13.5 V,
	11.16				Tj = 125 °C,		2500	3400	mΩ
					IOUTECV = + 0.4 A
	11.17			Switched-off output	VOUT= 0V,	-5	-2		µA
					standby mode
			IQLH	current highside
	11.18			drivers of OUT1-6,	VOUT= 0V,	-10	-7		µA
				8-11
					active mode

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L99DZ70XP							Electrical specifications
	Table 11.		On-resistance and switching times (continued)
	Item		Symbol	Parameter	Test condition		Min.	Typ.	Max.	Unit
	11.19			Switched-off output		VOUT= 0V,	-5	-2		µA
					standby mode
			IQLH7,8	current highside
						VOUT= 0V,
	11.20			drivers of OUT7-8			-15	-10		µA
					active mode
	11.21			Switched-off output		VOUT= VS,		80	120	µA
					standby mode
				current lowside
						VOUT= 0V,
	11.22			drivers of OUT1-6			-10	-7		µA
					active mode
			IQLL
	11.23			Switched-off output		VOUT= VS,	-15		15	µA
					standby mode
				current lowside
						VOUT= VS,
	11.24			drivers of ECV			-10		10	µA
					active mode
				Output delay time,
	11.25			highside driver on			20	40	80	µs
				(OUTX except
				OUT7,8)
				Output delay time,
	11.26		td ON H	highside driver on	VS = 13.5 V,		15	35	60	µs
				(OUT7,8 in high	VCC = 5 V (1)(2)(3)
				RDSon mode)
				Output delay time,
	11.27			highside driver on			10	35	80	µs
				(OUT7,8 in low
				RDSon mode)
				Output delay time,
	11.28			highside driver off			60	150	200	µs
				(OUT1, 4, 5, 6, 11)
					VS = 13.5 V,
			td OFF H	Output delay time,
	11.29			highside driver off	VCC = 5 V(1)(2)(3)		40	70	100	µs
				(OUT2,3,7, high/low
				RDSon , 8 high/low
				RDSon , 9, 10)
					VS = 13.5 V,
	11.30		td ON L	Output delay time,		VCC = 5 V,	15	30	70	µs
				lowside driver On	corresponding
					highside driver is not
					active(1)(2)(3)
				Output delay time,
	11.31		td OFF L 1-6	lowside driver OUT			40	150	300	µs
				1-6 off		VS=13.5V,
				Output delay time,	V	=5V(1)(2)(3)
						CC
	11.32		td OFF L ECV	lowside driver ECV			15	45	80	µs
				off

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