The controller is an integrated circuit realized in BCD5 (BiCMOS-DMOS, version 5) fabrication
that provides complete control logic and protection for high performance step-down DC-DC and
niPOL converters.
It is designed to drive N-Channel MOSFETs in a synchronous rectified buck topology. The
output voltage of the converter can be precisely regulated down to 600mV with a maximum
tolerance of ±0.8% or to 1.2V, when one of the internal references is used. It is also possible to
use an external reference from 0V to 2.5V. The input voltage can range from 1.8V to 14V, while
the supply voltage can range from 4.5V to 14V. High peak current gate drivers provide for fast
switching to the external power section and the output current can be in excess of 20A,
depending on the number of the external MOSFETs used. The PWM duty cycle can range from
0% to 100% with a minimum on-time (T
with very low duty cycle and very high switching frequency.
The device provides voltage-mode control. It includes a 400KHz free-running oscillator that is
adjustable from 100KHz to 1MHz. The error amplifier features a 10MHz gain-bandwidthproduct and 5V/µs slew-rate that permits to realize high converter bandwidth for fast transient
response. The device monitors the current by using the R
side MOSFET(s), eliminating the need for a current sensing resistor and guaranteeing an
effective over-current-protection in all the application conditions. When necessary, two different
current limit protections can be externally set through two external resistors. A leading edge
adjustable blanking time is also available to avoid false over-current-protection (OCP)
interventions in every application condition. It is possible to select the HICCUP mode or the
constant current protection (L6730D) after the soft-start phase.
ON, MIN
) lower than 100ns making possible conversions
of both the high-side and low-
DS(on)
During the soft-start phase a constant current protection is provided. It is possible to select
(before the device turn-on) the sink-source or the source-only mode capability by acting on a
multifunction pin (L6730C). The L6730C disables the sink mode capability during the soft-start
in order to allow a proper start-up also in pre-biased output voltage conditions. The L6730D can
always sink current and so it can be used to supply the DDR Memory BUS termination. Other
features are Master-Slave synchronization (with 180° phase shift), Power-Good with adjustable
delay, over-voltage-protection, feed-back disconnection, selectable UVLO threshold (5V and
12V Bus) and thermal shutdown. The HTSSOP20 package allows the realization of really
compact DC/DC converters.
4/50
L6730C - L6730DSummary description
1.1 Functional description
Figure 1.Block diagram
VCC=4.5V to14V
V
=1.8V to14V
in
SS/INH
SYNCH
OSC
EAREF
PGOOD
SINK/OVP/UVLO*
TMASK
PGOOD
OCL
Monitor
Protection
and Ref
+
-
MASKING TIME
ADJUSTMENT
OCH
LDO
OSC
L6730C/D
0.6V
1.2V
-
+
FB
VCCDR
PWM
+
-
E/A
COMP
BOOT
HGATE
PHASE
LGATE
PGND
GND
Vo
Note:In the L6730D the multifunction pin is: CC/OVP/UVLO.
5/50
Electrical dataL6730C - L6730D
2 Electrical data
2.1 Maximum rating
Table 1.Absolute maximum ratings
Symbol Parameter Value Unit
V
CC
V
BOOT - VPHASE
V
HGATE - VPHASE
V
BOOT
VCC to GND and PGND, OCH, PGOOD
-0.3 to 18V
Boot Voltage0 to 6V
0 to V
BOOT
- V
PHASE
BOOT-0.3 to 24V
PHASE-1 to 18
V
PHASE
PHASE Spike, transient < 50ns (FSW = 500KHz)
-3
+24
OCH Pin
SS, FB, EAREF, SYNC, OSC, OCL, LGATE, COMP, S/O/
U, TMASK, PGOODELAY, V
CCDR
Maximum Withstanding Voltage Range
-0.3 to 6V
±1500
Test Condition: CDF-AEC-Q100-002 "Human Body Model"
OTHER PINS±2000
Acceptance Criteria: "Normal Performance"
2.2 Thermal data
Table 2.Thermal data
SymbolDescriptionHTSSOP20QFN4x4Unit
(1)
R
thJA
T
STG
T
J
T
A
1. Package mounted on demoboard
Max. Thermal Resistance Junction to ambient 5030°C/W
Storage temperature range-40 to +150°C
Junction operating temperature range-40 to +125°C
Ambient operating temperature range-40 to +85°C
V
V
VPGOOD Pin±1000
6/50
L6730C - L6730DPin connections and functions
3 Pin connections and functions
Figure 2.Pins connection (top view)
PGOOD DELAY
PGOOD DELAY
SYNCH
SYNCH
SINK/OVP/UVLO
TMASK
TMASK
GND
GND
FB
FB
COMP
COMP
SS/INH
SS/INH
EAREF
EAREF
OSC
OSC
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
10
HTSSOP20
HTSSOP20
20
20
PGOOD
PGOOD
19
19
VCC
VCC
18
18
VCCDR
VCCDR
17
17
LGATE
LGATE
16
16
PGND
PGND
15
15
BOOT
BOOT
14
14
HGATE
HGATE
13
13
PHASE
PHASE
12
12
OCH
OCH
11
11
OCL
OCL
HTSSOP20
1. In the L6730D the multifunction pin is: CC/OVP/UVLO.
Table 3.Pins connection
Pin n.NameDescription
Connecting a capacitor between this pin and ground a delay is introduced
between the trigger of the internal PGOOD comparator and the external signal
1PGOOD DELAY
rising edge. No delay can be introduced on the falling edge of the PGOOD
signal. The delay can be calculated with the following formula:
QFN 4x4 24L
2SYNCH
SINK/OVP/UVLO
L6730C
3
CC/OVP/UVLO
L6730D
()
[µs]
pFCPGDelay⋅=5.0
It is a Master-Slave pin. Two or more devices can be synchronized by simply
connecting the SYNCH pins together. The device operating with the highest
F
will be the Master. The Slave devices will operate with 180° phase shift
SW
from the Master. The best way to synchronize devices together is to set their
at the same value. If it is not used the SYNCH pin can be left floating.
F
SW
With this pin it is possible:
– To enable-disable the sink mode current capability after SS (L6730C);
– To enable-disable the constant current OCP after SS (L6730D);
– To enable-disable the latch mode for the OVP;
– To set the UVLO threshold for the 5V BUS and 12V BUS.
The device captures the analog value present at this pin at the start-up when
meets the UVLO threshold.
V
CC
7/50
Pin connections and functionsL6730C - L6730D
Table 3.Pins connection
By connecting this pin to V
4
5GNDAll the internal references are referred to this pin.
6FB
7COMP
8SS/INH
9EAREF
T
MASK
values for the leading edge blanking time on the peak-over-current-protection.
The device captures the analog value present at this pin at the start-up when
meets the UVLO threshold.
V
CC
This pin is connected to the error amplifier inverting input. Connect it to Vout
through the compensation network. This pin is also used to sense the output
voltage in order to manage the over voltage conditions and the PGood signal.
This pin is connected to the error amplifier output and is used to compensate
the voltage control loop.
The soft-start time is programmed connecting an external capacitor from this
pin and GND. The internal current generator forces a current of 10µA through
the capacitor. This pin is also used to inhibit the device: when the voltage at
this pin is lower than 0.5V the device is disabled.
It is possible to set two internal references 0.6V / 1.2V or provide an external
reference from 0V to 2.5V:
– V
– V
– V
An internal clamp limits the maximum V
captures the analog value present at this pin at the start-up when V
the UVLO threshold.
Connecting an external resistor from this pin to GND, the external frequency
can be increased according with the following equation:
from 0% to 80% of V
EAREF
from 80% to 95% of V
EAREF
from 95% to 100% of V
EAREF
or ground it is possible to select two different
CCDR
−> External Reference
CCDR
CCDR
CCDR
−> V
=1.2V
REF
−> V
=0.6V
REF
at 2.5V (typ.). The device
EAREF
meets
CC
10OSC
6
1088.9
400
Connecting a resistor from this pin to V
be lowered according with the following equation:
400
If the pin is left open, the switching frequency is 400 KHz. Normally this pin is at
a voltage of 1.2V. In OVP the pin is pulled up to 4.5V (only in latched mode).
Don’t connect a capacitor from this pin to GND.
+=
KHzFsw
CCDR
−=
KHzFsw
⋅
)(
Ω
KR
OSC
(5V), the switching frequency can
7
1001.3
⋅
)(
Ω
KR
OSC
8/50
L6730C - L6730DPin connections and functions
Table 3.Pins connection
A resistor connected from this pin to ground sets the valley- current-limit. The
valley current is sensed through the low-side MOSFET(s). The internal current
11OCL
12OCH
generator sources a current of 100µA (I
external resistor (R
). The over-current threshold is given by the following
OCL
equation:
I
VALLEY
Connecting a capacitor from this pin to GND helps in reducing the noise
injected from V
to the device, but can be a low impedance path for the high-
CC
frequency noise related to the GND. Connect a capacitor only to a “clean”
GND.
A resistor connected from this pin and the high-side MOSFET(s) drain sets the
peak-current-limit. The peak current is sensed through the high-side
MOSFET(s). The internal 100µA current generator (I
the drain through the external resistor (R
given by the following equation:
I
PEAK
) from this pin to ground through the
OCL
R
I
⋅
OCL
OCL
=
R2
⋅
DSonLS
) sinks a current from
OCH
). The over-current threshold is
OCH
R
I
⋅
OCH
OCH
=
R
DSonHS
This pin is connected to the source of the high-side MOSFET(s) and provides
13PHASE
the return path for the high-side driver. This pin monitors the drop across both
the upper and lower MOSFET(s) for the current limit together with OCH and
OCL.
14HGATEThis pin is connected to the high-side MOSFET(s) gate.
Through this pin is supplied the high-side driver. Connect a capacitor from this
15BOOT
pin to the PHASE pin and a diode from V
to this pin (cathode versus
CCDR
BOOT).
16PGND
This pin has to be connected closely to the low-side MOSFET(s) source in
order to reduce the noise injection into the device.
17LGATEThis pin is connected to the low-side MOSFET(s) gate.
18
19
V
CCDR
V
CC
5V internally regulated voltage. It is used to supply the internal drivers and as a
voltage reference. Filter it to ground with at least 1µF ceramic cap.
Supply voltage pin. The operative supply voltage range is from 4.5V to 14V.
This pin is an open collector output and it is pulled low if the output voltage is
20PGOOD
not within the specified thresholds (90%-110%). If not used it may be left
floating. Pull-up this pin to V
with a 10K resistor to obtain a logical signal.
CCDR
9/50
L6730C - L6730DElectrical characteristics
4 Electrical characteristics
V
= 12V, TA = 25°C unless otherwise specified
CC
Table 4.Electrical characteristics
Symbol Parameter Test condition Min. Typ. Max. Unit
V
supply current
CC
VCC Stand By current
I
CC
quiescent current
V
CC
Power-ON
Tu r n - O N V
5V BUS
Tu r n - O F F V
Tu r n - O N V
12V BUS
Tu r n - O F F V
Tu r n - O N V
V
V
CCDR
IN OK
Regulation
Tu r n - O F F V
V
CCDR
Soft Start and Inhibit
I
SS
Soft Start Current
thresholdV
CC
thresholdV
CC
thresholdV
CC
thresholdV
CC
threshold
OCH
threshold
OCH
voltage
OSC = open; SS to GND4.56.5
OSC= open;
HG = open, LG = open, PH=open
= 1.7V
OCH
= 1.7V
OCH
= 1.7V
OCH
= 1.7V
OCH
4.04.24.4
3.63.84.0
8.38.68.9
7.47.78.0
8.510
1.11.251.47
0.91.051.27
=5.5V to 14V
V
CC
= 1mA to 100mA
I
DR
4.555.5V
SS = 2V71013
SS = 0 to 0.5V203045
mA
V
µA
Oscillator
f
OSC
f
OSC,RT
∆V
OSC
Initial AccuracyOSC = OPEN380400420KHz
Total Accuracy
Ramp Amplitude 2.1V
Output Voltage (1.2V MODE)
V
FB
Output Voltage1.1901.21.208V
Output Voltage (0.6 MODE)
V
FB
Output Voltage 0.5970.6 0.603V
RT = 390KΩ to V
CCDR
RT = 18KΩ to GND
-1515%
10/50
L6730C - L6730DElectrical characteristics
Table 4.Electrical characteristics
Symbol Parameter Test Condition Min. Typ. Max. Unit
Error Amplifier
R
EAREF
I
FB
Ext Ref
Clamp
V
OFFSET
G
V
EAREF Input ResistanceVs. GND70100150kΩ
I.I. bias current
V
FΒ
0.2900.5µA
= 0V
2.3V
Error amplifier offsetVref = 0.6V-5+5mV
Open Loop Voltage GainGuaranteed by design100dB
GBWPGain-Bandwidth ProductGuaranteed by design10MHz
SRSlew-Rate
COMP = 10pF
Guaranteed by design
5V/µs
Gate Drivers
R
HGATE_ON
R
HGATE_OFF
R
LGATE_ON
R
LGATE_OFF
High Side Source Resistance
High Side Sink Resistance
Low Side Source Resistance
Low Side Sink Resistance
V
BOOT
V
BOOT
V
CCDR
V
CCDR
- V
- V
= 5V
= 5V
PHASE
PHASE
= 5V
= 5V
1.7Ω
1.12Ω
1.15Ω
0.6Ω
Protections
I
OCH
I
OCL
OVP
I
OSC
OCH Current Source
OCL Current Source90100110µΑ
Over Voltage Trip
(V
FB
/ V
EAREF
)
OSC Sourcing Current
= 1.7V
V
OCH
V
Rising
FB
V
= 0.6V
EAREF
V
Falling
FB
V
= 0.6V
EAREF
V
> OVP Trip V
FB
OSC
= 3V
90100110µΑ
120%
117%
30mA
Power Good
V
PGOOD
Upper Threshold
(V
FB
/ V
EAREF
)
Lower Threshold
(V
FB
/ V
EAREF
)
PGOOD Voltage Low
Rising
V
FB
V
Falling
FB
I
PGOOD
= -5mA
108110112%
889092%
0.5V
11/50
Electrical characteristicsL6730C - L6730D
Table 5.Thermal characterizations (V
CC
= 12V)
SymbolParameterTest ConditionMinTypMaxUnit
Oscillator
f
OSC
Initial Accuracy
OSC = OPEN;
=0°C~ 125°C
T
J
376400424KHz
Output Voltage (1.2V MODE)
T
= 0°C~ 125°C
V
FB
Output Voltage
J
T
= -40°C~ 125°C
J
1.1881.21.212V
1.1851.21.212V
Output Voltage (0.6V MODE)
T
= 0°C~ 125°C
V
FB
Output Voltage
J
T
= -40°C~ 125°C
J
0.5960.60.605V
0.5930.60.605V
12/50
L6730C - L6730DDevice description
5 Device description
5.1 Oscillator
The switching frequency is internally fixed to 400KHz. The internal oscillator generates the
triangular waveform for the PWM charging and discharging an internal capacitor (F
400KHz). This current can be varied using an external resistor (R
pin and GND or V
maintained at fixed voltage (typ. 1.2V), the frequency is increased (decreased) proportionally to
the current sunk (sourced) from (into) the pin. In particular, connecting R
frequency is increased (current is sunk from the pin), according to the following relationship:
in order to change the switching frequency. Since the OSC pin is
CCDR
6
1088.9
400
OSC
⋅
KR
+=
KHzFsw
Ω
(1)
)(
) connected between OSC
T
versus GND the
T
SW
=
Connecting R
the following relationship:
Switching frequency variation vs. R
Figure 3.Switching frequency variation versus R
to V
T
the frequency is reduced (current is sourced into the pin), according to
CCDR
400
−=
KHzFsw
is shown in Figure 3..
T
1500
1400
1300
1200
Rosc connected to GND
1100
1000
900
800
700
Fsw (KHz)
600
500
400
300
200
Rosc connected to Vccdr
100
0100200300400500600700800900 1000
OSC
.
T
7
1001.3
⋅
KR
Ω
(2)
)(
Rosc (KOHM )
13/50
Device descriptionL6730C - L6730D
5.2 Internal LDO
An internal LDO supplies the internal circuitry of the device. The input of this stage is the VCC
pin and the output (5V) is the V
Figure 4.LDO block diagram.
pin (see Figure 4.).
CCDR
4.5V÷ 14V
LDO
5.3 Bypassing the LDO to avoid the voltage drop with low Vcc
The LDO can be by-passed, providing directly a 5V voltage to V
V
pins must be shorted together as shown in Figure 5. V
CCDR
CCDR
least 1µF capacitor to sustain the internal LDO during the recharge of the bootstrap capacitor.
V
also represents a voltage reference for Tmask pin, S/O/U pin (L6730C) or CC/O/U pin
CCDR
(L6730D) and PGOOD pin (see Table 3: Pins connection).
If Vcc
≈ 5V the internal LDO works in dropout with an output resistance of about 1Ω.
The maximum LDO output current is about 100mA and so the output voltage drop can be
100mV: to avoid this the LDO can be bypassed.
. In this case Vcc and
CCDR
pin must be filtered with at
Figure 5.Bypassing the LDO
14/50
L6730C - L6730DDevice description
V
V
V
V
5.4 Internal and external references
It is possible to set two internal references, 0.6V and 1.2V or provide an external reference from
0V to 2.5V. The maximum value of the external reference depends on the V
the clamp operates at about 2V (typ.), while with V
greater than 5V the maximum external
CC
reference is 2.5V (typ.).
●V
●V
●V
from 0% to 80% of V
EAREF
from 80% to 95% of V
EAREF
from 95% to 100% of V
EAREF
−> External reference
CCDR
−> V
CCDR
CCDR
−> V
REF
REF
= 1.2V
= 0.6V
Providing an external reference from 0V to 450mV the output voltage will be regulated but
some restrictions must be considered:
●The minimum OVP threshold is set at 300mV;
●The under-voltage-protection doesn’t work;
●The PGOOD signal remains low;
To set the resistor divider it must be considered that a 100K pull-down resistor is integrated into
the device (see Figure 6.). Finally it must be taken into account that the voltage at the EAREF
pin is captured by the device at the start-up when Vcc is about 4V.
: with VCC = 4V
CC
5.5 Error amplifier
Figure 6.Error amplifier reference
CCDR
EAREF
100K
0.6
1.2
EXT
2.5
Error Amplifier Ref.
15/50
Device descriptionL6730C - L6730D
V
V
V
5.6 Soft start
When both VCC and VIN are above their turn-ON thresholds (VIN is monitored by the OCH pin)
the start-up phase takes place. Otherwise the SS pin is internally shorted to GND. At start-up, a
ramp is generated charging the external capacitor C
initial value for this current is 35µA and charges the capacitor up to 0.5V. After that it becomes
10µA until the final charge value of approximately 4V (see Figure 7.).
Figure 7.Device start-up: Voltage at the SS pin.
with an internal current generator. The
SS
ss
Vss
0.5V
0.5V
0.5V
4V
cc
in
4.2V or 8.6V
4.2V
1.25V
1.25V
4V
Vcc
Vin
t
t
16/50
L6730C - L6730DDevice description
The reference of the error amplifier is clamped with this voltage (Vss) until it reaches the
programmed value: 0.6V or 1.2V. During the soft-start phase the converter works in closed
loop. The L6730C can only source current during the soft-start phase in order to manage the
prebias start-up applications. The L6730D can always sink current and so it can be used to
supply the DDR Memory termination BUS. If an over current is detected during the soft-start
phase, the device provides a constant-current-protection. In this way, in case of short soft-start
time and/or small inductor value and/or high output capacitors value and thus, in case of high
ripple current during the soft-start, the converter can start-up in any case, limiting the current
(see section 4.5 Monitoring and protections) but not entering in HICCUP mode. The soft-start
phase ends when Vss reaches 3.5V. After that the over-current-protection triggers the HICCUP
mode (L6730C). With the L6730D there is the possibility to set the HICCUP mode or the
constant current mode after the soft-start acting on the multifunction pin CC/O/U. With the
L6730 the low-side MOSFET(s) management after soft-start phase depends on the S/O/U pin
state (see related section). If the sink-mode is enabled the converter can sink current after softstart (see figure 9) while, if the sink-mode is disabled the converter never sinks current (see
figure 10)..
Figure 8.Sink-mode enabled: Inductor current during and after soft-start (L6730C).
V
OUT
V
SS
V
CC
I
L
17/50
Device descriptionL6730C - L6730D
Figure 9.Sink-mode disabled: Inductor current during and after soft-start (L6730C).
Vout
Vss
Vcc
I
L
During normal operation, if any under-voltage is detected on one of the two supplies (VCC, VIN),
the SS pin is internally shorted to GND by an internal switch and so the SS capacitor is rapidly
discharged. Two different turn-on UVLO thresholds can be set: 4.2V for 5V BUS and 8.6V for
12V BUS.
18/50
L6730C - L6730DDevice description
5.7 Driver section
The high-side and low-side drivers allow using different types of power MOSFETs (also multiple
MOSFETs to reduce the R
supplied by V
time control avoids MOSFETs cross-conduction maintaining very short dead time duration (see
Figure 10.).
Figure 10. Dead times
while the high-side driver is supplied by the BOOT pin. A predictive dead
CCDR
), maintaining fast switching transitions. The low-side driver is
DS(on)
The control monitors the phase node in order to sense the low-side body diode recirculation. If
the phase node voltage is less than a certain threshold (-350mV typ.) during the dead time, it
will be reduced in the next PWM cycle. The predictive dead time control doesn’t work when the
high-side body diode is conducting because the phase node doesn’t go negative. This situation
happens when the converter is sinking current for example and, in this case, an adaptive dead
time control operates.
19/50
Device descriptionL6730C - L6730D
5.8 Monitoring and protections
The output voltage is monitored by the FB pin. If it is not within ±10% (typ.) of the programmed
value, the Power-Good (PGOOD) output is forced low. The PGOOD signal can be delayed by
adding an external capacitor on PGDelay pin (see Table 3: Pins connection and Figure 11.);
this can be useful to perform cascade sequencing. The delay can be calculated with the
following formula:
()
Figure 11. PGOOD signal
[pF] (3)
pFCPGDelay⋅=5.0
The device provides over-voltage-protection: when the voltage sensed on FB pin reaches a
value 20% (typ.) greater than the reference, the low-side driver is turned on. If the OVP notlatched mode has been set the low-side MOSFET is kept on as long as the over voltage is
detected (see Figure 12.).If OVP latched-mode has been set the low-side MOSFET is turned
on until Vcc is toggled (see Figure 13.). In case of latched-mode OVP the OSC pin is forced
high (4.5V typ.) if an over voltage is detected. .
Figure 12. OVP not latched
LGate
FB
OSC
20/50
L6730C - L6730DDevice description
Figure 13. OVP latched
LGate
OSC
FB
It must be taken into account that there is an electrical network between the output terminal and
the FB pin and therefore the voltage at this pin is not a perfect replica of the output voltage. If
the converter can sink current, in the most of cases the low-side will be turned-on before the
output voltage exceeds the over-voltage threshold, because the error amplifier will throw off
balance in advance. Even if the device doesn’t report an over-voltage, the behaviour is the
same, because the low-side is turned-on immediately. Instead, if the sink-mode is disabled, the
low-side will be turned-on only when the over-voltage-protection (OVP) operates and not
before, because the current can’t be reversed. In this case a delay between the output voltage
rising and the FB voltage rising can appear and the OVP can operate on late. The following two
figures show an over-voltage event in case of sink enabled and disabled. The output voltage
rises with a slope of 100mV/µs, emulating in this way the breaking of the high-side MOSFET as
an over-voltage cause.
Figure 14. OVP with sink enabled: the low-side MOSFET is turned-on in advance.
V
OUT
109%
FB
V
LGate
21/50
Device descriptionL6730C - L6730D
−
Figure 15. OVP with sink disabled: delay on the OVP operation.
126%
V
OUT
V
FB
LGate
The L6730D can always sink current and so the OVP will operate always in advance. The
device realizes the over-current-protection (OCP) sensing the current both on the high-side
MOSFET(s) and the low-side MOSFET(s) and so 2 current limit thresholds can be set (see
OCH pin and OCL pin in Table 3: Pins connection):
●Peak Current Limit
●Valley Current Limit
The Peak Current Protection is active when the high-side MOSFET(s) is turned on, after an
adjustable masking time (see Chapter 5.10 on page 25). The valley-current-protection is
enabled when the low-side MOSFET(s) is turned on after a fix masking time of about 400ns. If,
when the soft-start phase is completed, an over current event occurs during the on time (peakcurrent-protection) or during the off time (valley-current-protection) the device enters in
HICCUP mode (L6730C): the high-side and low-side MOSFET(s) are turned off, the soft-start
capacitor is discharged with a constant current of 10µA and when the voltage at the SS pin
reaches 0.5V the soft-start phase restarts. During the soft-start phase the OCP provides a
constant-current-protection. If during the T
the OCH comparator triggers an over current the
ON
high-side MOSFET(s) is immediately turned-off (after the masking time and the internal delay)
and returned-on at the next pwm cycle. The limit of this protection is that the Ton can’t be less
than masking time plus propagation delay (see Chapter 5.9: Adjustable masking time on
page 25) because during the masking time the peak-current-protection is disabled. In case of
very hard short circuit, even with this short T
, the current could escalate. The valley-current-
ON
protection is very helpful in this case to limit the current. If during the off-time the OCL
comparator triggers an over current, the high-side MOSFET(s) is not turned-on until the current
is over the valley-current-limit. This implies that, if it is necessary, some pulses of the high-side
MOSFET(s) will be skipped, guaranteeing a maximum current due to the following formula:
VoutVin
II
+=
T
⋅
L
(4)
MINONVALLEYMAX
,
In constant current protection a current control loop limits the value of the error amplifier’s
output (comp), in order to avoid its saturation and thus recover faster when the output returns in
regulation. Figure 16. shows the behaviour of the device during an over current condition that
persists also in the soft-start phase.
22/50
L6730C - L6730DDevice description
Figure 16. Constant current and Hiccup Mode during an OCP (L6730C).
VSS
VCOMP
I
L
Using the L6730D there is the possibility to set the constant-current-protection also after the
soft-start. The following figures show the behaviour of the L6730D during an overcurrent event.
Figure 17. Peak overcurrent-protection in constant-current-protection (L6730D).
V
OUT
Peak th
T
I
L
I
OUT
ON
Figure 17. shows the intervention of the peak OCP: the high-side MOSFET(s) is turned-off
when the current exceeds the OCP threshold. In this way the duty-cycle is reduced, the V
reduced and so the maximum current can be fixed even if the output current is escalating.
Figure 18. shows the limit of this protection: the on-time can be reduced only to the masking
time and, if the output current continues to increase, the maximum current can increase too.
Notice how the Vout remains constant even if the output current increases because the on-time
cannot be reduced anymore.
OUT
is
23/50
Device descriptionL6730C - L6730D
Figure 18. Peak OCP in case of heavy overcurrent (L6730D).
V
OUT
I
L
I
OUT
If the current is higher than the valley OCP threshold during the off-time, the high-side
MOSFET(s) will not be turned-on. In this way the maximum current can be limited (Figure 19.).
Figure 19. Valley OCP (L6730D).
V
OUT
I
L
Valley th
T
OFF
24/50
T
OFF
L6730C - L6730DDevice description
During the constant-current-protection if the Vout becomes lower than 80% of the programmed
value an UV (under-voltage) is detected and the device enters in HICCUP mode. The undervoltage-lock-out (UVLO) is adjustable by the multifunction pin (see Chapter 5.10 on page 25).
It’s possible to set two different thresholds:
●4.2V for 5V Bus
●8.6V for 12V Bus
Working with a 12V BUS, setting the UVLO at 8.6V can be very helpful to limit the input current
in case of BUS fall.
5.9 Adjustable masking time
By connecting the masking-time pin to V
or GND it is possible to select two different
CCDR
values for the peak -current-protection leading edge blanking time. This is useful to avoid any
false OCP trigger due to spikes and oscillations generated at the turn-on of the high-side
MOSFET(s). The amount of this noise depends a lot on the layout, MOSFETs, free-wheeling
diode, switched current and input voltage. In case of good layout and medium current, the
minimum masking time can be chosen, while in case of higher noise, it’s better to select to
maximum one. Connecting Tmask pin to V
the masking time is about 400ns while
CCDR
connecting it to GND the resulting masking time is about 260ns.
●To enable-disable the sink-mode-current capability (L6730C) or the constant current
protection (L6730D) at the end of the soft-start;
●To enable-disable the latch-mode for the OVP;
●To set the UVLO threshold for 5V BUS and 12V BUS.
Ta bl e 6 shows how to set the different options through an external resistor divider:
Figure 20. External resistor
R1
R2
VCCDR
S/O/U
CC/O/U
L6730C/D
L6730/B
25/50
Device descriptionL6730C - L6730D
≤
≤
Table 6.S/O/U pin; CC/O/U pin
R1R2
N.C0Ω05V BUSNot LatchedNot
11KΩ2.7KΩ0.25V BUSNot LatchedYes
6.2KΩ2.7KΩ0.35V BUSLatchedNot
4.3KΩ2.7KΩ0.45V BUSLatchedYes
2.7KΩ2.7KΩ0.512V BUSNot LatchedNot
1.8KΩ2.7KΩ0.612V BUSNot LatchedYes
1.2KΩ2.7KΩ0.712V BUSLatchedNot
0ΩN.C112V BUSLatchedYes
V
SOU/VCCDR
UVLOOVPSINK CC
5.11 Synchronization
The presence of many converters on the same board can generate beating frequency noise. To
avoid this it is important to make them operate at the same switching frequency. Moreover, a
phase shift between different modules helps to minimize the RMS current on the common input
capacitors. Figure 21. shows the results of two modules in synchronization. Two or more
devices can be synchronized simply connecting together the SYNCH pins. The device with the
higher switching frequency will be the Master while the other one will be the Slave. The Slave
controller will increase its switching frequency reducing the ramp amplitude proportionally and
then the modulator gain will be increased.
Figure 21. Synchronization.
PWM SIGNALS
To avoid a huge variation of the modulator gain, the best way to synchronize two or more
devices is to make them work at the same switching frequencyand, in any case, the switching
frequencies can differ for a maximum of 50% of the lowest one. If, during synchronization
between two (or more) L6730, it’s important to know in advance which the master is, it’s timely
to set its switching frequency at least 15% higher than the slave. Using an external clock signal
(f
) to synchronize one or more devices that are working at a different switching frequency
EXT
(f
) it is recommended to follow the below formula:
SW
INDUCTOR CURRENTS
fff⋅
3,1
SWEXTSW
The phase shift between master and slaves is approximately done 180°.
26/50
L6730C - L6730DDevice description
5.12 Thermal shutdown
When the junction temperature reaches 150°C ±10°C the device enters in thermal shutdown.
Both MOSFETs are turned OFF and the soft-start capacitor is rapidly discharged with an
internal switch. The device does not restart until the junction temperature goes down to 120°C
and, in any case, until the voltage at the soft-start pin reaches 500mV.
5.13 Minimum on-time (T
The device can manage minimum on-times lower than 100ns. This feature comes from the
control topology and from the particular over-current-protection system of the L6730C L6730D. In fact, in a voltage mode controller the current has not to be sensed to perform the
regulation and, in the case of L6730C - L6730D, neither for the over-current protection, given
that during the off-time the valley-current-protection can operate. The first advantage related to
this feature is the possibility to realize extremely low conversion ratios. Figure 22. shows a
conversion from 14V to 0.5V at 820KHz with a T
turn-on and turn-off times of the MOSFETs.
Figure 22. 14V -> 0.5V@820KHz, 5A
ON, MIN
)
of about 50ns. The on-time is limited by the
ON
50ns
27/50
Device descriptionL6730C - L6730D
5.14 Bootstrap anti-discharging system
This built-in system avoids that the voltage across the bootstrap capacitor becomes less than
3.3V. An internal comparator senses the voltage across the external bootstrap capacitor
keeping it charged, eventually turning-on the low-side MOSFET for approximately 200ns. If the
bootstrap capacitor is not enough charged the high-side MOSFET cannot be effectively turnedon and it will present a higher R
possible to mention at least two application conditions during which the bootstrap capacitor can
be discharged:
5.14.1 Fan’s power supply
In many applications the FAN is a DC MOTOR driven by a voltage-mode DC/DC converter.
Often only the speed of the MOTOR is controlled by varying the voltage applied to the input
terminal and there’s no control on the torque because the current is not directly controlled.
Obviously the current has to be limited in case of overload or short-circuit but without stopping
the MOTOR. With the L6730D the current can be limited without shutting down the system
because a constant-current-protection is provided. In order to vary the MOTOR speed the
output voltage of the converter must be varied. Both L6730C and L6730D have a dedicated pin
called EAREF (see the related section) that allows providing an external reference to the noninverting input of the error-amplifier.
In these applications the duty cycle depends on the MOTOR’s speed and sometimes 100% has
to be set in order to go at the maximum speed. Unfortunately in these conditions the bootstrap
capacitor can not be recharged and the system cannot work properly. Some PWM controller
limits the maximum duty-cycle to 80-90% in order to keep the bootstrap cap charged but this
make worse the performance during the load transient. Thanks to the “bootstrap antidischarging system” the L6730X can work at 100% without any problem. The following picture
shows the device behaviour when input voltage is 5V and 100% is set by the external
reference.
. In some cases the OCP can be also triggered. It’s
DS(on)
Figure 23. 100% duty cycle operation
T
≈
OFF
OFF
≈
200ns
200ns
T
V
= 5V
OUT
Vout=5V
Vout=5V
VIN = 5V
Vin=5V
Vin=5V
LGate
LGate
LGate
FSW
≈
6.3KHz
Fsw?6.3KHz
Fsw?6.3KHz
28/50
L6730C - L6730DDevice description
5.14.2 No-sink at zero current operation
The L6730C can work in no-sink mode. If output current is zero the converter skip some pulses
and works with a lower switching frequency. Between two pulses can pass a relatively long time
(say 200-300µs) during which there’s no switching activity and the current into the inductor is
zero. In this condition the phase node is at the output voltage and in some cases this is not
enough to keep the bootstrap cap charged. For example, if Vout is 3.3V the voltage across the
bootstrap cap is only 1.7V. The high-side MOSFET cannot be effectively turned-on and the
regulation can be lost. Thanks to the “bootstrap anti-discharging system” the bootstrap cap is
always kept charged. The following picture shows the behaviour of the device in the following
conditions: 12V◊3.3V@0A.
Figure 24. 12V -> 3.3V@0A in no-sink
I
L
Pulse trainMinimum Bootstrap VoltageV
PHASE
It can be observed that between two pulses trains the low-side is turned-on in order to keep the
bootstrap cap charged.
29/50
Application detailsL6730C - L6730D
−
V
V
V
V
6 Application details
6.1 Inductor design
The inductance value is defined by a compromise between the transient response time, the
efficiency, the cost and the size. The inductor has to be calculated to maintain the ripple current
(∆I
) between 20% and 30% of the maximum output current. The inductance value can be
L
calculated with the following relationship:
Where F
is the switching frequency, VIN is the input voltage and V
SW
Figure 25. shows the ripple current vs. the output voltage for different values of the inductor,
with Vin = 5V and Vin = 12V at a switching frequency of 400KHz.
Figure 25. Inductor current ripple.
8
7
6
5
4
3
2
1
INDUCTOR CURRENT RIPPL
0
01234
L
≅
OUTPUT VOLTAGE (V)
VoutVin
Vout
⋅
∆⋅
Vin
IFsw
L
(6)
is the output voltage.
OUT
in = 1 2 V , L = 1 u H
in = 1 2 V , L = 2 u H
in = 5 V, L=500nH
in = 5 V , L = 1 .5 u H
Increasing the value of the inductance reduces the current ripple but, at the same time,
increases the converter response time to a load transient. If the compensation network is well
designed, during a load transient the device is able to set the duty cycle to 100% or to 0%.
When one of these conditions is reached, the response time is limited by the time required to
change the inductor current. During this time the output current is supplied by the output
capacitors. Minimizing the response time can minimize the output capacitor size.
30/50
L6730C - L6730DApplication details
6.2 Output capacitors
The output capacitors are basic components for the fast transient response of the power
supply. They depend on the output voltage ripple requirements, as well as any output voltage
deviation requirement during a load transient. During a load transient, the output capacitors
supply the current to the load or absorb the current stored into the inductor until the converter
reacts. In fact, even if the controller recognizes immediately the load transient and sets the duty
cycle at 100% or 0%, the current slope is limited by the inductor value. The output voltage has
a first drop due to the current variation inside the capacitor (neglecting the effect of the ESL):
ESRIoutVout
ESR
Moreover, there is an additional drop due to the effective capacitor discharge or charge that is
given by the following formulas:
Vout
Formula (8) is valid in case of positive load transient while the formula (9) is valid in case of
negative load transient. D
100%. For a given inductor value, minimum input voltage, output voltage and maximum load
transient, a maximum ESR and a minimum C
also affect the static output voltage ripple. In the worst case the output voltage ripple can be
calculated with the following formula:
Usually the voltage drop due to the ESR is the biggest one while the drop due to the capacitor
discharge is almost negligible.
COUT
=∆
Vout
MAX
=∆
COUT
is the maximum duty cycle value that in the L6730C - L6730D is
2
(
ESRIVout
L
⋅∆=∆
2
2
⋅∆
VoutCout
⋅⋅
OUT
+⋅∆=∆
8
(7)
LIout
⋅∆
VoutDVinCout
−⋅⋅⋅
(8)
)maxmin,(2
LIout
(9)
value can be set. The ESR and C
1
)
⋅⋅
FswCout
(10)
OUT
values
6.3 Input capacitors
The input capacitors have to sustain the RMS current flowing through them, that is:
Where D is the duty cycle. The equation reaches its maximum value, I
losses in worst case are:
(11)
)1(DDIoutIrms−⋅⋅=
/2 with D = 0.5. The
OUT
2
(12)
)5.0(IoutESRP⋅⋅=
31/50
Application detailsL6730C - L6730D
6.4 Compensation network
The loop is based on a voltage mode control (Figure 26.). The output voltage is regulated to the
internal/external reference voltage and scaled by the external resistor divider. The error
amplifier output V
width modulated (PWM) with an amplitude of V
by the output filter. The modulator transfer function is the small signal transfer function of V
V
and a zero at F
simply the input voltage V
Figure 26. Compensation network
. This function has a double pole at frequency FLC depending on the L-Cout resonance
COMP
ESR
is then compared with the oscillator triangular wave to provide a pulse-
COMP
depending on the output capacitor’s ESR. The DC Gain of the modulator is
divided by the peak-to-peak oscillator voltage: V
IN
Z
FB
at the PHASE node. This waveform is filtered
IN
.
OSC
Z
IN
OUT
/
The compensation network consists in the internal error amplifier, the impedance networks Z
(R3, R4 and C20) and Z
closed loop transfer function with the highest 0dB crossing frequency to have fastest transient
response (but always lower than f
load regulation error. A stable control loop has a gain crossing the 0dB axis with -20dB/decade
slope and a phase margin greater than 45°. To locate poles and zeroes of the compensation
networks, the following suggestions may be used:
●Modulator singularity frequencies:
ω
●Compensation network singularity frequencies:
=
ω
P
1
ω
Z
(R5, C18 and C19). The compensation network has to provide a
FB
/10) and the highest gain in DC conditions to minimize the
SW
1
=
CoutLLC⋅
1
⎛
⎜
⋅
R
5
⎜
⎝
1
=
1
⋅
CR
(13)
(15)
⎞
⋅
CC
1918
⎟
⎟
+
CC
1918
⎠
(17)
195
ω
ω
ESR
Z
=
ω
=
2
1
CoutESR
⋅
1
=
2
CRP⋅
204
1
()
+⋅
RRC
4320
(14)
(16)
(18)
IN
32/50
L6730C - L6730DApplication details
●Compensation network design:
–Put the gain R
in order to obtain the desired converter bandwidth
5/R3
Vin
R
5
⋅=
∆
R
3
Vosc
ϖϖ
⋅
(18)
LCC
–Place ω
–Place ω
–Place ω
–Place ω
before the output filter resonance ωLC;
Z1
at the output filter resonance ωLC;
Z2
at the output capacitor ESR zero ω
P1
at one half of the switching frequency;
P2
ESR
–Check the loop gain considering the error amplifier open loop gain.
Figure 27. Asymptotic bode plot of converter's open loop gain
;
33/50
Application detailsL6730C - L6730D
6.5 Two quadrant or one quadrant operation mode (L6730C)
After the soft-start phase the L6730C can work in source only (one quadrant operation mode)
or in sink/source (two quadrant operation mode), depending on the setting of the multifunction
pin (see Chapter 5.10 on page 25). The choice of one or two quadrant operation mode is
related to the application. One quadrant operation mode permits to have a higher efficiency at
light load, because the converter works in discontinuous mode (see Figure 28.). Nevertheless
in some cases, in order to maintain a constant switching frequency, it’s preferable to work in two
quadrants, even at light load. In this way the reduction of the switching frequency due to the
pulse skipping is avoided. To parallel two or more modules is requested the one quadrant
operation in order not to have current sinking between different converters. Finally the two
quadrant operation allows faster recovers after negative load transient. For example, let’s
consider that the load current falls down from I
than L/V
(where L is the inductor value). Even considering that the converter reacts
OUT
instantaneously setting to 0% the duty-cycle, the energy ½*L*I
transferred to the output capacitors, increasing the output voltage. If the converter can sink
current this overvoltage can be faster eliminated.
Figure 28. Efficiency in discontinuous-current-mode and continuous-current-mode.
EFFICIENCY: DCM vs. CCM
to 0A with a slew rate sufficiently greater
OUT
2
stored in the inductor will be
OUT
0.7
0.6
0.5
0.4
EFF. (%
0.3
0.2
0.1
00.20.40.60.811.21.41.61.82
OUTPUT CURRENT (A)
EFFICIENCY DCM
EFFICIENCY CCM
34/50
L6730C - L6730DL6730 Demoboard
7 L6730 Demoboard
7.1 Description
L6730 demoboard realizes in a four layer PCB a step-down DC/DC converter and shows the
operation of the device in a general purpose application. The input voltage can range from 4.5V
to 14V and the output voltage is at 3.3V. The module can deliver an output current in excess of
30A. The switching frequency is set at 400 KHz (controller free-running F
increased up to 1MHz. A 7 positions dip-switch allows to select the UVLO threshold (5V or 12V
Bus), the OVP intervention mode and the sink-mode current capability.
Figure 29. Demoboard picture.
Top sideBottom side
) but it can be
SW
35/50
L6730 DemoboardL6730C - L6730D
7.2 PCB layout
Figure 30. Top layerFigure 31. Power ground layer
Figure 32. Signal ground layerFigure 33. Bottom layer
36/50
L6730C - L6730DL6730 Demoboard
Figure 34. Demoboard schematic
Table 7.Demoboard part list
ReferenceValueManufacturerPackageSupplier
R1820ΩNeohmSMD 0603IFARCAD
R20ΩNeohmSMD 0603IFARCAD
R3N.C.
R410Ω 1% 100mWNeohmSMD 0603IFARCAD
R511K 1% 100mWNeohmSMD 0603IFARCAD
R66K2 1% 100mWNeohmSMD 0603IFARCAD
R74K3 1% 100mWNeohmSMD 0603IFARCAD
R82K7 1% 100mWNeohmSMD 0603IFARCAD
R91K8 1% 100mWNeohmSMD 0603IFARCAD
R101K2 1% 100mWNeohmSMD 0603IFARCAD
R112K7 1% 100mWNeohmSMD 0603IFARCAD
R121KNeohmSMD 0603IFARCAD
37/50
L6730 DemoboardL6730C - L6730D
Table 7.Demoboard part list
ReferenceValueManufacturerPackageSupplier
R132K7 1% 100mWNeohmSMD 0603IFARCAD
R141K 1% 100mWNeohmSMD 0603IFARCAD
R151K 1% 100mWNeohmSMD 0603IFARCAD
R164K7 1% 100mWNeohmSMD 0603IFARCAD
R17N.C.
R182.2ΩNeohmSMD 0603IFARCAD
R192.2ΩNeohmSMD 0603IFARCAD
R2010K 1% 100mWNeohmSMD 0603IFARCAD
R21N.C.
R22N.C.
R230ΩNeohmSMD 0603IFARCAD
C1220nFKemetSMD 0603IFARCAD
C3-C7-C9-C15-C21100nFKemetSMD 0603IFARCAD
C21nF.KemetSMD 0603IFARCAD
C4-C6100uF 20VOSCON 20SA100MRADIAL 10X10.5SANYO
C84.7uF 20VAVXSMA6032IFARCAD
C1010nFKemetSMD 0603IFARCAD
C11N.C.
C1247nFKemetSMD 0603IFARCAD
C131.5nFKemetSMD 0603IFARCAD
C144.7nFKemetSMD 0603IFARCAD
C18-C19330uF 6.3VPOSCAP 6TPB330MSMDSANYO
C20N.C.
L11.8uHPanasonicSMDST
D11N4148STSOT23IFARCAD
D2STS1L30MSTDO216AASTMicroelectronics
Q1-Q2STS12NH3LLSTSO8STMicroelectronics
Q4-Q5STSJ100NH3LLSTSO8STMicroelectronics
U1L6730STHTSSOP20STMicroelectronics
SWITCHDIP SWITCH 7 POS.STMicroelectronics
38/50
L6730C - L6730DL6730 Demoboard
Table 8.Other inductor manufacturer
Manufacturer Series Inductor Value (µH) Saturation Current (A)
WURTH ELEKTRONIC 7443181801.8 20
SUMIDA CDEP134-2R7MC-H 2.715
EPCOS HPI_13 T640 1.4 22
TDK SPM12550T-1R0M220 122
TOKO FDA1254 2.2 14
COILTRONICS
Table 9.Other capacitor manufacturer
ManufacturerSeriesCapacitor value(µF)Rated voltage (V)
HCF1305-1R0 1.15 22
HC5-1R0 1.3 27
TDK
NIPPON CHEMI-CON25PS100MJ1210025
PANASONICECJ4YB0J107M1006.3
C4532X5R1E156M1525
C3225X5R0J107M1006.3
39/50
I/O DescriptionL6730C - L6730D
8 I/O Description
Figure 35. Demoboard
Table 10.I/O Functions
SymbolFunction
The input voltage can range from 1.8V to 14V. If the input voltage is between 4.5V and 14V
Input (V
Output (V
)
IN-GIN
OUT-GOUT
it can supply also the device (through the VCC pin) and in this case the pin 1 and 2 of the
jumper G1 must be connected together.
The output voltage is fixed at 3.3V but it can be changed by replacing the resistor R14 of the
output resistor divider:
)
The over-current-protection limit is set at 15A but it can be changed by replacing the
resistors R1 and R12 (see OCL and OCH pin in Table 3: Pins connection).
Using the input voltage to supply the controller no power is required at this input.
VCC-GND
CC
V
CCDR
TP1
TP2This test point is connected to the Tmask pin (see Table 3: Pins connection).
However the controller can be supplied separately from the power stage through
the V
An internal LDO provides the power into the device. The input of this stage is the VCC pin
and the output (5V) is the Vccdr pin. The LDO can be bypassed, providing directly a 5V
voltage from V
shorted.
This pin can be used as an input or as a test point. If all the jumper G2 pins are shorted, TP1
can be used as a test point of the voltage at the EAREF pin. If the pins 2 and 3 of G2 are
connected together, TP1 can be used as an input to provide an external reference for the
internal error amplifier (see section 4.3. Internal and external references).
input (4.5-14V) and, in this case, jumper G1 must be left open.
CC
and Gndcc. In this case the pins 1 and 3 of the jumper G1 must be
CCDR
R
VVo
REF
16
)1(
+⋅=
R
14
TP3This test point is connected to the S/O/U pin (see Chapter 5.10 on page 25).
40/50
L6730C - L6730DI/O Description
Table 10.I/O Functions
SYNCHThis pin is connected to the synch pin of the controller (see Chapter 5.11 on page 26).
PWRGDThis pin is connected to the PGOOD pin of the controller.
DIP SWITCH
Table 11.Dip switch
Different positions of the dip switch correspond to different settings of the multifunction pin
(S/O/U) (CC/O/U).
UVLOOVPSINK CC
5VNot LatchedNot0S7A
5VNot LatchedYes0.2S1-S7B
5VLatchedNot0.3S2-S7C
5VLatchedYes0.4S3-S7D
12VNot LatchedNot0.5S4-S7E
12VNot LatchedYes0.6S5-S7F
12VLatchedNot0.7S6-S7G
12VLatchedYes1S1H
Vsou/V
CCDR
DIP SWITCHSTATE
41/50
EfficiencyL6730C - L6730D
Y
Y
9 Efficiency
The following figures show the demoboard efficiency versus load current for different values of
input voltage and switching frequency:
Figure 36. Demoboard efficiency 400KHz
95.00%
90.00%
85.00%
EFFICIENC
80.00%
75.00%
V
VIN = 5V
IN = 5VVIN = 5V
VIN = 12V
13579111315
Figure 37. Demoboard efficiency 645KHz
95.00%
Fsw=400KHz
Iout (A)
Fsw=645KHz
VO = 3.3V
V
= 3.3V
O
90.00%
85.00%
80.00%
EFFICIENC
75.00%
70.00%
42/50
VIN = 5V
VIN = 12V
13579111315
Iout (A)
L6730C - L6730DEfficiency
Y
Figure 38. Demoboard efficiency 1MHz
Fsw=1MHz
VO = 3.3V
95.00%
90.00%
85.00%
VIN = 5V
80.00%
75.00%
EFFICIENC
70.00%
65.00%
60.00%
13579111315
Iout (A)
Figure 39. Efficiency with 2xSTS12NH3LL+2XSTSJ100NH3LL
12V-->3.3V
0.96
0.95
0.94
0.93
0.92
0.91
0.9
EFFICIENCY (%)
0.89
0.88
0.87
35791113151719
VIN = 12V
400KHz
700KHz
1MHz
OUTPUT CURRENT (A)
43/50
POL DemoboardL6730C - L6730D
10 POL Demoboard
10.1 Description
A compact demoboard has been realized to manage currents in the range of 10-15A. Figure
36. shows the schematic and Table 9. the part list. Multi-layer-ceramic-capacitors (MLCCs)
have been used on the input and the output in order to reduce the overall size.
Figure 40. Pol demoboard schematic.
Table 12.Pol demoboard part list.
ReferenceValueManufacturerPackageSupplier
R11K8ΩNeohmSMD 0603IFARCAD
R210KΩNeohmSMD 0603IFARCAD
R3N.C.
R410Ω NeohmSMD 0603IFARCAD
R511K 1% 100mWNeohmSMD 0603IFARCAD
R62K7 1% 100mWNeohmSMD 0603IFARCAD
R7N.C.NeohmSMD 0603IFARCAD
R80Ω NeohmSMD 0603IFARCAD
R93K 1% 100mWNeohmSMD 0603IFARCAD
R104K7 1% 100mWNeohmSMD 0603IFARCAD
44/50
L6730C - L6730DPOL Demoboard
Y
Table 12.Pol demoboard part list.
R1115Ω 1% 100mWNeohmSMD 0603IFARCAD
R124K7 1% 100mWNeohmSMD 0603IFARCAD
R131K 1% 100mWNeohmSMD 0603IFARCAD
R142.2ΩNeohmSMD 0603IFARCAD
R152.2ΩNeohmSMD 0603IFARCAD
C1-C7220nFKemetSMD 0603IFARCAD
C6- C19-C20-C9100nFKemetSMD 0603IFARCAD
C21nFKemetSMD 0603IFARCAD
C11N.C.
C1268nFKemetSMD 0603IFARCAD
C13220pF KemetSMD0603IFARCAD
C84.7uF 20VAVXSMA6032IFARCAD
C146.8nFKemetSMD 0603IFARCAD
C3-C4-C515uFTDK MLC
C4532X5R1E156M
C15-C16-C17-C18100uFPANASONIC MLC P/N
ECJ4YBOJ107M
L11.8uHPanasonicSMDST
D1STS1L30MSTDO216AAST
Q1STS12NH3LLSTPOWER SO8ST
Q2STSJ100NH3LLSTPOWER SO8ST
U1L6730STHTSSOP20ST
SMD1812IFARCAD
SMD 1210IFARCAD
Figure 41. Pol Demoboard efficiency
0.94
0.92
0.9
0.88
0.86
EFFICIENC
0.84
0.82
1357911
12V-->3.3V@400KHz
OUTP UT CURRENT (A)
45/50
Package mechanical dataL6730C - L6730D
11 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second Level Interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com.
L 0.450 0.600 0.750 0.018 0.024 0.030
L1 1.000 0.039
k 0° min., 8° max.
aaa 0.100 0.004
1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions. Intelead flash or protrusions shall not exceed 0.25mm per
side.
3. The size of exposed pad is variable depending of leadframe design pad size. End user should verify “D1” and “E2”
dimensions for each device application.
mminch
Figure 42. Package dimensions
47/50
Package mechanical dataL6730C - L6730D
Table 14.QFN 4mm x 4mm 24L mechanical data
Dim
MinTypMaxMinTypMax
A 1.00 39.4
A1 0.00 0.05 0.0 2.0
b 0.18 0.30 7.1 11.8
D 3.9 4.1 153.5 161.4
D2 1.95 2.25 76.8 88.6
E 3.9 4.1 153.5 161.4
E2 1.95 2.25 76.8 88.6
e 0.50 19.7
L 0.40 0.60 15.7 23.6
mminch
Figure 43. Package dimensions
48/50
L6730C - L6730DRevision history
12 Revision history
Table 15.Revision history
DateRevisionChanges
21-Dec-20051Initial release.
07-Jun-20062Added QFN package information, new template
49/50
L6730C - L6730D
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED,
AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS,
NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR
SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.