
查询L6382供应商
FOR INTEL VR10,VR11 AND AMD 6BIT CPUS
Features
■ 0.5% OUTPUT VOLTAGE ACCURACY
■ 7/8 BIT PROGRAMMABLE OUT PUT UP TO
1.60000V - INTEL VR10.x, VR11 DAC
■ 6 BIT PROGRAMMABLE OUT PU T UP TO
1.5500V - AMD 6BIT DAC
■ HIGH CURRENT INTEGRATED GATE
DRIVERS
■ FULL DIFFERENTIAL CURRENT SENSING
ACROSS INDUCTOR OR LOW SIDE
MOSFET
■ PIN-TO-PIN COMPATIBILITY ALLOWS
SYSTEM SCALABIL IT Y
■ EMBEDDED VRD THERMAL MONITOR
■ INTEGRATED REMOTE SENSE BUFFER
■ DYNAMIC VID MANAGEMENT
■ ADJUSTABLE REFEREN CE VOLTAGE
OFFSET
■ PROGRAMMABLE SOFT START
■ PROGRAMMABLE OVER VOLTAGE
PROTECTION
■ PRELIMINARY OVER VOLTAGE
■ CONSTANT OVER CURRENT PROTECTION
■ OSCILLATOR INTERNALLY FIXED AT
150kHz EXTERNALLY AD JUSTABLE
■ OUTPUT ENABLE
■ SS_END / PGOOD SIGNAL
■ TQFP64 10x10mm PACKAGE WITH
EXPOSED PAD
L6713 - L6714
3,4 PHASE CONTROLLER
Data Brief
TQFP64 (Exposed Pad)
Description
L6713, L6714 implement a three/four phase
stepdown controller with 120º/90º phase-shift
between each phase with integrated high current
drivers in a compact 10x10mm body package with
exposed pad. Pin-to-pin compatibility allows
system scalability: a 4 phase application c an be
easily downgraded to 3 phases by removing one
phase. The device em beds selectable DACs: the
output voltage ranges up to 1.60 000V (both Intel
VR10.x and VR11 DAC) or up to 1.5500V (AMD
6BIT DAC) managing D-VID with ±0.5% output
voltage accuracy over line and temperature
variations. Additional programmable offset can be
added to the reference voltage with a single
external resistor. The controller assures fast
protection against load ov er current and under /
over voltage (in this last case also before UVLO).
In case of over-current the system works in
Constant Current mode until UVP. Selectable
current reading adds flexibility to the design
allowing current sense across inductor or LS
mosfets. System Thermal Monitor is also provided
allowing system protection from over-temperature
conditions.
Applications
■ HIGH CURRENT VRD FOR DESKTOP CPUs
■ WORKSTATION AND SERVER CPU POWER
SUPPLY
Order co des
Part number Package Packing
L6713 - L6714 TQFP64 (Exposed Pad) TUBE
L6713TR - L6714TR TQFP64 (Exposed Pad) TAPE & REEL
October 2005 1/5
For further information contact your local STMicroelectronics sales office.
■ VRM MODULES
Rev 1
www.st.com
5

L6713 - L 6714
Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second Level Interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com.
2/5

L6713 - L 6714
Table 1. TQFP64 Mechanical Data
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.20 0.0472
A1 0.05 0.15 0.002 0.006
A2 0.95 1.00 1.05 0.0374 0.0393 0.0413
b 0.17 0.22 0.27 0.0066 0.0086 0.0086
c 0.09 0.20 0.0035 0.0078
D 11.80 12.00 12.20 0.464 0.472 0.480
D1 9.80 10.00 10.20 0.386 0.394 0.401
D2 2.00 0.787
D3 7.50 0.295
E 11.80 12.00 12.20 0.464 0.472 0.480
E1 9.80 10.00 10.20 0.386 0.394 0.401
E2 2.00 0.787
E3 7.50 0.295
e 0.50 0.0197
L 0.45 0.60 0.75 0.0177 0.0236 0.0295
L1 1.00 0.0393
k 0° 3.5° 7° 0° 3.5° 7°
ccc 0.080 0.0031
Table 2. TQFP64 Package Dimensions
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L6713 - L 6714
Table 3. Revision History
Date Revision Description of Change
5 Oct 2005 1 First Draft
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L6713 - L 6714
nformation furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequence
f use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is grante
y implic ation or otherwise under any patent or patent ri ghts of STMicroelectronics . Specific at i ons menti oned in th i s publication are subje
o change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are n
uthoriz ed for use as critical components in li fe support devic es or system s without express written approval of STMicroel ectronics.
The ST logo is a registered t rademark of S T M i croelectr oni cs.
All other nam es are the pro perty of thei r respectiv e owners
© 2005 STMi croelectronics - All ri ghts reserved
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