ST L6590 User Manual

FULLY INTEGRATED POWER SUPPL Y
WIDE-RANGE MAINS OPERATION
"ON-CHIP" 700V V (BR)DSS POWER MOS
65 kHz INTERNAL OSCILLA TOR
2.5V ± 2% INTERNAL REFERENCE
STANDBY MODEFOR HIGH EFFICIENCY AT
OVERCURRENT AND LATCHED
OVERVOLTAGE PROTECTION
NON DISSIPATIVE BUILT-IN START-UP CIRCUIT
THERMAL SHUTDOWN WITH HYSTERESIS
BROWNOUTPROTECTION (SMD PACKAGE
ONLY)
L6590
MINIDIP SO16W
ORDERING NUMBERS:
L6590N L6590D
- HOME APPLIANCES/LIGHTING
LINE CARD, DC-DC CONVERTERS
MAIN APPLICATIONS
WALL PLUG POWER SUPPLIES UP TO 15 W
AC-DC ADAPTERS
AUXILIARYPOWER SUPPLIES FOR:
- CRT AND LCD MONITOR (BLUE ANG EL)
- DESKTOP PC/SERVER
- FAX, TV, LASER PRINTER
TYPICAL APPLICATION CIRCUIT
AC line
88 to 264 Vac
GND
DRAIN
L6590
1
Vcc
3
56, 7,8
4
VFBCOMP
Pout
up to 15W
DESCRIPTION
The L6590 is a monolithic switching regulator de­signed in BCD OFF-LINEtechnology, able to operate with wide range input voltage and to deliver up to 15Woutput power. The internal power switch is a lat­eral power MOSFET with a typical R and a V
AC line
88 to 264 Vac
(BR)DSS
of 700V minimum.
DRAIN
1
GND
L6590
VFB COMP
3
56, 7, 8
4
Vcc
DS(on)
of 13
Pout
up to 15W
October 2000
Primary Feedback
Secondary Feedback
1/23
L6590
D
DESCRIPTION
(continued)
The MOSFET is source-grounded, thus it is possible to build flyback, boost and forward converters.
The device can work with secondary feedback and a
2.5V±2%internal reference,in addition to a high gain error amplifier, makes possible also the use in appli­cations either with primary feedback or not isolated.
Theinternalfixedoscillator frequencyandthe integrated non dissipative start-up generator minimize the external component count and power consumption.
The device is equipped with a standby function that automatically reduces the oscillator frequency from 65 to 22 kHz under light load conditions to enhance
BLOCK DIAGRAM
DRAIN
(1)
[1]
START-UP
THERMAL
SHUTDOWN
+
-
GND
(6,7,8)
PGND
[9, ..., 16]
OCP
STANDBY
65/22kHz
efficiency (P
<1W@P
in
= 0.5W with wide range
out
mains). Internal protections like cycle-by-cycle current limiting,
latched output overvoltage protection, mains undervolt­age protection (SMD version only) and thermal shut­down generate a 'robust' design solution.
TheIC usesa special leadframe with the ground pins (6, 7 and 8 in minidip, 9 to16 in SO16W package) in­ternally connected in order for heat to be easily re­moved from the silicon die. An heatsink can then be realized by simply making provision of few cm copper on the PCB. Furthermore, the pin(s) close to the high-voltage one are not connected to ease com­pliance with safety distances on the PCB.
[x] : L6590D (SO16W)
CC
V
(3)
SGN
[5]
BOK
[6]
VFB
(5)
[4]
[8]
OSC
SUPPLY
&UVLO
PWM
VREF
+
-
OVP
BROWNOUT
VREF
+
-
­+
2.5V
2.5V
2
of
PIN CONNECTIONS
DRAIN
COMP
2/23
(Top view)
N.C.
Vcc
MINIDIP
L6590
GND GND GND VFB
DRAIN
N.C. N.C.
Vcc
SGND
BOK
COMP
VFB
COMP
[7]
(4)
PGND PGND PGND PGND PGND PGND PGND PGND
SO16W L6590D
L6590
PIN FUNCTIONS
Pin#
L6590 L6590D
1 1 DRAIN Drain connection of the internal power MOSFET. The internal high voltage start-up
2 2, 3 N.C. Not internally connected. Provision for clearance on the PCB. 34V
47
5 8 VFB Inverting input of the Error Amplifier.The non-inverting one is internally connected to a
6 to 8 - GND Connection of both the source of the internal MOSFET and the return of the bias current
- 6 BOK Brownout Protection. If the voltage applied to this pin is lower than 2.5V the PWM is
- 5 SGND Current return for the bias current of the IC.
- 9 to 16 PGND Connection of the source of the internal MOSFET. Pins connected to the metal frame to
Name Description
generator sinks current from this pin.
Supply pin of the IC. An electrolytic capacitor is connected between this pin and ground.
CC
The internal start-up generator charges the capacitor until the voltage reaches the start­up threshold. The PWM is stopped if the voltage at the pin exceeds a certain value.
COMP
Output of the Error Amplifier. Used for control loop compensation or to directly control PWM with an optocoupler.
2.5V± 2% reference. This pin can be grounded in some feedback schemes.
of the IC. Pins connected to the metal frame to facilitate heat dissipation.
disabled. This pin is typically used for sensing the input voltage of the converter through a resistor divider. If not used, the pin can be either left floating or connected to Vcc through a 15 kresistor.
facilitate heat dissipation.
THERMAL DATA
Symbol Parameter Minidip SO16W Unit
R
thj-amb
R
thj-pins
(*) Value depending on PCB copper area and thickness
Thermal Resistance Junction to ambient (*) 35 to 60 40 to 65 °C/W Thermal Resistance Junction to pins 15 20 °C/W
.
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
I
V
I
clamp
P
T
T
stg
ds d cc
tot
Drain Source Voltage -0.3 to 700 V Drain Current 0.7 A IC Supply Voltage 18 V VccZener Current 20 mA Error Amplifier Ouput Sink Current 3 mA Voltage on Feedback Input 5 V BOK pin Sink Current 1 mA Power Dissipation at T
2
, 2 oz copper dissipating area on PCB
3cm Operating Junction Temperature -40 to 150 °C
j
< 50°C (Minidip and SO16W)
amb
1.5 W
Storage Temperature -40 to 150 °C
3/23
L6590
ELECTRICAL CHARACTERISTCS
(Tj= -25 to 125°C, Vcc= 10V; unless otherwise specified)
Symbol Parameter Test Condition Min. Typ. Max. Unit
POWER SECTION
V
(BR)DSS
I
R
DS(on)
Drain Source Voltage Id< 200 µA; Tj= 25 °C 700 V Off state drain current Vds= 560V; Tj= 125 °C 200 µA
dss
Drain-to-Source on resistance R
vs. Tj: see fig. 20
DS(on)
I
= 120mA; Tj=25°C 13 16
d
= 120mA; Tj= 125 °C 23 28
I
d
ERROR AMP SECTION
V
Input Voltage Tj= 25 °C 2.45 2.5 2.55 V
FB
= 125°C 2.4 2.5 2.6
T
j
Ib E/A Input Bias Current V
= 0 to 2.5 V 0.3 5 µA
FB
Avol DC Gain open loop 60 70 dB
B Unity Gain Bandwidth 0.7 1 MHz
SVR Supply voltage Rejection f = 120 Hz 70 dB
I
I
source
Output Sink Current V
sink
Output Source Current V
=1V 1 mA
COMP
= 3.5V; VFB = 2V -0.5 -1 -2.5 mA
COMP
V
COMPH
V
COMPL
Vout High I Vout Low I
OSCILLATOR SECTION
F
D
D
Oscillator Frequency Tj=25°C 58 65 72 kHz
osc
Min. Duty Cycle V
min
Max. Duty Cycle V
max
DEVICE OPERATION SECTION
I
I
chargeVCC
V
CCclampVCC
V
Operating Supply Current fsw = Fosc 4.5 7 mA
op
I
Quiescent Current MOS disabled 3.5 6 mA
Q
charge Current Vcc=0VtoV
clamp Voltage I
Start Threshold
ccon
voltage
= -0.5mA; VFB=2V 3.8 4.50 V
source
= 1mA ; VFB=3V 1 V
sink
52 65 74
=1V 0 %
COMP
=4V 67 70 73 %
COMP
- 0.5V;
V
= 100 to 400V; Tj=25°C
ds
=0VtoV
V
cc
ccon
ccon
- 0.5V;
-3 -4.5 -7 mA
-2.5 -4.5 -7.5 mA
Vds= 100 to 400V
= 10mA (*) 16.5 17 17.5 V
clamp
(*) 14 14.5 15 V
V
4/23
V
ccoff
dsmin
Min operating voltage after Turnon(*) 6 6.5 7 V
Drain start voltage 40 V
L6590
ELECTRICAL CHARACTERISTICS
(continued)
Symbol Parameter Test Condition Min. Typ. Max. Unit
CIRCUIT PROTECTIONS
I
pklim
OVP Overvoltage Protection I
Pulse-by-pulse Current Limit di/dt = 120 mA/ µs 550 625 700 mA
= 10 mA (*) 16 16.5 17 V
cc
LEB Masking Time After MOSFET turn-on (**) 120 ns
STANDBY SECTION
F
I
pksb
Oscillator Frequency 19 22 25 kHz
SB
Peak switch current for Standby
Transition from F
osc
to F
SB
80 mA
Operation
I
pkno
Peak switch current for Normal
Transition from FSBto F
osc
190 mA
Operation
BROWNOUT PROTECTION (L6590D only)
V I V
Threshold Voltage Voltage either rising or falling 2.4 2.5 2.6 V
th
Current Hysteresis V
Hys
Clamp Voltage I
CL
= 3V -30 -50 -70 µA
pin
= 0.5 mA 5.6 6.4 7.2 V
pin
THERMAL SHUTDOWN (***)
Threshold 150 165 °C Hysteresis 40 °C
(*) Parameters tracking one the other (**) Parameter guaranteed by design, not tested in production (***) Parameters guaranteed by design, functionality tested in production
Figure 1. Start-up & UVLO Thresholds Figure 2. Start-up Current Generator
Vcc [V]
16
14
Start-up
12
10
8
6
-50 0 50 100 150
Tj [°C]
UVLO
Icc [mA]
5.5
5
Vdrain = 40 V
4.5
4
3.5
3
024681012
Vcc [V]
Tj = -25°C
Tj = 25 °C
Tj = 125 °C
5/23
L6590
Figure 3 . Start-up Current Generator
Icc [mA]
5.5
Vdrain = 60 V
Tj = -25 °C
5
Tj = 25°C
4.5
4
Tj = 125°C
3.5
3
024681012
Vcc [V]
Figure 4. IC Consumption Before Start-up
Icc [µA]
700
600
500
400
300
200
Tj = 125°C
Tj = -25 °C
Tj = 25 °C
Figure 6. IC Operating Current
Icc [mA]
5
VFB = 2.3 V fsw = 65 kHz
4.5
4
Tj = 125°C
Tj = 25 °C
Tj = -25°C
3.5
3
7 8 9 10 11 12 13 14 15
Vcc [V]
Figure 7. IC Operating Current
Icc [mA]
4.4
VFB = 2.3 V
4.2 4
3.8
3.6
3.4
3.2
fsw = 22 kHz
Tj = 125 °C
Tj = 25 °C
Tj = -25°C
100
7 8 9 101112131415
Vcc [V]
Figure 5. IC Quiescent Current
Icc [mA]
4
VFB = 2.7 V
3.8
3.6
3.4
Tj = 125°C
Tj = -25°C
3.2
3
6 8 10 12 14 16 18
Vcc [V]
6/23
Tj = 25°C
3
7 8 9 10 11 12 13 14 15
Vcc [V]
Figure 8. S witching Frequency vs.
Temperature
fsw [kHz]
80 70 60 50 40 30 20 10
-50 0 50 100 150
Normal operation
Standby
Tj [°C]
L6590
Figure 9 . Vcc clamp vs. Temperature
VCCclamp [V]
18
17.8
17.6
I
clamp
=20mA
17.4
Iclamp =10mA
17.2
17
-50 0 50 100 150
Tj [°C]
Figure 10. OV P Threshold vs. Temperature
Vth [V]
16
15.8
15.6
15.4
Figure 12. OCP threshold vs. Temperat ure
Ipklim / (Ipklim@ Tj = 25°C)
1.1
1.08
di/dt = 120 mA/µs
1.06
1.04
1.02
1
0.98
-50 0 50 100 150
Tj [°C]
Figure 13. Internal E/A Referenc e Voltage
Vref [V]
2.6
2.55
2.5
15.2
15
-50 0 50 100 150
Tj [°C]
Figure 11. OCP Threshold vs. Current Slope
Ipklim / (Ipklim @ di/dt = 120 mA/µs)
1.06
1.04
1.02
1
0.98
0.96 50 100 150 200 250
Tj = 25°C
dI/dt[mA/µs]
2.45
2.4
-50 0 50 100 150
Tj [°C]
Figure 14. Error Amplifier Slew Rate
VCOMP [V]
5
= 100 pF
L
open loop
4
3
VCOMP
V
FB
RL =10k
C
2
1
0
0 2 4 6 8 10121416
t[µs]
7/23
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