ST L6210 User Manual

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Features

■ Monolithic array of eight Schottky diodes

■ High efficiency

■ 4 A peak current

■ Low forward voltage

■ Fast recovery

■ Time two separated diode bridges

Description

The L6210 is a monolithic IC containing eight Schottky diodes arranged as two separated diode bridges.

This diodes connection makes this device versatile in many applications.

L6210

Dual Schottky diode bridge

PDIP 16

They are used particular in bipolar stepper motor applications, where high efficient operation, due to low forward voltage drop and fast reverse recovery time, are required.

Table 1. Device summary

Order code Package Packing

E-L6210 PDIP 16 Tube

The L6210 is available in a 16 pin powerdip package (12 + 2 + 2) designed for the 0 to 70°C ambient temperature range.

April 2008 Rev 2 1/8

www.st.com

Contents L6210

Contents

1 Block and pin connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3 Mounting instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

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L6210 Block and pin connection diagram

1 Block and pin connection diagram

Figure 1. Block diagram

Figure 2. Pin connection (top view)

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Electrical specifications L6210

2 Electrical specifications

2.1 Absolute maximum ratings

Table 2. Absolute maximum ratings

Symbol Parameter Value Unit

Repetitive Forward Current Peak 2 A

Peak Reverse Voltage (per diode) 50 V

Operating Ambient Temperature 70 °C

AMB

STG

2.2 Thermal data

Table 3. Thermal data

Symbol Parameter Min. Typ. Max. Unit

Storage Temperature Range –55 to +150 °C

TH J-CASE

TH J-AMB

Thermal Impedance Junction-case 14 °C/W

Thermal Impedance Junction-ambient without External Heatsink

65 °C/W

2.3 Electrical characteristics

Table 4. Electrical characteristics

= 25°C unless otherwise specified)

Symbol Parameter Test conditions Min. Typ. Max. Unit

= 100 mA 0.65 0.8 V

Leakage Current VR = 40 V, T

Forward Voltage Drop

Note: At forward currents of greater than 1 A, a parasitic current of approximately 10 mA may be

collected by adiacent diodes.

= 500 mA 0.8 1 V

= 1 A 1 1.2 V

= 25 °C 1 mA

AMB

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L6210 Mounting instructions

3 Mounting instructions

The R area of the printed circuit boards as shown in Figure 3 or to an external heatsink (Figure 4). During soldering the pin temperature must not exceed 260°C and the soldering time must not be longer then 12 s. The external heatsink or printed circuit copper area must be connected to electrical ground.

Figure 3. Example of PC board copper area which is used as heatsink

b of the L6210 can be reduced by soldering the GND pins to suitable copper

th j-am

Figure 4. Example of an external heatsink

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Package information L6210

4 Package information

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK

packages are lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 5. PDIP 16 mechanical data and package dimensions

DIM.

A 5.330 0.2098

A1 0.380 0.0150

A2 2.920 3.300 4.950 0.1150 0.1299 0.1949

b 0.360 0.460 0.560 0.0142 0.0181 0.0220

b2 1.140 1.520 1.780 0.0449 0.0598 0.0701

c 0.200 0.250 0.360 0.0079 0.0098 0.01 42

(*)

E 7.620 7.870 8.260 0.3000 0.3098 0.3252

(*)

e 2.540 0.1000

e1 17.780 0.7000

eA 7.620 0.3000

eB 10.920 0.4299

L 2.920 3.300 3.810 0.1150 0.1299 0.1500

(*)“D” and “E1” dimensions do not include mold flash or protusions.

Mold flash or protusions shall not exceed 0.25mm.

mm inch

MIN. TYP. MAX. MIN. TYP. MAX.

18.670 19.180 19.690 0.7350 0.7 551 0.7752

6.100 6.350 7.110 0.2402 0.2500 0.2799

OUTLINE AND

MECHANICAL DATA

PDIP 16

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0015895_E

0015895 E

L6210 Revision history

5 Revision history

Table 5. Document revision history

Date Revision Changes

31-Jul-2003 1 Initial release.

23-Apr-2008 2 Package information updated.

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L6210

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