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USER GUIDE
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QSEVEN-Q7ALx2
Doc. Preliminary User Guide, Rev. 0.7
Doc. ID: 1067-2270
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
QSEVEN
-Q7ALX2 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the user guide or any product characteristics
set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s),
conveys no license or title under any patent, copyright or mask work rights to these products and makes no
representations or warranties that these products are free from patent, copyright or mask work right infringement
unless otherwise specified. Applications that are described in this user guide are for illustration purposes only.
Kontron makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification. Kontron expressly informs the user that this user guide only contains a general
description of processes and instructions which may not be applicable in every individual case. In cases of doubt,
please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2020 by Kontron AG
Kontron AG
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR
COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE
SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A
HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF
PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR
ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only
.
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Revision History
Revision Brief Description of Changes Date of Issue Author
0.1 Initial hardware info 2020-Apr-07 CW
0.2 Added info from Hardware Spec and figures for the mechanical
dimensions and dated the power information
0.3 Added inputs from Kontron Asia 2020-May-06 CW
0.4 Added Inputs from Kontron Germany 2020-May-18 CW
0.5 Added photos, power on and assembly diagrams. 2020-Jun-10 CW
0.6 Added general hardware and software inputs 2020-Jun-29 CW
0.7 Updated tables added Caution in Chapter 5.7 2020-Jul-01 CW
2020-Apr-17 CW
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/termsand-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support
.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of
mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit
http://www.kontron.com/support-and-services/services
.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron Support
revised user guide on our website.
. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
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Symbols
V) when touching
products or parts of products. Failure to observe the precautions indicated and/or
endanger your life/health and/or result in damage to your
This symbol and title inform that the electronic boards and their components are sensitive
ng operations and
The following symbols may be used in this user guide
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60
prescribed by the law may
material.
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
ESD Sensitive Device!
to static electricity. Care must therefore be taken during all handli
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Handling and operation of the product is permitted only for trained personnel within a work
place that is access controlled. Follow the “General Safety Instructions for IT Equipment”
supplied with the product.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the
manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporateresponsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the
product be waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound
environmental disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
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You are encouraged to return our products for proper disposal.
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Table of Contents
Symbols ................................................................................................................................................................................................................. 6
For Your Safety ................................................................................................................................................................................................... 7
High Voltage Safety Instructions ................................................................................................................................................................. 7
Special Handling and Unpacking Instruction ........................................................................................................................................... 7
Lithium Battery Precautions ......................................................................................................................................................................... 8
General Instructions on Usage ..................................................................................................................................................................... 8
Quality and Environmental Management ................................................................................................................................................ 8
Disposal and Recycling ................................................................................................................................................................................... 8
WEEE Compliance ............................................................................................................................................................................................. 8
Table of Contents............................................................................................................................................................................................... 9
List of Tables ...................................................................................................................................................................................................... 11
List of Figures ..................................................................................................................................................................................................... 11
1/ General Safety Instructions for Equipment ............................................................................................................................... 12
Electrostatic Discharge (ESD) ................................................................................................................................................................ 13 1.1.
Grounding Methods .................................................................................................................................................................................. 13 1.2.
Requirements IEC 62368-1 ..................................................................................................................................................................... 14
Instructions for the Lithium Battery ................................................................................................................................................... 14
2/
Introduction .......................................................................................................................................................................................... 15
3/ Product Description ........................................................................................................................................................................... 16
4/ Scope of Delivery ................................................................................................................................................................................ 17
Packing List ................................................................................................................................................................................................. 17 4.1.
Accessories ................................................................................................................................................................................................ 17
5/
Product Specification ........................................................................................................................................................................ 18
Block Diagram............................................................................................................................................................................................. 18 5.1.
Module Views............................................................................................................................................................................................. 19
Component Technical Data ................................................................................................................................................................... 21
Environmental Condition ...................................................................................................................................................................... 23
Standards and Directives ...................................................................................................................................................................... 24 5.5.
Mechanical Specification ...................................................................................................................................................................... 25 5.6.
5.6.1. Heat Spreader Mechanical Specification ...................................................................................................................................... 26
Thermal Management............................................................................................................................................................................ 27 5.7.
5.7.1. Heatspreader Plate and Cooling Solutions ................................................................................................................................... 27
5.7.2. Temperature Sensors ......................................................................................................................................................................... 28
Power Specification ................................................................................................................................................................................ 29 5.8.
5.8.1. Power Supply Specification ............................................................................................................................................................... 29
5.8.2. Power Supply Voltage Rise Time .................................................................................................................................................... 29
5.8.3. Power Supply Voltage Ripple ........................................................................................................................................................... 29
5.8.4. Input Power Sequencing.................................................................................................................................................................... 30
5.8.5. Power Management ............................................................................................................................................................................ 30
5.8.5.1. Power Supply Control and Management Signals .................................................................................................................... 31
6/ Features and Interfaces .................................................................................................................................................................. 32
CAN Bus ....................................................................................................................................................................................................... 32 6.1.
eMMC (option) .......................................................................................................................................................................................... 32
Fast I2C ........................................................................................................................................................................................................ 32
GPIO .............................................................................................................................................................................................................. 32
JTAG .............................................................................................................................................................................................................. 32
1.3.
1.4.
4.2.
5.2.
5.3.
5.4.
6.2.
6.3.
6.4.
6.5.
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Kontron Security Solution (option) .................................................................................................................................................... 33 6.6.
LPC ................................................................................................................................................................................................................ 33
RTC ............................................................................................................................................................................................................... 34
SDIO .............................................................................................................................................................................................................. 34
SPI ............................................................................................................................................................................................................... 34
6.10.1. SPI boot .................................................................................................................................................................................................. 34
SpeedStep™ Technology ..................................................................................................................................................................... 35 6.11.
TPM 2.0 (option) ..................................................................................................................................................................................... 35 6.12.
UART ........................................................................................................................................................................................................... 36 6.13.
Watchdog Timer (WDT) - Dual Stage ............................................................................................................................................. 36
6.14.1. Watchdog Timer Signal ..................................................................................................................................................................... 36
7/ System Resources ............................................................................................................................................................................. 37
PCI Devices .................................................................................................................................................................................................. 37 7.1.
I2C Bus ......................................................................................................................................................................................................... 37
SM Bus ......................................................................................................................................................................................................... 37
8/
Connectors ........................................................................................................................................................................................... 38
MIPI Connector Pin Assignment (option for some variants) ..................................................................................................... 38 8.1.
CPLD Connector Pin Assignment ........................................................................................................................................................ 38 8.2.
Qseven® Connector Pin Assignment ................................................................................................................................................. 39 8.3.
9/
Power on .............................................................................................................................................................................................. 43
Connecting to the Carrier Board .......................................................................................................................................................... 43 9.1.
10/
uEFI BIOS ............................................................................................................................................................................................... 44
Starting the uEFI BIOS ........................................................................................................................................................................... 44 10.1.
Setup Menus ........................................................................................................................................................................................... 45
10.2.1. Main Setup Menu ................................................................................................................................................................................ 45
10.2.2. Advanced Setup Menu ...................................................................................................................................................................... 47
10.2.3. Chipset Setup Menu .......................................................................................................................................................................... 54
10.2.3.1. Chipset> North Bridge .................................................................................................................................................................... 54
10.2.3.2. Chipset > South Bridge .................................................................................................................................................................. 55
10.2.3.3. Chipset> Uncore Configuration .................................................................................................................................................. 56
10.2.3.4. Chipset> South Cluster Configuration ..................................................................................................................................... 59
10.2.4. Security Setup Menu ......................................................................................................................................................................... 67
10.2.4.1. Remember the Password ............................................................................................................................................................. 69
10.2.5. Boot Setup Menu ................................................................................................................................................................................ 70
10.2.6. Save and Exit Setup Menu ............................................................................................................................................................... 72
The uEFI Shell .......................................................................................................................................................................................... 73 10.3.
10.3.1. Basic Operation of the uEFI Shell................................................................................................................................................... 73
10.3.1.1. Entering the uEFI Shell ................................................................................................................................................................... 73
10.3.1.2. Exiting the uEFI Shell ...................................................................................................................................................................... 73
uEFI Shell Scripting ............................................................................................................................................................................... 74 10.4.
10.4.1. Startup Scripting ................................................................................................................................................................................. 74
10.4.2. Create a Startup Script ..................................................................................................................................................................... 74
10.4.3. Example of Startup Scripts ............................................................................................................................................................. 74
10.4.3.1. Execute Shell Script on other Harddrive .................................................................................................................................. 74
Firmware Update .................................................................................................................................................................................... 75 10.5.
10.5.1. Updating Procedure ............................................................................................................................................................................ 75
Appendix A: List of Acronyms ..................................................................................................................................................................... 76
About Kontron ................................................................................................................................................................................................... 77
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6.7.
6.8.
6.9.
6.10.
6.14.
7.2.
7.3.
10.2.
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
List of Tables
Table 1: Packing List ......................................................................................................................................................................................... 17
Table 2: Accessory List ................................................................................................................................................................................... 17
Table 3: Component Technical Data .......................................................................................................................................................... 21
Table 4: Environmental Condition ............................................................................................................................................................. 23
Table 5: Standards and Directives ............................................................................................................................................................. 24
Table 6: Power Supply Specification ......................................................................................................................................................... 29
Table 7: Power Supply Control and Management Signals .................................................................................................................. 31
Table 8: Supported BIOS Features ............................................................................................................................................................. 33
Table 9: SPI Boot Pin Configuration ........................................................................................................................................................... 34
Table 10: Supported SPI Boot Flash Types for 8-SOIC Package ....................................................................................................... 35
Table 11: Dual Staged Watchdog Timer- Time-Out Events ............................................................................................................... 36
Table 12: I2C Bus Port Address .................................................................................................................................................................... 37
Table 13. SMBus Address .............................................................................................................................................................................. 37
Table 14: MIPI-CSI2 Connector Pin Assignment .................................................................................................................................... 38
Table 15: CPLD Connector Pin Assignment .............................................................................................................................................. 39
Table 16: QSEVEN Connector Pin Assignment ........................................................................................................................................ 39
Table 17: Navigation Hot Keys in the Legend Bar .................................................................................................................................. 44
Table 18: Main Setup Menu Sub-screens and Functions Example ................................................................................................. 46
Table 19: Advanced Setup menu Sub-screens and Functions Example ....................................................................................... 47
Table 20: Chipset Set > North Bridge Sub-screens and Function ................................................................................................... 54
Table 21: Chipset Set> South Bridge Sub-screens and Functions ................................................................................................... 55
Table 22: Chipset Set> Uncore Configuration Sub-screens and Functions .................................................................................. 57
Table 23: Chipset>South Cluster Configuration Sub-screens and Functions ............................................................................. 59
Table 24: Security Setup Menu Initial Screen ........................................................................................................................................ 67
Table 25: Boot Setup Menu Sub-screens and Functions ................................................................................................................... 70
Table 26: Save and Exit Setup Menu Sub-screens and Functions .................................................................................................. 72
Table 27: List of Acronyms ........................................................................................................................................................................... 76
List of Figures
Figure 1: QSEVEN Module ............................................................................................................................................................................... 16
Figure 2 : Block Diagram Q7ALx2 Module ................................................................................................................................................. 18
Figure 3 : Top Side View Q7ALx2 .................................................................................................................................................................. 19
Figure 4 : Bottom Side View Q7ALx2 ......................................................................................................................................................... 20
Figure 5 : Q7ALx2 Top Side Mechanical Specification (measurement in mm) ............................................................................ 25
Figure 6: Q7ALx2 Bottom Side Mechanical Specification (measurement in mm) ...................................................................... 25
Figure 7: Heat Spreader for Commercial Grade Mechanical Specification (measurement in mm) ..................................... 26
Figure 8: Heat Spreader for Industrial Grade Mechanical Specification (measurement in mm).......................................... 26
Figure 9: Heatspreader Plate Assembly .................................................................................................................................................. 27
Figure 10: HWM with Temperature Sensor ............................................................................................................................................. 28
Figure 11: Input Power Start and Stop Sequence................................................................................................................................... 30
Figure 12 : MIPI CSI2 Connector ................................................................................................................................................................... 38
Figure 13 : CPLD Connector ........................................................................................................................................................................... 38
Figure 14: Qseven® Module with Carrier Board Assembly with Heaspreader Plate ................................................................. 43
Figure 15: Main Setup Menu Initial Screen Example ............................................................................................................................ 45
Figure 16: Advanced Setup Menu Initial Screen Example .................................................................................................................. 47
Figure 17: Chipset > North Bridge Menu Initial Screen Example ...................................................................................................... 54
Figure 18: Chipset>South Bridge Menu Initial Screen Example ........................................................................................................ 55
Figure 19: Chipset>Uncore Configuration Menu Initial Screen Examples ..................................................................................... 56
Figure 20: Chipset>South Cluster Configuration Menu Initial Screen Example.......................................................................... 59
Figure 21: Security Setup Menu Initial Screen Example ...................................................................................................................... 67
Figure 22: Boot Setup Menu Initial Screen Example ............................................................................................................................ 70
Figure 23: Save and Exit Setup Menu Initial Screen Example ........................................................................................................... 72
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1/ General Safety Instructions for Equipment
Read and observe the instructions within this chapter that have been compiled for user’s
safety and to ensure accordance with regulations. If the following General Safety
Instructions for Equipment are not observed, it could lead to injuries to the operator and/or
The product has been built and tested according to the basic safety requirements for low voltage (LVD) applications
and has left the manufacturer in a safety-related, flawless condition. To maintain this condition and to ensure safe
operation, the operator must observe the correct operating conditions for the product and following the general
safety instructions:
The product must be used as specified in the product documentation, in which the instructions for safety for the
product and for the operator are described. These contain guidelines for setting up, assembly, installation and
maintenance, transport and storage.
The on-site electrical installation must meet the requirements of the country's specific local regulations.
The product must be connected only to certified mains power supply complying with the requirements of IEC
62368-1 standard or better.
If a Power Supply Unit (PSU) comes with the product, only this PSU should be used to supply the product.
If supplied with a power cable, only use the supplied power cable.
Do not use an extension cable to connect the product
To guarantee sufficient airflow to cool the product, ensure that:
Ventilation openings are not covered or blocked.
Clean the filter pad regularly (as often as necessary, depending on the environment).
Do not place the product close to heat sources or damp places.
The product is well ventilated
damage to the product. Kontron is exempt from accident liability, also during the warranty
period if the instructions within this user guide are not observed.
Only devices or parts that fulfill the safety requirements as stipulated by the applied safety standards may be
connected to the available interfaces.
Before opening the product, make sure that the product is disconnected from the mains.
Switching off the product by the power button does not disconnect the product from the mains. Complete
disconnection is only possible if the power cable is removed from the wall plug or from the product. Ensure that
there is free and easy access to enable disconnection.
The product may only be opened for the insertion or removal of add-on cards (depending on the configuration of
the system). This may only be carried out by qualified operators.
If extensions are being carried out, the following must be observed:
All effective legal regulations and all technical data are adhered to
Power consumption of any add-on card does not exceed the specified limitations
Current consumption of the system does not exceed the value stated on the product label.
Only use original accessories and spare parts approved by Kontron.
Note: safe operation is no longer possible when any of the following applies:
Product has visible damage
Product is no longer functioning
In these cases, the product must be switched off and disconnected from the mains. Additionally, ensured
that the product can no longer be operated.
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Additional safety instructions for DC power supply circuits
To guarantee safe operation of products with DC power supply voltages larger than 60 volts DC or a power
consumption larger than 120 VA, observe that:
Product is set up, installed and operated in a room or enclosure marked with “RESTRICTED ACCESS”, if there
are no safety messages such as safety signs and labels on the product.
Do not touch either directly or indirectly, cables or parts without insulation in electrical circuits with
dangerous voltage or power.
Reliable protective earth connection is provided
Suitable, easily accessible disconnecting device is used in the application (e.g. overcurrent protective device),
if the product cannot be disconnected
A disconnect device, if provided in or as part of the equipment, must disconnect both poles simultaneously
Interconnecting power circuits of different devices cause no electrical hazards
A sufficient dimensioning of the power cable wires must be selected – according to the maximum electrical
specifications on the product label – as stipulated by applied safety standards.
The products do not generally fulfill the requirements for "centralized DC power systems“” as stipulated by the
applied safety standards and therefore may not be connected to such devices!
Electrostatic Discharge (ESD) 1.1.
A sudden discharge of electrostatic electricity can destroy static-sensitive devices.
Proper packaging and grounding techniques are necessary precautions to prevent damage. Always take the following
precautions:
1. Transport ESD-sensitive products in ESD-safe containers such as boxes or bags.
2. Keep electrostatic sensitive parts in their containers until they arrive at the ESD-safe workplace.
3. Always be properly grounded when touching sensitive products, components, or assembly.
4. Store ESD-sensitive products in protective packaging or on antistatic mats.
Grounding Methods 1.2.
To avoid electrostatic damage, observe the following grounding guidelines:
1. Cover workstations with approved antistatic material. Always wear a wrist strap connected to the workplace.
Always use properly grounded tools and equipment.
2. Use antistatic mats, heel straps, or air ionizers for more protection.
3. Always handle electrostatically sensitive components by their edge or by their casing.
4. Avoid contact with pins, leads, or circuitry.
5. Switch off power and input signals before inserting and removing connectors or connecting test equipment.
6. Keep work area free of non-conductive materials such as ordinary plastic assembly aids and Styrofoam.
7. Use only field service tools that are conductive, such as cutters, screwdrivers, and vacuum cleaners.
8. Always place drives and boards PCB-assembly-side down on the foam.
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Requirements IEC 62368-1 1.3.
Users of the Q7ALx2 module must evaluate the end product to ensure the requirements of the IEC 62368-1 safety
standard are met:
The module must be installed in a suitable mechanical, electrical and fire enclosure.
The module in its enclosure must be evaluated for temperature and air flow considerations.
For interfaces having a power pin such as external power or fan, ensure that the connectors and wires are
suitably rated.
All connections from or to the Module shall be with Safety Extra Low Voltage (SELV) circuits only.
Wires have suitable rating to withstand the maximum available power.
The enclosure of any peripheral device fulfills the fire protecting requirements of IEC 62368-1.
Instructions for the Lithium Battery 1.4.
The O7ALx2 module is supported via a lithium battery on a separate carrier board. When replacing a lithium battery,
only use the same or equivalent type or a replacement recommended by the manufacturer. Follow the replacement
precautions stated below.
Danger of explosion when replaced with wrong type of battery. Replace only with the same
or equivalent battery type recommended by the manufacturer. The lithium battery type
must be UL recognized.
After removing the lithium battery, dispose of the lithium battery according to the regulations within your region.
Do not dispose of lithium batteries in general trash collection. Dispose of the battery
according to the local regulations dealing with the disposal of these special materials, (e.g.
to the collecting points for dispose of batteries).
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
2/ Introduction
This user guide describes the Qseven® modules Q7ALx2 from Kontron, known as Q7ALx2 within this user guide. The
Q7ALx2 is an off-the-shelf module designed to meet the Qseven® standard. The Q7ALx2 includes all the components
of a common PC on a small form factor board (70 mm x 70 mm) designed to be mounted on a carrier board using the
Qseven® (MXM) connector. The interface connectors on the carrier board connect to the end application.
The use of the Q7ALx2 module requires basic knowledge of PC hardware and software. This user guide focuses on
describing the Q7ALx2’s special features and is not intended to be a standard PC textbook.
Before powering on the Q7ALx2 module, Kontron recommends new users to read and observe the General Safety
Instructions for Equipment in the previous Chapter and study the power on procedure in Chapter 9/: Power on.
Configuration and setup of the Q7ALx2 is performed automatically or manually, by the user, via the BIOS setup.
Latest revision of this user guide, datasheet, BIOS, drivers and BSPs (Board Support Packages) are available for
downloaded from Kontron’s Web Page.
This user guide is a preliminary version. Preliminary versions may contain information that
requires rework. Items highlighted in yellow may still need to be confirmed.
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3/ Product Description
The Q7ALx2 module is based on the Qseven® Specification Rev 2.1 using an Intel x86 SoC, supporting on-module
system memory, eMMC Flash memory expansion and extensive interfaces.
Figure 1: QSEVEN Module
The main Qseven-Q7ALx2 features are:
Intel® Atom x5 E3950, E3940, E3930 and mobile Celeron N3350/4200 with integrated chipset
Qseven® form factor (70 mm x 70 mm)
Qseven® connector complies to Qseven® specification Rev 2.1
Up to 8 GByte LPDDR4 memory down
From 32 GByte (SLC) /up to 64 GB (MLC) eMMC 5.1 Flash (option)
2x SATA 6 Gb/s
4x PCIe x1, Gen 2
1x GbE LAN
2x USB 3.0 (QSEVEN port 0,1)
4x USB 2.0 Host (QSEVEN port 2, 3, 4, 5)
1x USB 2.0 OTG (QSEVEN port 1) using switch of full functional OTG
2x Display ( 1x eDP and 1x DP or HDMI)
1x SDIO
1x SPI external Boot (SPI0)
1x SPI for generic devices (SPI1)
1x HDA Audio / I2S Audio (muxed)
2x I2C interfaces
1x SMB interface
1x MIPI-CSI2 (option for some variants)
1x UART interfaces
8x GPIO’s / LPC (muxed)
1x CAN Bus interface
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4/ Scope of Delivery
Packing List 4.1.
Check that your delivery is complete, and contains the item(s) below (according to the ordered configuration). If you
discover damaged or missing item(s), contact your dealer.
Table 1: Packing List
Delivered Part Part Description
Q7ALx2 Qseven® module board with Intel x86 SoC and on-module memory
Note: The above packing list is for standard single box package only.
Accessories 4.2.
The following accessories are available for the Q7ALx2.
Table 2: Accessory List
Part Name SAP Number Part Description
Heatspreader Plate Commercial 81004-0000-99-1 Heatspeader to attach to commercial Qseven® Q7ALx2
module
Heatspreader Plate Industrial 81005-0000-99-1 Heatspeader to attach to industrial Qseven® Q7ALx2
module
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5/ Product Specification
Block Diagram 5.1.
he following figure displays the Q7ALx2 module’s system block diagram.
T
Figure 2 : Block Diagram Q7ALx2 Module
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
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Module Views 5.2.
1 SOC
4 CPLD connector
3 5 4
1
2 6 6
Figure 3 : Top Side View Q7ALx2
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
6
6
2 Memory down
3 Qseven® connector
5 MIPI-CSI2 Connector (shown here as
vacant slot - option for some variants)
6 4x Mounting points
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Figure 4 : Bottom Side View Q7ALx2
Qseven® connector
4x Mounting points
1
2
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
2
2
2
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1
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
2 GByte to 32 GByte (SLC) eMMC 5.1 Flash
Component Technical Data 5.3.
The table below summarizes the Q7ALx2 module’s main component technical features:
Table 3: Component Technical Data
Q7ALx2 Module
Form Factor Qseven® module standardized form factor (70 mm x 70 mm)
Processor
System On Chip
(SOC)
Memory
System Memory
Embedded processors based on Intel x86 SoC with integrated chipset:
Industrial Grade (@ -40°C to 85°C):
Intel Atom x5 E3930, 2 Cores, 1.8 GHz, 6,5 W
Intel Atom x5 E3940, 4 Cores, 1.8 GHz, 9,5 W
Intel Atom x7 E3950, 4 Cores, 2.0 GHz, 12 W
Commercial Grade (0°C to 60°C):
Intel Mobile Celeron N3350 2 Cores, 2.4 GHz, 6 W
Intel Mobile Celeron N4200 2 Cores, 2.5 GHz, 6 W
Up to 4x LPDDR4 1.2 V DRAMs
Single channel
Up to 8 GBytes (1 GB to 8 GB)
2400 MT/s
eMMC Storage
(option)
or
2 GByte to 64 GByte (MLC) eMMC 5.1 Flash
Controller
Embedded
FPGA (MAX10) controller for embedded feature set and logic control
Controller
H/W Status
Monitor
Nuvoton NCT7802Y hardware monitor supports:
SM Bus connection to SoC
PWM and Tach interface to external fan
Temperature measurements (2x external thermal diodes and 1x internal sensor)
Analog/Digital measurements on V_RTC, VCC and VCC_SB
Complex
Programmable
Logic Devices
(CPLD)
CPLD (MAX10) controller supports:
Power Sequencing
Status and control signal level shifting to allow signals routed to Qseven® connector
to comply with Qseven® Specifications
LPC to UART bridge to provide 4-wire UART
LPC to I2C bridge to provide I2C interface
LPC to GPIO bridge to provide eight GPIOs
LPC to CAN bridge to provide CAN interface
Watchdog Dual Staged Watchdog timer supported by:
Watchdog time out (WDOUT)
Watchdog trigger(WDTRIG#)
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Windows® 10 Enterprise 64 bit
VCC = 5 VDC +/- 5%
Software
BIOS On-board 128 Mb SPI flash for BIOS storage
Operating System
Support
Windows 10 IoT 64 bit
Linux Yocto 64-bit
I/O functions on Qseven® connector
PCIe 4x PCIe Gen 2 (5 GT/s), lanes configured as:
4 x1 (4 PCIe links x1 wide)
or
1 x4 (1 PCIe link x4 wide).
Note: Implement the PCIe links and support signals as per the Qseven® Specification.
SATA 2x SATA Gen 3 links (6Gb/s)
GbE LAN 1x GBE port
(using Intel i210IT/i211AT Ethernet controller)
USB 2x USB 3.0 (USB 3.0 or USB 2.0 compatible)
4x USB 2.0
1x USB OTG (USB 2.0 host or client operation)
HDA 1x HDA audio (muxed with I2S interface)
I2S 1x Inter-IC Sound (I2S) interface (muxed with HDA interface)
Serial Port 1x 4-wire UART interface (TX, RX, CTS, RTS) at 3.3 VDC (supported by the MAX10 FPGA)
SPI 1x fast SPI interface from primary SPI chip for external boot from Carrier BIOS SPI chip
1x SPI interface as secondary SPI interface for generic SPI devices on the carrier board
CAN 1x CAN bus V2.0 interface
I2C 2x I2C Interfaces (1x standard and 1x muxed with SMB)
GPIO 8x General Purpose Input/Output (GPIOs) configurable in BIOS (muxed with LPC bus)
SDIO 1x SDIO interface with the Qseven® connector
LVDS Dual channel using eDP2LVDS or eDP + DP
On-module Connectors
MIPI 1x MIPI-CSI2, 36-pin connector (option for some variants)
CPLD 1x CPLD,6-pin connector ( used for JTAG)
Qseven® 1x Qseven® MXM, 230-pin connector (used for interfaces, control and power)
Power
Power Supply
VCC_SB = 5 VDC +/- 5%
VCC_RTC = 3 VDC (Range: 2.4 VDC to 3.3 VDC)
Power
Management
LID/SLeep/Batlow
Signal
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Power saving supports C-states (C0, C1, C6, C7, C8, C9 and C10)
Wake on LAN (WOL)
Supported
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HDMI
Display
Digital Displays Up to two independent digital displays using “DDI0” and “DDI1” from the SoC:
DDI0 – eDP (no LVDS only shares Qseven® connector pin with LVDS )
DDI1 - DP++ or HDMI
DDI0
DDI1
eDP
DP++
eDP interface is DDI0 from SoC (Resolution: 3840x2160 @60Hz)
Dual Mode HDMI (Resolution: 3840x2160 @30Hz)
DP++ interface is DDI1 from SoC (Resolution: 4096x2160 @60Hz)
Security
TPM TPM (option)
Note: To use TPM, the TPM feature must be enabled in the BIOS setup.
Kontron Security
Supported
Solution Approtect
Environmental Condition 5.4.
Table 4: Environmental Condition
Environmental
Temperature
(operating)
Temperature
(non-operating)
Relative Humidity 93%, at +40°C, non-condensing (according to IEC 60068-2-78)
Shock According to IEC/EN60068-2-6
Vibration According to IEC/EN60068-2-27
Commercial grade 0°C to +60°
Industrial grade (E2): -40°C to +85°
-40°C to +85°C
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Standards and Directives 5.5.
The Qseven® Q7ALx2 module complies with the following Standards and Directive.
Table 5: Standards and Directives
CE
National Certification CE Marking Directive 93/68/EEC
Low Voltage Directive (LVD) 2006/95/EC
EMC/EMI
Emission EN 55032 Class B /
FCC part 15 Class B
Immunity IEC/EN 61000-6-1 Test conducted in standard available chassis with Q7 carrier board.
Safety
International CE EN 62368-1
Environment
WEEE Compliant with the Waste Electrical and Electronic Equipment (WEEE) 2012/19/EU directive; to
reduce waste of electrical and electronic equipment, encourage recycling and environmental
disposal and increase the environmental awareness of producers
RoHS II Compliant with the Restriction of Hazardous Substances (RoHS) 2011/65/EU directive or the
late status thereof, to reduce hazardous substances in electrical and electronic equipment
REACH Compliant with the Registration, Evaluation, Authorization and Restriction of Chemicals (REACH)
Regulation No. 1907/2006 to identify the intrinsic properties of chemical substances earlier
Test conducted in standard available chassis with Q7 carrier board.
Electromagnetic compatible – Emission standard for information
technology equipment (ITE). External test in certified test laboratory and
declaration of conformity written by Kontron Technology only.
Electromagnetic compatible – Generic immunity standard Part1:
Residential, commercial and light industrial environment. Internal test
and declaration of conformity written by Kontron Technology only.
Component recognition Audio/video, information and communication
technology equipment – Safety requirements
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Mechanical Specification 5.6.
Figure 5 : Q7ALx2 Top Side Mechanical Specification (measurement in mm)
Figure 6: Q7ALx2 Bottom Side Mechanical Specification (measurement in mm)
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4.17
5.42
5.66
5.17
5.66
63
63
70
5.6.1. Heat Spreader Mechanical Specification
Figure 7: Heat Spreader for Commercial Grade Mechanical Specification (measurement in mm)
Figure 8: Heat Spreader for Industrial Grade Mechanical Specification (measurement in mm)
5.42
70
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6
1 2 4
3
Thermal Management 5.7.
5.7.1. Heatspreader Plate and Cooling Solutions
A heatspreader plate assembly is available for the Q7ALx2. The heatspreader plate is NOT a heat sink. The
heatspreader plate is a Qseven® standard thermal interface to accompany a heat sink or external cooling device(s).
The aluminum slugs and thermal pads on the underside of the heatspreader plate act as thermal interfaces between
the heatspreader plate and the major heat-generating components on the Q7ALx2 module. Approximately 80 % of
the module’s dissipated power is conducted to the heatspreader plate and can be removed by the cooling solution.
Figure 9: Heatspreader Plate Assembly
5
1
Heatspreader plate
2 Thermal pad
3 Aluminum slug
An external cooling device must be used to maintain the heatspreader plate at the specified operating temperature.
Under worst-case conditions, the cooling device must maintain an ambient air temperature and the heatspreader
plate temperature, on any spot of the heatspreader's surface, must remain under the temperature grade’s maximum
specification of:
60°C for commercial grade modules
75°C for extended temperature grade modules
85°C for industrial temperature grade module
Hot Surface
A Heatspreader plate or heatsink can get hot. To avoid burns and personal injury:
• Do not touch the when the product is operating
• Allow the product to cool before handling
• Wear protective gloves
• Switch off the product when not in use
4 Thermal pad
5 Thermal pad
6 Thermal pad
Operate only with an external cooling solution
To maintain the surface temperature of the heatspreader plate under the maximum
temperature specified an external cooling device such as a heatsink must be used.
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HWM Chip - measures “module
1
5.7.2. Temperature Sensors
The Hardware Monitor (HWM) chip (Nuvoton NCT802Y) uses an on-chip temperature sensor to measure the module’s
temperature. This measurement is referred to as the “module temperature” in the BIOS setup menu (Advanced>H/W
Monitor). The HWM uses the SMBus interface, see Table 13: SMBus Address.
Figure 10: HWM with Temperature Sensor
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1
temperature”
For documentation and CAD drawings of heatspreader plate and cooling solutions, refer to
Kontron’s Customer Section
.
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Power Specification 5.8.
The Q7ALx2 module receives power from a carrier board via the Qseven® connector. The Q7ALx2 must be connected
to a carrier board to power on.
The Qseven® module is powered on by connecting to a carrier board using the Qseven®
connector. Before connecting the module’s Qseven® connector to the carrier board’s
corresponding connector, switched off and disconnected the carrier board from the main
power supply. Failure to disconnect the main power supply could result in personal injury
and damage to the module and/or carrier board.
5.8.1. Power Supply Specification
As defined by the Qseven® specification, the Q7ALx2 module is supplied with power using 12 VDC VCC pins on the
Qseven® connector. The Q7ALx2 module is designed to be driven with a single +5 VDC input power rail. Additionally,
two optional power rails supply other supported supply voltages such as +5 VDC standby and 3 VDC RTC. The 3 V RTC
voltage is provided by the Real Time Clock battery cell located on the carrier board.
Table 6: Power Supply Specification
Supply Voltage (VCC) 5 VDC
Standby Voltage (VCC_SB) 5 VDC ±5 %
RTC Voltage (VCC_RTC) 3 VDC ( Range: 2.4 VDC to 3.3 VDC)
Ground (GND) Power Ground
Input Current 0.5 A per input voltage pin (max.)
Module Power 12W (when supplied with the minimum input voltage level (max.)
5.8.2. Power Supply Voltage Rise Time
The Q7ALx2 module’s input voltage rise time is 0.1 ms to 20 ms from input voltage ≤10% to nominal input voltage.
To comply with the ATX specification there must be a smooth and continuous ramp up of each DC input voltage
from 10 % to 90 % of the DC input voltage final set point.
5.8.3. Power Supply Voltage Ripple
The Q7ALx2 module’s maximum power supply voltage ripple for the input voltage range (+4.75 VDC to 5.25 VDC) is
50 mV peak-to-peak. The voltage ripple must not cause the input voltage range to be exceeded.
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5.8.4. Input Power Sequencing
The following figure illustrates the Q7ALx2 module’s inputs power start and stop sequence requirements.
Figure 11: Input Power Start and Stop Sequence
VCC_RTC
VCC_SB
VCC
PWGIN
PWGIN is an active high input for the Qseven® module and indicate that the all the power
rails on the carrier board are ready for use.
Start sequence
VCC_RTC must come up at the same time or before VCC_SB comes up (T1)
VCC_SB must come up at the same time or before VCC comes up (T2)
PWGIN must be active at the same time or after VCC comes up (T3)
Stop Sequence
PWGIN must be inactive at the same time or before VCC goes down (T4)
VCC must go down at the same time or before VCC_SB goes down (T5)
VCC_SB must go down at the same time or before VCC_RTC goes down (T6)
5.8.5. Power Management
Power management options are available within the BIOS setup. The Q7ALx2 implements the Advanced Configuration
and Power Interface (ACPI) ACPI 3.0 hardware specification to control typical features such as power button and
suspend states.
If power is removed, 5 VDC can be applied to VCC_SB pins (pins 205 and 206) to support the suspend-states:
Suspend-to-Disk (S4)
Soft-off state (S5)
Implementing the wake-up event (S0) requires a connection to power, as the module will be started.
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5.8.5.1. Power Supply Control and Management Signals
Power supply control settings are set in the BIOS setup menus and enable the module to shut down, rest and wake
from standby.
Table 7: Power Supply Control and Management Signals
Signal Pin Description
PWRBTN# 20 Power button: this signal is a low active input and triggered on the falling edge.
PWGIN# 26 Power good input: this high active input for the Qseven® module indicates that all
power rails located on the carrier board are ready for use.
RSTBTN# 28 Reset button: this input may be driven active low by external circuitry to reset the
Qseven® module.
BATLOW# 27 Battery low: this signal may be driven active low by external circuitry to signal that the
system battery is low or may be used to signal some other external battery
management event.
Wake# 17 Wake Event: this may be driven active low by external circuitry to signal an external
wake-up event.
SUS_S3# 18 S3 State: this signal shuts off power to all runtime system components that are not
maintained during S3 (Suspend to Ram), S4 or S5 states. The signal SUS_S3# is
necessary in order to support the optional S3 cold power state.
SUS_S5# 16 S5 State: This signal indicates S4 or S5 (Soft Off) state.
SLP_BTN# 21 Sleep button: this low active signal transitions the module into the sleep state or to
wake up the system up. This signal is triggered on falling edge. (Pin shared with GPIO)
LID_BTN# 22 LID button: this low active signal detects a LID switch and brings the module into the
sleep state or wakes up the module again. Open/Close state may be software
configurable. (Pin shared with GPIO)
The SUS_S3# signal must be able to enable the carrier board’s power rails generated out of
the VCC power rail.
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6/ Features and Interfaces
CAN Bus 6.1.
The CAN Bus interface is compliant with the CAN Bus V 2.0 specification and implemented via a LPC to GPIO bridge.
eMMC (option) 6.2.
The Embedded Multimedia Flash Card (eMMC) is eMMC 5.1 compatible and supports eMMC flash capacities from
2 GByte to 32 GByte (SLC) or from 2 GByte to 64 GByte (MLC). During the manufacturing process, Multi Level Cell
(MLC) eMMC is reconfigured to act as pseudo Single Level Cell (pSLC) eMMC to provide improved reliability,
endurance and performance.
The eMMC flash memory features are:
Up to 32 GByte (SLC) / 64 GB (MLC) eMMC 5.1 Flash
eMMC 5.1 compatible
Fast I2C 6.3.
Fast I2C (100 to 400 kHz) supports transfer between components on the same board. The Qseven-Q7ALx2 features
two I2C Interfaces. One standard I2C interface and one I2C interface multiplexed with the SM Bus.
The I2C controller supports:
Multimaster transfers
Clock stretching
Collision detection
Interruption on completion of an operation
GPIO 6.4.
The eight GPIO pins GPI00 (pin 185), GPIO1 (pin 186), GPIO2 (pin 187), GPIO3 (pin 188), GPIO4 (pin 189), GPIO5 (pin 190),
GPIO6 (pin 191) and GPIO7 (pin 192) on the Qseven® connector are pin shared with the LPC. An EEPROM bit is added so
that the carrier board can define if the pins are used as GPIO or LPC.
The GPIO or LPC option is configured in the BIOS setup:
Advanced>CPLD Configuration>GPIO-LPC Mux Select [Mux to LPC, Mux to GPIO]
JTAG 6.5.
Joint Test Action Group (JTAG) is an industry standard used to verify designs and test modules or boards after they
have been manufactured. JTAG tests for common problems by observing data at the device’s inputs and controlling
the data at the outputs. Simple tests can be performed to find manufacturing defects such as missing devices
unconnected pins or failed/dead devices. The JTAG signals are: TDI (Test Data In), TDO (Test Data Out), TMS (Test
Mode Select), TCK (Test Clock), and TRST (Test Report-optional).
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Kontron Security Solution (option) 6.6.
Kontron Security Solution is a combined hardware and software solution that includes an embedded hardware
security module and a software framework to protect applications.
The integrated security module connected to SoC port 7. Therefore, if this option is installed, SoC port 7 is not
available for other interfaces. The main integrate security solution features are:
Copy protection
IP protection
License model enforcement
If required, customers can customize the solution to meet specific needs. For more information, contact
Support.
Kontron
LPC 6.7.
The Low Pin Count (LPC) interface signals are connected to the LPC bus bridge located in the CPU or integrated
chipset. The LPC low speed interface can be used for peripheral circuits such as an external Super I/O controller that
typically combines legacy-device support into a single IC. The implementation of this sub-system complies with the
Qseven® Specification.
The LPC bus does not support DMA (Direct Memory Access). When more than one device is used on LPC, a zero delay
clock buffer is required that can lead to limitations for the ISA bus.
The LPC Interface signals LPC_AD0 (pin 185), LPC_AD1 (pin 186), LPC_AD2 (pin 187), LPC_AD3 (pin 188), LPC_CLK (pin
189), LPC_FRAME# (pin 190) and LPC_LDRQ# (pin 192) on the Qseven® connector are pin shared with the GPIO. The
CPLD controller incorporates a LPC bridge to support either I2C, to GPIO. An EEPROM bit on the carrier board can
define if the pins are used as GPIO or LPC.
The GPIO or LPC option is configured in the BIOS setup:
Advanced>CPLD Configuration>GPIO-LPC Mux Select [Mux to LPC, Mux to GPIO]
Table 8: Supported BIOS Features
LPC Interface Signals Description
LPC Bridge to UART 4-wire UART
GPIO 8x GPIOs
CAN Used GPIO bridge to support CAN interface
I2C I2C interface
PS/2 Not supported
LPT Not suppored
Floppy Not supported
Interface signal marked as not supported (PS/2, LPT and Floppy) do not exclude OS support (e.g. Hardware Monitor
(HWM) is accessible via SMB). If any other LPC Super I/O additional BIOS implementations are necessary, contact
Kontron Support
.
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RTC 6.8.
The Real Time Clock (RTC) accurately keeps track of the current time. The RTC’s low power consumption means that
the RTC can be powered from an alternative source of power, enabling the RTC to continue to keep time while the
primary source of power is off or unavailable. The Q7ALx2 module’s RTC battery voltage range is 2.4 V - 3.3 V.
SDIO 6.9.
The Secure Digital Input/Output (SDIO) interface is used to interchange data between devices. Using an SDIO card,
data can be interchanged between portable or non-portable memory. The 4-bit SDIO transmits data on SDIO_DAT1
(pin 148), SDIO_DAT1 (pin 149), SDIO_DAT3 (pin 149) and SDIO_DAT4 (pin 150) and controls the data using pins 142,
143, 145, 146 and 147 on the Qseven® connector.
SPI 6.10.
The Serial Peripheral Interface Bus (SPI) bus is a synchronous four-wire serial data link standard. Devices
communicate in master/slave mode, where the master device initiates the data frame. .A master device can control
one or multiple slave device(s) by setting the slave’s (chip select) line.
The Q7ALx2 module supports one fast Serial Peripheral Interface Bus (SPI) interface. The SPI interface is connected to
the primary SPI chip on the module and can also be used to boot from the external BIOS SPI chip on the carrier board.
The SPI interface can boot from the primary on-module SPI chip or with an external SPI BIOS
chip on the carrier board.
6.10.1. SPI boot
SPI boot is perfomed from the module’s 128 Mb SPI Flash used for BIOS storage or the carrier board’s Flash pin
(Module_BIOS_DIS#).
Table 9: SPI Boot Pin Configuration
Configuration MODULE_BIOS_DIS# Function
1 Open Boot on module BIOS
2 GND Boot on carrier board BIOS
The BIOS does not support being split between two chips. Booting takes place either from
the module SPI or from the carrier board SPI.
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SPI boot is available for multiple vendors. The following table lists the supported SPI Boot Flash types for the 8-SOIC
package.
Table 10: Supported SPI Boot Flash Types for 8-SOIC Package
Size Manufacturer Part Number Device ID
16MB Maxim MX25L12835F 0x20
16MB Winbond W25Q128 0x90
16MB Micron N25Q128A 0xBA
SpeedStep™ Technology 6.11.
The SpeedStep™ technology enables the adaption of high performance computing in applications by switching
automatically between maximum performance mode and battery-optimized mode, depending on the needs of the
application. When battery powered is running in idle mode, the processor drops to lower frequencies (by changing the
CPU ratios) and voltage, thus conserving battery life while maintaining a high level of performance. The frequency is
automatically set back to the higher frequency, allowing you to customize performance.
In order to use the Intel® Enhanced SpeedStep™ technology the operating system must support SpeedStep™
technology.
By deactivating the SpeedStep™ feature in the BIOS setup, manual control or modification of the CPU performance is
possible. To achieve manual control, setup the CPU Performance States (P-state and C-state), use third party
software to control the CPU Performance States.
TPM 2.0 (option) 6.12.
The Trusted Platform Module (TPM) stores RSA encryption keys specific to the host system for hardware
authentication. The term TPM refers to the set of specifications applicable to TPM chips. The LPC bus connects the
TPM chip to the CPU.
Each TPM chip contains an RSA key pair called the Endorsement Key (EK). The pair is maintained inside the TPM chip
and cannot be accessed by software. The Storage Root Key (SRK) is created when a user or administrator takes
ownership of the system. This key pair is generated by the TPM based on the Endorsement Key and an ownerspecified password.
A second key, called an Attestation Identity Key (AIK) protects the device against unauthorized firmware and software
modification by hashing critical sections of firmware and software before they are executed. When the system
attempts to connect to the network, the hashes are sent to a server that verifies they match the expected values. If
any of the hashed components have been modified since the last start, the match fails, and the system cannot gain
entry to the network.
Enable the TPM feature in the BIOS setup:
Advanced>Trusted Computing>Security Device> [Enable, Disable]
Select the TPM version or allow for auto select in the BIOS setup:
Advanced>Trusted Computing>Device Select> [TPM 1.2, TPM2.0, AUTO]
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UART 6.13.
The 4-wire UART supported by MAX10 FPGA implements a serial communication interface (COM) and supports one
serial RX/TX port on the Qseven® connector’s pin-171 (UART0_TX) and pin-177 (UART0_RX) for UART0. The UART
controller is fully 16550A compatible.
UART features are:
On-Chip bit rate (baud rate) generator
With handshake lines
Interrupt function to the host
FIFO buffer for incoming and outgoing data
Watchdog Timer (WDT) - Dual Stage 6.14.
A watchdog timer (WDT) or (computer operating properly (COP) timer) is a computer hardware or software timer. If
there is a fault condition in the main program, the watchdog triggers a system reset or other corrective actions. The
intention is to bring the system back from the non-responsive state to normal operation.
Possible fault conditions are a hang, or neglecting to service the watchdog regularly. Such as writing a “service pulse”
to it, also referred to as “kicking the dog”, “petting the dog”, “feeding the watchdog” or “triggering the watchdog”.
The Q7ALx2 module offers a watchdog that works with two stages that can be programmed independently and used
stage by stage.
Table 11: Dual Staged Watchdog Timer- Time-Out Events
0000b No action Stage is off and will be skipped.
0001b Reset A reset restarts the module and starts a new POST and operating system.
0101b Delay -> No action Might be necessary when an operating system must be started and the time for
the first trigger pulse must be extended. Only available in the first stage.
1000b WDT Only This setting triggers the WDT pin on the QSEVEN® connector (pin 72) only.
1001b Reset + WDT
1010b NMI + WDT
1011b SMI + WDT
1100b SCI + WDT
1101b DELAY + WDT -> No
action
6.14.1. Watchdog Timer Signal
Watchdog time-out event (pin-72) on the Qseven® connector offers a signal that can be asserted when a watchdog
timer has not been triggered within a set time. The WDT signal is configurable to any of the two stages. After reset,
the signal is automatically deasserted. If deassertion is necessary during runtime, contact Kontron Support for
further help.
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
7/ System Resources
PCI Devices 7.1.
All devices follow the Peripheral Component Interconnect (PCI) 2.3 and PCI Express Base 1.0a specification. The BIOS
and Operating System (OS) control the memory and I/O resources. For more information, refer to the PCI 2.3
Specification.
I2C Bus 7.2.
The following table specifies the devices connected the I2C bus and includes the I2C address.
Table 12: I2C Bus Port Address
8-bit I2C Address Used For Available Comment
A0h JIDA-EEPROM Yes Module EEPROM
C0h LVDS PTN3460 Yes LVDS EEPROM
SM Bus 7.3.
The System Management (SM) Bus is an 8-bit address bus where the LSB (Bit 0) defines the direction (read/write).
Bit 0 = 0 defines the write address
Bit 0 = 1 defines the read address
The hexadecimal 8-bit addresses listed below show the write address for all devices. The hexadecimal 7-bit SMBus
addresses show the device address without bit0.
Table 13. SMBus Address
8-bit
Address
5Ch 2eh HWM NCT7802Y Do not use under any circumstances SMB
A0h 50h SPD DDR Channel 1 SMB
7-bit
Address
Device Comment SMBus
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8/ Connectors
MIPI Connector Pin Assignment (option for some variants) 8.1.
Figure 12 : MIPI CSI2 Connector
Table 14: MIPI-CSI2 Connector Pin Assignment
Pin Signal Pin Signal
1 CAM_PWR 3.3V 19 CAM0_I2C_DAT
2 CAM_PWR 3.3V 20 CAM0_ENA#
3 CAM0_CSI_D0+ 21 MCLK
4 CAM0_CSI_D0- 22 CAM1_ENA#
5 GND 23 CAM1_I2C_CLK
6 CAM0_CSI_D1+ 24 CAM1_I2C_DAT
7 CAM0_CSI_D1- 25 GND
8 GND 26 CAM1_CSI_CLK+
9 CAM0_CSI_D2+ 27 CAM1_CSI_CLK-
10 CAM0_CSI_D2- 28 GND
11 CAM0_RST# 29 CAM1_CSI_D0+
12 CAM0_CSI_D3+ 30 CAM1_CSI_D0-
13 CAM0_CSI_D3- 31 CAM1_RST#
14 GND 32 CAM1_CSI_D1+
15 CAM0_CSI_CLK+ 33 CAM1_CSI_D1-
16 CAM0_CSI_CLK- 34 GND
17 GND 35 CAM0_GPIO
18 CAM0_I2C_CLK 36 CAM1_GPIO
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
CPLD Connector Pin Assignment 8.2.
Figure 13 : CPLD Connector
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
2
20
24
26
40
Table 15: CPLD Connector Pin Assignment
Pin Signal
1 3.3V
2 TDO
3 TDI
4 TCK
5 TMS
6 GND
Qseven® Connector Pin Assignment 8.3.
The Qseven® connector is MXM 230-pin connector with the same number of pins on the module’s top and bottom
sides, see Figure 3, pos. 3 and Figure 4, pos. 1.
Table 16: QSEVEN Connector Pin Assignment
Pin Signal (Bottom side row) Pin Signal (Top side row)
1
3
5
7
9
11
13
15
17
19
21
23
KEY
25
27
29
31
33
35
37
39
41
43
45
47
49
GND
GBE_MDI3-
GBE_MDI3+
GBE_LINK100#
GBE_MDI1-
GBE_MDI1+
GBE_LINK#
GBE_CTREF
WAKE#
GPO0
SLP_BTN# / GPII1
GND
GND
BATLOW# / GPII2
SATA0_TX+
SATA0_TX-
SATA_ACT#
SATA0_RX+
SATA0_RX-
GND
BIOS_DISABLE# / BOOT_ALT#
SDIO_CD#
SDIO_CMD
SDIO_PWR#
SDIO_DAT0
4
6
8
10
12
14
16
18
22
KEY
28
30
32
34
36
38
42
44
46
48
50
GND
GBE_MDI2-
GBE_MDI2+
GBE_LINK1000#
GBE_MDI0-
GBE_MDI0+
GBE_ACT#
SUS_S5#
SUS_S3#
PWRBTN#
LID_BTN# / GPII0
GND
PWGIN
RSTBTN#
SATA1_TX+
SATA1_TX-
GND
SATA1_RX+
SATA1_RX-
GND
SDIO_CLK#
reserved
SDIO_WP
SDIO_DAT1
SDIO_DAT3
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
58
74
98
Pin Signal (Bottom side row) Pin Signal (Top side row)
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
81
85
87
89
91
93
95
97
99
101
103
105
107
109
111
113
115
117
119
121
123
125
127
129
131
133 DP_LANE3-/TMDS_CLK 134 USB_SSTX1+
135
SDIO_DAT2
Reserved
Reserved
GND
HDA_SYNC / I2S_WS
HDA_RST# / I2S_RST#
HDA_BITCLK / I2S_CLK
HDA_SDI / I2S_SDI
HDA_SDO / I2S_SDO
THRM#
THRMTRIP#
GND
USB_P7- / USB_SSTX0-
USB_P7+ / USB_SSTX0+
USB_6_7_OC#
USB_P5- / USB_SSTX2-
USB_2_3_OC#
USB_P3-
USB_P3+
USB_VBUS
USB_P1-
USB_P1+
GND
eDP0_TX0+ / LVDS_A0+
eDP0_TX0- / LVDS_A0-
eDP0_TX1+ / LVDS_A1+
eDP0_TX1- / LVDS_A1-
eDP0_TX2+ / LVDS_A2+
eDP0_TX2- / LVDS_A2-
LVDS_PPEN
eDP0_TX3+ / LVDS_A3+
eDP0_TX3- / LVDS_A3-
GND
eDP0_AUX+ / LVDS_A_CLK+
eDP0_AUX- / LVDS_A_CLK-
LVDS_BLT_CTRL / GP_PWM_OUT0
GP2_I2C_DAT / LVDS_DID_DAT
GP2_I2C_CLK / LVDS_DID_CLK
CAN0_TX
DP_LANE3+ / TMDS_CLK+
GND
52
54
56
60
62
64
66
68
70
72
76
78
80
82
86
88
90
92
94
96
100
102
104
106
108
110
112
114
116
118
120
122
124
126
128
130
132
136
Reserved
Reserved
USB_OTG_PEN
GND
SMB_CLK / GP1_I2C_CLK
SMB_DAT / GP1_I2C_DAT
SMB_ALERT#
GP0_I2C_CLK
GP0_I2C_DAT
WDTRIG#
WDOUT
GND
USB_P6- / USB_SSRX0-
USB_P6+ / USB_SSRX0+
USB_4_5_OC#
USB_P4- / USB_SSRX2-
USB_0_1_OC#
USB_P2-
USB_P2+
USB_ID
USB_P0-
USB_P0+
GND
eDP1_TX0+ / LVDS_B0+
eDP1_TX0- / LVDS_B0-
eDP1_TX1+ / LVDS_B1+
eDP1_TX1- / LVDS_B1-
eDP1_TX2+ / LVDS_B2+
eDP1_TX2- / LVDS_B2-
LVDS_BLEN
eDP1_TX3+ / LVDS_B3+
eDP1_TX3- / LVDS_B3-
GND
eDP1_AUX+ / LVDS_B_CLK+
eDP1_AUX- / LVDS_B_CLK-
GP_1-Wire_Bus / HDMI_CEC
eDP0_HPD# / LVDS_BLC_DAT
eDP1_HPD# / LVDS_BLC_CLK
CAN0_RX
USB_SSTX1-
GND
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
NC
NC
NC
NC
NC
NC
NC
NC
Pin Signal (Bottom side row) Pin Signal (Top side row)
137
139
141
143
145
147
149
151
153
155
157
159
161
163
165
167
169
171
173
175
177
179
181
183
185
187
189
191
193
195
197
199
201
203
205
207
209
211
213
215
217
219
DP_LANE1+ / TMDS_LANE1+
DP_LANE1- / TMDS_LANE1-
GND
DP_LANE2+ / TMDS_LANE0+
DP_LANE2- / TMDS_LANE0-
GND
DP_LANE0+ / TMDS_LANE2+
DP_LANE0- / TMDS_LANE2-
HDMI_HPD#
PCIE_CLK_REF+
PCIE_CLK_REF-
GND
PCIE3_TX+
PCIE3_TX-
GND
PCIE2_TX+
PCIE2_TX-
UART0_TX
PCIE1_TX+
PCIE1_TX-
UART0_RX
PCIE0_TX+
PCIE0_TX-
GND
LPC_AD0 / GPIO0
LPC_AD2 / GPIO2
LPC_CLK / GPIO4
SERIRQ / GPIO6
VCC_RTC
FAN_TACHOIN / GP_TIMER_IN
GND
SPI_MOSI
SPI_MISO
SPI_SCK
VCC_SB
MFG_NC0
MFG_NC1
VCC
138
140
142
144
146
148
150
152
154
156
158
160
162
164
166
168
170
172
174
176
178
180
182
184
186
188
190
192
194
196
198
200 SPI_CS0#
202
204 MFG_NC4
206
208 MFG_NC2
210
212
214
216
218
220
DP_AUX+
DP_AUX-
GND
USB_SSRX1-
USB_SSRX1+
GND
HDMI_CTRL_DAT
HDMI_CTRL_CLK
DP_HPD#
PCIE_WAKE#
PCIE_RST#
GND
PCIE3_RX+
PCIE3_RX-
GND
PCIE2_RX+
PCIE2_RX-
UART0_RTS#
PCIE1_RX+
PCIE1_RX-
UART0_CTS#
PCIE0_RX+
PCIE0_RX-
GND
LPC_AD1 / GPIO1
LPC_AD3 / GPIO3
LPC_FRAME# / GPIO5
LPC_LDRQ# / GPIO7
SPKR / GP_PWM_OUT2
FAN_PWMOUT / GP_PWM_OUT1
GND
SPI_CS1#
VCC_SB
MFG_NC3
VCC
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Pin Signal (Bottom side row) Pin Signal (Top side row)
221
223
225
227
229
VCC
VCC
VCC
VCC
VCC
222
224
226
228
230
VCC
VCC
VCC
VCC
VCC
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Carrier board
Qseven® connector
1 2 5
5 4 3
9/ Power on
The Q7ALx2 module receives power from a carrier board via the Qseven® connector. The Q7ALx2 must be connected
to a carrier board to power on and power off.
The Qseven® module is powered on by connecting to a carrier board using the Qseven®
connector. Before connecting the Qseven® module’s connector to the carrier board’s
corresponding connector, switch off and disconnected the main power supply. Failure to
disconnect the main power supply could result in personal injury and damage to the module
and/or carrier board.
Handling and operation of the product is permitted only for trained personnel within a work
place that is access controlled.
Connecting to the Carrier Board 9.1.
The Q7ALx2 module connects to a carrier board via the carrier boards Qseven® connector the height of the standoffs
between the carrier board and the module depends on the height of the Qseven® connector. The heatspreader plate
features boss extrusions as standoffs for precise installation on the module’s four mounting points.
Figure 14: Qseven® Module with Carrier Board Assembly with Heaspreader Plate
1
2 Q7ALx2 module
4
5 Standoffs (not supplied with module)
3 Heatspreader plate
To connect the Q7ALx2 module to the carrier board perform the following:
1. Switch off the power to the carrier board and disconnect the carrier board from the main power supply. Failure
to disconnect the main power supply could result in personal injury and damage to the module and/or carrier
board.
2. Insert the Q7ALx2 module’s Qseven® connector (Figure 3, pos. 3 and Figure 4, pos. 1), with the top side facing
upwards, into a carrier board’s corresponding Qseven® connector (Figure 14, pos.4
3. Secure the Q7ALx2 module to the carrier board using the four mounting points (Figure 3, pos. 6 and Figure 4, pos.
2) with standoffs. Note: The height of the required standoffs depends on the height of the carrier board’s
Qseven® connector.
4. Position and secures the the Q7ALx2 module’s heatspreader plate carefully, with the thermal pads on the
underside of the heatspreader on top of the Q7ALx2’s major heat-generating components (Figure 14, pos. 3).
5. Connect the carrier board to the main power supply and switch on the carrier board to power on the Q7ALx2
module or switch off the carrier board to power off the Q7ALx2 module.
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
10/ uEFI BIOS
Starting the uEFI BIOS 10.1.
The Q7ALx2 module uses a Kontron-customized, pre-installed and configured version of Aptio ® V uEFI BIOS based on
the Unified Extensible Firmware Interface (uEFI) specification and the Intel® Platform Innovation Framework for EFI.
This uEFI BIOS provides a variety of new and enhanced functions specifically tailored to the hardware features of the
Q7ALx2 module.
The BIOS features in this user guide are open to change and may not be the latest version.
The latest version may have differences to the options and features described in this
The uEFI BIOS setup program provides quick and easy access to the individual function settings for control or
modification of the uEFI BIOS configuration. The setup program allows for access to various menus that provide
functions or access to sub-menus with further specific functions of their own.
To start the uEFI BIOS setup program, follow the steps below:
chapter.
Register for the EMD Customer Section to get access to BIOS downloads and PCN service.
1. Power on the module, see Chapter 9/: Power on.
2. Wait until the first characters appear on the screen (POST messages or splash screen).
3. Press the <DEL> key.
4. If the uEFI BIOS is password-protected, a request for password will appear. Enter either the User Password or the
Supervisor Password (see Chapter 10.2.4 Security Setup Menu), press <RETURN>, and proceed with step 5.
5. A setup menu appears.
The uEFI BIOS setup program uses a hot key navigation system. The hot key legend bar is located at the bottom of the
setup screens. The following table provides a list of navigation hot keys available in the legend bar.
Table 17: Navigation Hot Keys in the Legend Bar
Sub-screen Description
<F1> <F1> key invokes the General Help window
<-> <Minus> key selects the next lower value within a field
<+> <Plus> key selects the next higher value within a field
<F2> <F2> key loads previous values
<F3> <F3> key loads optimized defaults
<F4> <F4> key Saves and Exits
<→> or <←>
<↑> or <↓>
<Left/Right> arrows selects major Setup menus on menu bar, for example, Main or Advanced
<Up/Down> arrows select fields in the current menu, for example, Setup function or sub-screen
<ESC> <ESC> key exits a major Setup menu and enters the Exit Setup menu
Pressing the <ESC> key in a sub-menu displays the next higher menu level
<RETURN> <RETURN> key executes a command or selects a submenu
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Setup Menus 10.2.
The Setup utility features menus listed in the selection bar at the top of the screen are:
Main
Advanced
Chipset
Security
Boot
Save & Exit
The currently active menu and the currently active uEFI BIOS setup item are highlighted in white. Use the left and right
arrow keys to select the setup menu.
Each setup menu provides two main frames. The left frame displays all available functions. Configurable functions
are displayed in blue. Functions displayed in grey provide information about the status or the operational
configuration. The right frame displays a Help window providing an explanation of the respective function.
10.2.1. Main Setup Menu
On entering the uEFI BIOS, the setup program displays the Main setup menu. This screen lists the Main setup menu
sub-screens and provides basic system information as well as functions for setting the system language, time and
date.
Figure 15: Main Setup Menu Initial Screen Example
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
The following table shows the Main setup menu sub-screens and functions and describes the content.
The BIOS features in this user guide are open to change and may not be the latest version.
The latest version may have differences to the options and features described in Table 18.
Table 18: Main Setup Menu Sub-screens and Functions Example
Sub-Screen Description
BIOS
Information>
On-board LAN
Information>
Read only field
BIOS vendor, Core version, Compliancy, Project version, Build date and time, and Access level
Read only field
LAN MAC Address
Additional information for MAC Address
The MAC address entry is the value used by the Ethernet controller and may contain the entry
‘Inactive’ - Ethernet chip is inactive. To activate the Ethernet chip set the following:
Advanced > Network Stack Configuration > Network Stack > Enable
88:88:88:88:87:88 is a special pattern that will be filled in by the Ethernet firmware if there is
no valid entry in the firmware block of the BIOS SPI (i.e. the MAC address has been overwritten
during the last attempt to flash the system).
CPU
Information>
Read only field
Processor Type, CPU signature, Microcode patch, CPU Speed, processor Core, intel VT-x
technology
Memory
Information>
Platform
Firmware
Information>
Read only field
Total memory and Memory speed
Read only field
Module Information
BXT SOC, MRC Version, PUNIT FW, PMC FW, TXE FW, GOP, and CPLD rev
System Date> Displays the system date [Week day mm/dd/yyyy]
System Time> Displays the system time [hh:mm:ss]
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Enabled
10.2.2. Advanced Setup Menu
The Advanced setup menu displays sub-screens and second level sub-screens with functions, for advanced
configurations.
Setting items, on this screen, to incorrect values may cause system malfunctions.
Figure 16: Advanced Setup Menu Initial Screen Example
The following table shows the Advanced sub-screens and functions and describes the content. Default settings are in
bold and for some functions, additional information is included.
The BIOS features in this user guide are open to change and may not be the latest version.
The latest version may have differences to the options and features described in Table 19.
Table 19: Advanced Setup menu Sub-screens and Functions Example
Sub-Screen Function Second level Sub-Screen / Description
Driver Health> Read only Information
Provides Health Status for the Drivers/Controllers
Trusted
Computing>
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Read only Information
TPM20 device Found, Vendor and Firmware version
Security Device
Support>
Enables or disables BIOS support for security device
Operating System will not show security device, and TCG EFI protocol
and INT1A interface are not available.
, Disabled]
Active PCR
Banks>
[
Read only field
Displays active PCR Banks
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Enabled
Enabled
None
Enabled
Enabled
Enabled
TCG_2
1.3
Auto
Disabled
Enabled
S3 Suspend to Ram
Disabled
Disabled
Disabled
Disabled
Sub-Screen Function Second level Sub-Screen / Description
Trusted
Computing>
(continued)
Available PCR
Banks>
Read only field
Displays available PCR Banks
SHA-1 PCR Bank> SHA-1 PCR Bank
, Disabled]
, Disabled]
SHA256 PCR
Bank>
[
SHA256 PCR Bank
[
Pending
Operation>
Platform
Hierarchy>
Storage
Hierarchy>
Endorsement
Hierarchy>
TPM2.0 UEFI Spec
Version>
Schedules an operation for security device Note: Computer reboots on
restart to change the state of the security device.
[
, TPM Clear]
Platform Hierarchy
[
, Disabled]
Storage Hierarchy
[
, Disabled]
Endorsement Hierarchy
[
, Disabled]
Selects TCG2 Spec Version support
TCG_1_2: is compatible mode for Win8/Win10 and
TCG_2: supports TCG2 protocol and event format Win 10 or later.
Physical
Presence Spec
Version>
TPM 20
[TCG_1_2,
Select to inform OS to support either PPI Spec 1.2 or 1.3
Note: Some HCK tests might not support 1.3.
[1.2,
]
Read only field
]
InterfaceType>
Device Select> Selects BIOS support for security devices.
Auto: supports both TPM 1.2 and TPM 2.0
TPM 1.2: restricts support to TPM 1.2 devices
TPM 2.0: restricts support to TPM 2.0 devices
]
]
ACPI Settings>
Enable ACPI Auto
Configuration>
Enable
Hibernation>
[TPM 1.2, TPM 2.0,
Enables or disables BIOS ACPI auto configuration. If enabled, the
system uses generic ACPI settings that may not fit the system best.
[Enabled,
Enables or disables systems ability to hibernate (OS/S4 Sleep State)
This option may not be effective with some operating systems.
[
, Disabled]
ACPI Sleep State> Selects highest ACPI sleep state the system enters when the
SUSPEND button is pressed
[Suspend Disabled,
Lock Legacy
Resources>
SMART Settings> SMART Self
Test>
Serial Port Console
Redirection>
COM0 Console
Redirection>
COM1 Console
Redirection>
Lock of legacy resources
[Enabled,
]
Run SMART Self Test on all HDDs during POST
[Enabled,
]
Console redirection via QSEVEN module’s COM1
[Enabled,
]
Console redirection via QSEVEN module’s COM2
[Enabled,
]
]
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Disabled
Disabled
COM0
Disabled
Enabled
Enabled
Disabled
Disabled
Disabled
Enabled
Disabled
Disabled
Sub-Screen Function Second level Sub-Screen / Description
Serial Port Console
Redirection>
(continued)
COM2 Console
Redirection>
COM3 Console
Redirection>
Console redirection via QSEVEN module’s COM3
[Enabled,
]
Console redirection via QSEVEN module’s COM4
[Enabled,
]
Additional Information COM # Console
If redirection is enabled then the port settings such as Terminal type, Bits per second, Data
bits, Parity etc. can be adjusted here. On-module COM ports do not support flow control.
If the Port is disabled, the COM# port is displayed as a read only field.
Legacy Console
Redirection
settings>
Serial Port for
Out-of-Band
Management /
Legacy Serial
Redirection
Port>
Console redirection
[Enabled,
Selects a COM port to display redirection of legacy
OS and legacy OPROM messages
[
, COM1, COM2, COM3]
]
Windows EMS
Console Redir.>
CPU Configuration> Turbo Mode> Enables or disables processor turbo mode
Note: EMTTM must also be enabled.
Auto means enabled unless the max. turbo ratio is bigger than 16-SKL
A0 W/A.
[
, Disabled]
Intel (VME)
Virtual
Technology>
Enables VMM to utilize additional hardware capabilities provided by
Vanderpool Technology
[
, Disabled]
VT-d> CPU VT-d
[Enabled,
]
Monitor Mwait> Monitor Mwait
AMI Graphic Output
Protocol Policy>
[Enabled,
Read only field
AMI Graphic driver version
, Auto]
Output Select>
PCI Subsystem
Settings>
Network Stack
Configuration>
Compatibility
Support Module
Read only field
AMI PCI driver version
Above 4G
Decoding>
Hot-Plug
Support>
64 bit capable devices to be decoded in above 4G address space
[Enabled,
Hot-Plug support for the entire system
[
, Disabled]
Network Stack> UEFI Network Stack
[Enabled,
CSM Support> CSM Support
[Enabled,
]
]
]
(CSM)
Configuration
NVMe
Configuration>
SDIO
Configuration>
www.kontron.com // 49
Read only field
NVMe controller and driver version
SDIO Access
Mode>
Auto Option: Access SD device in DMA mode if controller supports it,
otherwise in PIO mode. DMA option: Access SD device in DMA mode. PIO
Page 50
Auto
Auto
Enabled
Enabled,
Enabled,
20 sec
20 sec
Auto
Auto
Disabled]
Enabled,
Disabled]
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Sub-Screen Function Second level Sub-Screen / Description
SDIO
Configuration>
(continued)
SDIO Access
Mode>
(continued)
Mass storage
devices>
Option: Access SD device in PIO mode.
[
, ADMA, SDMA, PIO]
Mass storage device emulation type.
, Floppy, Forced FDD, Hard Disk]
[
USB Configuration> Read only fields
USB Configuration, UBS module Version, USB controllers, and USB devices
Legacy USB
Support>
Enable- supports legacy USB
Auto– disables legacy support, if no USB devices are connected
Disable-keeps USB devices available for EFI applications only
[
, Disabled, Auto]
XHCI Hand-off> XHCI ownership change claimed by XHCI driver.
Note: This is a work around for OS(s) without XHCI hand-off support.
USB Mass
Storage Driver
[
Enables or disables USB mass storage driver support
[
Disabled]
Disabled]
Support>
USB Transfer
Time-out>
Device Reset
Time-out>
Device Power-up
Delay>
Displays timeout value for control, bulk and interrupt transfers
[1 sec, 5 sec, 10 sec,
]
Displays USB mass storage device start unit command time-out
[10 sec,
, 30 sec, 40 sec]
Displays maximum time taken for the device to report itself to the
host properly. Auto uses the default :root port 100 ms /hub port delay
is taken from hub port descriptor.
[
, Manual]
Security
Configuration>
LVDS
Configuration>
Hardware Monitor>
Mass Storage
Devices>
TXE HMRFPO> TXE HMRFPO
TXE EOP
Message>
LVDS Flat Panel
Display Support>
CPU
Temperature>
PCB
Temperature>
Module
Temperature>
Module Voltage> Read only field
RTC Voltage> Read only field
DDR Voltage> Read only field
Input Voltage> Read only field
Mass storage device emulation type
[
, Floppy, Forced FDD, Hard Disk, CD-ROM]
[Enabled,
Send EOP Message before enter OS
[
Disabled]
Enables or disables the LVDS Flat Panel Display Support
[Enabled,
Read only field
CPU temperature (°C)
Read only field
PCB temperature (°C)
Read only field
Module temperature (°C)
Module voltage (V)
RTC Voltage (V)
DDR Voltage (V)
Input Voltage (V)
www.kontron.com // 50
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Enabled
3E8
10
Enabled
Enabled
Disabled
Disabled
Disable
Disabled
95°C
Sub-Screen Function Second level Sub-Screen / Description
Hardware Monitor>
(continued)
CPLD
Configuration>
System Fan –
Fan Pulse>
System Fan Control Mode>
System Fan –
Fan Trip Point>
System Fan –
Trip Point Speed>
Displays number of pulses the fan produces during one revolution.
(Range: 1-4)
Sets System Fan Control mode
[Manual, SMART FAN IV]
Displays temperature at which the fan accelerates.
(Range: 20°C – 80°C)
Displays Fan speed at trip point in %. Minimum value is 30 %.
Fan always runs at 100 % at (TJmax.-10°C).
Serial Port 0> Enables or disables the LVDS Flat Panel Display Support
[
, Disabled]
Base Address> Configure Serial Port Base Address
[3F8, 2F8,
, 2E8]
IRQ> Configure Serial Port IRQ
[7, 9,
, 11, 12, 13, 15]
GPIO IRQ> Configure IRQ for GPIO pins
[Disabled, 9, 10, 11, 12, 13, 15]
I2C IRQ> Configure IRQ for I2C Controller
[Disabled, 9, 10, 11, 12, 13, 15]
Audio Codec Mux
Select>
GPIO-LPC Mux
Select>
Mux select for Audio Codec type on Carrier Board
[Mux to I2S Codec, Mux to HDA Codec]
MUX select for pin as GPIO or LPC Bus to pass through to carrier board
[Mux to LPC, Mux to GPIO]
GPI0 Mux Select> MUX select for the pin as GPIO or SUS_STAT
[Mux to GPIO, Mux to SUS_STAT#]
Carrier Settings> Carrier
I2C0/SMBUS>
Switch to select which controller own the I2C_PM_CK & I2C_PM_DAT
pins on Qseven connector
[Use I2C0 Controller, Use SMBUS Controller]
Lid Switch Mode> Shows or hides Lid switch inside ACPI OS
, Disabled]
, Disabled]
Sleep Button
Mode>
[
Shows or hides Sleep button inside ACPI OS
[
Watchdog> Auto Reload> Enables automatic reload of watchdog timers on timeout
[Enabled,
]
Global Lock> Enable sets all Watchdog registers (except for WD_KICK) to read only,
until the module is reset. [Enabled,
]
Stage 1 Mode> Selects action for Watchdog stage 1
, Reset, NIM, SCI, Delay, WDT Signal only]
]
Thermal
Configuration
Parameters>
Automatic
Thermal
Reporting>
Passive Trip
Point>
Passive TC1
Value>
[
Configure _CRT, _PSV and _AC0 automatically based on values
recommended in BWG’s Thermal Reporting
[Enabled,
Configure temperature value of the ACPI Passive Trip Point – point
which OS will begin throttling the processor.
[Disable, 15°C, 23°C, 31°C, 39°C, 47°C, 55°C, 63°C, 71°C, 79°C, 87°C,
103°C, 111°C]
Sets the TC1 value for the ACPI Passive Cooling Formula. (Range: 1 – 6)
,
www.kontron.com // 51
Page 52
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Cold Reset
Enable
-0.5%
0% (No Clock Bending)
Enable
-0.5%
Disable
Enable
Disable
Enabled
Disabled
Disabled
Disable
Sub-Screen Function Second level Sub-Screen / Description
Thermal
Configuration
Parameters>
(continued)
Passive TC2
Value>
Passive TSP
Value>
Sets TC2 value for the ACPI Passive Cooling Formula.(Range: 1 – 16)
Sets TSP value for the ACPI Passive Cooling Formula.(Range: 2 – 32)
System
Component>
OS Reset Selet> Select the reset type in FACP table
[Warm Reset,
]
Spread Spectrum Clocking Configuration (SSC)
DDR SSC> Enable DDR SSC
, Disable]
DDR SSC
Selection Table>
DDR Clock
Bending
[
Select the item in SSC selection table for DDR spread spectrum
[0% (No SSC), -0.1%, -0.2%, -0.3%, -0.4%,
Select Clock Bending
[1.3%, 0.6%,
Selection Table>
Debug
Configuration>
HighSpeed
SerialIO SSC>
HighSpeed
SerialIO SSC
Selection T>
Kernel Debugger
Enable>
APEI BERT> Enable or disable APEI BERT
ACPI Memory
Debug>
End Of Post (TXE
Debug)>
Lock Directory
(TXE Debug)>
Suppress PTT
Commands>
TDO GPIO Pin> If select Auto, TDO will be disabled for A0 silicon only. For other
Max Memory 2G> Set Maximum Memory Size to 2 GB
Enable HighSpeed SerialIO SSC configuration
[
, Disable]
Select the item in SSC selection table for HighSpeed SerialIO spread
spectrum
[0% (No SSC), -0.1%, -0.2%, -0.3%, -0.4%,
Enable or disable support for a kernel debugger
[Enable,
[
, Disable]
]
Enable or disable ACPI Memory Debug
[Enable,
]
Disable to stop BIOS from sending End of Post Message
[
, Disabled]
Enable BIOS to lock SETUP variable after end of post
[Enabled,
]
Bypass TPM2 commands submitting to PTT FW
[Enabled,
]
steppings, TDO will be enabled. [Enable, Disable, Auto]
[Enable,
]
,]
, -0.9%]
,]
www.kontron.com // 52
Page 53
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Disable
Disable
Disabled
Enable
Enable
Disabled
Sub-Screen Function Second level Sub-Screen / Description
Debug
Configuration>
(continued)
Persistent RAM
size>
OS DnX focus
entry>
Processor Trace
Memory
Allocation>
Specify the amount of main memory to be reserved for Pram.
[4MB, 16MB, 64MB,
]
Enable OS Dnx
[Enable,
]
Disable or Select Processor trace memory region size : from 4 KB to
128 MB
[
, 4KB, 8KB, 16KB, 32KB, 64KB, 128KB, 256KB, 512KB, 1MB,
2MB, 4MB, 8MB, 16MB, 32MB, 64MB, 128MB]
CSE Data Clear> Data Clear is for reset/clearing of the CSE data region
RC ACPI Setting>
Native PCIE
Enable>
Enable or disable PCI Express Native Control in Windows
[
, Disable]
Native ASPM> On enable, windows will control the ASPM support for the device. If
disabled, the BIOS will [
, Disable]
RTD3 Settings> RTD3 Support> Enable or disable Runtime D3 support
[Enabled,
]
www.kontron.com // 53
Page 54
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
2 GB
Disabled
Disabled
10.2.3. Chipset Setup Menu
The Chipset setup menu lists four sub-screen options North bridge, South bridge, Uncore Configuration and South
Cluster Configuration.
10.2.3.1. Chipset> North Bridge
Figure 17: Chipset > North Bridge Menu Initial Screen Example
The following table shows the North bridge sub-screens and functions and describes the content. Default settings
bold.
are in
The BIOS features in this user guide are open to change and may not be the latest version.
The latest version may have differences to the options and features described in Table 20.
Table 20: Chipset Set > North Bridge Sub-screens and Function
Function Second level Sub-Screen / Description
Memory
Configuration>
Max TOLUD>
Above 4GB MMIO
BIOS Assignment>
Sets the maximum TOLUD value. Dynamic assignment adjusts
TOLUD automatically, based on largest MMIO length of the
installed graphic controller.
[
, 2.25 GB, 2.5 GB, 2,75 GB, 3 GB]
Enables or disables above 4 GB memorymappedIO BIOS
assignment. This is disabled automatically when aperture size is
set to 2048 MB.
PCIE VGA
Workaround>
[Enabled,
Enable If PCIe card cannot boot in DOS. For test purposes only.
[Enabled,
]
]
www.kontron.com // 54
Page 55
10.2.3.2. Chipset > South Bridge
Continuous
Enabled
Intel Linux
Enabled
RT Disabled
Figure 18: Chipset>South Bridge Menu Initial Screen Example
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
The following table shows the South Bridge sub-screens and functions, and describes the content. Default settings
are in
bold.
The BIOS features in this user guide are open to change and may not be the latest version.
The latest version may have differences to the options and features described in Table 21.
Table 21: Chipset Set> South Bridge Sub-screens and Functions
Function Second level Sub-Screen / Description
Serial IRQ Mode> Configure Serial IRQ Mode
[Quiet,
]
SMBus Support> Enable or disable SMBus Support
[
, Disabled]
OS Selection> Selects target OS.
[Windows 10 (Ver>=1607),
]
PCI Clock Run> Enables CLKRUN# logic to stop PCI clocks
Real Time
Option>
[
Select Read-Time Enable and IDI Agent Real-Time Traffic Mask Bits
[
, Disabled]
, RT Enabled (Agent IDI1), RT Enabled (Agent Disabled)]
www.kontron.com // 55
Page 56
10.2.3.3. Chipset> Uncore Configuration
Figure 19: Chipset>Uncore Configuration Menu Initial Screen Examples
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
The following table shows the Uncore Configuration sub-screens and functions and describes the content. Default
settings are in
bold.
www.kontron.com // 56
Page 57
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Enabled
Disabled
140
Enabled
IGD
Enabled
8 MB
256 MB
64 M
256 M
624 MHz
Enabled
Enabled
Auto
Enable
The setup menu screens may not be the latest version. The latest version may have certain
differences to the options and features described in Table 22.
Table 22: Chipset Set> Uncore Configuration Sub-screens and Functions
Function Second level Sub-Screen / Description
GOP Driver> Enable GOP Driver will unload VBIOS; Disable it will load VBIOS
[
, Disabled]
Intel Graphics Pei
Display Peim>
GOP Brightness
Level>
Enable or disable Pei (Early) Display
[Enabled,
]
Set GOP Brightness Level; (Range: 0 – 255)
[20, 40, 60, 80, 100, 120,
, 160, 180, 200, 220, 240, 255]
VBT Select> Select VBT for GOP Driver
[DDI1=DP++/HDMI, DDI1=HDMI]
Integrated
Graphics Device
(IGD)>
Enable: Enable IGD when selected as the Primary Video Adaptor; Disable: Always disable
IGD
[
, Disabled]
Primary Display> Select which of IGD/PCI Graphics device should be Primary Display
[
, PCIe, HG]
RC6 (render
Standby)>
Check to enable render standby support. IF SOix is enabled, RC6 should be enabled.
This function is read only if SOix is enabled.
[
, Disabled]
GTT Size> Selects the GTT size
[2 MB, 4 MB,
]
Aperature Size> Selects the aperture size
DVMT PreAllocated>
[128 MB,
Selects DVMT 5.0 pre-allocated (fixed) graphics memory size used by Internal graphics
[
, 96 M, 128 M, 160 M, 192 M, 224 M, 256 M, 288 M, 320 M, 352 M 384 M, 416 M, 448
, 512 MB]
M, 480M, 512 M]
DVMT Total Gfx
Mem>
Cd Clock
Frequency>
Selects DVMT 5.0 total graphics memory size used by internal graphics device
[128 M,
, MAX]
Selects the highest Cd clock frequency supported by the platform
[144 MHz, 288 MHz, 384 MHz, 576 MHz,
]
GT PM Support> GT PM Support
[
, Disabled]
PAVP Enable> PAVP
[
, Disabled]
BIA> Auto: GMCH uses VBIOS default
Level n: is enabled with selected aggressiveness level
[
, Disabled, Level 1, Level 2, Level 3, Level 4, Level5]
ALS Support> Valid only for ACPI
[
www.kontron.com // 57
, Disable]
Page 58
Function Second level Sub-Screen / Description
Auto
Auto
Auto
PWM-Inverted
Disable
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
IGD Flat Panel> [
, 640x480, 800x600, 1024x768, 1280x1024, 1366x768, 1680x1050, 1920x1200,
1280x800]
IGD Boot Type> Select preference for IGD display interface used when system boots.
[
, VGA port, HDMI, DP Port B, Dp Port C, eDP, DSI Prt A, DSI Port C]
Panel Scaling> Sets Panel scaling
[
, Centering, Stretching]
GMCH BLC
Control>
IPU
Enable/Disable>
Backlight control settings
[
, GMBus-Inverted, PWM-Normal, GMBus-Normal]
IPU Device
[Enable,
]
www.kontron.com // 58
Page 59
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Enable
Enable,
UAA (HD Inbox/IntelSST)
10.2.3.4. Chipset> South Cluster Configuration
Figure 20: Chipset>South Cluster Configuration Menu Initial Screen Example
The following table shows the South Cluster Configuration sub-screens and functions and describes the content.
Default settings are in
bold and for some functions, additional information is included.
The BIOS features in this user guide are open to change and may not be the latest version.
The latest version may have differences to the options and features described in Table 23.
Table 23: Chipset>South Cluster Configuration Sub-screens and Functions
Function Second level Sub-Screen / Description
HD Audio
Configuration>
www.kontron.com // 59
HD-Audio Support> HD-Audio support
[
, Disable]
HD-Audio DSP> HD-Audio DSP [
Audio DSP Feature Support:
Audio DSP
Compliance Mode>
Sets DSP enabled system compliance:
1: Non-UAA (IntelSST driver support only – CC_040100)
2: UAA (HD Audio Inbox or IntelSST driver support – CC_040380)
Note: NHLT (DMIC/BT/I2S configuration) is published for non-UAA
only. [Non_UAA (IntelSST),
WoV (Wake on
Voice) >
DSP Feature.
Bitmask structure:
[BIT0] – WoV
[BIT1] – BT Sideband
[BIT2] – Codec based VAD
[BIT3] – SRAM Reclaim
[BIT5] – BT Intel HFP
Disable]
]
Page 60
Disabled
Enabled
Enabled
Enabled
Enabled
Disabled
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Function Second level Sub-Screen / Description
HD Audio
Configuration>
(continued)
WoV (Wake on
Voice) >
(continued)
Bluetooth
Sideband>
SRAM Reclaim> DSP Feature.
BT Intel HFP> DSP Feature./ Bitmask structure:
BT Intel A2DP> DSP Feature.
www.kontron.com // 60
Context Aware>
[BIT6] – BT Intel A2DP
[BIT9] – Context Aware
[Enabled,
]
DSP Feature.
Bitmask structure:
[BIT0] – WoV
[BIT1] – BT Sideband
[BIT2] – Codec based VAD
[BIT3] – SRAM Reclaim
[BIT5] – BT Intel HFP
[BIT6] – BT Intel A2DP
[BIT9] – Context Aware
[
, Disabled]
Bitmask structure:
[BIT0] – WoV
[BIT1] – BT Sideband
[BIT2] – Codec based VAD
[BIT3] – SRAM Reclaim
[BIT5] – BT Intel HFP
[BIT6] – BT Intel A2DP
[BIT9] – Context Aware
[
, Disabled]
[BIT0] – WoV
[BIT1] – BT Sideband
[BIT2] – Codec based VAD
[BIT3] – SRAM Reclaim
[BIT5] – BT Intel HFP
[BIT6] – BT Intel A2DP
[BIT9] – Context Aware
[
[
, Disabled]
, Disabled]
Bitmask structure:
[BIT0] – WoV
[BIT1] – BT Sideband
[BIT2] – Codec based VAD
[BIT3] – SRAM Reclaim
[BIT5] – BT Intel HFP
[BIT6] – BT Intel A2DP
[BIT9] – Context Aware
[Enabled,
]
DSP Feature.
Bitmask structure:
[BIT0] – WoV
[BIT1] – BT Sideband
Page 61
Function Second level Sub-Screen / Description
Disabled
Disabled
Disabled
Enabled
Enabled
Disabled
Disabled
Intel Wake On Voice
Disabled
HD Audio
Configuration>
(continued)
Context Aware>
(continued)
NHLT Endpoints Configuration:
DMIC> Selects DMIC to expose in NHLT ACPI table
Bluetooth> Enables/Disables Bluetooth Endpoint in NHLT ACPI table
I2S SKP> Read only,
I2S HP> Read only,
Codex based VAD> DSP Feature.
[BIT2] – Codec based VAD
[BIT3] – SRAM Reclaim
[BIT5] – BT Intel HFP
[BIT6] – BT Intel A2DP
[Enabled,
[2 Mic Array, 4 Mic Array,
[Enabled,
Bitmask structure:
[BIT0] – WoV
[BIT1] – BT Sideband
[BIT2] – Codec based VAD
[BIT3] – SRAM Reclaim
[BIT5] – BT Intel HFP
[BIT6] – BT Intel A2DP
[BIT9] – Context Aware
[Enabled,
DSP based Speech
Pre-Processing>
Voice Activity
Detection>
Post-Processing Module Support:
Waves> Enables/Disables 3rd Party Processing Module Support (identlfied
DTS>
Spatial>
Dolby>
Samsung
SoundAlive>
Samsung
SoundBooster>
DSP Feature.
Bitmask structure:
[BIT0] – WoV
[BIT1] – BT Sideband
[BIT2] – Codec based VAD
[BIT3] – SRAM Reclaim
[BIT5] – BT Intel HFP
[BIT6] – BT Intel A2DP
[BIT9] – Context Aware
[Enabled,
Read only,
by GUID). WoV must be enabled as a feature first to selecr relevent
WoV IP. [Enabled,
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
]
]
]
]
]
]
www.kontron.com // 61
Page 62
Function Second level Sub-Screen / Description
Disabled
Disabled
Disabled
Disabled
VC0
VC0
HD-Audio link owns all the I/O buffers
Enabled
Enabled
Enabled
24 MHz
96 MHz
Enable
Enable
Enable
Enable
HD Audio
Configuration>
(continued)
Samsung EQ/DRC>
ForteMedia
SAMSoft>
Enables/Disables 3rd Party Processing Module Support (identlfied
by GUID). WoV must be enabled as a feature first to selecr relevent
WoV IP. [Enabled,
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
]
Intel WoV> Read only,
Sensory WoV> Read only,
Conexant PreProcess>
Context Aware Pre-
Enables/Disables 3rd Party Processing Module Support (identlfied
by GUID). WoV must be enabled as a feature first to selecr relevent
WoV IP. [Enabled,
Process>
Custom Module
‘Alpha‘>
Custom Module
‘Beta‘>
Custom Module
‘Gamma‘>
HD-Audio CSME
Memory Transfers>
HD-Audio Host
Memory Transfers>
HD-Audio I/O Buffer
Ownership Select>
Sets HD-Audio CSME memory transfers to VC0/VC2
, VC2]
[
Sets HD-Audio Host memory transfers to VC0/VC2
, VC2]
[
Sets HD-Audio I/O buffer ownership
[
I2S port owns all the I/O buffers]
]
,
LPSS
Configuration>
HD-Audio Clock
Gating>
HD-Audio Power
Gating>
HD-Audio Clock gating
[
, Disabled]
HD-Audio Power gating
[
, Disabled]
HD-Audio PME> HD-Audio PME
HD-Audio Link
Frequency>
[
Selects HD-Audio link frequency
Applicable only if HDA codec supports selected frequency.
, Disabled]
[6 MHz, 12 MHz,
iDisplay Link
Frequency>
Selects iDisplay Link frequency
Applicable only if iDisp codec supports selected frequency.
[48 MHz,
LPSS I2C1 Support
(D22:F1)>
LPSS I2C2 Support
(D22:F2)>
LPSS I2C3 Support
(D22:F3)>
LPSS I2C4 Support
(D22:F0)>
LPSS I2C1 Support (I2C_CAM0)
[
, Disable]
LPSS I2C2 Support (I2C_CAM1)
[
, Disable]
LPSS I2C3 Support (I2C_GP)
[
, Disable]
LPSS I2C4 Support (I2C_LCD)
[
, Disable]
]
]
www.kontron.com // 62
Page 63
Function Second level Sub-Screen / Description
Enable
Enable
Enable
Enable
Enabled,
Disabled
Disabled
Disabled
Auto
Disabled
L1.1 & L1.2
Enabled
Disabled
Disabled
Disabled
Disabled
Default Setting
Disabled
Disabled
LPSS
Configuration>
(continued)
LPSS HSUART1
Support (D24:F1)>
LPSS HSUART2
Support (D24:F2)>
LPSS HSUART1 Support
[
, Disable]
LPSS HSUART2 Support
[
, Disable]
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
PCI Express
Configuration>
LPSS SPI0 Support
(D25:F0)>
LPSS IOSF PMCTL
S0ix Enable>
PCI Express Clock
Gating>
LPSS SPI0 Support
[
, Disable]
LPSS IOSF Bridge PMCTL Register S0ix Bits
[
, Disable]
PCI Express clock gating for each root port
[
Disabled]
Port8xh Decode> PCI express port 8xh decode
]
]
]
Controls the PCI Express port
Auto automatically disables the unused root
port for optimum power saving.
[
settings
[
[Disabled, L1.1, L1.2,
[
[Enabled,
[Enabled,
[Enabled,
[Enabled,
Peer Memory Write
Enable>
Compliance Test
Mode>
PCI Root Port 4
(GbE)>
or
PCI Root Port 5
(NC)
or
PCI Root Port 0
(QSEVEN PCIe#0)>
or
PCI Root Port 1
(QSEVEN PCIe#1)>
or
PCI Root Port 2
(QSEVEN PCIe#2)>
or
PCI Root Port 3
(QSEVEN PCIe#3)>
[Enabled,
Peer memory write
[Enabled,
Enable when using compliance load board
[Enabled,
PCI Express Root
Port[#]>
ASPM> Active State Power Management (ASPM) level
L1 Substates> PCI Express L1 substrates settings
ACS> Access Control Service Extended Capability
URR> PCI Express unsupported request reporting
FER> PCI Express device fatal error reporting
NFER> PCI Express device non-fatal error reporting
CER> PCI Express device correctable error reporting
CTO> PCI Express completion timer (T0)
[
260-900 ms, 1-3.5 s, Disabled]
SEFE> Root PCI Express System Error on Fatal Error
[Enabled,
SENFE> Root PCI Express System Error on non-Fatal
Error [Enabled,
,Enabled, Disabled]
, Auto, L0s, L1, L0sL1]
]
, Disabled]
]
]
]
]
, 16-55 ms, 65-210 ms,
]
]
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Page 64
Function Second level Sub-Screen / Description
Disabled
Enabled
Disabled
Auto
Disabled
4
Enabled
Auto
Disabled
Enabled,
Disabled
Enabled,
PCI Express
Configuration>
(contined)
PCI Root Port 4
(GbE)>
or
PCI Root Port 5
SECE> Root PCI Express System Error on correctable
PME SCI> PCI Express PME SCI
(NC)
or
PCI Root Port 0
Hot Plug> PCI Express hot plug
(QSEVEN PCIe#0)>
or
PCIe Speed> Configures PCIe speed
PCI Root Port 1
(QSEVEN PCIe#1)>
or
Transmitter Half
Swing>
PCI Root Port 2
(QSEVEN PCIe#2)>
or
PCI Root Port 3
(QSEVEN PCIe#3)>
Extra Bus
Reserved>
Reserved
Memory>
(continued)
Reserved I/O> Reserved I/O for this root bridge
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
error
[Enabled,
[
[Enabled,
, Gen 1, Gen2]
[
, Disabled]
]
]
Transmitter half swing
[Enabled,
]
Extra bus reserved for bridges behind this root
bridge. (0-7)
Reserved memory and prefetchable memory for
this root bridge
Range: (1 MB-20 MB)
Range: (
k, 8 k, 12 k, 16 k, 20 k)
SATA Drivers>
PCH PCIE LTR> PCH PCIE latency reporting
Snoop Latency
Override>
Non Snoop
Latency
Override>
PCIE1 LTR Lock> PCIE LTR configuration lock
PCIE Selectable
De-emphasis>
SATA Test Mode> Test mode
[Enabled,
SATA Port 0>
SATA Port #> Read only field
or
SATA Port 1>
Port #> SATA port #
[
, Disabled]
Snoop latency override or Non Snoop override
for PCH PCIE.
Disabled: disables override
Manual: manually enters override values
Auto: maintains default BIOS flow.
[Disabled, Manual,
[Enabled,
]
]
Selects level of de-emphasis for an upstream
component, if the Link operates at 5.0 GT/s
speed.
1b – 3.5 dB
0b – 6 dB
[
Disabled]
]
SATA port installed/Not Installed and software
preserve
[
Disabled]
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Page 65
Function Second level Sub-Screen / Description
Disabled]
Enabled
Enabled
HS200
Disable
Disable
Disabled
S0 State
Enable
Disable
Disabled
Enabled
Disabled
Disabled
SATA Drivers>
(continued)
SATA Port 0>
or
SATA Port # Hot
Plug Capability>
SATA Port 1>
(continued)
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Reports SATA port as being Hot Plug capable
[Enabled,
SCC
Configuration>
USB
Configuration>
Miscellaneous
Configuration>
SCC SD Card Support
(D27:F0)>
SCC eMMC Support
(D28:F0)>
SCC card support
[
, Disabled]
SCC eMMC Support
[
, Disabled]
eMMC Max Speed> Selects the eMMC max. speed allowed
, DDR50]
]
USB Port Disable
Override>
[HS400,
Selectively enables or disables the corresponding USB port from
reporting a device connection to the controller.
[Enable,
xDCI Support> XDCI
xHCI Disable
Compliance Mode>
USB HW Mode AFE
Comparators>
[Enable,
xHCI Disable Compliance Mode
[FALSE, TRUE]
USB HW mode AFE comparators
[Enabled,
]
]
State After G3> Specifies the state to go to if power is reapplied after power failure
(G3 state)
S0 state: system boots directly as soon as power is applied.
S5 state: system remains in power-off states until the power
button is pressed.
Power Button
Debounce Mode>
[
Enable interrupt when PWRBTN# is asserted
[
, S5 State]
, Disable]
Wake On LAN> Wake on LAN
[Enable,
]
BIOS Lock> Enable/Disable the SC BIOS Lock Enable feature. Required to be
enabled to ensure SMM protection of flash
[Enabled,
]
RTC Lock> Enable will lock bytes 38h-3Fh in the lower/upper 128-byte bank of
RTC RAM
[
, Disabled]
TCO Lock> Enable TCO and Lock Down TCO
]
DCI Enable
(HDCIEN)>
[Enabled,
If enabled the user is considered to have consented to enable DCI
and allows debug over the USB 3 interface.
If disabled, the host controller does not enable the DCI feature.
[Enabled,
]
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Function Second level Sub-Screen / Description
Enabled
Disabled
Miscellaneous
Configuration>
(continued)
DCI Auto Detect
Enable>
If set, DCI Auto detects if DCI is connected during BIOS post time and
enables DCI. If not set, DCI is disabled.
[
, Disabled]
GPIO Lock> Enable to set GPIO Pad Configuration Lock for security
[Enabled,
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
]
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
10.2.4. Security Setup Menu
The Security setup menu provides information about the passwords and functions for specifying the security settings
such as Hard Disk user and master passwords.
Figure 21: Security Setup Menu Initial Screen Example
The following table shows the Security sub-screens and functions and describes the content. Default settings are in
bold and for some functions, additional information is included.
The BIOS features in this user guide are open to change and may not be the latest version.
The latest version may have differences to the options and features described in Table 24.
Table 24: Security Setup Menu Initial Screen
Function Description
Setup Administrator
Sets administrator password
Password>
User Password> Sets user password
HDD Security Configuration>
Read Only Information
Allows access to set, modify and clear Hard Disk user and master passwords.
User Passwords need to be installed for Enabling Security. Master Password
can be modified only when successfully unlocked with the Master Password in
Post. If the ‘Set HDD Password’ is grayed out, then power cycle to enable the
option again.
HDD Password Configuration
Security supported : Yes
Security Enabled : No
Security Locked : No
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Page 68
Function Description
Disabled
Customized
Disabled
HDD Security Configuration
(continued)
Security Frozen : No
HDD User Pwd Status : Not Installed
HDD Master Pwd Status : Installed
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Secure Boot>
Set User
Password>
Sets HDD password.
Note: It is advisable to power cycle the system after
setting Hard Disk passwords. The ‘Discarding or Saving
Changes’ in the setup does not have an impact on HDD
when the password is set or removed.
If the setup HDD user Password is grayed out, do power
cycle enable the option again.
System Mode> Read only information.
Secure Boot>
Vendor Keys>
Attempt Secure
Boot>
Secure Boot activated when Platform Key (PK) is enrolled,
System mode is User/Deployed, and CSM function is
disabled
]
Secure Boot
Mode>
[Enabled,
Set UEFI Secure Boot Mode to STANDARD mode or
CUSTOM mode
[Standard,
Key
Management>
Enables expert users to modify Secure Boot Policy
variables without full authentication
Provision
Factory Default
keys>
Allow to provision factory default Secure
Boot keys when System is in Setup Mode
[Enabled,
]
]
Install Factory
Default keys>
Enroll Efi
Image>
Force System to User Mode – install all
Factory Default keys
Allow the image to run in Secure Boot
mode. Enroll SHA256 Hash Certificate of
the Image into Authorized Signature
Database (db)
Platfrom Key
(PK)>
Key Exchange
Keys>
Enroll Factory Defaults or load
certificates from a file:
Public Key Certicate in:
EFI_SIGNATURE_LIST
EFI_CERT_X509 (DER encoded)
Authorized
Signatures>
Forbidden
Signatures>
Authorized
TimeStamps>
EFI_CERT_RSA2048 (bin)
EFI_CERT_SHA256,385,512
Authenticated UEFI Variable
EFI PE/COFF Image (SHA256)
Key Source : Default, External, Mixed,
test
OsRecovery
Signatures>
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
10.2.4.1. Remember the Password
It is recommended to keep a record of all passwords in a safe place. Forgotten passwords results in the user being
locked out of the system. If the system cannot be booted because the User Password or the Supervisor Password are
not known, clear the uEFI BIOS settings, or contact Kontron Support for further assistance.
HDD security passwords cannot be cleared using the above method.
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
ON
Disabled
Disabled
All Sata Devices
10.2.5. Boot Setup Menu
The Boot setup menu lists the dynamically generated boot-device priority order.
Figure 22: Boot Setup Menu Initial Screen Example
The following table shows the Boot set up sub-screens and functions and describes the content. Default settings are
in bold.
The BIOS features in this user guide are open to change and may not be the latest version.
The latest version may have differences to the options and features described in Table 25
.
Table 25: Boot Setup Menu Sub-screens and Functions
Function Description
Setup Prompt Timeout> Displays number of seconds that the firmware waits for setup activation key The
value 65535(0xFFFF) means an indefinite wait.
Bootup NumLock State> Selects keyboard NumLock state
[
, OFF]
Quiet Boot> Quiet Boot
[Enabled,
]
Boot Option #> Sets the system boot order
Fast Boot> Enables or disables FastBoot features
Note: Most probes are skipped to reduce time and cost during boot.
[Enabled,
]
SATA Support> SATA Support
[Last Boot HDD only,
]
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
EFI Driver
Full Initial
Enabled
Disabled
Disabled
Default
Function Description
VGA Support> If Auto, only install Legacy OpRom with Legacy OS and logo would NOT be shown
during post. Efi driver will still be installed with EFI OS.
[Auto,
]
USB Support> If disabled, all USB devices will NOT be available untill after OS boot. If Partial Initial,
USB Mass Storage and specific USB port/device will NOT be available before OS boot.
If Full Initial, all USB devices will be available in OS and Post.
[
, Partial Initial, Disable]
PS2 Support> PS2 Support
[
, Disabled]
Netwrok Stack Driver
Support>
Netwrok Stack Driver Support
[Enabled,
]
Redirection Support> Redirection Support
[Enabled,
]
New Boot Option Policy> Controls the placement of newly detected UEFI boot options
[
, Place First, Place Last]
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
10.2.6. Save and Exit Setup Menu
The Save and Exit setup menu provides functions for handling changes made to the settings and exiting the program.
Figure 23: Save and Exit Setup Menu Initial Screen Example
The following table shows the Save and Exit sub-screens and functions and describes the content.
The BIOS features in this user guide are open to change and may not be the latest version.
The latest version may have differences to the options and features described in Table 26.
Table 26: Save and Exit Setup Menu Sub-screens and Functions
Function Description
Save Changes and Exit > Exits system after saving changes
Discard Changes and Exit> Exits system setup without saving changes
Save Changes and Reset> Resets system after saving changes
Discard Changes and Reset> Resets system setup without saving changes
Save Changes> Saves changes made so far for any setup options
Discard Changes> Discards changes made so far for any setup options
Restore Defaults> Restores/loads standard default values for all setup options
Save as User Defaults> Saves changes made so far as user defaults
Restore User Defaults> Restores user defaults to all setup options
UEFI: Built in EFI Shell> Attempts to launch the boot option #1
Ubuntu (P1: WDC WDS120G1G0A-00SS50)> Attempts to launch the boot option #2
UEFI: SanDisk, Partition 1> Attempts to launch the boot option #3
Launch EFI Shell from File System Device> Attempts to launch EFI Shell application (Shell.efi) from one of the
available file system devices
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
The uEFI Shell 10.3.
The Kontron uEFI BIOS features a built-in and enhanced version of the uEFI Shell. For a detailed description of the
available standard shell scripting, refer to the EFI Shell User Guide. For a detailed description of the available
standard shell commands, refer to the EFI Shell Command Manual. Both documents can be downloaded from the EFI
and Framework Open Source Community homepage (http://sourceforge.net/projects/efi-shell/files/documents/).
AMI APTIO update utilities for DOS, EFI Shell and Windows are available at AMI.com:
http://www.ami.com/support/downloads/amiflash.zip
Kontron uEFI BIOS does not provide all shell commands described in the EFI Shell Command
Manual.
.
10.3.1. Basic Operation of the uEFI Shell
The uEFI Shell forms an entry into the uEFI boot order and is the first boot option by default.
10.3.1.1. Entering the uEFI Shell
To enter the uEFI Shell, follow the steps below:
1. Power on the module, see Chapter 9/Power on.
2. Press the <F7> key (instead of <DEL>) to display a choice of boot devices.
3. Choose ‘UEFI: Built-in EFI shell’.
EFI Shell version 2.40 [5.11]
Current running mode 1.1.2
Device mapping table
Fs0 :HardDisk - Alias hd33b0b0b fs0
Acpi(PNP0A03,0)/Pci(1D|7)/Usb(1, 0)/Usb(1, 0)/HD(Part1,Sig17731773)
4. Press the <ESC> key within 5 seconds to skip startup.nsh, and any other key to continue.
5. The output produced by the device-mapping table can vary depending on the board’s configuration.
6. If the <ESC> key is pressed before the 5 second timeout elapses, the shell prompt is shown:
Shell>
10.3.1.2. Exiting the uEFI Shell
To exit the uEFI Shell, follow one of the steps below:
1. Use the
2. Reset the board using the
www.kontron.com // 73
exit uEFI Shell command to select the boot device, in the Boot menu, that the OS boots from.
reset uEFI Shell command.
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
uEFI Shell Scripting 10.4.
10.4.1. Startup Scripting
If the <ESC> key is not pressed and the timeout has run out then the uEFI Shell automatically tries to execute some
startup scripts. It searches for scripts and executes them in the following order:
1. Initially searches for Kontron flash-stored startup script.
2. If there is no Kontron flash-stored startup script present, then the uEFI-specified
script must be located on the root of any of the attached FAT formatted disk drive.
3. If none of the startup scripts are present or the startup script terminates then the default boot order is
continued.
startup.nsh script is used. This
10.4.2. Create a Startup Script
Startup scripts can be created using the uEFI Shell built-in editor edit or under any OS with a plain text editor of your
choice. To create a startup shell script, simply save the script on the root of any FAT-formatted drive attached to the
system. To copy the startup script to the flash, use the
In case there is no mass storage device attached, the startup script can be generated in a RAM disk and stored in the
SPI boot flash using the
kRamdisk uEFI Shell command.
kBootScript uEFI Shell command.
10.4.3. Example of Startup Scripts
10.4.3.1. Execute Shell Script on other Harddrive
This example (startup.nsh) executes the shell script named bootme.nsh located in the root of the first detected disc
drive (fs0).
fs0:
bootme.nsh
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QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
fsx: (x = 0,1,2,etc. represents the USB stick)
cd <your_directory>
Firmware Update 10.5.
Firmware updates are typically delivered as a ZIP archive containing only the firmware images. The content of the
archive with the directory structure must be copied onto a data storage device with FAT partition.
10.5.1. Updating Procedure
BIOS can be updated with the Intel tool fpt.efi using the procedure below:
1. Copy these files to an USB stick.
flash.nsh (if available)
fpt.efi
fparts.txt
Q7ALx2i<xxx>.bin (where xxx stands for the version #)
Start the system into setup.
2. Change the following setup items:
Chipset > South Cluster Configuration> Miscellaneous Configuration > BIOS Lock > Disabled
3. Save and Exit the BIOS setup.
Changes are only effective during the first boot after applying the change. Failing to flash
during the next boot, may require steps 3 to be repeated.
4. On the next start, boot into shell.
5. Change to the drive representing the USB stick.
Change to the directory where you copied the flash tool.
6. Start flash.nsh (if available) OR enter
fpt –F Q7ALx2i<xxx>.bin
7. Wait until flashing is successful and then power cycle the board.
Do not switch off the power during the flash process!
Doing so leaves your module unrecoverable.
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Page 76
Appendix A: List of Acronyms
Table 27: List of Acronyms
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
ACPI Advanced Configuration and Power
Interface
BIOS Basic Input Output System
CAN Controller-area network
Carrier
Board
CPLD Complex Programmable Logic Devices
DDC Display Data Control
DDI Digital Display Interface
DDIO Digital Display Input/Output
DIMM Dual In-line Memory Module
DMA Direct Memory Access
DP DisplayPort
DMA Direct Memory Access
DRAM Dynamic Random Access Memory
DVI Digital Visual Interface
ECC Error Checking and Correction
EEPROM Electrically Erasable Programmable
eDP Embedded Display Port
EMC Electromagnetic Compatibility
eMMC embedded MultiMedia flash Card
ESD Electro Sensitive Device
FAT File Allocation Table
FIFO First In First Out
Gb Gigabit
GBE Gigabit Ethernet
GPI General Purpose Input
GPIO General Purpose Input Output
GPO General Purpose Output
GPU Graphics Processing Unit
HBR2 High Bitrate 2
HDA High Definition Audio (HD Audio)
HD/HDD Hard Disk /Drive
HDMI High Definition Multimedia Interface
HWM Hardware Monitor
I2C Inter integrated Circuit Communications
I2S Inter-IC Sound
IOT Internet of Things
JTAG Joint Test Action Group
Application specific circuit board that
accepts a COM Express ® module
(digital display interface standard)
Read-Only Memory
LAN Local Area Network
LPC Low Pin-Count Interface:
LPT Line Printing Terminal
LSB Least Significant Bit
LVDS Low Voltage Differential Signaling
MIPI Mobile Industry processor Industry
MLC Multi Level Cell
MTBF Mean Time Before Failure
NA Not Available
NC Not Connected
NCSI2 Network Communications Services
Interface
NTC Negative Temperature Coefficient
PCI Peripheral Component Interface
PCIe PCI-Express
PEG PCI Express Graphics
PHY Ethernet controller PHYsical layer
PSU Power Supply Unit
RoHS Restriction of the use of certain
Hazardous Substances
RTC Real Time Clock
SATA Serial AT Attachment:
SDIO Secure Digital Input/Output
SEL System Event Log
SLC Single Level Cell
SoC System on a Chip
SOL Serial Over LAN
SPI Serial Peripheral Inteface
SSH Secure Shell
TPM Trusted Platform Module
UART Universal Asynchronous Receiver
Transmitter
UEFI Unified Extensible Firmware Interface
USB Universal Serial Bus
VGA Video Graphics Adapter
WDT WatchDog Timer
WDOUT WatchDog Time Out
WDTRIG WatchDog TRigger
WEEE Waste Electrical and Electronic
Equipement ( directive)
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Page 77
Kontron S&T AG
Lise-Meitner-Str. 3-5
info@kontron.com
About Kontron
QSEVEN-Q7ALx2 - Preliminary User Guide, Rev. 0.7
Kontron is a global leader in IoT/Embedded Computing Technology (ECT). As a part of technology group
S&T, Kontron, together with its sister company S&T Technologies, offers a combined portfolio of secure
hardware, middleware and services for Internet of Things (IoT) and Industry 4.0 applications. With its
standard products and tailor-made solutions based on highly reliable state-of-the-art embedded
technologies, Kontron provides secure and innovative applications for a variety of industries. As a result,
customers benefit from accelerated time-to-market, reduced total cost of ownership, product longevity
and the best fully integrated applications overall.
For more information, please visit:
www.kontron.com
Global Headquarters
86156 Augsburg
Germany
Tel.: + 49 821 4086-0
Fax: +
www.kontron.com // 77
49 821 4086-111
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