5-line IPAD™, HDMI™ control line ESD protection
Features
■ Low line capacitance
■ High efficiency in ESD protection
■ Lead-free package
■ Very thin package
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
Complies with the standards:
■ IEC 61000-4-2 Level 4
– ± 15 kV (air discharge)
– ± 8 kV (contact discharge)
■ IEC 61000-4-2 Level 1
– ± 2 kV (air discharge)
– ± 2 kV (contact discharge)
HDMI05-CL01F3
Leed-free Flip-Chip package
(8 bumps)
Figure 1. Pin configuration (bump side)
3 2 1
SCL
SDA
CEC
GND
A
B
Application
Where ESD protection for HDMI control lines
(CEC, HPD, SCL and SDA) is required:
■ Mobile phones and communication systems
■ Portable multimedia players
■ Camcorder, digital still cameras
Description
The HDMI05-CL01F3 chip is a low capacitance
ESD protection for HDMI control pins. It also
integrates a pull-up resistor for I²C bus and a pulldown resistor for hot plug detect.
The ESD protection circuitry prevents damage to
the protected device when subjected to ESD
surges up to 15 kV.
HPD
GND5VRPU
C
Figure 2. Schematic
A1A3A2
CEC
5V
SCL
SDA
B3
HPD
C3
R3
R2
R1
GND
C2
1. B2 and C2 bumps must be connected together in the
PCB
TM: IPAD is a trademark of STMicroelectronics. HDMI, the
HDMI logo and High-Definition Multimedia Interface
are trademarks or registered trademarks of HDMI
Licensing LLC.
GND
B2 C1
April 2010 Doc ID 17458 Rev 1 1/8
www.st.com
8
Characteristics HDMI05-CL01F3
1 Characteristics
Table 1. Absolute maximum ratings (T
Symbol Parameter Value Unit
External pins (A1, A2, A3, B3 and C3):
ESD IEC 61000-4-2, level 4 - air discharge
V
PP
ESD IEC 61000-4-2, level 4 - contact discharge
Internal pin (C1):
ESD IEC 61000-4-2, level 1 - air discharge
ESD IEC 61000-4-2, level 1 - contact discharge
Line resistance power dissipation at 70 °C 60 mW
P
d
Operating temperature range -30 to + 85 °C
T
op
T
Storage temperature range -55 to + 150 °C
stg
Figure 3. Electrical characteristics - definitions
Symbol Parameter
V = Breakdown voltage
BR
I = Leakage current @ V
RM RM
V = Stand-off voltage
RM
C = Line capacitance
line
= 25 °C)
amb
15
8
kV
2
2
I
I
R
I
RM
VRMV
BR
I
RM
I
V
R
V
BRVRM
Table 2. Electrical characteristics (T
= 25 °C)
amb
Symbol Test condition Min. Typ. Max. Unit
V
BRIR
I
RM
, R
R
1
R
C
line
3
= 1 mA 14 V
VRM = 3 V per line 50 200 nA
2
V
= 0 V, V
line
= 30 mV, F = 1 MHz
osc
(measured under zero light conditions, B2 and C2
bumps connect together)
2/8 Doc ID 17458 Rev 1
1575 1750 1925 Ω
80 100 120 kΩ
81012pF
HDMI05-CL01F3 Characteristics
Figure 4. S21(dB) versus frequency on A1 Figure 5. Analog crosstalk measurements
B3-A3
Crosstalk (dB)
0
B3_A3_0V
-5
-
-
B3_A3_3.6V
B3_A3_2.5V
-10
-
-
B3_A3_5.5V
-15
-
-
-20
-
-
-25
-
-
-30
-
-
-35
-
-
-40
-
-
100k 1M 10M 100M 1G
(+8 kV contact discharge)
F(Hz)
S21 (dB)
0
-2
A1_0V
-4
A1_3.6V
-6
A1_2.5V
A1_5.5V
-8
-10
-12
-14
-16
-18
-20
-22
100k 1M 10M 100M 1G
F(Hz)
Figure 6. Digital crosstalk measurement
A3-B3 with 5 V applied on C1
Figure 7. ESD response to IEC 61000-4-2
on CEC line (A2)
2
1 V/Div
Output
20 V/Div
50 mV/Div
Input
1
20 ns/Div
20 ns/Div
Figure 8. ESD response to IEC 61000-4-2
(-8 kV contact discharge)
on CEC line (A2)
20 V/Div
VCL
20 ns/Div
VCL
20 ns/Div
Figure 9. Line capacitance versus reverse
applied voltage on A2-B2
C(pF)
10
8.0
6.0
4.0
2.0
0.0
0
4
2
8
6
10
V (V)
12
R
14
Doc ID 17458 Rev 1 3/8