®
IPAD™
MAIN PRODUCT CHARACTERISTICS:
Where EMI filtering in ESD sensitive equipment is
required :
■ LCD for Mobile phones
■ Computers and printers
■ Communication systems
■ MCU Boards
DESCRIPTION
The EMIF10-LCD01C2 is a 10 line highly integrated devices designed to suppress EMI/RFI noise in
all systems subjected to electromagnetic interferences. The EMIF10 flip chip packaging means the
package size is equal to the die size.
This filter includes an ESD protection circuitry,
which prevents the device from destruction when
subjected to ESD surges up 15kV.
BENEFITS
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Very low PCB space consuming: < 7mm
■ Coating resin on back side
■ Very thin package: 0.69 mm
■ High efficiency in ESD suppression on input
2
pins (IEC61000-4-2 level 4)
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration and wafer level packaging.
■ Lead free package
EMIF10-LCD01C2
10 LINE EMI FILTER
AND ESD PROTECTION
Lead free coated Flip-Chip
(25 bumps)
Figure 1: Pin Configuration (bump side)
5
I5
I10 I8 I6
O10 O8 O6
O5 O3 O1
Figure 2: Basic Cell Configuration
Input
3
4
I3
I4 I2
I9
GNDGND GND
O9 O7
O4 O2
Low-pass Filter
I7
12
I1
A
B
GNDGND
C
D
E
Output
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2:
Level 4 input pins 15kV (air discharge)
8kV (contact discharge)
Level 1 output pins 2kV (air discharge)
2kV (contact discharge)
MIL STD 833E - Method 3015-6 Class 3
August 2005
GND GND GND
Table 1: Order Code
Part Number Marking
EMIF10-LCD01C2 FL
REV. 1
Ri/o = 100
Cline = 35pF
Ω
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EMIF10-LCD01C2
Table 2: Absolute Maximum Ratings (T
amb
= 25°C)
Symbol Parameter Value Unit
T
T
T
Table 3: Electrical Characteristics (T
Symbol Parameter
V
BR
I
RM
V
RM
V
CL
Rd Dynamic resistance
I
PP
R
I/O
Junction temperature 125 °C
j
I
I
F
-40 to + 85
Operating temperature range
op
Storage temperature range -55 to +150 °C
stg
= 25°C)
amb
Breakdown voltage
Leakage current @ V
RM
Stand-off voltage
V
Clamping voltage
V
V
V
CL
RM
BR
F
I
RM
I
R
Peak pulse current
I
Series resistance between Input & Output
PP
V
Cline Input capacitance per line
Symbol Test conditions Min. Typ. Max. Unit
V
BR
I
RM
R
I/O
Cline
IR = 1 mA
VRM = 3V
6810V
500 nA
90 100 110 Ω
@ 0V bias 28 35 pF
Rt / Ft Induced rise and fall time 10-90% at 26 MHz fre-
quency signal V = 1.9 V (Rt / Ft input 1 ns, 50Ω
8
(1)
impedance generator)
(1) guaranteed by design
°C
ns
Figure 3: S21(dB) all lines attenuation
measurement and Aplac simulation
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Figure 4: Analog cross talk measurements
EMIF10-LCD01C2
Figure 5: ESD response to IEC61000-4-2
(+15kV air discharge) on one input and on one
output
V
in
V
out
Figure 7: Line capacitance versus applied
voltage
CLine(pF)
35
30
25
20
15
10
5
0
0.0 1.0 2.0 3.0 4.0 5.0
VLine(V)
Figure 6: ESD response to IEC61000-4-2 (-15kV
air discharge) on one input and on one output
Figure 8: Rise time 10-90% measurements with
1.9V signal at 26 MHz frequency (50Ω
generator)
Figure 9: Fall time 10-90% measurements with
1.9V signal at 26 MHz frequency (50Ω
generator)
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EMIF10-LCD01C2
Figure 10: Aplac model
Figure 11: Aplac parameters
ZRZ structure
aplacvar Remif10low 100
aplacvar Cemif10flow 17.5pF
Bumps
aplacvar Lbump 50pH
aplacvar Rbump 20m
aplacvar Cbump 1.5pF
Bulk
aplacvar Rsub 100m
Gnd connections
aplacvar Rgnd 100m
aplacvar Lgnd 200pH
aplacvar Cgnd 0.15pF
EMIF10-LCD01C1 model Ground return
BV = 7
CJO = Cemif10low
IBV = 1u
IKF = 1000
IS = 10f
ISR = 100p
N = 1
M = 0.3333
RS = 0.015
VJ = 0.6
TT = 50n
Figure 12: Order Code
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
C = Flip-Chip
x = 1: 500µm, Bump = 315µm
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EMIF yy - xxx zz Cx
= 2: Leadfree Pitch = 500µm, Bump = 315µm
= 3: Leadfree Pitch = 400µm, Bump = 250µm
Figure 13: FLIP-CHIP Package Mechanical Data
EMIF10-LCD01C2
500µm ± 50
315µm ± 50
500µm ± 50
2.64mm ± 50µm
2.64mm ± 50µm
250µm ± 40
Figure 14: Foot Print Recommendations Figure 15: Marking
695µm ± 75
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Dot, ST logo
xx = marking
z = packaging location
yww = datecode
(y = year
ww = week)
All dimensions in µm
230
545
545
xyxwz
400
E
100
w
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EMIF10-LCD01C2
Figure 16: FLIP-CHIP Tape and Reel Specification
Dot identifying Pin A1 location
8 +/- 0.3
ST
yww
xxz
E
4 +/- 0.1
yww
xxz
ST
E
Ø 1.5 +/- 0.1
yww
xxz
1.75 +/- 0.1 3.5 +/- 0.1
ST
E
0.73 +/- 0.05
All dimensions in mm
User direction of unreeling
4 +/- 0.1
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Part Number Marking Package Weight Base qty Delivery mode
EMIF10-LCD01C2 FL Flip-Chip 9.3 mg 5000 Tape & reel (7”)
Table 4: Ordering Information
Note: Further packing information available in the application notes
- AN1235: ''Flip-Chip: Package description and recommandations for use''
- AN1751: "EMI Filters: Recommendations and measurements"
Table 5: Revision History
Date Revision Description of Changes
12-Aug-2005 1 First issue
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EMIF10-LCD01C2
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
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