The EMIF09-SD01F3 is a highly integrated array
designed to suppress EMI/RFI noise for secure
digital memory cards. The EMIF09-SD01F3 is in
a Flip Chip package to offer space saving and
high RF performance.
This low-pass filter includes ESD protection
circuitry, which prevents damage to the protected
device when subjected to ESD surges up 15 kV.
This filter also has a low line capacitance to be
compatible with high data rate signals.
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 12. Package dimensions
400 µm ± 40
400 µm ± 40
185 µm ± 10 µm
1.97 mm ± 30 µm
255 µm± 40
185 µm ± 10 µm
1.97 mm ± 30 µm
605 µm ± 55
6/9
EMIF09-SD01F3Ordering information
Figure 13. FootprintFigure 14. Marking
Dot, ST logo
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
xyxwz
Solder stencil opening :
220 µm recommended
Figure 15. Flip Chip tape and reel specifications
Dot identifying Pin A1 location
4 ± 0.1
Ø 1.5 ± 0.1
w
1.75 ± 0.13.5 ± 0.1
8 ± 0.3
ST
2.11
0.69 ± 0.05
All dimensions in mm
yww
xxz
E
User direction of unreeling
Note:More information is available in the application note:
AN2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and
recommendation for use”
AN1751: EMI Filters: Recommendations and measurements
5 Ordering information
Table 4.Ordering information
yww
2.11
xxz
ST
E
2.11
4 ± 0.1
yww
xxz
ST
E
Order codeMarkingPackageWeightBase qtyDelivery mode
EMIF09-SD01F3GZFlip Chip5.2 mg5000Tape and reel (7”)
7/9
Revision historyEMIF09-SD01F3
6 Revision history
Table 5.Document revision history
DateRevisionChanges
19-Oct-20051Initial release.
09-Feb-20062Tape cavity dimensions added in Figure 13. Other graphics improved.
22-Mar-20063
Reformatted to current standard. Typical and maximum values updated
for IRM in Electrical characteristics, page 3.
28-Apr-20084
Updated ECOPACK statement. Updated Figure 11, Figure 12 and
Figure 15. Reformatted to current standards.
8/9
EMIF09-SD01F3
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