EMIF08-VID01F2
8 line low capacitance EMI filter
and ESD protection
Main product characteristics
Where EMI filtering in ESD sensitive equipment is
required :
■ LCD & camera for mobile phones
■ Computers and printers
■ Communication systems
■ MCU Boards
Description
The EMIF08-VID01F2 is an 8 line highly
integrated device designed to suppress EMI/RFI
noise in all syste ms subjected to electromag netic
interference. The flip chip packaging means the
package size is equal to the die size.
This filter include s ESD pr otection ci rcuitr y, which
prevents damage to the application when it is
subjected to ESD surges up to 15kV.
Benefits
■ High efficiency EMI filter (-33 dB @ 900 Mhz)
■ Low line capacitance suitable for high speed
data bus
■ Low serial resistance for camera impedance
adaptation
■ Optimized PCB space consuming: 1.29 mm x
3.92 mm
■ Very thin package: 0.65 mm
■ Lead free pacakge
■ High efficiency in ESD suppression on inputs
pins (IEC61000-4-2 level 4).
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration & wafer level packaging.
Lead free flip chip package
Pin configuration (Bumps side)
9 8 7
6 5 4 3 2 112 11 10
I8O8I7O7I6O6I5O5I4O4I3O3I2O2I1
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Complies with following standards:
IEC61000-4-2
level 4 input pins 15 kV (air discharge)
8 kV (contact discharge
level 1 output pins 2 kV (air discharge)
2 kV (contact discharge
MIL STD 883E - Method 3015-6 Class 3
O1
A
B
C
Rev 2
August 2005 1/6
www.st.com
6
1 Electrical characteristics (T
Figure 1. Basic cell configuration
= 25°C) EMIF08-VID01F2
amb
Input
Output
RRRRRRR
R = 100
C
= 16 pF typ. @ 3V
line
Ω
Table 1. Absolute ratings (limiting values)
Symbol Parameter Value Unit
Vpp
ESD discharge IEC61000-4-2 air discharge
ESD discharge IEC61000-4-2 contac t dis charge
Tj Maximum junction temperature 125 °C
T
op
T
stg
Operating t emperature range -40 to +85 °C
Storage temperature range -55 to +150 °C
15
8
kV
KV
1 Electrical characteristics (T
Symbol Parameters
V
BR
Breakdown voltage
I
V
C
Leakage current @ V
RM
RM
Stand-off voltage
Series resistance between Input &
R
Output
line
Input capacitance per line
RM
Symbol Test conditions Min Typ Max Unit
V
BR
I
RM
R
I/O
C
line
IR = 1mA
VRM = 3V per line
I=10mA 80 100 120 Ω
VR = 3V DC, 1 MHz
amb
= 25°C)
I
I
I
I
RM
RM
V
V
RM
RM
6810V
16 19 pF
V
V
V
V
BR
BR
500 nA
2/6
EMIF08-VID01F2 1 Electrical characteristics (T
amb
Figure 2. S21 (dB) attenuation measurement Figure 3. Analog crosstalk measurement
= 25°C)
dB
0
0
-5
-5
-10
-10
-15
-15
-20
-20
-25
-25
-30
-30
-35
-35
-40
-40
-45
-45
100k 1M 10M 100M 1G
100k 1M 10M 100M 1G
f (Hz)
Figure 4. ESD response to IEC61000-4-2
(+15 kV air discharge) on one
Input
Input
10V/d
10V/d
Output
Output
10V/d
10V/d
input V
and one output V
in
out
dB
0
0
0
0
-10
-10
-10
-10
-20
-20
-20
-20
-30
-30
-30
-30
-40
-40
-40
-40
-50
-50
-50
-50
-60
-60
-60
-60
-70
-70
-70
-70
-80
-80
-80
-80
-90
-90
-90
-90
-100
-100
-100
-100
100k 1M 10M 100M 1G
100k 1M 10M 100M 1G
100k 1M 10M 100M 1G
100k 1M 10M 100M 1G
f (Hz)
Figure 5. ESD response to IEC61000-4-2
(- 15 kV air discharge) on one
Input
Input
10V/d
10V/d
Output
Output
10V/d
10V/d
input V
and one output V
in
out
200ns/d
200ns/d
Figure 6. Line capacitance versus applied
voltage
C (pF)
LINE
28
26
24
22
20
18
16
14
12
10
012345
V (V)
LINE
200ns/d
3/6
2 Ordering information scheme EMIF08-VID01F2
2 Ordering information scheme
EMIF vv - xxx zz F y
EMI Filter
Number of lines
X: resistance (Ohms)
Z: capacitance value / 10 pF
or
Application (3 letters) and
Version (2 digits)
F: Flip chip
1: Pitch = 500 µm, Bump = 315 µm
2: Lead free Pitch = 500 µm, Bump = 315 µm
3 Package mechanical data flip chip
315 µm +/- 50
315 µm +/- 50
500µm +/-50
500µm +/-50
500µm +/-50500µm +/-50
250µm +/-50
250µm +/-50
250µm +/-50
50
50
50
-
-
-
501µm +/
501µm +/
501µm +/
315 µm +/- 50
435 µm +/-50
435 µm +/-50
435 µm +/-50
3.92 mm +/-50µm
3.92 mm +/-50µm
3.92 mm +/-50µm
650µm +/- 65
650µm +/- 65650µm +/- 65
1.29 mm +/-50µm
1.29 mm +/-50µm
1.29 mm +/-50µm1.29 mm +/-50µm
Figure 7. Marking Figure 8. Foot print recommendation
Dot, ST Logo
xx = marking
z = packaging
location
yww = date code
Dimensions in µm
365
36
5
220
240
E
E
®
®
®
xxz
xxz
xxz
y
y
y
ww
ww
ww
Copper pad Diameter :
Copper pad Diameter :
250µm recommended , 300µm max
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder stencil opening : 330µm
40
40
40
Solder mask opening recommendation :
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
340µm min for 300µm copper pad diameter
4/6
EMIF08-VID01F2 4 Ordering information
Figure 9. Flip chip tape and reel specification
Dot identifying Pin A1 location
12 +/- 0.3
12 +/- 0.3
0.73 +/- 0.05
0.73 +/- 0.05
Dot identifying Pin A1 location
ST
ST
ST
yww
yww
yww
xxz
xxz
xxz
E
E
E
User direction of unreeling
User direction of unreeling
4 +/- 0.1
4 +/- 0.1
yww
yww
yww
xxz
xxz
xxz
ST
ST
ST
E
E
E
4 +/- 0.1
4 +/- 0.1
f 1.5 +/- 0.1
f 1.5 +/- 0.1
ST
ST
ST
yww
yww
yww
xxz
xxz
xxz
E
E
E
1.75 +/- 0.1
1.75 +/- 0.1
5.5 +/- 0.5
5.5 +/- 0.5
4 Ordering information
Ordering code Marking Package Weight Base qty Delivery mode
EMIF08-VID01F2 GS Flip Chip 6.8 mg 5000 7” Tape and reel
5 Revision history
Date Revision Changes
13-Jul-2005 1 Initial release.
11-Aug-2005 2 Fonts changed in Figures 7, 8, and 9
5/6
5 Revision history EMIF08-VID01F2
Information furnished is believed to be accurate and reliable. However, ST Microelectronics assumes no responsibility for the consequences
of use of such information no r for any infringement of patent s or other rights of third part ies which ma y result from its u se. No license is grant ed
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notic e. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of the i r respective owners
© 2005 STMicroelectronics - All rights reserv ed
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
6/6
Loading...