ST EMIF08-VID01F2 User Manual

ST EMIF08-VID01F2 User Manual

EMIF08-VID01F2

8 line low capacitance EMI filter and ESD protection

Main product characteristics

Where EMI filtering in ESD sensitive equipment is required :

LCD & camera for mobile phones

Computers and printers

Communication systems

MCU Boards

Description

The EMIF08-VID01F2 is an 8 line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The flip chip packaging means the package size is equal to the die size.

This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15kV.

Benefits

High efficiency EMI filter (-33 dB @ 900 Mhz)

Low line capacitance suitable for high speed data bus

Low serial resistance for camera impedance adaptation

Optimized PCB space consuming: 1.29 mm x 3.92 mm

Very thin package: 0.65 mm

Lead free pacakge

High efficiency in ESD suppression on inputs pins (IEC61000-4-2 level 4).

High reliability offered by monolithic integration

High reducing of parasitic elements through integration & wafer level packaging.

Lead free flip chip package

Pin configuration (Bumps side)

12 11 10

9 8 7

6 5 4

3 2 1

 

I8

I7

I6

I5

I4

I3

I2

I1

A

 

GND

 

GND

 

GND

 

GND

B

 

 

 

 

 

 

 

 

O8

O7

O6

O5

O4

O3

O2

O1

C

 

 

 

 

 

 

 

 

Complies with following standards:

IEC61000-4-2

 

 

level 4 input pins

15 kV

(air discharge)

 

8 kV

(contact discharge

level 1 output pins

2 kV

(air discharge)

 

2 kV

(contact discharge

MIL STD 883E - Method 3015-6 Class 3

 

Rev 2

August 2005

1/6

 

 

 

www.st.com

1 Electrical characteristics (Tamb = 25°C)

EMIF08-VID01F2

Figure 1. Basic cell configuration

Input Output

R

R = 100

Cline = 16 pF typ. @ 3 V

Table 1.

Absolute ratings (limiting values)

 

 

Symbol

Parameter

Value

Unit

 

 

 

 

Vpp

ESD discharge IEC61000-4-2 air discharge

15

kV

ESD discharge IEC61000-4-2 contact discharge

8

KV

 

 

 

 

 

Tj

Maximum junction temperature

125

°C

 

 

 

 

Top

Operating temperature range

-40 to +85

°C

Tstg

Storage temperature range

-55 to +150

°C

1 Electrical characteristics (Tamb = 25°C)

Symbol

Parameters

I

 

 

VBR

Breakdown voltage

 

 

 

IRM

Leakage current @ VRM

 

 

 

VRM

 

I

 

V

Stand-off voltage

RM

 

VRM

V

BR

R

Series resistance between Input &

 

 

 

Output

 

 

 

 

 

 

 

Cline

Input capacitance per line

 

 

 

Symbol

Test conditions

Min

Typ

Max

Unit

 

 

 

 

 

 

VBR

IR = 1mA

6

8

10

V

IRM

VRM = 3V per line

 

 

500

nA

RI/O

I=10mA

80

100

120

Cline

VR = 3V DC, 1 MHz

 

16

19

pF

2/6

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