(typically better than -40 dB from 900 MHz to
2GHz)
■ Very low clamping voltage
■ Low line capacitance (30 pF max) suitable for
high-speed interfaces
■ Maximum rise and fall time: 6 ns (10% - 90%)
■ Compliant with high speed data rate
■ Lead-free Flip-Chip package in 400 µm pitch
■ Very thin package: 0.6 mm thickness
Benefits
EMIF07-LCD03F3
Flip Chip
(18 bumps)
Description
The EMIF07-LCD03F3 is a 7-line highly
integrated L/C filter designed to suppress
EMI/RFI noise in all systems subjected to
electromagnetic interference.
■ High efficiency in EMI filtering
■ High bandwidth: typically 200 MHz at -3 dB
■ 80% space saving versus discrete solution
(BOM reduction)
■ High reliability offered by monolithic integration
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Figure 11. Package dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
4/7
EMIF07-LCD03F3Ordering information
Figure 12. FootprintFigure 13. Marking
Figure 14. Flip Chip tape and reel specification
Dot identifying Pin A1 location
4 ± 0.1
8 ± 0.3
ST
yww
xxz
E
1.71
yww
xxz
ST
E
2.08
Ø 1.5 ± 0.1
ST
yww
xxz
E
1.75 ± 0.1
3.5 ± 0.1
0.69 ± 0.05
All dimensions in mm
User direction of unreeling
Note:More information is available in the application notes:
AN2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and
recommendation for use”
AN1751: “EMI filters: Recommendations and measurements”
4 Ordering information
Table 3.Ordering information
Order codeMarkingPackageWeightBase qtyDelivery mode
EMIF07-LCD03F3HWFlip Chip4 mg5000Tape and reel 7”
4 ± 0.1
5/7
Revision historyEMIF07-LCD03F3
5 Revision history
Table 4.Document revision history
DateRevisionChanges
05-Dec-081Initial release.
6/7
EMIF07-LCD03F3
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