7-line IPAD™, EMI filter and ESD protection
Features
■ High attenuation in the mobile frequency range
(typically better than -40 dB from 900 MHz to
2GHz)
■ Very low clamping voltage
■ Low line capacitance (30 pF max) suitable for
high-speed interfaces
■ Maximum rise and fall time: 6 ns (10% - 90%)
■ Compliant with high speed data rate
■ Lead-free Flip-Chip package in 400 µm pitch
■ Very thin package: 0.6 mm thickness
Benefits
EMIF07-LCD03F3
Flip Chip
(18 bumps)
Description
The EMIF07-LCD03F3 is a 7-line highly
integrated L/C filter designed to suppress
EMI/RFI noise in all systems subjected to
electromagnetic interference.
■ High efficiency in EMI filtering
■ High bandwidth: typically 200 MHz at -3 dB
■ 80% space saving versus discrete solution
(BOM reduction)
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
■ IEC 61000-4-2 level 4 on inputs and outputs:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Applications
Displays and cameras where EMI filtering in ESD
sensitive equipment is required:
■ Mobile phones and PDAs
■ Personal and home entertainment (portable
Audio, DVD players, LCD TVs)
■ Portable navigation devices
■ Digital still cameras
■ Portable gaming systems
TM: IPAD is a trademark of STMicroelectronics.
The EMIF07-LCD03F3 Flip-Chip packaging
means the package size is equal to the die size.
This LC filter includes ESD protection circuitry,
which prevents damage to the protected device
when subjected to ESD surges up ±15 kV.
Figure 1. Pin layout (bump side)
Figure 2. Device configuration
December 2008 Rev 1 1/7
www.st.com
7
Characteristics EMIF07-LCD03F3
1 Characteristics
Table 1. Absolute maximum ratings (T
Symbol Parameter and test conditions Value Unit
Input and output pins:
V
ESD discharge IEC 610000-4-2, air discharge
pp
ESD discharge IEC 610000-4-2, contact discharge
amb
= 25 °C)
±15
±15
kV
T
T
T
Table 2. Electrical characteristics (T
Maximum junction temperature 125 °C
j
Operating temperature range -40 to +85 °C
op
Storage temperature range -55 to 150 °C
stg
Symbol Parameters
V
BR
I
RM
V
RM
R
I/O
C
line
Breakdown voltage
Leakage current @ V
RM
Stand-off voltage
Series resistance between input and output
Line capacitance
Symbol Test conditions Min Typ Max Unit
V
BR
I
RM
R
I/O
C
line
IR = 1 mA 14 V
VRM = 3 V per line 200 nA
Tolerance ± 20% 100 125 150 Ω
Vline = 0 V, V
= 30 mV, F =1 MHz 30 pF
OSC
Figure 3. Attenuation versus frequency (all
GND bumps connected)
S21 (dB)
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
-55
-60
100k 1M 10M 100M 1G
I1-
O1
-
I3
O3
-
I5
O5
-
I7 O7
F (Hz)
-
I2
O2
-
I4
O4
-
O6
I6
= 25 °C)
amb
Figure 4. Analog cross talk versus frequency
(all GND bumps connected)
XTalk (dB)
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
100k 1M 10M 100M 1G
I1-O2 I1- O7
F (Hz)
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EMIF07-LCD03F3 Characteristics
Figure 5. ESD response under IEC61000-4-2
Figure 6. ESD response under IEC61000-4-2
conditions, VPP = +15 kV air
discharge
Figure 7. Line capacitance versus applied voltage
C
(pF)
line
30.00
25.00
20.00
15.00
10.00
5.00
0.00
012345
V
line
(V)
conditions, VPP = -15 kV air
discharge
F=1 MHz
V
= 30 mV
OSC
TJ= 25° C
RMS
Figure 8. Typical rise and fall time: input
voltage
INPUT VOLTAGE
X: 10 ns/DIV
Y:1 V/DIV
t
10% -90% = 3.34 ns
rise
t
90%-10% = 3.65 ns
fall
Figure 9. Typical rise and fall time: output
voltage
OUTPUT VOLTAGE
X: 10ns/DIV
Y: 1V/DIV
t
10% -90% = 3.45 ns
rise
t
90%-10% = 4.09 ns
fall
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Ordering information scheme EMIF07-LCD03F3
2 Ordering information scheme
Figure 10. Ordering information scheme
EMIF yy - xxx zz F3
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
3 = Lead-free, pitch = 400 µm, bump = 255 µm
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Figure 11. Package dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
4/7
EMIF07-LCD03F3 Ordering information
Figure 12. Footprint Figure 13. Marking
Figure 14. Flip Chip tape and reel specification
Dot identifying Pin A1 location
4 ± 0.1
8 ± 0.3
ST
yww
xxz
E
1.71
yww
xxz
ST
E
2.08
Ø 1.5 ± 0.1
ST
yww
xxz
E
1.75 ± 0.1
3.5 ± 0.1
0.69 ± 0.05
All dimensions in mm
User direction of unreeling
Note: More information is available in the application notes:
AN2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and
recommendation for use”
AN1751: “EMI filters: Recommendations and measurements”
4 Ordering information
Table 3. Ordering information
Order code Marking Package Weight Base qty Delivery mode
EMIF07-LCD03F3 HW Flip Chip 4 mg 5000 Tape and reel 7”
4 ± 0.1
5/7
Revision history EMIF07-LCD03F3
5 Revision history
Table 4. Document revision history
Date Revision Changes
05-Dec-08 1 Initial release.
6/7
EMIF07-LCD03F3
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