6-line low capacitance IPAD™ for micro-SD card
Features
■ EMI low-pass filter
■ Integrated pull up resistors to prevent bus
floating when no card is connected
■ 208 MHz clock frequency compatible with
SDR104 mode (SD3.0)
■ Lead-free package
Benefits
EMIF06-MSD04F3
with EMI filtering and ESD protection
Flip Chip
(16 bumps)
■ Low power consumption
■ Easy layout thanks to smart pin-out
configuration
■ Very low PCB space consumption
■ High reliability offered by monolithic integration
■ Reduction of parasitic elements thanks to CSP
integration
Complies with the following standards:
■ IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Application
Micro (T-Flash) secure digital memory card in:
■ Mobile phones
■ Communication systems
Description
The EMIF06-MSD04F3 is a highly integrated
device based on IPAD technology offering two
functions: ESD protection to comply with IEC
standard, and EMI filtering to reject mobile phone
frequencies.
Figure 1. Pin configuration (bump side)
1234
A
B
C
D
TM: IPAD is a trademark of STMicroelectronics
July 2011 Doc ID 018849 Rev 1 1/9
www.st.com
9
Characteristics EMIF06-MSD04F3
1 Characteristics
Table 1. Absolute ratings (limiting values)
Symbol Parameter Value Unit
ESD discharge IEC 61000-4-2, level 4
Air discharge, card side
V
PP
Contact discharge, card side
Air discharge, IC side
Contact discharge, IC side
T
Maximum junction temperature 125 °C
j
T
Operating temperature range - 40 to + 85 °C
op
T
Storage temperature range - 55 to + 150 °C
stg
Figure 2. EMIF06-MSD04F3 configuration
R7
R11
R9
R8
R10
R1
R2
R3
R4
R5
R6
Host
side
Clk
CMD
Dat0
Dat1
Dat2
Dat3/CD
15
8
2
2
Vcc
SDClk
SDCMD
SDDat0
SDDat1
SDDat2
SDDat3/CD
kV
Card
side
Table 2. Pin configuration
Pin Signal Pin Signal
A1 Dat0 C1 CMD
A2 Dat1 C2 V
A3 SDDat1 C3 V
A4 SDDda0 C4 SDCMD
B1 Clk D1 Dat3/CD
B2 V
B3 V
B4 SDClk D4 SDDat3/CD
cc
ss
2/9 Doc ID 018849 Rev 1
Vss
ss
ss
D2 Dat2
D3 SDDat2
EMIF06-MSD04F3 Characteristics
Table 3. Electrical characteristic
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
BR
I
RM
R1, R2, R3,
R4, R5, R6
R7, R8, R9,
R10, R11
C
line
F
0
tR,t
Breakdown voltage IR = 1 mA 14 16 V
Leakage current at V
RM
VRM = 3 V 0.1 µA
Serial resistance Tolerance ±10 %, matching ±2 % 36 40 44 Ω
Pull-up resistance Tolerance ±20 %, matching ±2 % 20 25 30 kΩ
Data line capacitance
V = 1.8 V, F = 10 MHz, V
V = 2.9 V, F = 10 MHz, V
= 30 mV 7.5 10
OSC
= 30 mV 9
OSC
Cut-off frequency S21 = -3 dB 550 MHz
C
= 10 pF, low-ref = 0.58 V,
Rise and fall time
F
load
high-ref = 1.27 V
0.98 ns
Figure 3. S21 attenuation measurements Figure 4. Analog crosstalk measurements
S21 (dB)
0
-5
-10
-15
-20
-25
-30
100k 1M 10M 100M 1G
Clk Dat0
Dat1
Dat3
Dat2
Cmd
F (Hz)
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
dB
0
100k 1M 10M 100M 1G
Clk-Dat0 Dat3-SDDat0
F (Hz)
pF
Doc ID 018849 Rev 1 3/9
Characteristics EMIF06-MSD04F3
Figure 5. Line capacitance versus applied
voltage (typical values)
C
(pF)
line
12
11
10
F=10 MHz
=30 mV
V
OSC
T
=25 °C
AMB
RMS
9
8
7
6
5
4
3
2
V
1
BIAS
(V)
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Figure 7. Digital crosstalk measurements
Figure 6. Line capacitance versus frequency
(typical values)
C
(pF)
line
8
7
6
5
4
3
2
V
=30 mV
1
0
OSC
T
=25 °C
AMB
1
V
=1.8 V
BIAS
V
=2.9 V
BIAS
RMS
10 100
F (MHz)
500
4/9 Doc ID 018849 Rev 1
EMIF06-MSD04F3 Characteristics
Figure 8. Host side response to IEC 61000-4-2 (+8 kV contact discharge) on card side
Figure 9. Host side response to IEC 61000-4-2 (-8 kV contact discharge) on card side
Doc ID 018849 Rev 1 5/9
Layout recommendations EMIF06-MSD04F3
2 Layout recommendations
Figure 10. Layout recommendations
Vcc
Dat1
Dat0
Clk
CMD
Dat3/CD
Dat2
Input Output
Top level
Second level
Top View
3 Ordering information scheme
Dat1
Dat0
Vss
Clk
Vcc
NC
NC
Vss
CMD
Dat3/CD
Dat2
Figure 11. Ordering information scheme
EMI filter
Number of lines
Application
MSD = micro SD card
Version
04 = 7.5 pF line capacitance
6/9 Doc ID 018849 Rev 1
Package
F = Flip Chip
3= lead-free, pitch = 400 µm, bump = 255 µm
EMIF 06 - MSD 04 F3
EMIF06-MSD04F3 Package information
4 Package information
● Epoxy meets UL94, V0
● Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Figure 12. Package dimensions
400 µm ± 40
255 µm ± 40
170 µm ± 10
400 µm ± 40
1.54 mm ± 40 µm
170 µm ± 10
1.54 mm ± 40 µm
605 µm ± 55
Figure 13. Footprint Figure 14. Marking
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Doc ID 018849 Rev 1 7/9
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing
location
yww = datecode
y = year,
ww = week
x
y
z
wxw
Ordering information EMIF06-MSD04F3
Figure 15. Tape and reel specification
Dot identifying Pin A1 location
0.20
1.65
8.0
0.69
All dimensionsare typical values in mm
5 Ordering information
Table 4. Ordering information
2.0
4.0
ST
ST
yww
yww
xxz
xxz
E
E
yww
yww
xxz
xxz
1.65
User direction of unreeling
Ø 1.55
1.75
3.5
ST
ST
E
E
ST
ST
yww
yww
xxz
xxz
E
E
4.0
Order code Marking Package Weight Base qty Delivery mode
EMIF06-MSD04F3 JW Flip Chip 3.2 mg 5000 Tape and reel 7”
Note: More information is available in the application notes:
AN2348: “Flip Chip: Package description and recommendations for use”
AN1751: "EMI Filters: Recommendations and measurements"
6 Revision history
Table 5. Document revision history
Date Revision Changes
12-July-2011 1 First issue.
8/9 Doc ID 018849 Rev 1
EMIF06-MSD04F3
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Doc ID 018849 Rev 1 9/9
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