6-line low capacitance IPAD™ for micro-SD card
Features
■ EMI low-pass filter
■ ESD protection ±15 kV (IEC 61000-4-2)
■ Integrated pull up resistors to prevent bus
floating when no card is connected
■ 208 MHz clock frequency compatible with
SDR104 mode (SD3.0)
■ Lead-free package
■ Coated version option on request
■ Electrical card detect option
EMIF06-MSD03F3
with EMI filtering and ESD protection
Flip Chip
(16 bumps)
Figure 1. Pin configuration (bump side)
Benefits
■ Low power consumption
■ Easy layout thanks to smart pin-out
configuration
■ Very low PCB space consumption
■ High reliability offered by monolithic integration
■ Reduction of parasitic elements thanks to CSP
integration
Complies with the following standards:
■ IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Application
Micro (T-Flash) secure digital memory card in:
■ Mobile phones
■ Communication systems
Description
The EMIF06-MSD03F3 is a highly integrated
device based on IPAD technology offering two
functions: ESD protection to comply with IEC
standard, and EMI filtering to reject mobile phone
frequencies.
1234
A
B
C
D
TM: IPAD is a trademark of STMicroelectronics
July 2011 Doc ID 018984 Rev 1 1/8
www.st.com
8
Characteristics EMIF06-MSD03F3
1 Characteristics
Table 1. Absolute ratings (limiting values)
Symbol Parameter Value Unit
ESD discharge IEC 61000-4-2, level 4
air discharge, card side
V
PP
contact discharge, card side
air discharge, IC side
contact discharge, ICside
T
Maximum junction temperature 125 °C
j
T
Operating temperature range - 40 to + 85 °C
op
T
Storage temperature range - 55 to + 150 °C
stg
Figure 2. EMIF06-MSD03F3 configuration
15
8
kV
2
2
Vcc2
Clk
CMD
Data 0
2kV
Data 1
Data 2
Data 3/CD
Table 2. Pin configuration
R9
R13
R11
R10
R12
R1
R2
R3
R4
R5
R6
GND
Vcc1
SDClk
SDCMD
SDData 0
SDData 1
SDData 2
SDData 3/CD
15kV
Pin Signal Pin Signal
A1 DATA0 C1 CMD
A2 DATA1 C2 V
A3 SDDATA1 C3 V
cc2
ss
A4 SDDATA0 C4 SDCMD
B1 CLK D1 DATA3/CD
B2 V
B3 V
B4 SDCLK D4 SDDATA3/CD
cc1
ss
D2 DATA2
D3 SDDATA2
2/8 Doc ID 018984 Rev 1
EMIF06-MSD03F3 Characteristics
Table 3. Electrical characteristic
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
BR
I
RM
R1, R2, R3,
R4, R5, R6
R9, R10,
R11, R12
Breakdown voltage IR = 1 mA 14 16 V
Leakage current at V
RM
VRM = 3 V 0.1 µA
Serial resistance Tolerance ±10 %, matching ±2 % 40 Ω
Pull-up resistance Tolerance ±10 %, matching ±2 % 50 kΩ
R13 Pull-up resistance on CMD Tolerance ±10 % 15 kΩ
C
F
tR,t
line
0
V = 0 V, F = 10 MHz, V
Data line capacitance
V = 2.9 V, F = 10 MHz, V
Cut-off frequency S21 = -3 dB 550 MHz
C
= 10 pF, low-ref = 0.58 V,
Rise and fall time
F
load
high-ref = 1.27 V, V
DDIO
= 30 mV 10 12
OSC
= 30 mV 7.5 10
OSC
= 30 mV 9
OSC
= 1.8 V
0.98 ns
Figure 3. S21 attenuation measurements Figure 4. Analog crosstalk measurements
S21 (dB)
0.00
-5.00
-10.00
-15.00
-20.00
-25.00
-30.00
100.0k 1.0M 10.0M 100.0M 1.0G
Clk Data0
Data1 Data2
Data3 Cmd
F (Hz)
-100.00
-110.00
-120.00
dB
0.00
-10.00
-20.00
-30.00
-40.00
-50.00
-60.00
-70.00
-80.00
-90.00
100.0k 1.0M 10.0M 100.0M 1.0G
Clk-Data0 Data3-SDData0
F (Hz)
pF V = 1.8 V, F = 10 MHz, V
Figure 5. Line capacitance versus applied
voltage (typical values)
C (pF)
12
11
10
9
8
7
6
5
Clk
4
Data0
3
CMD
2
Data3
1
0
012345
Figure 6. Line capacitance versus frequency
(typical values)
C (pF)
F=10 MHz
V
=30 mV
OSC
=25 °C
T
AMB
V
(V)
BIAS
Doc ID 018984 Rev 1 3/8
16.00
14.00
12.00
10.00
8.00
6.00
4.00
2.00
0.00
0 50 100 150 200 250 300 350
F=1MHz to 350MHz
=30mV
V
osc
Tj=25 °C
Line DATA/GND
A3/B3 (SDDATA1) &D3/C3 (SDDATA2)
RMS
F (MHz)
Characteristics EMIF06-MSD03F3
Figure 7. Digital crosstalk measurements
Vcc= 3.9 V
Figure 8. ESD response to IEC 61000-4-2
(+8 kV contact discharge) on one
input and one output
20.0 V/div
10.0 V/div
20 ns/div
20 ns/div
Figure 9. ESD response to IEC 61000-4-2
(-8 kV contact discharge) on one
input and one output
10.0 V/div
20 ns/div
10.0 V/div
20 ns/div
4/8 Doc ID 018984 Rev 1
EMIF06-MSD03F3 Ordering information scheme
2 Ordering information scheme
Figure 10. Ordering information scheme
EMIF 06 - MSD 03 F3
EMI filter
Number of lines
Application
MSD = micro SD card
Version
03 = 10 pF line capacitance
Package
F = Flip Chip
3= lead-free, pitch = 400 µm, bump = 255 µm
Doc ID 018984 Rev 1 5/8
Package information EMIF06-MSD03F3
3 Package information
● Epoxy meets UL94, V0
● Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Figure 11. Package dimensions
400 µm ± 40
255 µm ± 40
170 µm ± 10
400 µm ± 40
1.54 mm ± 40 µm
170 µm ± 10
1.54 mm ± 40 µm
605 µm ± 55
Figure 12. Footprint Figure 13. Marking
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
6/8 Doc ID 018984 Rev 1
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing
location
yww = datecode
y = year,
ww = week
x
y
z
wxw
EMIF06-MSD03F3 Ordering information
Figure 14. Tape and reel specification
Dot identifying Pin A1 location
0.20
1.68
8.0
0.69
All dimensionsare typical values in mm
4 Ordering information
Table 4. Ordering information
2.0
4.0
ST
ST
yww
yww
xxz
xxz
E
E
yww
yww
xxz
xxz
1.68
User direction of unreeling
Ø 1.55
1.75
3.5
ST
ST
E
E
ST
ST
yww
yww
xxz
xxz
E
E
4.0
Order code Marking Package Weight Base qty Delivery mode
EMIF06-MSD03F3 JV Flip Chip 3.2 mg 5000 Tape and reel 7”
Note: More information is available in the application notes:
AN2348: “Flip Chip: Package description and recommendations for use”
AN1751: "EMI Filters: Recommendations and measurements"
5 Revision history
Table 5. Document revision history
Date Revision Changes
11-Jul-2011 1 First issue.
Doc ID 018984 Rev 1 7/8
EMIF06-MSD03F3
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8/8 Doc ID 018984 Rev 1
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