EMIF06-mSD01F2
IPAD™
Mini and micro SD Card - EMI filtering and 25 kV ESD protection
Main application
Mini and micro (T-Flash) Secure Digital memory
card in mobile phones and communication
systems
Description
The EMIF06-mSD01F2 is a highly integrated
device based on IPAD technology with the
following functions:
■ ESD protection to comply with IEC standard
■ EMI Filtering to reject mobile phone
frequencies
Pin configuration (bump side)
Flip-Chip
(16 Bumps)
Benefits
■ EMI Low-pass-filter
■ ESD protection ±25 kV (IEC 61000-4-2)
■ Integrated pull up resistors to prevent bus
floating when no card is connected
■ 50 Mhz clock frequency compatibility with
C
< 20 pF
line
■ Low power consumption
■ Easy Layout thanks to smart pin-out
configuration
■ Very low PCB space consuming
■ High reliability offered by monolithic integration
■ Reduction of parasitic elements thanks to CSP
integration
■ Lead free package
■ Coated version option upon request
Complies with the following standards:
IEC 61000-4-2
level 4 15 kV (air discharge)
8 kV (contact discharge)
MIL STD 883G - Method 3015-7 Class 3A
SD Card Specification Ver. 1.01
MicroSD Card Specification Ver. 1.0
Physical layer specification, Part 1 vesion 1.1
1234
A
B
C
D
A1 DATA0 C1 CMD
A2 DATA1 C2 Vss
A3 SDDATA1 C3 Vss
A4 SDDATA0 C4 SDCMD
B1 CLK D1 DATA3/CD
B2 Vcc D2 DATA2
B3 Vss D3 SDDATA2
B4 SDCLK D4 SDDATA3/CD
Order code
Part Number Marking
EMIF06-mSD01F2 HJ
TM: IPAD is a trademeark of STMicroelectronics
February 2007 Rev 1 1/7
www.st.com
7
Characteristics EMIF06-mSD01F2
1 Characteristics
Table 1. Absolute ratings (limiting values)
Symbol Parameter and test conditions Value Unit
V
V
T
T
ESD discharge IEC 61000-4-2, air discharge
PP
ESD discharge IEC 61000-4-2, contact discharge
Maximum input voltage 5.5 V
in
T
Maximum junction temperature 125 ° C
j
Operating temperature range - 40 to + 85 ° C
op
Storage temperature range 125 ° C
stg
Figure 1. EMIF06-mSD01F2 configuration
Host
R9 R10
Clk
CMD
Data0
Data1
Data2
Data3/CD
Vss Vss
R11 R12
R13
R1
R3
R5
25
25
Vcc
R2
R4
R6
SDClk
SDCMD
SDData0
SDData1
SDData2
SDData3/CD
kV
Card
Table 2. Electrical characteristics
Symbol Test conditions Min. Typ. Max. Unit
V
BR
I
RM
IR = 1 mA 14 16 V
VRM = 3 V 0.1 µA
R1, R2, R3, R4, R5, R6 Tolerance ±20% 40 Ω
R9, R10, R11, R12, R13 Tolerance ±30% 25 kΩ
C
line
V = 0 V, F = 1 MHz V
2/7
= 30 mV 17 20 pF
osc
EMIF06-mSD01F2 Characteristics
Figure 2. Frequency response for
0.00
-10.00
-20.00
-30.00
-40.00
-50.00
line D3/D2 - V
dB
1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G
D2-D3
not connected
CC
F (Hz)
Figure 4. ESD response to IEC 61000-4-2
(+15 kV air discharge) on one imput
(V
) and one output (V
in
out
)
Figure 3. Frequency response for
line C1/B4 - VCC not connected
dB
0.00
-10.00
-20.00
-30.00
-40.00
-50.00
-60.00
-70.00
-80.00
1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G
C1-B4
F (Hz)
Figure 5. ESD response to IEC 61000-4-2
(-15 kV air discharge) on one imput
(Vin) and one output (V
out
)
Figure 6. Junction capacitance versus
reverse applied voltage
CLK line (typical values)
C (pF)
LINE
14
12
10
8
6
4
2
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
V (V)
LINE
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Technical information EMIF06-mSD01F2
2 Technical information
Figure 7. T-Flash connection diagram recommendation
(MicroSD Specification Ver 1.0)
R
DATRCMD
CMD
DAT0~3
CLK
C
HOST
1C2C3
EMIF06-mSD01F2
Pin 1
Pin 2
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
Pull-up resistance R
DAT
and R
are implemented to prevent bus floating when no card is
CMD
inserted or when all card drivers are in high impedance mode. Resistance values should be
set between 10 kΩ and 100 kΩ .
The pull-up resistors and capacitors described in the above recommendation are integrated
in the EMIF06-mSD01F2. This makes the EMIF06-mSD01F2 an easy "plug and play"
solution to implement secured T-flash, mini-SD card terminations.
Figure 8. Layout recommendation
DAT1
DAT0
DAT1
DAT0
CLK
CMD
DAT3/CD
DAT2
Input Output
Top level
Second level
VSS
CLK
VCC
NC
NC
VSS
CMD
DAT3/CD
DAT2
GNDTop View
4/7
EMIF06-mSD01F2 Ordering information scheme
3 Ordering information scheme
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 2: Lead free Pitch = 500 µm, Bump = 315 µm
4 Package information
Figure 9. Flip-Chip Package dimensions
500 µm ± 50
315 µm ± 50
500 µm ± 50
1.92 mm ± 50 µm
1.92 mm ± 50 µm
Figure 10. Foot print recommendations Figure 11. Marking
Dot, ST logo
Copper pad Diameter:
250 µm recommended , 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
650 µm ± 65
x
y
wxw
E
z
5/7
Ordering information EMIF06-mSD01F2
Figure 12. Flip-Chip Tape and reel specification
Dot identifying Pin A1 location
8 +/- 0.3
ST
yww
xxz
E
4 +/- 0.1
yww
xxz
ST
E
Ø 1.5 +/- 0.1
yww
xxz
1.75 +/- 0.1 3.5 +/- 0.1
ST
E
0.73 +/- 0.05
All dimensions in mm
User direction of unreeling
4 +/- 0.1
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Note: More packing information is available in the application notes:
AN1235: “Flip-Chip: Package description and recommendations for use”
AN1751: "EMI Filters: Recommendations and measurements"
5 Ordering information
Ordering code Marking Package Weight Base qty Delivery mode
EMIF06-mSD01F2 HJ Flip-Chip 5.3 mg 5000 Tape and reel 7”
6 Revision history
Date Revision Description of Changes
02-Feb-2007 1 First issue.
6/7
EMIF06-mSD01F2
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