ST EMIF06-HMC01F2 User Manual

6-line IPAD™, EMI filter including ESD protection

Features

■ 6-line low-pass-filter

■ High efficiency in EMI filtering

■ Very low PCB space occupation: < 4.4 mm

■ Lead-free package

■ Very thin package: 0.65 mm

■ High efficiency in ESD suppression

■ High reliability offered by monolithic integration

■ High reducing of parasitic elements through

integration and wafer level packaging

2

EMIF06-HMC01F2

Flip Chip

(16 bumps)

Figure 1. Pin layout (bump side)

1342

Complies with the following standards

■ IEC 61000-4-2 level 4 on external pins

– 15 kV (air discharge)
– 8 kV (contact discharge)

■ MIL STD 883E - Method 3015-6 Class 3

Applications

■ High speed MultiMediaCard

Description

The EMIF06-HMC01F2 is a highly integrated
array designed to suppress EMI / RFI noise for
high speed MultiMediaCard port filtering. The
EMIF06-HMC01F2 Flip Chip packaging means
the package size is equal to the die size.

Additionally, this filter includes ESD protection
circuitry which prevents damage to the application
when subjected to ESD surges up to 15 kV.

A

B

C

D

A1 cmd C1 dat2
A2 clk C2 gnd
A3 Vmmc/Vdd C3 MMCdat1
A4 MMCclk C4 MMCdat0
B1 dat1 D1 dat3
B2 dat0 D2 gnd
B3 gnd D3 MMCdat3
B4 MMCcmd D4 MMCdat2

Figure 2. Basic cell configuration

R10

R11

R12

R13

Vmmc

MMCclk

MMCcmd

MMCdat0

MMCdat1

MMCdat2

MMCdat3

R14

R2

R3

R4

R5

R6

R7

Vmmc

clk

cmd

dat0

dat1

dat2

dat3

GND

TM: IPAD is a trademark of STMicroelectronics.

April 2008 Rev 2 1/8

www.st.com

8

Characteristics EMIF06-HMC01F2

1 Characteristics

Table 1. Absolute maximum ratings (T

Symbol Parameter and test conditions Value Unit

Internal pins (A4, B4, C3, C4, D3, D4):

ESD discharge IEC61000-4-2, air discharge

V

ESD discharge IEC61000-4-2, contact discharge

PP

External pins (A1, A2, A3, B1, B2, C1, D1):

ESD discharge IEC61000-4-2, air discharge
ESD discharge IEC61000-4-2, contact discharge

amb

= 25 °C)

15

2
2

kV

8

T

T

T

Table 2. Electrical characteristics (T

Symbol Parameters

V

I

V

C

Maximum junction temperature 125 °C

j

Operating temperature range -40 to +85 °C

op

Storage temperature range -55 to 150 °C

stg

= 25 °C)

amb

I

BR

RM

RM

line

Breakdown voltage

Leakage current @ V

RM

Stand-off voltage

Input capacitance per line

VRMVBR

IRM

IRM

V

BRVRM

Symbol Test conditions Tolernace Min Typ Max Unit

V

BR

I

RM

C

line

R

R

2

,

R

R

5

,

R

10

,

R

12

,

R

IR = 1 mA 14 V

VRM = 3V 0.1 µA

@ 0V 20 pF

R

3

4

,

,

I = 50 mA ± 20 % 50 Ω

R

6

7

,

R

11

,

I = 50 µA ± 30 % 75 kΩ

R

13

I = 200 µA ± 30 % 7 kΩ

14

V

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EMIF06-HMC01F2 Characteristics

Figure 3. S21 (dB) attenuation measurement Figure 4. Analog crosstalk measurement

0.00

dB

-10.00

-20.00

-30.00

-40.00

-50.00

100.0k 1.0M 10.0M 100.0M 1.0G
f/Hz

Figure 5. ESD response to IEC 61000-4-2

(+15kV air discharge) on one input
(V

) and on one output (V

in

out

)

Input

10V/d

Output

10V/d

0.00

dB

-10.00

-20.00

-30.00

-40.00

-50.00

-60.00

-70.00

-80.00

100.0k 1.0M 10.0M 100.0M 1.0G
f/Hz

Figure 6. ESD response to IEC 61000-4-2

(-15kV air discharge) on one input
(Vin) and on one output (V

out

)

Input

10V/d

Output

10V/d

200ns/d

200ns/d

Figure 7. Junction capacitance versus reverse voltage applied (typical values)

C (pF)

LINE

16

14

12

10

8

6

4

2

0

012345

V (V)

LINE

Vosc=30mV

Vosc=30mV
F=1MHz

F=1MHz
Ta=25°C

Ta=25°C

3/8

Application information EMIF06-HMC01F2

2 Application information

Figure 8. Aplac model device structure

R10

R11

R12

R13

R14

LbumpRbump

Rsub Cbump

LbumpRbump

Rsub Cbump

LbumpRbump

Rsub Cbump

Rbump

Lbump

Rsub Cbump

LbumpRbump

Rsub Cbump

LbumpRbump

Rsub Cbump

A2

A1

B2

B1

C1

D1

Cgnd

R2

R3

R4

R5

R6

R7

MODEL = demif06_gnd

Lbump

Rbump

Lgnd

Rgnd

clk

cmd

dat0

dat1

dat2

dat3

MODEL = demif06

bulk

clk

bulk

cmd

bulk

dat0

bulk

dat1

bulk

dat2

bulk

dat3

bulk

A3

A4

B4

C4

C3

D3

D4

Lbump Rbump

Rsub

Cbump

Lbump

Rbump

RsubCbump

Lbump Rbump

RsubCbump

Lbump

Rbump

RsubCbump

Lbump Rbump

RsubCbump

Lbump Rbump

RsubCbump

Lbump Rbump

RsubCbump

Vmmc_Vdd

bulk

MMCclk

bulk

MMCcmd

bulk

MMCdat0

bulk

MMCdat1

bulk

MMCdat2

bulk

MMCdat3

bulk

Vmmc_Vdd

MMCclk

MMCcmd

MMCdat0

MMCdat1

MMCdat2

MMCdat3

MODEL = demif06

Figure 9. Aplac parameters

Variables

R2 50

R3 50

R4 50

R5 50

R6 50

R7 50

R10 75k

R11 75k

R12 75k

R13 75k

R14 7k

Rsub 100m

Variables

Cz 11pF

Cz_gnd 45pF

RS_gnd 480m

Ls 950pH

Rs 150m

Rbump 100m

Lbump 50pH

Cbump 0.15pF

Lgnd 50pH

Rgnd 100m

Cgnd 0.15pF

demif06_gnd

BV=14

IBV=1m

CJO=Cz_gnd

M=0.31

RS=RS_gnd

VJ=0.6

TT=100n

demif06

BV=14

IBV=1m

CJO=Cz

M=0.31

RS=1

VJ=0.6

TT=100n

4/8

EMIF06-HMC01F2 Ordering information scheme

3 Ordering information scheme

Figure 10. Ordering information scheme

EMIF yy - xxx zz Fx

EMI Filter

Number of lines

Information

x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version

Package

F = Flip Chip
x = 2: Lead-free, pitch = 500 µm, bump = 315 µm

4 Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Figure 11. Package dimensions

500 µm ± 10

500 µm ± 10

210 µm

1.92 mm ± 50 µm

315 µm ± 50

1.92 mm ± 50 µm

210 µm

650 µm ± 65

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Ordering information EMIF06-HMC01F2

Figure 12. Footprint Figure 13. Marking

Dot, ST logo
xx = marking

Copper pad Diamete :

250 µm recommended, 300 µm max

Solder stencil opening: 330 µm

z = manuafacturing location
yww = datecode

(y = year

ww = week)

E

xyxwz

Solder mask opening recommendation:

340 µm min for 315 µm copper pad diameter

Figure 14. Flip Chip tape and reel specification

Dot identifying Pin A1 location

4 ± 0.1

Ø 1.5 ± 0.1

w

1.75 ± 0.1 3.5 ± 0.1

2.06

yww

xxx

User direction of unreeling

0.73 ± 0.05

All dimensions in mm

8 ± 0.3

yww

xxx

ST

E

Note: More information is available in the application notes:

AN1235:"Flip Chip: Package description and recommendations for use"

AN1751: “EMI filters: Recommendations and measurements”

5 Ordering information

Table 3. Ordering information

Order code Marking Package Weight Base qty Delivery mode

EMIF06-HMC01F2 GH Flip Chip 5.3 mg 5000 Tape and reel 7”

ST

E

2.06

4 ± 0.1

yww

xxx

ST

E

6/8

EMIF06-HMC01F2 Revision history

6 Revision history

Table 4. Document revision history

Date Revision Changes

25-Jan-2005 1 Initial release.

Updated ECOPACK statement. Updated Figure 10, Figure 11,

28-Apr-2008 2

Figure 12, Figure 13 and Figure 14. Reformatted to current

standards.

7/8

EMIF06-HMC01F2

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