EMIF06-1502M12
6-line IPAD™
low capacitance EMI filter and ESD protection in micro QFN package
Features
■ EMI asymmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Very low PCB space consuming:
2.5 mm x 1.5 mm
■ Very thin package: 0.6 mm max
■ High efficiency in ESD suppression on inputs
pins (IEC 61000-4-2 level 4)
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration and wafer level packaging
■ Lead-free package
Complies with following standards:
■ IEC 61000-4-2 level 4 input pins
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ MIL STD 883G - Method 3015-7 Class 3A
(all pins)
Applications
12
10
11
GND
9
8
7
1
2
3
4
5
6
Micro QFN 2.5 mm x 1.5 mm
(bottom view)
Figure 1. Pin configuration (top view)
1 Input Output 12
2 Input
3 Input
4 Input
5 Input
6 Input
Output 11
Output 10
Output 9
Output 8
Output 7
Where EMI filtering in ESD sensitive equipment is
required:
■ LCD and camera for mobile phones
■ Computers and printers
■ Communication systems
■ MCU boards
Description
Figure 2. Basic cell configuration
Input
Typical line capacitance = 14 pF @ 2.5 V
170 Ω
Output
EMIF06-1502M12 is a 6-line, highly integrated
device designed to suppress EMI/RFI noise in all
systems exposed to electromagnetic interference.
This filter includes ESD protection circuitry, which
prevents damage to the application when
subjected to ESD surges up to 15 kV on the input
pins.
February 2008 Rev 4 1/10
TM: IPAD is a trademark of STMicroelectronics
www.st.com
Characteristics EMIF06-1502M12
1 Characteristics
Table 1. Absolute ratings (limiting values at T
= 25 °C unless otherwise specified)
amb
Symbol Parameter Value Unit
ESD IEC 61000-4-2, air discharge on input pins
V
ESD IEC 61000-4-2, contact discharge on input pins
PP
ESD IEC 61000-4-2, contact discharge on output pins
Junction temperature 125 °C
T
j
T
T
Table 2. Electrical characteristics (T
Operating temperature range -40 to + 85 °C
op
Storage temperature range -55 to +150 °C
stg
Symbol Parameter
V
I
V
V
R
I
R
C
BR
RM
RM
CL
PP
I/O
line
Breakdown voltage
Leakage current @ V
RM
Stand-off voltage
Clamping voltage
Dynamic resistance
d
Peak pulse current
Series resistance between Input & Output
Input capacitance per line
amb
= 25 °C)
I
I
F
V
BR
V
V
RM
CL
I
RM
I
R
I
PP
15
8
4
V
F
V
Symbol Test conditions Min. Typ. Max. Unit
kV
V
BR
I
RM
R
I/O
C
line
IR = 1 mA 6 8 10 V
VRM = 3 V per line 100 nA
Tolerance ± 10% 153 170 187 Ω
V
= 2.5 V dc, V
LINE
= 30 mV, F = 1 MHz 12 14 16.5 pF
OSC
Figure 3. S21 attenuation measurement Figure 4. Analog cross talk measurements
dB
0.00
-15.00
-30.00
F (Hz)
-45.00
100.0k 1.0M 10.0M 100.0M 1.0G
2/10
dB
0.00
0.00
-10.00
-10.00
-20.00
-20.00
-30.00
-30.00
-40.00
-40.00
-50.00
-50.00
-60.00
-60.00
-70.00
-70.00
-80.00
-80.00
-90.00
-90.00
-100.00
-100.00
100.0k 1.0M 10.0M 100.0M 1.0G
100.0k 1.0M 10.0M 100.0M 1.0G
F (Hz)
EMIF06-1502M12 Ordering information scheme
Figure 5. ESD response to IEC 61000-4-2
V
in
V
out
(+15 kV air discharge) on one input
(V
) and on one output (V
in
)
out
C1 = 10 V/d
C2 = 5 V/d
100 ns/d
Figure 6. ESD response to IEC 61000-4-2
(- 15 kV air discharge) on one input
(Vin) and on one output (V
V
in
V
out
Figure 7. Line capacitance versus reverse voltage applied (typical value)
C
(pF)
LINE
24
22
20
18
16
14
12
10
8
6
4
2
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
V
(V)
LINE
)
out
C1 = 10 V/d
C2 = 5 V/d
100 ns/d
2 Ordering information scheme
Figure 8. Ordering information scheme
EMIF yy - xxx z Mx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
Package
Mx = Micro QFN x leads
3/10
Package information EMIF06-1502M12
3 Package information
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Table 3. QFN 2.5 x 1.5 package dimensions
®
D
N
E
112
Ref
Millimeters inches
MIN TYP MAX MIN TYP MAX
A 0.500.550.600.200.220.24
A1 0.00 0.02 0.05 0.00 0.01 0.02
A
A1
D2
2
E2
N
e
L
k
b
b 0.150.180.250.060.070.10
D 2.50 0.98
D2 1.70 1.80 1.90 0.67 0.71 0.75
E 1.50 0.59
E2 0.30 0.40 0.50 0.12 0.16 0.24
e 0.40 0.16
k 0.20 0.08
L 0.250.300.350.100.120.14
Figure 9. Footprint Figure 10. Marking
0.40
0.20
Dot: Pin 1
Identification
X = Marking
YWW= Data code
(Y=year
WW= week
0.40
0.60
0.25
2.10
Dimensions
XY
XY
1.80
4/10
ww
ww
EMIF06-1502M12 Package information
Figure 11. Tape and reel specification
1.75 +/- 0.1
4.00+/-0.1
2.0+/-0.05
2.0+/-0.05
8.1 +/- 0.1
8.1 +/- 0.1
2.70
2.70
ww
ww
XY
XYwwXY
4.00+/-0.1
XY
XYwwXY
ww
ww
f 1.5 +/- 0.1
f 1.5 +/- 0.1
XY
XYwwXY
ww
ww
1.75 +/- 0.1
3.5 +/- 0.05
3.5 +/- 0.05
0.75
0.75
1.70
1.70
User direction of unreeling
User direction of unreeling
4.00
4.00
Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin 1
mark is to be used for this purpose.
5/10
Recommendation on PCB assembly EMIF06-1502M12
4 Recommendation on PCB assembly
4.1 Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 12. Stencil opening dimensions
L
T
W
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
W
Aspect Ratio
Aspect Area
-----
1.5≥=
T
LW×
---------------------------2T L W+()
0.66≥=
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c) Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 13. Recommended stencil window position
5µm 5µm
15 µm
0.40
600 µm
570 µm
190 µm
400 µm
288 µm
15 µm
200 µm
1800 µm
300 µm
1224 µm
288 µm
50 µm
50 µm
0.40
1.80
Footprint
Stencil window
Footprint
0.20
0.60
0.25
2.10
6/10
EMIF06-1502M12 Recommendation on PCB assembly
4.2 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed
4. Solder paste with fine particles: powder particle size is 20-45 µm.
4.3 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering
3. Standard tolerance of ± 0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
4.4 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
7/10
Recommendation on PCB assembly EMIF06-1502M12
4.5 Reflow profile
Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
Temperature (°C)
260°C max
260°C max
255°C
255°C
220°C
220°C
180°C
180°C
125 °C
125 °C
3°C/s max
3°C/s max
0
0
012345 67
012345 67
10-30 sec
10-30 sec
90 to 150 sec
90 to 150 sec
90 sec max
90 sec max
2°C/s recommended
2°C/s recommended
6°C/s max
6°C/s max
Time (min)
Time (min)
Note: Minimize air convection currents in the reflow oven to avoid component movement.
8/10
EMIF06-1502M12 Ordering information
5 Ordering information
Table 4. Ordering information
Order code Marking Package Weight Base qty Delivery mode
EMIF06-1502M12 E
1. The marking can be rotated by 90° to differentiate assembly location
(1)
Micro QFN 6 mg 3000 Tape and reel (7”)
6 Revision history
Table 5. Document revision history
Date Revision Changes
12-Dec-2005 1 Initial release.
3-Jul-2006 2
1-Feb-2007 3 Added note on marking rotation in section 3. Package information.
04-Feb-2008 4
Reformatted to current standard. Changed Figure 1 to show
improved results.
Reformatted to current standards. Updated ECOPACK statement.
Updated Section 4: Recommendation on PCB assembly.
9/10
EMIF06-1502M12
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10/10
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