ST EMIF06-1002F2 User Manual

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6-line IPAD™, EMI filter and ESD protection

Features

■ Lead-free package

■ Very low PCB space consumption

1.92 mm x 1.79 mm

■ Very thin package: 0.65 mm

■ High efficiency in ESD suppression

(IEC 61000-4-2 level 4 on external pins)

■ High reliability offered by monolithic integration

■ High reduction of parasitic elements through

integration and wafer level packaging

Complies with the following standards

■ IEC 61000-4-2 level 4:

– 15 kV (air discharge) – 8 kV (contact discharge)

EMIF06-1002F2

Flip Chip

(14 bumps)

Figure 1. Pin configuration (bump side)

43 2 1

Application

This device is designed for EMI filtering in ESD sensitive equipment such as mobile phones.

Description

The EMIF06-1002F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF06-1002F2 Flip Chip packaging means the package size is equal to the die size.

This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV. This device includes 6 EMI filters.

TM: IPAD is a trademark of STMicroelectronics.

GND

Figure 2. Basic cell configuration

External pin

Internal pin

March 2010 Doc ID 14730 Rev 2 1/7

www.st.com

Electrical characteristics EMIF06-1002F2

1 Electrical characteristics

Table 1. Absolute maximum ratings

(1)

Symbol Parameter Value Unit

ESD discharge IEC 61000-4-2, level 4 on external pins (I1 to I6)

Air discharge

Contact discharge

Air discharge on internal pins (O1 to O6) Contact discharge on internal pins (O1 to O6)

Junction temperature range -30 to 125 °C

1. (Tamb = 25 °C)

Table 2. Electrical characteristics

Storage temperature range -55 to 150 °C

stg

Symbol Parameters

I/O

line

Breakdown voltage

Leakage current @ V

Stand-off voltage

Clamping voltage

Dynamic impedance

Peak pulse current

Series resistance between input and output

Input capacitance per line

(1)

VCL

VRMVBR

2 2

IRM IR

IPP

Symbol Test conditions Min Typ Max Unit

I/O

line

1. (Tamb = 25 °C)

IR = 1 mA 6 V

VRM = 3 V 200 nA

VR = 3 V DC, F = 1 MHz 9.2 11.5 13.8 pF

Cut-off frequency (Z

source

= Z

= 50 Ω) 280 MHz

load

2/7 Doc ID 14730 Rev 2

80 100 120 Ω

EMIF06-1002F2 Electrical characteristics

Figure 3. S21 attenuation measurements Figure 4. Analog crosstalk measurements

0.00

-5.00

-10.00

-15.00

-20.00

-25.00

-30.00

-35.00

-40.00

100.0k 1.0M 10.0M 100.0M 1.0G

I1 - O1 I2 - O2 I3 - O3 I4 - O4 I5 - O5 I6 - O6

F (Hz)

Figure 5. ESD response to IEC61000-4-2

(+ 15 kV air discharge) on one input (V

) and one output (V

out

)

Figure 6. ESD response to IEC61000-4-2

0.00

-10.00

-20.00

-30.00

-40.00

-50.00

-60.00

-70.00

-80.00

-90.00

-100.00

-110.00

-120.00

-130.00

-140.00

100.0k 1.0M 10.0M 100.0M 1.0G

I1 - O2 I1 - O6

(- 15 kV air discharge) on one input (Vin) and one output (V

F (Hz)

out

)

Figure 7. Line capacitance versus applied voltage for filter

C(pF)

0123 45

Doc ID 14730 Rev 2 3/7

V (V)

LINE

F=1MHz

osc

=30mV

Tj=25°C

RMS

Ordering information scheme EMIF06-1002F2

2 Ordering information scheme

Figure 8. Ordering information scheme

EMIF yy - xxx z Fx

EMI Filter

Number of lines

Information

x = resistance value (Ohms) z = capacitance value / 10(pF)

Package

F = Flip Chip x = 2: Lead-free, pitch = 500 µm, bump = 315 µm

4/7 Doc ID 14730 Rev 2

EMIF06-1002F2 Package information

3 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

packages, depending on their level of environmental compliance. ECOPACK®

is an ST trademark.

Figure 9. Package dimensions

500 µm ± 10

315 µm ± 50

500 µm ± 10

1.92 mm ± 50 µm

1.79 mm ± 50 µm

650 µm ± 65

Figure 10. Footprint Figure 11. Marking

Dot, ST logo xx = marking

Copper pad Diameter:

250 µm recommended , 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 300 µm copper pad diameter

z = manufacturing location yww = datecode

(y = year

ww = week)

Note: More packing information is available in the application notes:

AN1235: "Flip Chip: Package description and recommendations for use"

AN1751: “EMI filters: Recommendations and measurements”

x y

wxw

Doc ID 14730 Rev 2 5/7

Ordering information EMIF06-1002F2

xxz

yww

2.02

1.89

xxz

yww

xxz

yww

Figure 12. Flip Chip tape and reel specification

Dot identifying Pin A1 location

8 ± 0.3

4 ± 0.1

Ø 1.5 ± 0.1

1.75 ± 0.1

3.5 ± 0.1

0.73 ± 0.05

All dimensions in mm

4 Ordering information

Table 3. Ordering information

Order code Marking Package Weight Base qty Delivery mode

EMIF06-1002F2 JC Flip Chip 4.7 mg 5000 Tape and reel 7”

5 Revision history

xxz yww

xxz

yww

xxz

yww

4 ± 0.1

User direction of unreeling

Table 4. Document revision history

Date Revision Changes

21-May-2008 1 First issue.

29-Mar-2010 2 Upated Flip Chip tape and reel specification Figure 12.

6/7 Doc ID 14730 Rev 2

EMIF06-1002F2

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