ST EMIF04-EAR02M8 User Manual

4-line IPAD™ EMI filter and ESD protection for headset

Features

■ lead-free package

■ high attenuation: -30 dB at 900 MHz

■ low cut-off frequencies: 60 MHz for speaker

lines

■ high current capability: 50 mA per line

■ very low PCB space consumption:

1.5 mm x 1.7 mm

■ very thin package: 0.6 mm maximum

■ high efficiency in ESD suppression

IEC6 1000-4-2 level 4

■ high reliability offered by monolithic integration

Complies with following standards:

■ IEC 61000-4-2 level 4 all pins:

– 15 kV (air discharge)
– 8 kV (contact discharge)

EMIF04-EAR02M8

µQFN-8L

Figure 1. Pin configuration (bottom side)

MIC_P_Ext

MIC_N_Ext

EAR_Ext

EAR_Ext

GND

MIC_P_Int

MIC_N_Int

EAR_Int

EAR_Int

Application

■ mobile phones

Figure 2. Equivalent circuit

R

R

R

MIC

MIC

MIC

C

C

C

L_MIC

L_MIC

L_MIC

Description

The EMIF04-EAR02M8 chip is a highly integrated
device designed to suppress EMI/RFI noise for
mobile phone headsets. The new LC architecture
on the speaker lines provides a high attenuation
value maintaining a very low serial resistance.

The µQFN-8L package offers the possibility to
integrate the whole function in a very small PCB
space.

Additionally, this filter includes ESD protection
circuitry, which prevents damage to the protected
device when subjected to ESD surges up 30 kV.

TM: IPAD is a trademark of STMicroelectronics

September 2010 Doc ID 15508 Rev 2 1/12

C

C

C

R

R

R

L_MIC

L_MIC

L_MIC

L

L

L

C

C

C

L

L

L

C

C

C

MIC

MIC

MIC

EAR

EAR

EAR

L_EAR

L_EAR

L_EAR

EAR

EAR

EAR

L_EAR

L_EAR

L_EAR

www.st.com

12

Characteristics EMIF04-EAR02M8

1 Characteristics

Table 1. Absolute maximum ratings (T

Symbol Parameter Value Unit

ESD IEC 61000-4-2

V

PP

air discharge
contact discharge

I

T

Maximum rms current per channel 50 mA

EAR

Operating junction temperature -30 to 125 °C

T

j

Storage temperature range -55 to +150 °C

stg

Figure 3. Electrical symbols and parameters

amb

= 25 °C)

30
30

kV

Breakdown voltage

V

BR

V

Stand-off voltage

RM

Leakage current @ V

I

RM

V

V

BR

RM

Table 2. Electrical characteristics (T

amb

I

RM

I

RM

I

RM

= 25 °C)

V

V

V

RM

BR

Symbol Test conditions Min. Typ. Max. Unit

V

BRIR

I

RM

L

EAR

R

L

R

MIC

C

L_EARVR

C

L_MICVR

F

c_EAR

F

c_MIC

= 1 mA 7 V

VRM = 3 V 100 nA

1.5 nH

Parasitic resistance of inductor L

EAR

0.30 0.6 Ω

54 68 82 Ω

= 0 V DC, 1 MHz 84 105 126 pF

= 0 V DC, 1 MHz 60 76 92 pF

Cut-off frequency earphone line:
Z

SOURCE

= Z

LOAD

= 50 Ω

Cut-off frequency microphone line:
Z

SOURCE

= Z

LOAD

= 50 Ω

60 MHz

70 MHz

2/12 Doc ID 15508 Rev 2

EMIF04-EAR02M8 Characteristics

Figure 4. S21 attenuation measurement Figure 5. Analog cross talk measurements

dB

0

-5

-10

-15

-20

-25

-30

-35

-40

-45

-50

MIC_N
MIC_P
EAR_R
EAR_L

F (Hz)

100k 1M 10M 100M 1G

Figure 6. ESD response to IEC 61000-4-2

(+15 kV air discharge) on one MIC
input (V

IN

) and on one MIC output

in

5.00 V/div

dB

0

-10

-20

-30

-40

-50

-60

-70
100k 1M 10M 100M 1G

MIC_N - MIC_P

EAR_L - MIC_P

F (Hz)

Figure 7. ESD response to IEC 61000-4-2

(-15 kV air discharge) on one MIC
input (Vin) and on one MIC output

5.00 V/div

IN

OUT

100 ns/div

5.00 V/div

Figure 8. ESD response to IEC 61000-4-2

(+15 kV air discharge) on one EAR
input (V

IN

OUT

) and on one EAR output

in

5.00 V/div

5.00 V/div

100 ns/div

5.00 V/div

OUT

100 ns/div

Figure 9. ESD response to IEC 61000-4-2

(-15 kV air discharge) on one EAR
input (Vin) and on one EAR output

5.00 V/div

IN

5.00 V/div

OUT

100 ns/div

Doc ID 15508 Rev 2 3/12

Characteristics EMIF04-EAR02M8

Figure 10. Relative line capacitance variation

versus applied voltage

C/C0

1.0

MIC lines

EAR lines

0.8

V (V)

0.6
0

1

2

3

R

4

Figure 12. Total harmonic distortion with

noise: MIC lines, R = 32 Ω

THD + N (dB)

0

-50

Figure 11. Total harmonic distortion with

noise: MIC lines, R = 10 kΩ

THD + N (dB)

0

-50

-100

5

100

1 k

Figure 13. Total harmonic distortion with

noise: EAR lines, R = 32 Ω

THD + N (dB)

0

-50

F (Hz)

10 k

-100

100

F (Hz)

1 k

10 k

-100

100

Figure 14. Total harmonic distortion with noise: EAR lines, R = 8 Ω

THD + N (dB)

0

-50

-100

100

1 k

F (Hz)

10 k

1 k

F (Hz)

10 k

4/12 Doc ID 15508 Rev 2

EMIF04-EAR02M8 Application information

2 Application information

Figure 15. Example of application scheme using EMIF04-EAR02M8

VDDV

VDDV

DD

DD

MIC_P_Int

MIC_N_Int

MIC_P

MIC_N

MIC_P

MIC_P

MIC_N

MIC_N

MIC_P_Ext

MIC_N_Ext

EMIF04-EAR02M8

EMIF04-EAR02M8

EAR_R

EAR_R

EAR_L

EAR_L

Cable

Cable

Headset

Headset

connector

connector

EAR_Ext

EAR_Ext

3 Ordering information scheme

Figure 16. Ordering information scheme

EMIF yy - xxxzz M8

EMI filter

Number of lines

Information

xxx = application
zz = version

GND

EAR_Int

EAR_Int

EAR_R

EAR_L

Audio sub-system

Audio sub-system

Package

M8 = µQFN-8L

Doc ID 15508 Rev 2 5/12

Package information EMIF04-EAR02M8

k

4 Package information

● Epoxy meets UL94, V0

● Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK

Table 3. µQFN-8L dimensions

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

.

Dimensions

D

N

E

2

1

Ref.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 0.50 0.55 0.60 0.020 0.022 0.024

A1 0.00 0.02 0.05 0.000 0.001 0.002

b 0.15 0.18 0.25 0.006 0.007 0.001

A

A1

E2

D2

1

2

L

D 1.65 1.70 1.75 0.067

D2 1.15 1.3 1.4 0.045 0.051 0.055

E 1.45 1.50 1.55 0.059

E2 0.05 0.20 0.30 0.002 0.008 0.012

e 0.40 0.016

N

b

k 0.20 0.008

e

L 0.25 0.30 0.35 0.010 0.012 0.014

Figure 17. Footprint Figure 18. Marking

0.40

0.26

1.32

0.20

0.60

0.32

2.10

6/12 Doc ID 15508 Rev 2

Dot: Pin1 identication
XX = Marking

XX

EMIF04-EAR02M8 Package information

Figure 19. Tape and reel specification

Ø 1.55 ± 0.05

1.75 ± 0.1

0.25 ± 0.05

2.0 ± 0.05

4.0 ± 0.1

0.70 ± 0.05

All dimensions in mm

8.0 ± 0.3

1.95 ± 0.1

KA KA KA

1.75 ± 0.1

User direction of unreeling

4.0 ± 0.1

3.5 ±- 0.1

Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no

case should this product marking be used to orient the component for its placement on a
PCB. Only pin 1 mark is to be used for this purpose.

Doc ID 15508 Rev 2 7/12

Recommendation on PCB assembly EMIF04-EAR02M8

5 Recommendation on PCB assembly

5.1 Stencil opening design

1. General recommendation on stencil opening design

a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 20. Stencil opening dimensions

L

T

W

b) General design rule

Stencil thickness (T) = 75 ~ 125 µm

W

Aspect Ratio

Aspect Area

-----

1.5≥=

T

LW×

---------------------------­2T L W+()

0.66≥=

2. Reference design

a) Stencil opening thickness: 100 µm

b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.

c) Stencil opening for leads: Opening to footprint ratio is 90%.

Figure 21. Recommended stencil window position

5 µm 5 µm

15 µm

T=100 µm

600 µm

570 µm

260 µm

120 µm

190 µm

200 µm

1320 µm

160 µm

1080 µm

15 µm

120 µm

50 µm

50 µm

Footprint

Stencil window

Footprint

8/12 Doc ID 15508 Rev 2

EMIF04-EAR02M8 Recommendation on PCB assembly

5.2 Solder paste

1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2. “No clean” solder paste is recommended.

3. Offers a high tack force to resist component movement during high speed

4. Solder paste with fine particles: powder particle size is 20-45 µm.

5.3 Placement

1. Manual positioning is not recommended.

2. It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering

3. Standard tolerance of ±0.05 mm is recommended.

4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.

5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.

6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.

5.4 PCB design preference

1. To control the solder paste amount, the closed via is recommended instead of open
vias.

2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.

Doc ID 15508 Rev 2 9/12

Recommendation on PCB assembly EMIF04-EAR02M8

5.5 Reflow profile

Figure 22. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Temperature (°C)

Temperature (°C)

260°C max

260°C max

255°C

255°C

220°C

220°C

180°C

180°C

125 °C

125 °C

3°C/s max

3°C/s max

0

0

012345 67

012345 67

10-30 sec

10-30 sec

90 to 150 sec

90 to 150 sec

90 sec max

90 sec max

2°C/s recommended

2°C/s recommended

6°C/s max

6°C/s max

Time (min)

Time (min)

Note: Minimize air convection currents in the reflow oven to avoid component movement.

10/12 Doc ID 15508 Rev 2

EMIF04-EAR02M8 Ordering information

6 Ordering information

Table 4. Ordering information

Order code Marking Package Weight Base qty Delivery mode

EMIF04-EAR02M8 KA

1. The marking can be rotated by multiples of 90° to differentiate assembly location.

(1)

µQFN-8L 3.8 mg 3000 Tape and reel

For the latest information on available order codes see the product pages on www.st.com.

7 Revision history

Table 5. Document revision history

Date Revision Changes

24-Mar-2009 1 Initial release

02-Sep-2010 2

Changed “input pins” to “all pins” in standards compliance section.
Updated Figure 16. Added paragraph in Section 6: Ordering information.

Doc ID 15508 Rev 2 11/12

EMIF04-EAR02M8

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12/12 Doc ID 15508 Rev 2