3-line IPAD™ EMI filter including ESD protection
Features
■ EMI symmetrical (I/O) low-pass filter
■ high efficiency in EMI filtering
■ lead-free coated package
■ very low PCB space occupation:
– 1.42 mm x 1.42 mm
■ very thin package: 0.65 mm
■ high efficiency in ESD suppression
■ high reliability offered by monolithic integration
■ high reduction of parasitic elements through
integration and wafer level packaging
Complies with following standards:
EMIF03-SIM02C2
Coated Flip-Chip package
(8 bumps)
■ IEC 61000-4-2 level 4 on external and V
CC
pins:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ MIL STD 883G - Method 3015-7 Class 3
Applications
Where EMI filtering in ESD sensitive equipment is
required:
■ SIM Interface (subscriber identify module)
■ UIM Interface (universal identify module)
Description
The EMIF03-SIM02C2 is a highly integrated
device designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The EMIF03 Flip-Chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry
which protects the application from damage when
subjected to ESD surges up 15 kV.
TM: IPAD is a trademark of STMicroelectronics
Figure 1. Pin configuration (bump side)
123
RST
RST
in
CLK
in
Data
in
ext
Gnd
V
CC
CLK
ext
Data
ext
A
B
C
September 2010 Doc ID 13251 Rev 3 1/8
www.st.com
8
Characteristics EMIF03-SIM02C2
1 Characteristics
Figure 2. Basic cell configuration
V
CC
RST in RST ext
CLK in
Data in
Table 1. Absolute ratings (limiting values)
Symbol Parameter Value Unit
Internal pins (A3, B3, C3):
ESD discharge IEC61000-4-2, air discharge
V
PP
ESD discharge IEC61000-4-2, contact discharge
External pins (A2, B1, C2, C1):
ESD discharge IEC61000-4-2, air discharge
ESD discharge IEC61000-4-2, contact discharge
T
Maximum junction temperature 125 °C
j
100 Ω
R1
47 Ω
R2
100 Ω
R3
GND
CLK ext
Data ext
Cline = 20pF max.
2
2
15
8
kV
T
op
T
stg
Operating temperature range -40 to +85 °C
Storage temperature range -55 to +150 °C
Figure 3. Electrical characteristics (definitions)
Symbol Parameter
V = Breakdown voltage
BR
V = Clamping voltage
CL
I = Leakage current @ V
RM RM
V = Stand-off voltage
RM
I = Forward current
F
I = Peak pulse current
PP
I = Breakdown current
R
V = Forward voltage drop
F
I
I
F
V
V
V
V
CL
RM
BR
F
I
RM
I
R
I
PP
V
2/8 Doc ID 13251 Rev 3
EMIF03-SIM02C2 Characteristics
Table 2. Electrical characteristics, parameter values
Symbol Test conditions Min Typ Max Unit
V
BR
I
RM
R
d
R
, R
1
R
2
C
line
IR = 1 mA 6 20 V
VRM = 3 V 0.2 µA
Tolerance ± 20% 100
3
Tolerance ± 20% 47
VR = 0 V 20 pF
Figure 4. S21 (dB) attenuation measurement
(A2-A3 line)
EMIF03-SIM02C2_FREQ-MEAS_PM428
0.00
dB
-10.00
-20.00
-30.00
-40.00
100.0k 1.0M 10.0M 100.0M 1.0G
Aplac 7.70 User: ST Microelectronics Sep 22 2004
A2/A3 Line
f/Hz
Figure 6. S21 (dB) attenuation measurement
(C1-C3 line)
EMIF03-SIM02C2_FREQ-MEAS_PM428
0.00
dB
-10.00
-20.00
-30.00
-40.00
100.0k 1.0M 10.0M 100.0M 1.0G
Aplac 7.70 User: ST Microelectronics Sep 22 2004
C1/C3 line
f/Hz
1.5 Ω
Figure 5. S21 (dB) attenuation measurement
(B1-B3 line)
EMIF03-SIM02C2_FREQ-MEAS_PM428
0.00
dB
-10.00
-20.00
-30.00
-40.00
100.0k 1.0M 10.0M 100.0M 1.0G
Aplac 7.70 User: ST Microelectronics Sep 22 2004
B1/B3 line
f/Hz
Figure 7. Analog crosstalk measurements
EMIF03-SIM02C2_FREQ-MEAS_PM428
0.00
dB
-10.00
-20.00
-30.00
-40.00
-50.00
-60.00
-70.00
-80.00
-90.00
-100.00
100.0k 1.0M 10.0M 100.0M 1.0G
Aplac 7.70 User: ST Microelectronics Sep 22 2004
Xtalk A2/B3
f/Hz
Doc ID 13251 Rev 3 3/8
Characteristics EMIF03-SIM02C2
Figure 8. Voltages when IEC 61000-4-2
(+15 kV air discharge) applied to
external pin
Figure 9. Voltages when IEC 61000-4-2
(-15 kV air discharge) applied to
external pin
Vexternal : 10V/d
Vinternal : 10V/d
100ns/d
Figure 10. Line capacitance versus reverse applied voltage (typical)
C(pF)
20.00
16.00
12.00
8.00
Vexternal : 5V/d
Vinternal
: 5V/d
100ns/d
Figure 11. Aplac model
a2
b3
c1
Por t1
50
4.00
0.00
LbumpRbump
RsubCbump
Lbump Rbump
RsubCbump
LbumpRbump
Rsub
Cbump
Ls 100m
VR(V)
012345
100
bulk
bulk
bulk
Dext1
0.25
a2
Dext2
0.28
Cgnd
Dext1
0.25
47
100
Bulk
Dint1
Lbump
Rbump
Lgnd
Rgnd
Dint1
Dint2
0.29 0.31
bulk
bulk
bulk
0.29
a3
LbumpRbump
Rsub Cbump
LbumpRbump
Rsub Cbump
LbumpRbump
Rsub Cbump
100m Ls
a3
b1
c3
Por t2
50
4/8 Doc ID 13251 Rev 3
EMIF03-SIM02C2 Ordering information scheme
Figure 12. Aplac parameters
Ls 950pH
Rs 150m
Cext1 15pF
Cint1 4.5pF
Cext2 14pF
Cint2 4pF
Rbump 20m
Lbump 50pH
Cbump 0.15pF
Rgnd 500m
Lgnd 50pH
Cgnd 0.15pF
Rsub 100m
Model Dint1
BV=15
CJO=Cint1
IBV=1u
IKF=1000
IS=10f
ISR=100p
N=1
M=0.3333
RS=0.001m
VJ=0.6
TT=50n
Model Dext1
BV=15
CJO=Cext1
IBV=1u
IKF=1000
IS=10f
ISR=100p
N=1
M=0.3333
RS=0.001m
VJ=0.6
TT=50n
Model Dint2
BV=15
CJO=Cint2
IBV=1u
IKF=1000
IS=10f
ISR=100p
N=1
M=0.3333
RS=0.001m
VJ=0.6
TT=50n
Model Dext2
BV=15
CJO=Cext2
IBV=1u
IKF=1000
IS=10f
ISR=100p
N=1
M=0.3333
RS=0.001m
VJ=0.6
TT=50n
2 Ordering information scheme
Figure 13. Ordering information scheme
EMIF yy - xxx zz Cx
EMI filter
Number of lines
Information
3 letters = application
2 digits = version
Package
C = Coated Flip Chip
x = 2: lead-free, pitch = 500 µm, bump = 315 µm
Doc ID 13251 Rev 3 5/8
Package information EMIF03-SIM02C2
3 Package information
● Epoxy meets UL94, V0
● Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Figure 14. Flip-Chip dimensions
500µm ± 50
315µm ± 50
500µm ± 50
1.42mm ± 50µm
1.42mm ± 50µm
695µm ± 65
Figure 15. Marking Figure 16. Footprint recommendation
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing location
yww = datecode
(y = year
Copper pad Diameter:
250 µm recommended, 300 µm max
xyxwz
w
6/8 Doc ID 13251 Rev 3
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 315 µm copper pad diameter
EMIF03-SIM02C2 Ordering information
Figure 17. Flip-Chip tape and reel specification
Dot identifying Pin A1 location
8 +/- 0.3
yww
xxz
ST
E
4 +/- 0.1
yww
xxz
ST
E
Ø 1.5 +/- 0.1
yww
xxz
ST
E
1.75 +/- 0.1 3.5 +/- 0.1
0.78 +/- 0.05
All dimensions in mm
4 Ordering information
Table 3. Ordering information
Ordering code Marking Package Weight Base qty Delivery mode
EMIF03-SIM02C2 GR Flip Chip 3.04 mg 5000 7” Tape and reel
5 Revision history
Table 4. Document revision history
Date Revision Changes
4 +/- 0.1
User direction of unreeling
07-Feb-2007 1 Initial release.
21-Mar-2007 2 Updated weight in Ordering information.
02-Sep-2010 3 Updated marking in Ta b l e 3 .
Doc ID 13251 Rev 3 7/8
EMIF03-SIM02C2
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8/8 Doc ID 13251 Rev 3
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