IPAD™
2 line EMF filter including ESD protection
Main application
When EMI filtering is ESD sensitive equipment is
required:
■ Mobile phones and communication systems
■ Computers, printers and MCU boards
Description
The EMIF02-USB05F2 is a highly integrated array
designed to suppress EMI / RFI noise for USB
port filtering. The EMIF02-USB05F2 Flip-Chip
packaging means the package size is equal to the
die size.
Additionally, this low-pass filter includes an ESD
protection circuitry to prevent damage to the
application when subjected to ESD surges up
to 15 kV.
This device is designed to be fully compatible with
USB standards.
EMIF02-USB05F2
Flip-Chip
(8 Bumps)
Pin configuration (bump side)
12
V
IO4
CC
A
O2 I2
O1 I1
IO3
GND
B
C
D
Benefits
■ 2 x EMI low-pass filter + 2 line ESD protection
■ 1.5 kΩ pull-up included
■ High efficiency in EMI filtering
■ Lead free package
■ Very low PCB space consumption:
1.92 mm x 0.92 mm
■ Very thin package: 0.65 mm
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
■ USB full speed (12 Mbps), OTG compliant
Complies with following standards:
IEC 61000-4-2
level 4
MIL STD 883G - Method 3015-7 Class 3
November 2006 Rev 2 1/7
15 kV (air discharge)
8 kV (contact discharge)
Functional diagram
IO4
IO3
Input 2
GND
Input 1
V
CC
R3
R1
Output2
R2
Output 1
Order code
Part Number Marking
EMIF02-USB05F2 GV
TM: IPAD is a trademark of STMicroelectronics
www.st.com
7
Characteristics EMIF02-USB05F2
1 Characteristics
Table 1. Absolute ratings (limiting values)
Symbol Parameter and test conditions Value Unit
Maximum junction temperature 125 ° C
T
j
T
T
Table 2. Electrical characteristics (Tamb = 25° C)
Operating temperature range - 40 to + 85 ° C
op
Storage temperature range - 55 to + 150 ° C
stg
Symbol Parameter
V
I
RM
V
C
Breakdown voltage
BR
Leakage current @ V
Stand-off voltage
RM
Input capacitance per line
line
RM
BR
I
I
R
I
RM
VRMV
I
RM
V
I
R
BRVRM
Symbol Test conditions Tolerance Min. Typ. Max. Unit
V
BR
I
RM
R
, R
1
2
R
3
C
line
IR = 1 mA 6 9 V
VRM = 5 V per line 1 µA
I = 10 mA ± 5% 33 Ω
I = 1 mA ± 5% 1.5 kΩ
@ 0 V 30 pF
Matching Serial resistance matching 1 %
V
2/7
EMIF02-USB05F2 Characteristics
Figure 1. S21 (dB) attenuation measurement Figure 2. Analog crosstalk measurements
dB
0.00
-10.00
-
-
-
-20.00
-
-
-
-30.00
-
-
-
-40.00
-
-
-
100.0k 1.0M 10.0M 100.0M 1.0G
F (Hz)
Figure 3. ESD response to IEC 61000-4-2
(+15 kV air discharge) on one input
(Vin) and on one output (Vout)
V(in)
5V/d
Figure 4. ESD response to IEC 61000-4-2
V(in)
5V/d
dB
0.00
-10.00
-
-20.00
-
-30.00
-
-40.00
-
-50.00
-
-60.00
-
-70.00
-80.00
-90.00
-100.00
-
100.0k 1.0M 10.0M 100.0M 1.0G
F (Hz)
(-15 kV air discharge) on one input
(Vin) and on one output (Vout)
V(out)
5V/d
100 ns/d
Figure 5. Junction capacitance versus
reverse voltage applied
C (pF)
LINE
35
Vosc=30mV
30
25
20
15
10
5
0
0123 45
V (V)
LINE
Vosc = 30 mV
F=1MHz
F = 1 MHz
Tamb = 25
Ta=25°C
V(out)
5V/d
100 ns/d
°C
3/7
Ordering information scheme EMIF02-USB05F2
Figure 6. Aplac model device structure
Lbump
Rbump
A1
A2
D2
bulk
Rbump
B1
C1
Lbump
=D1
MODEL
bulk
Rbump Rbump
Lbump Lbump
=D1
MODEL MODEL
R2
bulk
R1
MODEL
bulk
bulk
R3
=D1
Lbump
MODEL
bulk
=D1
Figure 7. Aplac model parameters
aplacvar R1 33
aplacvar R2 33
aplacvar R3 1.5k
aplacvar Cz_D1 15pF
aplacvar Rs_D1 1
aplacvar Cz_D2 300pF
aplacvar Rs_D2 0.3
aplacvar Lgnd 100pH
aplacvar Rgnd 100m
aplacvar Cgnd 0.4pF
aplacvar Lbump 50pH
aplacvar Rbump 20m
Rbump
=D1
B2
Rbump Rbump
Lbump Lbump
=D1
MODEL MODEL
C2
Diode D1
BV=7
IBV=1m
CJO=Cz_d1
M=0.3333
RS=Rs_d1
VJ=0.6
TT=100n
bulk bulk
Diode D2
BV=7
IBV=1m
CJO=Cz_d2
M=0.3333
RS=Rs_d2
VJ=0.6
TT=100n
=D1
Cgnd
MODEL
D1
Lbump
Rbump
Lgnd
Rgn d
=D2
2 Ordering information scheme
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 2: Leadfree Pitch = 500 µm, Bump = 315 µm
4/7
EMIF02-USB05F2 Package information
3 Package information
Figure 8. Flip-Chip package dimensions
500 µm ± 10
500 µm ± 10
0.92 mm ± 50 µm
315 µm ± 50
1.92 mm ± 50 µm
650 µm ± 65
Figure 9. Foot print recomendations Figure 10. Marking
Dot, ST logo
xx = marking
z = manufacturing location
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 315 µm copper pad diameter
yww = datecode
(y = year
ww = week)
E
xyxwz
w
Figure 11. Flip-Chip tape and reel specification
Dot identifying Pin A1 location
4 +/- 0.1
8 +/- 0.3
ST
0.73 +/- 0.05
All dimensions in mm
yww
xxx
E
5/7
yww
xxx
User direction of unreeling
ST
E
4 +/- 0.1
Ø 1.5 +/- 0.1
ST
yww
xxx
E
1.75 +/- 0.1 3.5 +/- 0.1
Ordering information EMIF02-USB05F2
Note: More packing information is available in the application notes
AN1235: “Flip-Chip: Package description and recommendations for use”
AN1751: “EMI Filters: Recommendations and measurements”
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
4 Ordering information
Ordering code Marking Package Weight Base qty Delivery mode
EMIF02-USB05F2 GV Flip-Chip 2.7 mg 5000 Tape and reel 7”
5 Revision history
Date Revision Changes
14-Mar-2005 1 Initial release.
13-Nov-2006 2
Reformatted to current standards. Modified functional diagram on
page 1 to show connections. Updated Aplac model information.
6/7
EMIF02-USB05F2
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
7/7
Loading...