ST EMIF02-USB03F2 User Manual

2-line IPAD™, EMI filter including ESD protection
Features
2-line, low-pass filter + 2-line ESD protection
High efficiency in EMI filtering
Lead-free package
Very thin package: 0.65 mm
High efficiency in ESD suppression
(IEC 61000-4-2 level 4)
High reliability offered by monolithic integration
High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
IEC 61000-4-2 level 4 on external pins:
– 15 kV (air discharge) – 8 kV (contact discharge)
IEC 61000-4-2 level 1 on internal pins:
– 2 kV (air discharge) – 2 kV (contact discharge)
Application
ESD protection and EMI filtering for:
USB OTG port
Description
The EMIF02-USB03F2 is a highly integrated array designed to suppress EMI / RFI noise for USB OTG (on-the-go) ports.
2
EMIF02-USB03F2
Flip Chip
(11 bumps)

Figure 1. Pin layout (bump side)

3
2
1
Dz
ID
Pup
Vbus
D+
Pd2
out
D-
GND
out

Figure 2. Schematic

EMIF02-USB03F2
D+OUT D+IN
D-OUT
Pd2
Pd1
Pup Dz ID Vbus
R3=1.3kΩ
R2=33Ω
R1=33Ω
R5=15kΩ R4=17kΩ
C
= 20 pF max.
LINE
Pd1
D+
in
D-
in
A
B
C
D
D-IN
The EMIF02-USB03F2 Flip-Chip packaging means the package size is equal to the die size.
Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV on external contacts.
TM: IPAD is a trademark of STMicroelectronics.
February 2010 Doc ID 10740 Rev 5 1/8
www.st.com
8
Characteristics EMIF02-USB03F2

1 Characteristics

Table 1. Absolute ratings (T
Symbol Parameter and test conditions Value Unit
Internal pins (D3, C3, C2, B2, B1):
ESD discharge IEC61000-4-2, air discharge
V
ESD discharge IEC61000-4-2, contact discharge
PP
External pins (D1, C1, A2, A3, B3):
ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge
amb
= 25 °C)
15
2 2
kV
8
T
T
T
Table 2. Electrical characteristics (T
Maximum junction temperature 125 °C
j
Operating temperature range -40 to +85 °C
op
Storage temperature range -55 to 150 °C
stg
= 25 °C)
amb
Symbol Parameters
C
V
I
RM
V
V
R
I
PP
LINE
BR
RM
CL
Breakdown voltage
Leakage current @ V
RM
Stand-off voltage
Clamping voltage
Dynamic impedance
d
Peak pulse current
Input capacitance per line
Symbol Test conditions Min Typ Max Unit
C
V
I
RM
LINE
BR
IR = 1 mA 14 V
VRM = 3 V 0.2 µA
V
= 0 V, V
LINE
measured in zero light condition
= 30 mV, F = 1 MHz,
OSC
20 pF
, R
R
1
R
R
R
Tolerance ± 5 % 33 Ω
2
Tolerance ± 5 % 1.30 kΩ
3
Tolerance ± 5 % 17 kΩ
4
Tolerance ± 5 % 15 kΩ
5
2/8 Doc ID 10740 Rev 5
EMIF02-USB03F2 Characteristics
Figure 3. Filtering measurement Figure 4. Analog crosstalk measurement
dB
0
-1 0
-2 0
-3 0
F (Hz)
-4 0 100k 1M 10M 100M 1G
D+In D+Out
D-In D-Out
Figure 5. ESD response to IEC 61000-4-2
(+15 kV air discharge) on one input V
and on one output V
in
20.0 V / Div. VCL= 74 V
IN
10.0 V / Div. VCL= 27 V
OUT
out
100 ns / Div.
100 ns / Div.
Figure 6. ESD response to IEC 61000-4-2
10.0 V / Div.
10.0 V / Div.
dB
0
-1 0
-2 0
-3 0
-4 0
-5 0
-6 0
-7 0
-8 0
-9 0
-100
-110
-120
-130 100k 1M 10M 100M 1G
D-In D+Out
F (Hz)
DZ ID
(-15 kV air discharge) on one input V
and on one output V
in
IN
VCL= -47 V
OUT
VCL= -23 V
out
100 ns / Div.
100 ns / Div.

Figure 7. Junction capacitance versus reverse voltage applied (typical values)

C(pF)
20
18
16
14
12
10
8
6
4
2
0
0123456789101112
Doc ID 10740 Rev 5 3/8
V
LINE
(V)
Application information EMIF02-USB03F2

2 Application information

Figure 8. Application schematic

Vbus
3.3V
USB OTG Xceiver

Figure 9. Aplac model

RsLs Rs Ls
Por t1
Por t1
50
50
C3
C3
RsLs Rs Ls
MODEL = D02_usb03
MODEL = D02_usb03
bulk
bulk
RsubumpCbump
RsubumpCbump RsubumpCbump
RsubumpCbump
RsubumpCbump RsubumpCbump
RsubumpCbump
RsubumpCbump RsubumpCbump
RsubumpCbump
RsubumpCbump RsubumpCbump
RsubumpCbump
RsubumpCbump RsubumpCbump
ID
EMIF02-USB03F2
D+OUT D+IN
D+
D-OUT
D-
GND GND
Pd2
Pd1
C3
C3
Rbump
Rbump
Lbump
Lbump
A3
A2
B3
B2
B3
B2
bulk
bulk
bulk
bulk
B1
B1
R_17k
R_17k
D3
C1
D3
C1
C1
C1
D1
D1
A3
A3
R_33R
R_33R
A3
R_1k3
R_1k3
bulkA2
bulkA2
bulkB2
bulkB2
bulkC2
bulkC2
bulkC3
bulkC3
bulkB3
bulkB3
A2
MODEL = D02_usb03
MODEL = D02_usb03
bulk
bulk
B2
B2
bulk
bulk
Pup Dz ID Vbus
R3=1.3kΩ
R2=33Ω
R1=33Ω
R5=15kΩ R4=17kΩ
R1 = R2 = 33 Ω
Cline = 20 pF max.
C1
C1
B1
B1
bulk
bulk
LbumpRbump
LbumpRbump
C2
C2
bulkbulk
bulk
bulkbulk
bulk
R_33R
R_33R
MODEL = D02_usb03
MODEL = D02_usb03
RsubumpCbump
RsubumpCbump RsubumpCbump
bulkB1
bulkB1
RsubumpCbump
RsubumpCbump RsubumpCbump
bulk
bulk
RsubumpCbump
RsubumpCbump RsubumpCbump
bulkD3
bulkD3
RsubumpCbump
RsubumpCbump RsubumpCbump
bulk
bulk
RsubumpCbump
RsubumpCbump RsubumpCbump
bulk
bulk
D2
D2
MODEL = D02_usb03_gnd
MODEL = D02_usb03_gnd
bulk
bulk
C2
C2
R_15k
R_15k
D1
D1
bulk
bulk
Por t2
Por t2
50
50
D-IN
Cgnd
Cgnd
Vbus
ID
D+
D-
USB OTG connector
D2
D2
D2
Lbump
Lbump
Lbump
Rbump
Rbump
Rbump
Lgnd
Lgnd
Lgnd
Rgnd
Rgnd
Rgnd

Figure 10. Aplac parameters

Ls 950pH Rs 150m R_33R 33 R_1k3 1.3k R_15k 15k R_17k 17k Cz_usb03 11pF Rs_usb03 1 Cz_usb03_gnd 220pF
4/8 Doc ID 10740 Rev 5
Rs_usb03_gnd 0.9 Lgnd 50pH Rgnd 100m Cgnd 0.15pF Lbump 50pH Rbump 20m Cbump 2.4pF Rsubump 100m
EMIF02-USB03F2 Ordering information scheme

3 Ordering information scheme

Figure 11. Ordering information scheme

EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (ohm) z = capacitance value / 10 (pF) or 3 letters = application 2 digits = version
Package
F = Flip Chip x = 2: lead-free, pitch = 500 µm, bump = 315 µm

4 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Figure 12. Package dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
500 µm
500 µm
220 µm
1.44 mm ± 30 µm
315 µm ± 50
.
650 µm ± 65
1.94 mm ± 30 µm
220 µm
Doc ID 10740 Rev 5 5/8
Ordering information EMIF02-USB03F2

Figure 13. Footprint Figure 14. Marking

Dot, ST logo
Copper pad Diameter:
250 µm recommended, 300 µm max.
Solder stencil opening:
330 µm recommended
Solder mask opening recommendation:
340 µm min. for 300 µm copper pad diameter
ECOPACK status xx = marking z = manufacturing location yww = datecode
(y = year
ww = week)

Figure 15. Flip Chip tape and reel specification

Dot identifying Pin A1 location
4 ± 0.1
8 ± 0.3
ST
yww
xxz
E
2.04
yww
ST
xxz
E
1.58
xyxwz
Ø 1.5 ± 0.1
ST
yww
xxz
E
w
1.75 ± 0.1 3.5 ± 0.1
0.73 ± 0.05
All dimensions in mm
User direction of unreeling
Note: More information is available in the application notes:
AN1235:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”

5 Ordering information

Table 3. Ordering information

Order code Marking Package Weight Base qty Delivery mode
EMIF02-USB03F2 FU Flip Chip 4 mg 5000 Tape and reel 7”
4 ± 0.1
6/8 Doc ID 10740 Rev 5
EMIF02-USB03F2 Revision history

6 Revision history

Table 4. Document revision history

Date Revision Changes
14-Oct-2004 1 Initial release.
25-Oct-2004 2 Figure 14.: Flip Chip marking dimensions updated.
3
27-Oct-2004
28-Apr-2008 4
08-Feb-2010 5
Minor layout update. No content change.
Updated ECOPACK statement. Updated Figure 11, Figure 12, Figure 13,
Figure 14 and Figure 15. Reformatted to current standards.
Updated the maximum value of I
in Ta bl e 2 . Updated Figure 12 and
RM
Figure 15 for die dimension reductions.
Doc ID 10740 Rev 5 7/8
EMIF02-USB03F2
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8/8 Doc ID 10740 Rev 5
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