The EMIF02-USB03F2 is a highly integrated array
designed to suppress EMI / RFI noise for USB
OTG (on-the-go) ports.
2
EMIF02-USB03F2
Flip Chip
(11 bumps)
Figure 1.Pin layout (bump side)
3
2
1
Dz
ID
Pup
Vbus
D+
Pd2
out
D-
GND
out
Figure 2.Schematic
EMIF02-USB03F2
D+OUTD+IN
D-OUT
Pd2
Pd1
PupDz ID Vbus
R3=1.3kΩ
R2=33Ω
R1=33Ω
R5=15kΩR4=17kΩ
C
= 20 pF max.
LINE
Pd1
D+
in
D-
in
A
B
C
D
D-IN
The EMIF02-USB03F2 Flip-Chip packaging
means the package size is equal to the die size.
Additionally, this filter includes ESD protection
circuitry which prevents damage to the protected
device when subjected to ESD surges up to 15 kV
on external contacts.
TM: IPAD is a trademark of STMicroelectronics.
February 2010Doc ID 10740 Rev 51/8
www.st.com
8
CharacteristicsEMIF02-USB03F2
1 Characteristics
Table 1.Absolute ratings (T
SymbolParameter and test conditionsValueUnit
Internal pins (D3, C3, C2, B2, B1):
ESD discharge IEC61000-4-2, air discharge
V
ESD discharge IEC61000-4-2, contact discharge
PP
External pins (D1, C1, A2, A3, B3):
ESD discharge IEC61000-4-2, air discharge
ESD discharge IEC61000-4-2, contact discharge
Rs_usb03_gnd 0.9
Lgnd 50pH
Rgnd 100m
Cgnd 0.15pF
Lbump 50pH
Rbump 20m
Cbump 2.4pF
Rsubump 100m
EMIF02-USB03F2Ordering information scheme
3 Ordering information scheme
Figure 11. Ordering information scheme
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (ohm)
z = capacitance value / 10 (pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
x = 2: lead-free, pitch = 500 µm, bump = 315 µm
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Figure 12. Package dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
500 µm
500 µm
220 µm
1.44 mm ± 30 µm
315 µm ± 50
.
650 µm ± 65
1.94 mm ± 30 µm
220 µm
Doc ID 10740 Rev 55/8
Ordering informationEMIF02-USB03F2
Figure 13. FootprintFigure 14. Marking
Dot, ST logo
Copper pad Diameter:
250 µm recommended, 300 µm max.
Solder stencil opening:
330 µm recommended
Solder mask opening recommendation:
340 µm min. for 300 µm copper pad diameter
ECOPACK status
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Figure 15. Flip Chip tape and reel specification
Dot identifying Pin A1 location
4 ± 0.1
8 ± 0.3
ST
yww
xxz
E
2.04
yww
ST
xxz
E
1.58
xyxwz
Ø 1.5 ± 0.1
ST
yww
xxz
E
w
1.75 ± 0.13.5 ± 0.1
0.73 ± 0.05
All dimensions in mm
User direction of unreeling
Note:More information is available in the application notes:
AN1235:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
5 Ordering information
Table 3.Ordering information
Order codeMarkingPackageWeightBase qtyDelivery mode
Figure 14 and Figure 15. Reformatted to current standards.
Updated the maximum value of I
in Ta bl e 2 . Updated Figure 12 and
RM
Figure 15 for die dimension reductions.
Doc ID 10740 Rev 57/8
EMIF02-USB03F2
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