ST EMIF02-SPK03F2 User Manual

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2-channel EMI filter and ESD protection for speaker phone

Features

■ 2-channel EMI symmetrical (I/O) low-pass filter

■ High efficiency in EMI filtering:

– S21 attenuation, -40 dB at 900 MHz – Xtalk, in audio band, -60 dB

■ Very low PCB space consumption:

0.89 x 1.26 mm

■ Very thin package: 0.6 mm after reflow

■ High efficiency in ESD suppression on input

pins (IEC 61000-4-2 level 4)

■ High reliability offered by monolithic integration

■ High reduction of parasitic elements through

integration and wafer level packaging

■ Packaged in lead-free Flip Chip

Complies with the following standards

■ IEC 61000-4-2 level 4:

– ±15 kV (air discharge) – ±8 kV (contact discharge)

EMIF02-SPK03F2

Datasheet − production data

Flip Chip

(5 bumps)

Figure 1. Pin configuration (bump side)

Figure 2. Functional schematic

GND

Application

■ Mobile phones

■ Portable devices

■ Connectivity devices

Description

The EMIF02-SPK03F2 chip is a highly integrated

I1 O1

I2 O2

device designed to suppress EMI/RFI noise for interface line filtering.

The EMIF02-SPK03F2 is 2-channel, ultra compact, high attenuation filter available in

0.5 mm pitch WLCSP package. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.

June 2012 Doc ID 023219 Rev 1 1/10

This is information on a product in full production.

www.st.com

Characteristics EMIF02-SPK03F2

1 Characteristics

Table 1. Absolute maximum ratings (T

Symbol Parameter Value Unit

ESD discharge IEC 61000-4-2

Air discharge

(1)

Contact discharge

SPK

stg

1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353, “IEC 61000-4-2 standard testing”.

Maximum rms currrent per channel 800 mA

Maximum junction temperature 125 °C

Operating temperature range -30 to 85 °C

Storage temperature range -55 to + 150 °C

Figure 3. Electrical characteristics - definitions

amb

= 25 °C)

30 kV

Symbol Parameter

V = Breakdown voltage

V = Clamping voltage

I = Leakage current @ V

RM RM

V = Stand-off voltage

I = Peak pulse current

I = Breakdown current

Table 2. Electrical characteristics - values (Tamb = 25 °C)

= Dynamic resistance

Slope: 1/R

Symbol Test conditions Min. Typ. Max. Unit

DC_L

line

IR = 1 mA 6 V

tp = 100 ns 0.2 Ω

VRM = 3 V per line 0.3 µA

DC resistance of the inductor 0.07 0.1 Ω

Vline = 0 V, V

= 30 mV, F = 1 MHz 250 pF

OSC

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EMIF02-SPK03F2 Characteristics

Figure 4. Insertion losses versus frequency

APLAC 8.21 User: F:Cust# 8463:STMicroelectronics - Tours:AWR Corporation:RP=111

S21

-10

-20

-30

-40

-50

-60

300k 1M 3M 10M 30M 100M 300M 1G 3G

I1-O1

EMIF02-SPK03F2

F/Hz

I2-O2

Figure 5. Analog crosstalk versus frequency

APLAC 8.21 User: F:Cust# 8463:STMicroelectronics - Tours:AWR Corporation:RP=111

XTalk

-10

-20

-30

-40

-50

-60

-70

300k 1M 3M 10M 30M 100M 300M 1G 3G

I1-O2

EMIF02-SPK03F2

F/Hz

Doc ID 023219 Rev 1 3/10

Characteristics EMIF02-SPK03F2

Figure 6. Audio band analog crosstalk

Figure 7. Clamping voltage V

versus peak pulse current IPP for short pulse

duration such as ESD surges

Ipp(A)

32 30 28 26 24

Triangular pulse tP= 100 ns Direct and reverse polarity TJinitial = 25 °C

22 20 18 16 14 12 10

8 6 4 2

VCL(V)

0 2 4 6 8 10 12 14 16

Note: For further information on the dynamic characteristic see the STMicroelectronics’

application note AN4022, “TVS short pulse R

measurement and correlation with TVS

clamping voltage during ESD”.

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EMIF02-SPK03F2 Characteristics

Figure 8. ESD test conditions

2 x -20 dB

50 inputΩ

Figure 9. Output filter ESD response to IEC 61000-4-2 (+30 kV contact discharge) Ix to Ox

Doc ID 023219 Rev 1 5/10

Characteristics EMIF02-SPK03F2

Figure 10. Output filter ESD response to IEC 61000-4-2 (-30 kV contact discharge) Ix to Ox

Figure 11. Total harmonic distortion plus noise

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EMIF02-SPK03F2 Ordering information scheme

2 Ordering information scheme

Figure 12. Ordering information scheme

EMIF yy - xxx zz Fx

EMI Filter

Number of lines

Information

x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version

Package

F = Flip Chip x = 2: lead-free, pitch = 500 µm, bump = 255 µm

Doc ID 023219 Rev 1 7/10

Package information EMIF02-SPK03F2

3 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

packages, depending on their level of environmental compliance. ECOPACK®

is an ST trademark.

Figure 13. Package dimensions

500 µm ±10

250 µm ±10

435 µm

500 µm ±15

0.89 mm ±50 µm

315 µm ±50

1.26 mm ±50 µm

650 µm ±65

Figure 14. Footprint Figure 15. Marking

Dot, ST logo

ECOPACK status

xx = marking

Copper pad Diameter:

250 µm recommended, 300 µm max.

Solder stencil opening:

330 µm recommended

Solder mask opening recommendation:

340 µm min. for 315 µm copper pad diameter

z = manufacturing location yww = datecode

(y = year

ww = week)

xyxwz

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EMIF02-SPK03F2 Ordering information

Figure 16. Tape and reel specification

Dot identifying Pin A1 location

2.0

0.22

1.39

xxz

8.0

yww

1.02

0.73

± 0.05

All dimensions are typical values in mm

User direction of unreeling

Note: More information is available in the application notes:

AN1235,”IPAD™ 400 µm Flip Chip: package description and recommendations for use”

AN1751, “EMI filters: recommendations and measurements”

4.0

xxz yww

4.0

Ø 1.55

xxz

yww

1.75

3.5

4 Ordering information

Table 3. Ordering information

Order code Marking Package Weight Base qty Delivery mode

EMIF02-SPK03F2 JX Flip Chip 1.8 mg 5000 Tape and reel 7”

5 Revision history

Table 4. Document revision history

Date Revision Changes

19-Jun-2012 1 Initial release.

Doc ID 023219 Rev 1 9/10

EMIF02-SPK03F2

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10/10 Doc ID 023219 Rev 1

ST EMIF02-SPK03F2 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Figure 1. Pin configuration (bump side)

Figure 2. Functional schematic

1 Characteristics

Figure 3. Electrical characteristics - definitions

Figure 4. Insertion losses versus frequency

Figure 5. Analog crosstalk versus frequency

Figure 6. Audio band analog crosstalk

Figure 8. ESD test conditions

Figure 9. Output filter ESD response to IEC 61000-4-2 (+30 kV contact discharge) Ix to Ox

Figure 10. Output filter ESD response to IEC 61000-4-2 (-30 kV contact discharge) Ix to Ox

Figure 11. Total harmonic distortion plus noise

2 Ordering information scheme

Figure 12. Ordering information scheme

3 Package information

Figure 13. Package dimensions

Figure 14. Footprint Figure 15. Marking

Figure 16. Tape and reel specification

4 Ordering information

Table 3. Ordering information

5 Revision history

Table 4. Document revision history