ST EMIF02-MIC06F3 User Manual

2-line IPAD™ EMI filter and ESD protection

Features

■ 2-line symmetrical low-pass filter

■ Lead-free package

■ Very low PCB space consuming: < 1.5 mm

Very thin package: 0.65 mm

■

■ High efficiency in ESD suppression

IEC 61000-4-2 level 4

■ High reliability offered by monolithic integration

■ High reduction of parasitic elements through

integration and wafer level packaging

Complies with the following standards

■ IEC 61000-4-2 level 4:

– 15 kV (air discharge)
– 8 kV (contact discharge)

2

EMIF02-MIC06F3

Lead-free Flip-Chip package

(8 bumps)

Figure 1. Pin configuration (bump side)

123

MIC

Bias

ECI

A

Application

■ Mobile phones (differential microphone filtering

and ESD protection)

Description

The EMIF02-MIC06F3 is a highly integrated
device designed to suppress EMI/RFI noise for
dual microphone line filtering.

The EMIF02-MIC06F3 Flip-Chip packaging
means the package size is equal to the die size.
That's why EMIF02-MIC06F3 is a very small
device.

Additionally, this filter includes an ESD protection
circuitry which prevents damage to the application
when subjected to ESD surges up to 15 kV.

TM: IPAD is a trademark of STMicroelectronics.

Op

On

n

Gnd

A

Gnd

Mic2p

Mic2n

B

C

September 2011 Doc ID 15195 Rev 4 1/8

www.st.com

8

Characteristics EMIF02-MIC06F3

1 Characteristics

Figure 2. Configuration

GND

GND

B1

Mic2p

Mic2n

C1 C3

GND

GND

ECI

A2

Mic Bias

C11 C21

C12

GND

B2 and C2 are ground pins

A3

R11

R12

GND

R21R31

R22

C22

GND

B3

to ASIC

ECI pin connection

The ECI pin (enhancement control interface) is an input pin for the audio pre-amplifier chip
which detects the voltage of the microphone line MIC2P in case the user presses the on­hook/off-hook button on the headset. When the user selects off-hook using the headset
button, the MIC2P is shorted to MIC2N which is grounded. If your design does not support
the ECI feature, the ECI pin must be left open (not connected).

Table 1. Absolute ratings (limiting values)

Symbol Parameter and test conditions Value Unit

Pins B1 and C1:

ESD discharge IEC 61000-4-2, level 4
air discharge

V

PP

contact discharge

Pins A2, A3, B2, B3, C2, C3:

ESD discharge IEC 61000-4-2, level 1
air discharge
contact discharge

P

T

T

op

T

stg

Power dissipation at T

D

Maximum junction temperature 125 °C

j

Operating temperature range - 40 to + 85 °C

Storage temperature range - 55 to + 150 °C

= 25 °C 60 mW

amb

2/8 Doc ID 15195 Rev 4

15

8

kV

2
2

EMIF02-MIC06F3 Characteristics

Figure 3. Electrical characteristics (definitions)

I

Symbol Parameter

V = Breakdown voltage

BR

I = Leakage current @ V

RM RM

R = Series resistance

I/O

between input and output

C = Line capacitance

line

IR
IRM

VRMVBR

IRM
IR

V

V

BRVRM

Table 2. Electrical characteristics - values (T

Symbol Test conditions Min. Typ. Max. Unit

V

BR

I

RM

R

11

R

12

R

, R

21

22

R

31

, C

C

11

12

C

, C

21

22

IR = 1 mA 14 V

VRM = 3 V per line 100 nA

VR = 0 V 0.8 1 nF

VR = 0 V 1 1.25 nF

Figure 4. Attenuation simulation with

1 kΩ input and 10 kΩ output

db

0

-10

-20

-30

-40

-50

-60

-70

-80

-90

-100
10 100 1k 10k 100k 1M 10M 100M 1G

Input: 1 k
Output: 10 k
AC simulation

Ω

Ω

50Ω measurements

50Ω simulations

F (Hz)

= 25 °C)

amb

1.922.1kΩ

0.811.2kΩ

1.76 2.2 2.64 kΩ

20 25 30 Ω

Figure 5. Analog crosstalk measurement

db

0.00

-10.00

-20.00

-30.00

-40.00

-50.00

-60.00

-70.00

-80.00

-90.00

-100.00

100.0k 1.0M 10.0M 100.0M 1.0G
Mic2p-On

F (Hz)

Mic2n-Op

Doc ID 15195 Rev 4 3/8