ST EMIF02-MIC03M6 User Manual

2-line IPAD™, EMI filter and ESD protection for microphone

Features

■ EMI symmetrical (I/O) low-pass filter

■ High efficiency in EMI filtering

■ Very low PCB space consumption:

1.0 mm x 1.45 mm

■ Very thin package: 0.6 mm max

■ High efficiency in ESD suppression

■ High reliability offered by monolithic integration

■ High reduction of parasitic elements through

integration and wafer level packaging

■ Lead-free and halogen-free package

Complies with following standards

■ IEC 61000-4-2 level 4, input and output pins

■ IEC 61000-4-2 level 4 requirements

– 8 kV (contact discharge)

or

– 15 kV (air discharge)

EMIF02-MIC03M6

Pin 1

Micro QFN 6 leads

1.45 mm x 1.00 mm
(bottom view)

Figure 1. Pin configuration (top view)

MIC

GND GND

MIC

R in

L in

1

2

3

MIC

6

R out

5

MIC

4

L out

Application

■ Mobile phones

Description

The EMIF02-MIC03M6 is a 2-line highly
integrated device designed to suppress EMI/RFI
noise in all systems exposed to electromagnetic
interference.

This filter includes ESD protection circuitry, which
prevents damage to the application when
subjected to ESD surges up to 8 kV on all pins.

May 2011 Doc ID 14448 Rev 2 1/11

Figure 2. Basic cell configuration

Low-pass filter

Input

GND GND GND

R = 68 , C

TM: IPAD is a trademark of STMicroelectronics

line

= 45 pF typ.Ω

Output

www.st.com

11

Characteristics EMIF02-MIC03M6

1 Characteristics

Table 1. Absolute ratings

(1)

Symbol Parameter Value Unit

V

T

T

1. limiting values at T

2. According to IEC61000-4-2 test conditions with ungrounded table top equipment set-up, PCB board on insulated plane
(dimensions 25 x 25 mm

Table 2. Electrical characteristics (T

ESD discharge IEC61000-4-2 contact discharge

PP

ESD discharge IEC61000-4-2 air discharge

T

Junction temperature 125 °C

j

Operating temperature range -40 to + 85 °C

op

Storage temperature range -55 to +150 °C

stg

= 25 °C unless otherwise specified

amb

2

), 2 serial resistors of 470 kΩ to GND reference plane

amb

(2)

= 25 °C)

8

15

Symbol Parameter

I

I

PP

I

R

I

RM

VRMV

I

RM

I

R

I

PP

VBRV

RM

V

V

CL

BR

RM

RM

CL

PP

I/O

line

Breakdown voltage

Leakage current @ V

RM

Stand-off voltage

Clamping voltage

Dynamic resistance

d

Peak pulse current

Series resistance between Input & Output

Input capacitance per line

V

CL

BR

V

I

V

V

R

I

R

C

Symbol Test conditions Min. Typ. Max. Unit

BR

RM

I/O

IR = 1 mA 6 8 V

VRM = 3 V per line 500 nA

Tolerance ± 20% 68 Ω

(1)

VR = 0 V, F = 1 MHz, V

= 30 mV 45 pF

OSC

V

I

R

C

line

1. Tolerance ± 20%

kV

2/11 Doc ID 14448 Rev 2

EMIF02-MIC03M6 Characteristics

Figure 3. S21 attenuation measurement Figure 4. Analog cross talk measurements

(MIC R / MIC L)

dB

0.00

-5.00

-10.00

-15.00

-20.00

-25.00

-30.00

-35.00

-40.00

300.0k 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G

F (Hz)

Figure 5. ESD response to IEC 61000-4-2

(+8 kV contact discharge) on MIC
lines

Input

vi = 20 V/d

Figure 6. ESD response to IEC 61000-4-2

dB

0.00

0.00

-10.00

-10.00

-20.00

-20.00

-30.00

-30.00

-40.00

-40.00

-50.00

-50.00

-60.00

-60.00

-70.00

-70.00

-80.00

-80.00

300.0k 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G

300.0k 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G
Xtalk

L

R-L Xtalk L-R

F (Hz)

(-8 kV contact discharge) on MIC
lines

Input

vi = 20 V/d

Output

vo = 10 V/d

20 ns/d

vo = 10 V/d

Output

20 ns/d

Doc ID 14448 Rev 2 3/11

Ordering information scheme EMIF02-MIC03M6

2 Ordering information scheme

Figure 7. Ordering information scheme

EMIF yy - xxx zz Mx

EMI Filter

Number of lines

Information

xxx = application
zz = version

Package

Mx = Micro QFN x leads

4/11 Doc ID 14448 Rev 2

EMIF02-MIC03M6 Package information

3 Package information

● Epoxy meets UL94, V0

● Lead-free packages

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK

Table 3. Micro QFN 1.45 x 1.00 6L dimensions

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

D

N

112

A

A1

2

Dimensions

Ref.

E

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 0.50 0.55 0.60 0.020 0.022 0.024

A1 0.00 0.02 0.05 0.000 0.001 0.002

b 0.18 0.25 0.30 0.007 0.010 0.012

D 1.45 0.057

L

k

E 1.00 0.039

.

e 0.50 0.020

b

e

K 0.20 0.008

L 0.30 0.35 0.40 0.012 0.014 0.016

Figure 8. Footprint in mm [inches] Figure 9. Marking

0.50

[0.020]

0.25

[0.010]

0.60

[0.023]

0.30

[0.012]

Dot : Pi n 1 Identification

1.60

[0.063]

L

Doc ID 14448 Rev 2 5/11

Package information EMIF02-MIC03M6

Figure 10. Tape and reel specification

Dot identifying pin 1 location

8.0 +/- 0.3

8.0 +/- 0.3

1.65

2.0+/-0.05

2.0+/-0.05

4.00+/-0.1

4.00+/-0.1

φ 1.5 +/- 0.1

φ 1.5 +/- 0.1

1.75 +/- 0.1

1.75 +/- 0.1

3.5 +/- 0.03

3.5 +/- 0.03

LL L

0.75

0.75 1.20

User direction of unreeling

All dimensions in mm

User direction of unreeling

Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should

this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose.

4.00

4.00

6/11 Doc ID 14448 Rev 2

EMIF02-MIC03M6 Recommendation on PCB assembly

4 Recommendation on PCB assembly

4.1 Stencil opening design

1. General recommendation on stencil opening design

a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 11. Stencil opening dimensions

L

T

W

b) General design rule

Stencil thickness (T) = 75 ~ 125 µm

W

Aspect Ratio

Aspect Area

-----

1.5≥=

T

LW×

---------------------------­2T L W+()

0.66≥=

2. Reference design

a) Stencil opening thickness: 100 µm

b) Stencil opening for leads: Opening to footprint ratio is 90%.

Figure 12. Recommended stencil window position

7µm 7µm

15 µm

650 µm

620 µm

236 µm

15 µm

250 µm

Footprint

Stencil window

Footprint

Doc ID 14448 Rev 2 7/11

Recommendation on PCB assembly EMIF02-MIC03M6

4.2 Solder paste

1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2. “No clean” solder paste is recommended.

3. Offers a high tack force to resist component movement during high speed.

4. Solder paste with fine particles: powder particle size is 20-45 µm.

4.3 Placement

1. Manual positioning is not recommended.

2. It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.

3. Standard tolerance of ± 0.05 mm is recommended.

4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.

5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.

6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.

4.4 PCB design preference

1. To control the solder paste amount, the closed via is recommended instead of open
vias.

2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.

8/11 Doc ID 14448 Rev 2

EMIF02-MIC03M6 Recommendation on PCB assembly

4.5 Reflow profile

Figure 13. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Temperature (°C)

Temperature (°C)

260°C max

260°C max

255°C

255°C

220°C

220°C

180°C

180°C

125 °C

125 °C

3°C/s max

3°C/s max

0

0

012345 67

012345 67

10-30 sec

10-30 sec

90 to 150 sec

90 to 150 sec

90 sec max

90 sec max

2°C/s recommended

2°C/s recommended

6°C/s max

6°C/s max

Time (min)

Time (min)

Note: Minimize air convection currents in the reflow oven to avoid component movement.

Doc ID 14448 Rev 2 9/11

Ordering information EMIF02-MIC03M6

5 Ordering information

Table 4. Ordering information

Order code Marking Package Weight Base qty Delivery mode

EMIF02-MIC03M6 L

1. The marking can be rotated by 90° to differentiate assembly location

(1)

Micro QFN 2.2 mg 3000 Tape and reel (7”)

6 Revision history

Table 5. Document revision history

Date Revision Changes

13-Feb-2008 1 Initial release

Updated ECOPACK statement. Updated n: IEC 61000-4-2 level 4

27-May-2011 2

requirements on page 1. Added note 2. on page 2 . Updated title
Figure 5. and Figure 6. on page 3.

10/11 Doc ID 14448 Rev 2

EMIF02-MIC03M6

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Doc ID 14448 Rev 2 11/11