ST EMIF02-MIC02F2 User Manual

2-line IPAD™, EMI filter and ESD protection
Features
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Lead-free package
1.42 mm x 0.92 mm
Very thin package: 0.65 mm
High efficiency in ESD suppression
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration and wafer level packaging
EMIF02-MIC02F2
Flip Chip
(6 bumps)

Figure 1. Pin configuration (bump side)

123
Complies with the following standards
IEC 61000-4-2 level 4 on input pins
– 15 kV (air discharge) – 8 kV (contact discharge)
IEC 61000-4-2 level 1 on input pins
– 2 kV (air discharge) – 2 kV (contact discharge)
Applications
Where EMI filtering in ESD sensitive equipment is required:
Mobile phones and communication systems
Computers, printers and MCU Boards
Description
The EMIF02-MIC02 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.
I2
O2
GND
GND
I1
O1

Figure 2. Basic cell configuration

Low-pass Filter
Input
GND GND GND
Output
A
B
Ri/o = 470 Cline = 16 pF
W
This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.
May 2011 Doc ID 10913 Rev 4 1/8
TM: IPAD is a trademark of STMicroelectronics.
www.st.com
8
Electrical characteristics EMIF02-MIC02F2

1 Electrical characteristics

Table 1. Absolute ratings (T
Symbol Parameter Value Unit
amb
= 25 °C)
T
T
T
Table 2. Electrical characteristics (T
Symbol Parameters
V
V
V
R
C
junction temperature 125 °C
j
Operating temperature range -40 to +85 °C
op
Storage temperature range -55 to 150 °C
stg
= 25 °C)
amb
I
I
R
I
BR
RM
RM
CL
PP
I/O
line
Breakdown voltage
Leakage current @ V
RM
Stand-off voltage
Clamping voltage
d
Dynamic impedance
VCL
Peak pulse current
Series resistance between input and output
Input capacitance per line
I
PP
IR IRM
VRMVBR
IRM IR
IPP
VBRVRM
Symbol Test conditions Min. Typ. Max. Unit
V
BR
I
RM
IR = 1 mA 14 16 V
VRM = 12 V per line 500 nA
VCL
V
R
I/O
C
line
@ 0 V 16 20 pF
2/8 Doc ID 10913 Rev 4
423 470 517 Ω
EMIF02-MIC02F2 Electrical characteristics
Figure 3. Attenuation measurement and

Figure 4. Analog crosstalk measurements

Aplac simulation
S21 (dB)
- 10.00
- 15.00
- 20.00
- 25.00
- 30.00
- 35.00
- 40.00
- 45.00
- 50.00
1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G
F (Hz)
Measurement
Simulation
dB
-20.00
-30.00
-
-40.00
-
-50.00
-
-60.00
-
-70.00
-
-80.00
-
1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G
I2/O1
F (Hz)
Figure 5. Digital crosstalk measurement Figure 6. ESD response to IEC61000-4-2
(-15 kV air discharge) on one input V(in) and on one output V(out)
Figure 7. ESD response to IEC61000-4-2
(+15 kV air discharge) on one input V(in) and on one output V(out)
Doc ID 10913 Rev 4 3/8
Figure 8. Line capacitance versus applied
voltage
C(pF)
20
18
16
14
12
10
8
6
4
2
V (V)R
0
0123456789101112
V
osc
F=1MHz
=30mV
Tj=25°C
RMS
Application information EMIF02-MIC02F2

2 Application information

Figure 9. Aplac model

I1
Cox
Rsubump
Rsubump
Cox
I2
R_470R
MODEL = D01-int
MODEL = D01-ext
MODEL = D01-ext
MODEL = D01-int
R_470R

Figure 10. Aplac parameters

Model D01-ext BV = 7 CJO = Cz_ext IBV = 1u IKF = 1000 IS = 10f ISR = 100p N = 1 M = 0.3333 RS = Rs_ext VJ = 0.6 TT = 50n
Model D01-int BV = 7 CJO = Cz_int IBV = 1u IKF = 1000 IS = 10f ISR = 100p N = 1 M = 0.3333 RS = Rs_int VJ = 0.6 TT = 50n
O1
Cox
Rsubump
MODEL = D01-gnd
Rsubump
Cox
O2
gnd
gnd
Cgnd
Model D01-gnd BV = 7 CJO = Cz_gnd IBV = 1u IKF = 1000 IS = 10f ISR = 100p N = 1 M = 0.3333 RS = Rs_gnd VJ = 0.6 TT = 50n
50pH
50m
Lgnd
Cgnd
Rgnd
Ls 400pH Rs 100m
R_470R 482.6 Cz_ext 8.73pF Rs_ext 850m Cz_int 2.9pF Rs_int 850m Cz_gnd 215.61pF Rs_gnd 470m
Rgnd 10m Lgnd 48pH Cgnd 0.15pF
50pH
50m
Lgnd
Rgnd
4/8 Doc ID 10913 Rev 4
Cox 3.05pF Rsubump 200m
EMIF02-MIC02F2 Ordering information scheme

3 Ordering information scheme

Figure 11. Ordering information scheme

EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms) z = capacitance value / 10 pF or 3 letters = application 2 digits = version
Package
F = Flip Chip x = 2: Lead-free, pitch = 500 µm, bump = 315 µm

4 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK

Figure 12. Package dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
500 µm ± 50
210 µm
0.92 mm ± 50µm
315 µm ± 50500 µm ± 50
1.42 mm ± 50 µm
210 µm
650µm ± 65
Doc ID 10913 Rev 4 5/8
Ordering information EMIF02-MIC02F2

Figure 13. Footprint Figure 14. Marking

Dot, ST logo
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
xx = marking z = manufacturing location yww = datecode
(y = year
ww = week)

Figure 15. Flip Chip tape and reel specification

Dot identifying Pin A1 location
0.20 ± 0.02
1.47 ± 0.05
8.0 ± 0.3
2.0 ± 0.05
ST
ST
yww
yww
xxz
xxz
E
E
4.0 ± 0.1
ST
ST
yww
yww
xxz
xxz
E
E
Ø 1.55 ± 0.05
ST
ST
yww
yww
xxz
xxz
E
E
E
xyxwz
w
1.75 ± 0.1
3.5 ±- 0.05
1.02 ± 0.05
0.73 ± 0.05
All dimensions in mm
User direction of unreeling

5 Ordering information

Table 3. Ordering information

Order code Marking Package Weight Base qty Delivery mode
EMIF02-MIC02F2 FJ Flip Chip 2.3 mg 5000 Tape and reel 7”
Note: More information is available in the application notes:
AN1235:"Flip Chip: Package description and recommendations for use" AN1751: “EMI filters: Recommendations and measurements”
4.0 ± 0.1
6/8 Doc ID 10913 Rev 4
EMIF02-MIC02F2 Revision history

6 Revision history

Table 4. Document revision history

Date Revision Changes
12-Oct-2004 1 Initial release.
11-Jan-2006 2
17-Apr-2008 3
ECOPACK statement added. Die dimensions modified in Figure 12. and first page. Typographical errors corrected.
Updated ECOPACK statement. Updated Figure 11, Figure 12 and
Figure 15. Reformatted to current standards.
26-May-2011 4 Updated C
values in Ta bl e 2.
line
Doc ID 10913 Rev 4 7/8
EMIF02-MIC02F2
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8/8 Doc ID 10913 Rev 4
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