Where EMI filtering in ESD sensitive equipment is
required:
■ Mobile phones and communication systems
■ Computers, printers and MCU Boards
Description
The EMIF02-MIC02 is a highly integrated device
designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The EMIF02 Flip-Chip packaging
means the package size is equal to the die size.
I2
O2
GND
GND
I1
O1
Figure 2.Basic cell configuration
Low-pass Filter
Input
GNDGNDGND
Output
A
B
Ri/o = 470
Cline = 16 pF
W
This filter includes an ESD protection circuitry
which prevents damage to the application when
subjected to ESD surges up 15 kV.
May 2011Doc ID 10913 Rev 41/8
TM: IPAD is a trademark of STMicroelectronics.
www.st.com
8
Electrical characteristicsEMIF02-MIC02F2
1 Electrical characteristics
Table 1.Absolute ratings (T
SymbolParameterValueUnit
amb
= 25 °C)
T
T
T
Table 2.Electrical characteristics (T
SymbolParameters
V
V
V
R
C
junction temperature125°C
j
Operating temperature range-40 to +85°C
op
Storage temperature range-55 to 150°C
stg
= 25 °C)
amb
I
I
R
I
BR
RM
RM
CL
PP
I/O
line
Breakdown voltage
Leakage current @ V
RM
Stand-off voltage
Clamping voltage
d
Dynamic impedance
VCL
Peak pulse current
Series resistance between input and
output
Input capacitance per line
I
PP
IR
IRM
VRMVBR
IRM
IR
IPP
VBRVRM
SymbolTest conditionsMin.Typ.Max.Unit
V
BR
I
RM
IR = 1 mA1416V
VRM = 12 V per line500nA
VCL
V
R
I/O
C
line
@ 0 V1620pF
2/8Doc ID 10913 Rev 4
423470517Ω
EMIF02-MIC02F2Electrical characteristics
Figure 3.Attenuation measurement and
Figure 4.Analog crosstalk measurements
Aplac simulation
S21 (dB)
- 10.00
- 15.00
- 20.00
- 25.00
- 30.00
- 35.00
- 40.00
- 45.00
- 50.00
1.0M3.0M10.0M 30.0M 100.0M 300.0M1.0G3.0G
F (Hz)
Measurement
Simulation
dB
-20.00
-30.00
-
-40.00
-
-50.00
-
-60.00
-
-70.00
-
-80.00
-
1.0M3.0M10.0M 30.0M 100.0M 300.0M1.0G3.0G
I2/O1
F (Hz)
Figure 5.Digital crosstalk measurementFigure 6.ESD response to IEC61000-4-2
(-15 kV air discharge) on one input
V(in) and on one output V(out)
Figure 7.ESD response to IEC61000-4-2
(+15 kV air discharge) on one input
V(in) and on one output V(out)
Doc ID 10913 Rev 43/8
Figure 8.Line capacitance versus applied
voltage
C(pF)
20
18
16
14
12
10
8
6
4
2
V (V)R
0
0123456789101112
V
osc
F=1MHz
=30mV
Tj=25°C
RMS
Application informationEMIF02-MIC02F2
2 Application information
Figure 9.Aplac model
I1
Cox
Rsubump
Rsubump
Cox
I2
R_470R
MODEL = D01-int
MODEL = D01-ext
MODEL = D01-ext
MODEL = D01-int
R_470R
Figure 10. Aplac parameters
Model D01-ext
BV = 7
CJO = Cz_ext
IBV = 1u
IKF = 1000
IS = 10f
ISR = 100p
N = 1
M = 0.3333
RS = Rs_ext
VJ = 0.6
TT = 50n
Model D01-int
BV = 7
CJO = Cz_int
IBV = 1u
IKF = 1000
IS = 10f
ISR = 100p
N = 1
M = 0.3333
RS = Rs_int
VJ = 0.6
TT = 50n
O1
Cox
Rsubump
MODEL = D01-gnd
Rsubump
Cox
O2
gnd
gnd
Cgnd
Model D01-gnd
BV = 7
CJO = Cz_gnd
IBV = 1u
IKF = 1000
IS = 10f
ISR = 100p
N = 1
M = 0.3333
RS = Rs_gnd
VJ = 0.6
TT = 50n
x = resistance value (Ohms)
z = capacitance value / 10 pF
or
3 letters = application
2 digits = version
Package
F = Flip Chip
x = 2: Lead-free, pitch = 500 µm, bump = 315 µm
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 12. Package dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
500 µm ± 50
210 µm
0.92 mm ± 50µm
315 µm ± 50500 µm ± 50
1.42 mm ± 50 µm
210 µm
650µm ± 65
Doc ID 10913 Rev 45/8
Ordering informationEMIF02-MIC02F2
Figure 13. FootprintFigure 14. Marking
Dot, ST logo
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Figure 15. Flip Chip tape and reel specification
Dot identifying Pin A1 location
0.20 ± 0.02
1.47 ± 0.05
8.0 ± 0.3
2.0 ± 0.05
ST
ST
yww
yww
xxz
xxz
E
E
4.0 ± 0.1
ST
ST
yww
yww
xxz
xxz
E
E
Ø 1.55 ± 0.05
ST
ST
yww
yww
xxz
xxz
E
E
E
xyxwz
w
1.75 ± 0.1
3.5 ±- 0.05
1.02 ± 0.05
0.73 ± 0.05
All dimensions in mm
User direction of unreeling
5 Ordering information
Table 3.Ordering information
Order codeMarkingPackageWeightBase qtyDelivery mode
EMIF02-MIC02F2FJFlip Chip2.3 mg5000Tape and reel 7”
Note:More information is available in the application notes:
AN1235:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
4.0 ± 0.1
6/8Doc ID 10913 Rev 4
EMIF02-MIC02F2Revision history
6 Revision history
Table 4.Document revision history
DateRevisionChanges
12-Oct-20041Initial release.
11-Jan-20062
17-Apr-20083
ECOPACK statement added. Die dimensions modified in Figure 12.
and first page. Typographical errors corrected.
Updated ECOPACK statement. Updated Figure 11, Figure 12 and
Figure 15. Reformatted to current standards.
26-May-20114Updated C
values in Ta bl e 2.
line
Doc ID 10913 Rev 47/8
EMIF02-MIC02F2
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.