ST EMIF02-MIC02F2 User Manual

Download

2-line IPAD™, EMI filter and ESD protection

Features

■ EMI symmetrical (I/O) low-pass filter

■ High efficiency in EMI filtering

■ Lead-free package

■ Very low PCB space occupation:

1.42 mm x 0.92 mm

■ Very thin package: 0.65 mm

■ High efficiency in ESD suppression

■ High reliability offered by monolithic integration

■ High reducing of parasitic elements through

integration and wafer level packaging

EMIF02-MIC02F2

Flip Chip

(6 bumps)

Figure 1. Pin configuration (bump side)

123

Complies with the following standards

■ IEC 61000-4-2 level 4 on input pins

– 15 kV (air discharge) – 8 kV (contact discharge)

■ IEC 61000-4-2 level 1 on input pins

– 2 kV (air discharge) – 2 kV (contact discharge)

Applications

Where EMI filtering in ESD sensitive equipment is required:

■ Mobile phones and communication systems

■ Computers, printers and MCU Boards

Description

The EMIF02-MIC02 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.

GND

Figure 2. Basic cell configuration

Low-pass Filter

Input

GND GND GND

Output

Ri/o = 470 Cline = 16 pF

This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV.

May 2011 Doc ID 10913 Rev 4 1/8

TM: IPAD is a trademark of STMicroelectronics.

www.st.com

Electrical characteristics EMIF02-MIC02F2

1 Electrical characteristics

Table 1. Absolute ratings (T

Symbol Parameter Value Unit

amb

= 25 °C)

Table 2. Electrical characteristics (T

Symbol Parameters

junction temperature 125 °C

Operating temperature range -40 to +85 °C

Storage temperature range -55 to 150 °C

stg

= 25 °C)

amb

I/O

line

Breakdown voltage

Leakage current @ V

Stand-off voltage

Clamping voltage

Dynamic impedance

VCL

Peak pulse current

Series resistance between input and output

Input capacitance per line

IR IRM

VRMVBR

IRM IR

IPP

VBRVRM

Symbol Test conditions Min. Typ. Max. Unit

IR = 1 mA 14 16 V

VRM = 12 V per line 500 nA

VCL

I/O

line

@ 0 V 16 20 pF

2/8 Doc ID 10913 Rev 4

423 470 517 Ω

EMIF02-MIC02F2 Electrical characteristics

Figure 3. Attenuation measurement and

Figure 4. Analog crosstalk measurements

Aplac simulation

S21 (dB)

- 10.00

- 15.00

- 20.00

- 25.00

- 30.00

- 35.00

- 40.00

- 45.00

- 50.00

1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G

F (Hz)

Measurement

Simulation

-20.00

-30.00

-40.00

-50.00

-60.00

-70.00

-80.00

1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G

I2/O1

F (Hz)

Figure 5. Digital crosstalk measurement Figure 6. ESD response to IEC61000-4-2

(-15 kV air discharge) on one input V(in) and on one output V(out)

Figure 7. ESD response to IEC61000-4-2

(+15 kV air discharge) on one input V(in) and on one output V(out)

Doc ID 10913 Rev 4 3/8

Figure 8. Line capacitance versus applied

voltage

C(pF)

V (V)R

0123456789101112

osc

F=1MHz

=30mV

Tj=25°C

RMS

Application information EMIF02-MIC02F2

2 Application information

Figure 9. Aplac model

Cox

Rsubump

Cox

R_470R

MODEL = D01-int

MODEL = D01-ext

MODEL = D01-int

R_470R

Figure 10. Aplac parameters

Model D01-ext BV = 7 CJO = Cz_ext IBV = 1u IKF = 1000 IS = 10f ISR = 100p N = 1 M = 0.3333 RS = Rs_ext VJ = 0.6 TT = 50n

Model D01-int BV = 7 CJO = Cz_int IBV = 1u IKF = 1000 IS = 10f ISR = 100p N = 1 M = 0.3333 RS = Rs_int VJ = 0.6 TT = 50n

Cox

Rsubump

MODEL = D01-gnd

Rsubump

Cox

gnd

Cgnd

Model D01-gnd BV = 7 CJO = Cz_gnd IBV = 1u IKF = 1000 IS = 10f ISR = 100p N = 1 M = 0.3333 RS = Rs_gnd VJ = 0.6 TT = 50n

50pH

50m

Lgnd

Cgnd

Rgnd

Ls 400pH Rs 100m

R_470R 482.6 Cz_ext 8.73pF Rs_ext 850m Cz_int 2.9pF Rs_int 850m Cz_gnd 215.61pF Rs_gnd 470m

Rgnd 10m Lgnd 48pH Cgnd 0.15pF

50pH

50m

Lgnd

Rgnd

4/8 Doc ID 10913 Rev 4

Cox 3.05pF Rsubump 200m

EMIF02-MIC02F2 Ordering information scheme

3 Ordering information scheme

Figure 11. Ordering information scheme

EMIF yy - xxx zz Fx

EMI Filter

Number of lines

Information

x = resistance value (Ohms) z = capacitance value / 10 pF or 3 letters = application 2 digits = version

Package

F = Flip Chip x = 2: Lead-free, pitch = 500 µm, bump = 315 µm

4 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK

Figure 12. Package dimensions

packages, depending on their level of environmental compliance. ECOPACK®

is an ST trademark.

500 µm ± 50

210 µm

0.92 mm ± 50µm

315 µm ± 50500 µm ± 50

1.42 mm ± 50 µm

210 µm

650µm ± 65

Doc ID 10913 Rev 4 5/8

Ordering information EMIF02-MIC02F2

Figure 13. Footprint Figure 14. Marking

Dot, ST logo

Copper pad Diameter:

250 µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 300 µm copper pad diameter

xx = marking z = manufacturing location yww = datecode

(y = year

ww = week)

Figure 15. Flip Chip tape and reel specification

Dot identifying Pin A1 location

0.20 ± 0.02

1.47 ± 0.05

8.0 ± 0.3

2.0 ± 0.05

yww

xxz

4.0 ± 0.1

yww

xxz

Ø 1.55 ± 0.05

yww

xxz

xyxwz

1.75 ± 0.1

3.5 ±- 0.05

1.02 ± 0.05

0.73 ± 0.05

All dimensions in mm

User direction of unreeling

5 Ordering information

Table 3. Ordering information

Order code Marking Package Weight Base qty Delivery mode

EMIF02-MIC02F2 FJ Flip Chip 2.3 mg 5000 Tape and reel 7”

Note: More information is available in the application notes:

AN1235:"Flip Chip: Package description and recommendations for use" AN1751: “EMI filters: Recommendations and measurements”

4.0 ± 0.1

6/8 Doc ID 10913 Rev 4

EMIF02-MIC02F2 Revision history

6 Revision history

Table 4. Document revision history

Date Revision Changes

12-Oct-2004 1 Initial release.

11-Jan-2006 2

17-Apr-2008 3

ECOPACK statement added. Die dimensions modified in Figure 12. and first page. Typographical errors corrected.

Updated ECOPACK statement. Updated Figure 11, Figure 12 and

Figure 15. Reformatted to current standards.

26-May-2011 4 Updated C

values in Ta bl e 2.

line

Doc ID 10913 Rev 4 7/8

EMIF02-MIC02F2

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

www.st.com

8/8 Doc ID 10913 Rev 4

ST EMIF02-MIC02F2 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Figure 1. Pin configuration (bump side)

Figure 2. Basic cell configuration

1 Electrical characteristics

Figure 4. Analog crosstalk measurements

2 Application information

Figure 9. Aplac model

Figure 10. Aplac parameters

3 Ordering information scheme

Figure 11. Ordering information scheme

4 Package information

Figure 12. Package dimensions

Figure 13. Footprint Figure 14. Marking

Figure 15. Flip Chip tape and reel specification

5 Ordering information

Table 3. Ordering information

6 Revision history

Table 4. Document revision history