Single line IPAD™, EMI filter and ESD protection
Features
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency EMI filtering
■ Lead-free package
■ 400 µm pitch
■ Very low PCB space occupation: 0.6 mm
Very thin package: 0.6 mm
■
■ High reliability offered by monolithic integration
■ Reduction of parasitic elements through CSP
integration
Complies with the following standards
■ IEC 61000-4-2 level 4 on internal and external
pins:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ MIL STD 883F - Method 3015.7 Class 3
2
EMIF01-TV01F3
Flip Chip
(4 bumps)
Figure 1. Pin configuration (bump side)
A
B
1
2
Pin Description Pin Description
A1 TV OUT internal B1 TV OUT external
A2 GND B2 GND
Application
■ TV analog signal in TV_OUT interface
Description
The EMIF01-TV01F3 is a highly integrated array
designed to suppress EMI/RFI noise and provide
impedance matching for mobile phone and
portable applications. The EMIF01-TV01F3 is in a
Flip Chip package to offer space saving and high
RF performance.
This low pass filter includes ESD protection
circuitry which prevents damage to the protected
device when subjected to ESD surges up to
15 kV.
May 2011 Doc ID 12078 Rev 3 1/8
Figure 2. Device configuration
TV out
Internal
GND GND
GND GND
TM: IPAD is a trademark of STMicroelectronics.
R
R
TV out
External
B1A1
www.st.com
8
Characteristics EMIF01-TV01F3
1 Characteristics
Table 1. Absolute maximum ratings
Symbol Parameter and test conditions Value Unit
Internal pins (A1) and external pin (B1):
V
ESD discharge IEC 61000-4-2, air discharge
PP
ESD discharge IEC 61000-4-2, contact discharge
Maximum junction temperature 125 °C
T
j
T
Operating temperature range -30 to +85 °C
op
15
8
P Maximum power dissipation 80 °C
kV
T
Table 2. Electrical characteristics (T
Storage temperature range -55 to 150 °C
stg
= 25 °C)
amb
Symbol Parameters
V
V
V
R
C
Breakdown voltage
BR
I
Leakage current @ V
RM
Stand-off voltage
RM
Clamping voltage
CL
R
Dynamic impedance
d
Peak pulse current
I
PP
Series resistance between Input & Output
I/O
Input capacitance per line
line
RM
Symbol Test conditions Min Typ Max Unit
V
BRIR
I
RM
= 1 mA 6 8 V
VRM = 3 V 0.2 µA
R Tolerance ± 5 % 75 Ω
C
@ 0 V 30 35 pF
line
2/8 Doc ID 12078 Rev 3
EMIF01-TV01F3 Characteristics
Figure 3. S21 (db) attenuation measurement Figure 4. ESD response to IEC61000-4-2
(+15 kV air discharge)
db
0.00
-10.00
-20.00
-30.00
-40.00
f (Hz)
-50.00
100.0k 1.0M 10.0M 100.0M 1.0G
Figure 5. ESD response to IEC61000-4-2
(-15 kV air discharge)
TV out
internal
10 V/d
TV out
external
100 ns/d
10 V/d
Figure 6. Line capacitance versus applied
voltage
C (pF)
LINE
35
30
25
20
15
10
5
0
0123456
V
(V)
LINE
TV out
internal
10 V/d
TV out
external
10 V/d
100 ns/d
F=1MHz
V
=30mV
osc
Tj=25°C
RMS
Doc ID 12078 Rev 3 3/8
Application information EMIF01-TV01F3
2 Application information
Figure 7. Aplac model
I1 O1Lbump Rbump LbumpRbump
model = d1
Rbump
Lbump
Rs Ls Rs
Rline
75p
I1 O1
model = d2
Rbump
Lbump
Ls
Por t1
Figure 8. Aplac parameters
Variables
aplacvar Rline 75
aplacvar C_d1 17.5p
aplacvar C_d2 17.5p
aplacvar Ls 950pH
aplacvar Rs 150m
aplacvar Lbump96pH
aplacvar Rbump 20m
aplacvar Lgnd 75pH
Diode D1
BV=7
IBV=1m
CJO=C_d1
M=0.28
RS=0.48
VJ=0.6
TT=100n
Por t2
Diode D2
BV=7
IBV=1m
CJO=C_d2
M=0.28
RS=0.7
VJ=0.6
TT=100n
4/8 Doc ID 12078 Rev 3
EMIF01-TV01F3 Ordering information scheme
3 Ordering information scheme
Figure 9. Ordering information scheme
EMIF yy - xx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10 (pF)
or
2 letters = application
2 digits = version
Package
F = Flip Chip
x = 3: Lead-free, pitch = 400 µm, bump = 255 µm
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Figure 10. Package dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
400 µm ± 40
185 µm ± 10 µm
770 µm ± 30 µm
400 µm ± 40
770 µm ± 30µm
185 µm ± 10 µm
255 µm ± 40
.
605 µm ± 55
Doc ID 12078 Rev 3 5/8
Ordering information EMIF01-TV01F3
Figure 11. Footprint Figure 12. Marking
Dot
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening :
220 µm recommended
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
xyxwz
w
Figure 13. Flip Chip tape and reel specification
Dot identifying Pin A1 location
4 ± 0.1
Ø 1.5 ± 0.1
1.75 ± 0.1 3.5 ± 0.1
0.71 ± 0.05
All dimensions in mm
8 ± 0.3
yww
xxz
0.87
User direction of unreeling
Note: More information is available in the application notes:
AN2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and
recommendation for use”
AN1751: “EMI filters: Recommendations and measurements”
5 Ordering information
Table 3. Ordering information
yww
xxz
0.87
4 ± 0.1
yww
xxz
Order code Marking Package Weight Base qty Delivery mode
EMIF01-TV01F3 HC Flip Chip 0.79 mg 5000 Tape and reel 7”
6/8 Doc ID 12078 Rev 3
EMIF01-TV01F3 Revision history
6 Revision history
Table 4. Document revision history
Date Revision Changes
09-Feb-2006 1 Initial release.
28-Apr-2008 2
26-May-2011 3 Updated figure in Table 2. Updated ECOPACK statement.
Updated ECOPACK statement. Updated Figure 9, Figure 10, and Figure
13. Reformatted to current standards.
Doc ID 12078 Rev 3 7/8
EMIF01-TV01F3
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8/8 Doc ID 12078 Rev 3
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