ST DCPL-WB-02D3 User Manual

with integrated 50 ohm loaded isolated port
Features
Wide operating frequency range:
– 2400 MHz-5850 MHz
Low insertion loss
High ESD ruggedness
Lead-free CSP
Small footprint: 1670 x 1440 µm
Very low profile (< 600 µm after reflow)
Benefits
DCPL-WB-02D3
Wide-band, dual-path directional coupler
Datasheet production data
Flip Chip (7 bumps)

Figure 1. Pin configuration (bump view)

1
LB
A
in
LB out
3
2
GND
High RF performance
RF module size reduction
Applications
Multi-band equipment such as:
Power amplifier module
Front end module
WLAN
LB Path
50 Ω
CPLD
B1
B1
B
HB Path
HB
out
GND
C2
HB
C
in
Description
The DCPL-WB-02D3 is a wide-band, dual-path directional coupler designed to measure transmission output power in WLAN applications. This dual path CPL has been customized for wide-band operating frequencies (2G/5G WLAN) with low insertion losses in the transmission bandwidth (2400 MHz - 5850 MHz).
This device is built with two different RF couplers (one dedicated to LB, the other dedicated to HB) sharing the same coupled ports. Isolated port is loaded with an integrated 50 Ω resistor.
The DCPL-WB-02D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel.
June 2012 Doc ID 023285 Rev 1 1/8
This is information on a product in full production.
www.st.com
8
Characteristics DCPL-WB-02D3

1 Characteristics

Table 1. Absolute maximum rating (limiting values)

Value
Symbol Parameter
Min. Typ. Max.
Unit
P
IN
V
ESD (HBM)
V
ESD (MM)
V
ESD (CDM)
T
OP
Table 2. Electrical characteristics - impedances (T
Input Power RF
Human body model, JESD 22-A114F, all I/O 2 kV
Machine model, JESD 22-A115-A, all I/O 100 V
Charge device model, JESD 22-C101-C, all I/O 500 V
Operating temperature -30 +85 °C
(CW mode) 25 dBm
IN
Symbol Parameter
Z
Z
OUT
Z
CPL
Nominal output impedance (LB and HB paths) 50 Ω
Nominal input impedance (LB and HB paths) 50 Ω
IN
Nominal coupled port impedance 50 Ω
= 25 °C)
amb
Value
Min. Typ. Max.
Unit
2/8 Doc ID 023285 Rev 1
DCPL-WB-02D3 Characteristics
Table 3. Electrical characteristics - LB WLAN path RF performance (T
Symbol Parameter Test condition
Frequency range
f
(bandwidth)
IL
LB path insertion loss
LB
From 2400 MHz to 2500 MHz
Min. Typ. Max.
2400 2450 2500 MHz
Value
= 25 °C)
amb
Unit
0.2 dB
RL
CPLD
Ripple
Table 4. Electrical characteristics - HB WLAN path RF performance (T
LB path return loss
LB
(IN, OUT pins)
LB path coupling factor at 2.45 GHz 17 18 19 dB
LB
Coupling ripple in LB
LB
From 2400 MHz to 2500 MHz
From 2400 MHz to 2500 MHz
15 dB
Value
Symbol Parameter Test condition
Min. Typ. Max.
Frequency range
f
(bandwidth)
IL
RL
CPLD
HB path insertion loss
HB
HB path return loss
HB
(IN, OUT pins)
HB path coupling factor at 5.375 GHz 11 12 13 dB
HB
RippleHBCoupling ripple in HB
From 4900 MHz to 5850 MHz
From 4900 MHz to 5850 MHz
From 4900 MHz to 5850 MHz
4900 5375 5850 MHz
15 dB
0.5 dB
= 25 °C)
amb
Unit
0.5 dB
1.2 dB
Doc ID 023285 Rev 1 3/8
PCB recommendation DCPL-WB-02D3

2 PCB recommendation

Figure 2. Recommended land pattern

LB_IN
CPL
HB_IN
GND
GND
LB_OUT
HB_OUT

3 Ordering information scheme

Figure 3. Ordering information scheme

DCPL
Pad
Ø220 µm
Top layer
Aperture 130 µm
WB 02 D3
Dual high directivity coupler
Wide band
Version
Package
D3 = Bump diameter, 255 µm
4/8 Doc ID 023285 Rev 1
DCPL-WB-02D3 Package information

4 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.

Figure 4. Package dimensions

Ø 255 µm ± 40 µm
LB out
50 Ω
1.44 mm ± 50 µm
HB
out
1.67 mm ± 50 µm
GND
LB Path
HB Path
GND
C2
632 µm
630 µm ±60 µm
LB
in
CPLD
B1
B1
HB
in
-
517 µm
200 µm
Figure 5. Footprint Figure 6. Marking
Copper pad diameter: 220 µm recommended
Solder mask opening:
300 µm minimum
Solder stencil opening: 220 µm recommended
Dot, ST logo
ECOPACK status xx = marking z = manufacturing location yww = datecode
(y = year
ww = week)
xyx
wzw
Doc ID 023285 Rev 1 5/8
Package information DCPL-WB-02D3

Figure 7. Tape and reel specifications

2.0
4.0
Ø 1.50
0.20
1.77
x
x
z
y
w
w
x
x
z
y
w
w
x
x
z
y
w
w
8.0
0.73
All dimensions in mm(typical values)
1.54
User direction of unreeling
4.0
Note: More packing information is available in the STMicroelectronics Application notes:
AN2348: “IPAD™ 400 µm Flip Chip: package description and recommendations for use”
AN1751: “EMI Filters: recommendations and measurements”
1.75
3.5
6/8 Doc ID 023285 Rev 1
DCPL-WB-02D3 Ordering information

5 Ordering information

Table 5. Ordering information

Order code Marking Package Weight Base qty Delivery mode
DCPL-WB-02D3 SF Flip Chip 2.5 mg 5000 Tape and reel 7”

6 Revision history

Table 6. Document revision history

Date Revision Changes
18-Jun-2012 1 Initial release
Doc ID 023285 Rev 1 7/8
DCPL-WB-02D3
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8/8 Doc ID 023285 Rev 1
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