with integrated 50 ohm loaded isolated port
Features
■ 50 Ω nominal input / output impedance
■ Wide operating frequency range:
– 2400 MHz-5850 MHz
■ Low insertion loss
■ High ESD ruggedness
■ Lead-free CSP
■ Small footprint: 1670 x 1440 µm
■ Very low profile (< 600 µm after reflow)
Benefits
DCPL-WB-02D3
Wide-band, dual-path directional coupler
Datasheet − production data
Flip Chip (7 bumps)
Figure 1. Pin configuration (bump view)
1
LB
A
in
LB
out
3
2
GND
■ High RF performance
■ RF module size reduction
Applications
Multi-band equipment such as:
■ Power amplifier module
■ Front end module
■ WLAN
LB Path
50 Ω
CPLD
B1
B1
B
HB Path
HB
out
GND
C2
HB
C
in
Description
The DCPL-WB-02D3 is a wide-band, dual-path
directional coupler designed to measure
transmission output power in WLAN applications.
This dual path CPL has been customized for
wide-band operating frequencies (2G/5G WLAN)
with low insertion losses in the transmission
bandwidth (2400 MHz - 5850 MHz).
This device is built with two different RF couplers
(one dedicated to LB, the other dedicated to HB)
sharing the same coupled ports. Isolated port is
loaded with an integrated 50 Ω resistor.
The DCPL-WB-02D3 has been designed using
STMicroelectronics IPD (integrated passive
device) technology on non-conductive glass
substrate to optimize RF performance. The device
is delivered 100% tested in tape and reel.
June 2012 Doc ID 023285 Rev 1 1/8
This is information on a product in full production.
www.st.com
8
Characteristics DCPL-WB-02D3
1 Characteristics
Table 1. Absolute maximum rating (limiting values)
Value
Symbol Parameter
Min. Typ. Max.
Unit
P
IN
V
ESD (HBM)
V
ESD (MM)
V
ESD (CDM)
T
OP
Table 2. Electrical characteristics - impedances (T
Input Power RF
Human body model, JESD 22-A114F, all I/O 2 kV
Machine model, JESD 22-A115-A, all I/O 100 V
Charge device model, JESD 22-C101-C, all I/O 500 V
Operating temperature -30 +85 °C
(CW mode) 25 dBm
IN
Symbol Parameter
Z
Z
OUT
Z
CPL
Nominal output impedance (LB and HB paths) 50 Ω
Nominal input impedance (LB and HB paths) 50 Ω
IN
Nominal coupled port impedance 50 Ω
= 25 °C)
amb
Value
Min. Typ. Max.
Unit
2/8 Doc ID 023285 Rev 1
DCPL-WB-02D3 Characteristics
Table 3. Electrical characteristics - LB WLAN path RF performance (T
Symbol Parameter Test condition
Frequency range
f
(bandwidth)
IL
LB path insertion loss
LB
From 2400 MHz
to 2500 MHz
Min. Typ. Max.
2400 2450 2500 MHz
Value
= 25 °C)
amb
Unit
0.2 dB
RL
CPLD
Ripple
Table 4. Electrical characteristics - HB WLAN path RF performance (T
LB path return loss
LB
(IN, OUT pins)
LB path coupling factor at 2.45 GHz 17 18 19 dB
LB
Coupling ripple in LB
LB
From 2400 MHz
to 2500 MHz
From 2400 MHz
to 2500 MHz
15 dB
Value
Symbol Parameter Test condition
Min. Typ. Max.
Frequency range
f
(bandwidth)
IL
RL
CPLD
HB path insertion loss
HB
HB path return loss
HB
(IN, OUT pins)
HB path coupling factor at 5.375 GHz 11 12 13 dB
HB
RippleHBCoupling ripple in HB
From 4900 MHz
to 5850 MHz
From 4900 MHz
to 5850 MHz
From 4900 MHz
to 5850 MHz
4900 5375 5850 MHz
15 dB
0.5 dB
= 25 °C)
amb
Unit
0.5 dB
1.2 dB
Doc ID 023285 Rev 1 3/8
PCB recommendation DCPL-WB-02D3
2 PCB recommendation
Figure 2. Recommended land pattern
LB_IN
CPL
HB_IN
GND
GND
LB_OUT
HB_OUT
3 Ordering information scheme
Figure 3. Ordering information scheme
DCPL
–
Pad
Ø220 µm
Top layer
Aperture
130 µm
WB – 02 D3
Dual high directivity coupler
Wide band
Version
Package
D3 = Bump diameter, 255 µm
4/8 Doc ID 023285 Rev 1
DCPL-WB-02D3 Package information
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Figure 4. Package dimensions
Ø 255 µm ± 40 µm
LB
out
50 Ω
1.44 mm ± 50 µm
HB
out
1.67 mm ± 50 µm
GND
LB Path
HB Path
GND
C2
632 µm
630 µm ±60 µm
LB
in
CPLD
B1
B1
HB
in
-
517 µm
200 µm
Figure 5. Footprint Figure 6. Marking
Copper pad diameter:
220 µm recommended
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing
location
yww = datecode
(y = year
ww = week)
xyx
wzw
Doc ID 023285 Rev 1 5/8
Package information DCPL-WB-02D3
Figure 7. Tape and reel specifications
2.0
4.0
Ø 1.50
0.20
1.77
x
x
z
y
w
w
x
x
z
y
w
w
x
x
z
y
w
w
8.0
0.73
All dimensions in mm(typical values)
1.54
User direction of unreeling
4.0
Note: More packing information is available in the STMicroelectronics Application notes:
AN2348: “IPAD™ 400 µm Flip Chip: package description and recommendations for use”
AN1751: “EMI Filters: recommendations and measurements”
1.75
3.5
6/8 Doc ID 023285 Rev 1
DCPL-WB-02D3 Ordering information
5 Ordering information
Table 5. Ordering information
Order code Marking Package Weight Base qty Delivery mode
DCPL-WB-02D3 SF Flip Chip 2.5 mg 5000 Tape and reel 7”
6 Revision history
Table 6. Document revision history
Date Revision Changes
18-Jun-2012 1 Initial release
Doc ID 023285 Rev 1 7/8
DCPL-WB-02D3
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