Wide-band, dual-path directional coupler with ISO port
Features
■ 50 Ω nominal input / output impedance
■ Wide operating frequency range:
– 824 MHz-2170 MHz
■ Low insertion loss (< 0.2 dB)
■ High directivity (> 20 dB)
■ High ESD ruggedness
■ Lead-free CSP package
■ Small footprint: 1670 x 1440 µm
■ Very low profile (< 650 µm thickness)
DCPL-WB-00D3
Lead-free Flip Chip (8 bumps)
Figure 1. Pin configuration (bump view)
A1A2A3
Benefits
■ High RF performance
■ RF module size reduction
Complies with the following standards:
■ IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Applications
Multi-band equipment such as:
■ Power amplifier module
■ Front end module
■ GSM/WCDMA mobile phone
LB Path
B1B3
HB Path
C1C2C3
Description
The DCPL-WB-00D3 is a wide-band, dual-path
directional coupler designed to measure cell
phone transmission output power in
GSM/WCDMA applications. This dual path CPL
has been customized for wide-band operating
frequencies (EGSM and CELL, PCS, DCS,
WCDMA band I) with less than 0.2 dB insertion
losses in the transmission bandwidth (824 MHz 1980 MHz).
This device is built with two different RF couplers
(one dedicated to LB, the other dedicated to HB)
sharing the same coupled and isolated ports.The
DCPL-WB-00-D3 has been designed using
STMicroelectronics IPD (integrated passive
device) technology on non-conductive glass
substrate to optimize RF performance.
The device is delivered 100% tested in tape and
reel.
April 2011 Doc ID 17967 Rev 1 1/11
www.st.com
11
Characteristics DCPL-WB-00D3
1 Characteristics
Table 1. Device pin configuration
Bump Name Description
A1 Lbin LB coupler RF input
A2 GND RF ground
A3 Lbout LB coupler RF output
B1 CPLD Coupler port
B3 ISO Isolated port
C1 Hbin HB coupler RF input
C2 GND RF ground
C3 Hbout HB coupler output
Table 2. Absolute maximum rating (limiting values)
Value
Symbol Parameter
Min. Typ. Max.
Unit
P
IN
Input Power RF
(CW mode) 35 dBm
IN
ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω)
V
ESD (IEC)
V
ESD (HBM)
V
ESD (MM)
V
ESD (CDM)
T
OP
Table 3. Electrical characteristics - impedances (T
, LB
LB
IN
LBIN, LB
, HBIN, HB
OUT
, HBIN, HB
OUT
, air discharge
OUT
, contact discharge
OUT
Human body model, JESD 22-A114F, all I/O 2 kV
Machine model, JESD 22-A115-A, all I/O 100 V
Charge device model, JESD 22-C101-C, all I/O 500 V
Operating temperature -30 +85 °C
Symbol Parameter
Z
Z
Z
OUT
Z
CPL
ISO
Nominal output impedance (LB and HB paths) 50 Ω
Nominal input impedance (LB and HB paths) 50 Ω
IN
Nominal coupled port impedance 50 Ω
Nominal isolated port impedance 50 Ω
±15
±8
= 25 °C)
amb
Value
Min. Typ. Max.
kV
Unit
2/11 Doc ID 17967 Rev 1
DCPL-WB-00D3 Characteristics
Table 4. Electrical characteristics - LB path RF performance (T
Symbol Parameter Test condition
Frequency range
f
(bandwidth)
IL
LB path insertion loss
LB
From 824 MHz
to 960 MHz
Min. Typ. Max.
824 960 MHz
Value
= 25 °C)
amb
Unit
0.1 0.2 dB
RL
CPLD
Ripple
DIR
LB path return loss
LB
LB path coupling factor
LB
Coupling ripple in LB
LB
LB coupler directivity
LB
From 824 MHz
to 960 MHz
From 824 MHz
to 915 MHz
(824 to 849 MHz)
(880 to 915 MHz)
From 824 MHz
to 915 MHz
15 dB
32 37 dB
20 dB
Table 5. Electrical characteristics - HB path RF performance (T
Symbol Parameter Test condition
Frequency range
f
(bandwidth)
IL
HB
RL
CPLD
Ripple
B
DIR
HB path insertion loss
HB path return loss
HB
HB path coupling factor
HB
H
Coupling ripple in HB
HB coupler directivity
HB
From 1710 MHz
to 2170 MHz
From 1710 MHz
to 2170 MHz
From 1710 MHz
to 1980 MHz
(1710 to 1785 MHz)
(1850 to 1910 MHz)
(1920 to 1980 MHz)
From 1710 MHz
to 1980 MHz
Min. Typ. Max.
1710 1980 MHz
15 dB
29 34 dB
20 dB
Value
0.1 0.2 dB
amb
0.5 dB
= 25 °C)
Unit
0.5 dB
Doc ID 17967 Rev 1 3/11
Characteristics DCPL-WB-00D3
1.1 RF measurement (on reference evaluation board)
Measurements done on reference evaluation board under 50 Ω, de-embedding at
DCPL-WB-00D3 bumps.
Figure 2. Low band path insertion loss
IL
-0.00
dB
-0.05
-0.10
-0.15
-0.20
-0.25
7.5E8
8.0E8
8.5E8
Figure 3. High band path insertion loss
IL
-0.00
dB
-0.05
-0.10
-0.15
-0.20
-0.25
1.5E9
1.7E9
1.9E9
Figure 4. Low band path coupling factor
CPLD
-31
dB
-32
-33
-34
-35
-36
-37
-38
7.5E8
8.0E8
8.5E8
9.0E8
2.1E9
9.0E8
9.5E8
2.3E9
9.5E8
F(Hz)
1.0E9
F(Hz)
2.5E9
F(Hz)
1.0E9
4/11 Doc ID 17967 Rev 1
DCPL-WB-00D3 Characteristics
Figure 5. High band path coupling factor
CPLD
-28
dB
-29
-30
-31
-32
-33
-34
-35
1.5E9
1.7E9
1.9E9
2.1E9
2.3E9
F(Hz)
2.5E9
Figure 6. Low band path directivity
DIR
30
dB
28
26
24
22
20
0.75
0.80
Figure 7. High band path directivity
DIR
30
dB
28
26
24
22
20
1.5
1.7
0.85
1.9
0.90
2.1
0.95
2.3
F(Hz)
1.00
F(Hz)
2.5
Doc ID 17967 Rev 1 5/11
Characteristics DCPL-WB-00D3
Figure 8. Demo board description - layer 1
pad diameter
220um
Figure 9. Solder mask 1 + layer 1
Solder mask
diameter
>300µm
(320µm)
6/11 Doc ID 17967 Rev 1
DCPL-WB-00D3 Ordering information scheme
2 Ordering information scheme
Figure 10. Ordering information scheme
DCPL
Dual high directivity coupler
Wide band
Version
Pitch
D3 = bump diameter = 255 µm
WB – 00 D3
– –
Doc ID 17967 Rev 1 7/11
Package information DCPL-WB-00D3
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Figure 11. Package dimensions
Ø255µm +/-40µm
GND LB inLB out
GND LB inLB out
GND LB inLB out
A1
A2A3
A2A2A3A3
LB Path
ISO
ISO
B3
B3B3
1.44mm +/- 50µm
630µm
+/-60µm
LB Path
HB Path
HB Path
GND HB inHB out
GND HB inHB out
1.67mm +/- 50 µm
A1A1
B1
B1B1
C1C2C3
C1C1C2C2C3C3
CPLD
CPLD
ISO
ISO
B3
B3B3
GND LB inLB out
A2A3
A2A2A3A3
LB Path
HB Path
GND HB inHB out
GND HB inHB out
632 µm
A1
A1A1
B1
B1B1
C1C2C3
C1C1C2C2C3C3
CPLD
CPLD
517µm
Figure 12. Footprint Figure 13. Marking
Copper pad diameter:
220 µm recommended
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing
location
yww = datecode
(y = year
ww = week)
xyxwz
w
8/11 Doc ID 17967 Rev 1
DCPL-WB-00D3 Package information
Figure 14. Flip-Chip tape and reel specifications
4.0 ± 0.1
User direction of unreeling
0.20 ± 0.02
0.73 ± 0.05
All dimensions in mm
2.0 ± 0.05
1.77± 0.05
8.0 +0.3 -0.10
1.54 ± 0.05
Note: More packing information is available in the application notes:
AN2348: “400 µm Flip-Chip: Package description and recommendations for use”
AN1751: “EMI Filters: Recommendations and measurements”
Ø 1.50 ± 0.10
1.75 ± 0.1
3.5 ±- 0.05
2.0 ± 0.1
Doc ID 17967 Rev 1 9/11
Ordering information DCPL-WB-00D3
4 Ordering information
Table 6. Ordering information
Order code Marking Package Weight Base qty Delivery mode
DCPL-WB-00D3 RS Flip Chip 2.5 mg 5000 Tape and reel 7”
5 Revision history
Table 7. Document revision history
Date Revision Changes
14-Apr-2010 1 Initial release
10/11 Doc ID 17967 Rev 1
DCPL-WB-00D3
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Doc ID 17967 Rev 1 11/11
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