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DCPL-WB-00C2
User Manual
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ST DCPL-WB-00C2 User Manual

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Wide-band, dual-path directional coupler with ISO port
Features
■ 50 Ω nominal input / output impedance
■ wide operating frequency range:
– 824 MHz-2170 MHz
■ 37 dB typical coupling factor
■ high directivity (> 20 dB)
■ high ESD ruggedness
■ lead-free CSP package
■ Flip-Chip package
■ small footprint: 1700 x 1850 µm
■ very low profile (< 670 µm thickness)
Benefits
■ high RF performance
■ RF module size reduction
DCPL-WB-00C2
Lead-free Flip Chip (8 bumps)

Figure 1. Pin configuration (bump view)

A1A2A3
LB Path
ISO
HB Path
B1B3
C1C2C3
CPL
Complies with the following standards:
■ IEC 61000-4-2 level 4:
– 15 kV (air discharge) – 8 kV (contact discharge)
Applications
Multi-band equipment such as:
■ power amplifier module
■ front end module
■ GSM/WCDMA mobile phone
Description
The DCPL-WB-00C2 is a wide-band, dual-path directional coupler designed to measure cell phone transmission output power in GSM/WCDMA applications. This dual-path CPL has been customized for wide-band operating frequencies (EGSM and CELL, PCS, DCS, WCDMA band I) with less than 0.2 dB insertion losses in the transmission bandwidth (824 MHz ­1980 MHz).
This device is built with two different RF couplers (one dedicated to LB, the other dedicated to HB) sharing the same coupled and isolated ports.The DCPL-WB-00C2 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance.
The device is delivered 100% tested in tape and reel.
October 2010 Doc ID 17994 Rev 1 1/11
www.st.com
11
Characteristics DCPL-WB-00C2

1 Characteristics

Table 1. Device pin configuration

Bump Name Description
A1 Lbin LB coupler RF input
A2 GND RF ground
A3 Lbout LB coupler RF output
B1 CPLD Coupler port
B3 ISO Isolated port
C1 Hbin HB coupler RF input
C2 GND RF ground
C3 Hbout HB coupler output

Table 2. Absolute maximum rating (limiting values)

Value
Symbol Parameter
Min. Typ. Max.
Unit
P
IN
Input Power RF
(CW mode) - 36 dBm
IN
ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω)
V
ESD (IEC)
V
ESD (HBM)
V
ESD (MM)
V
ESD (CDM)
T
OP
Table 3. Electrical characteristics - impedances (T
LB LB
IN
IN
, LB , LB
, HBIN, HB
OUT
, HBIN, HB
OUT
, air discharge
OUT
, contact discharge
OUT
Human body model, JESD22-A114-B, All I/O 2 - - kV
Machine model, JESD22-A115-A, All I/O 100 - - V
Charge device model, JESD22-C101-C, All I/O 500 - - V
Operating temperature -30 - +85 °C
Symbol Parameter
Z
Z
Z
OUT
Z
CPL
ISO
Nominal output impedance (LB and HB paths) - 50 - Ω
Nominal input impedance (LB and HB paths) - 50 - Ω
IN
Nominal coupled port impedance - 50 - Ω
Nominal isolated port impedance - 50 - Ω
±15
--kV
±8
= 25 °C)
amb
Value
Min. Typ. Max.
Unit
2/11 Doc ID 17994 Rev 1
DCPL-WB-00C2 Characteristics
Table 4. Electrical characteristics - LB path RF performance (T
Symbol Parameter Test condition
T
IL
Operating temperature -30 - +85 °C
OP
Frequency range
f
(bandwidth)
LB path insertion loss
LB
From 824 MHz to 960 MHz
Min. Typ. Max.
824 - 960 MHz
Value
-0.10.2dB
amb
= 25 °C)
Unit
RL
CPLD
Ripple
DIR
LB path return loss
LB
LB coupling factor
LB
Coupling ripple in LB
LB
LB coupler directivity
LB
From 824 MHz to 960 MHz
From 824 MHz to 915 MHz
(824 to 849 MHz) (880 to 915 MHz)
From 824 MHz to 915 MHz
15 - - dB
32 - 37 dB
--0.5dB
22 - - dB
Table 5. Electrical characteristics - HB path RF performance (T
Symbol Parameter Test condition
T
IL
RL
CPLD
Operating temperature -30 - +85 °C
OP
Frequency range
f
(bandwidth)
HB path insertion loss
HB
HB path return loss
HB
HB coupling factor
HB
From 1710 MHz to 2170 MHz
From 1710 MHz to 2170 MHz
From 1710 MHz to 1980 MHz
(1710 to 1785 MHz)
Ripple
Coupling ripple in HB
HB
(1850 to 1910 MHz) (1920 to 1980 MHz)
DIR
HB coupler directivity
HB
From 1710 MHz to 1980 MHz
Min. Typ. Max.
1710 - 1980 MHz
15 - - dB
29 - 34 dB
22 - - dB
Value
-0.10.2dB
--0.5dB
amb
= 25 °C)
Unit
Doc ID 17994 Rev 1 3/11
Characteristics DCPL-WB-00C2

1.1 RF measurement (on reference evaluation board)

Measurements done on reference evaluation board under 50 Ω, de-embedding at DCPL-WB-00D3 bumps.

Figure 2. Low band path insertion loss

IL - LB (dB)
0.00
-0.05
-0.10
-0.15
F (MHz)
-0.20
800 820 840 860 880 900 920 940 960 980 1000

Figure 3. High band path insertion loss

IL - HB (dB)
0.00
-0.05
-0.10
-0.15
-0.20
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200

Figure 4. Low band path coupling factor

CPLD - LB (dB)
-30
-31
-32
-33
-34
-35
-36
-37
-38
-39
-40
800 820 840 860 880 900 920 940 960 980 1000
F (MHz)
F (MHz)
4/11 Doc ID 17994 Rev 1
DCPL-WB-00C2 Characteristics
001750180018501900195020002050210021502200

Figure 5. High band path coupling factor

CPLD - HB (dB)
-28
-29
-30
-31
-32
-33
-34
-35
36
--37
F (MHz)
-38
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200

Figure 6. Low band path directivity

DIR - LB (dB)
35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20
800 820 840 860 880 900 920 940 960 980 1000
F (MHz)

Figure 7. High band path directivity

DIR - LB (dB)
35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20
17
Doc ID 17994 Rev 1 5/11
F (MHz)
Characteristics DCPL-WB-00C2

Figure 8. Demo board description - layer 1

Copper pad diameter: 275 µm

Figure 9. Solder mask 1 + layer 1

Solder mask diameter: 375 µm
6/11 Doc ID 17994 Rev 1
DCPL-WB-00C2 Ordering information scheme

2 Ordering information scheme

Figure 10. Ordering information scheme

DCPL
Dual high directivity coupler
Wide band
Version
Package
C2 = Coated Flip Chip, bump size = 315 µm
– –
WB – 00 C2
Doc ID 17994 Rev 1 7/11
Package information DCPL-WB-00C2

3 Package information

● Epoxy meets UL94, V0
● Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.

Figure 11. Package dimensions

685 µm
685 µm
B3
B3B3
600µm
A2A3
A2A2A3A3
1.7 mm
315 µm dia.
600µm
A1
A1A1
B1
B1B1
C1C2C3
C1C1C2C2C3C3
670 µm
1.85 mm

Figure 12. Footprint Figure 13. Marking

Copper pad diameter :
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
8/11 Doc ID 17994 Rev 1
Dot, ST logo
ECOPACK status xx = marking z = manufacturing location yww = datecode
(y = year ww = week)
xyx
wzw
DCPL-WB-00C2 Package information

Figure 14. Flip-Chip tape and reel specifications

Dot identifying Pin A1 location
0.22
1.95
8.0
0.73
All dimensions are typical values in mm
2.0
ST
xxz
xxz
yww
yww
4.0
ST
xxz
xxz
yww
yww
1.80
User direction of unreeling
Note: More packing information is available in the application notes:
AN1235: "Flip-Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements”
4.0
Ø 1.55
ST
xxz
xxz
yww
yww
1.75
3.5
Doc ID 17994 Rev 1 9/11
Ordering information DCPL-WB-00C2

4 Ordering information

Table 6. Ordering information

Order code Marking Package Weight Base qty Delivery mode
DCPL-WB-00C2 RN Flip Chip 3.65 mg 5000 Tape and reel

5 Revision history

Table 7. Document revision history

Date Revision Changes
07-Oct-2010 1 Initial release.
10/11 Doc ID 17994 Rev 1
DCPL-WB-00C2
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Doc ID 17994 Rev 1 11/11
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