ST BTA24, BTB24, BTA25, BTA26, BTB26 User Manual

BTA24, BTB24, BTA25
BTA26, BTB26, T25
25 A standard and Snubberless™ triacs
Features
High current triac
Low thermal resistance with clip bonding
commutation (3 quadrant) capability
BTA series UL1557 certified (File ref: 81734)
Packages are RoHS (2002/95/EC) compliant
Applications
TO-220AB Insulated
Applications include the ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits, etc., or for phase control operation in light dimmers, motor speed controllers, and silmilar.
The snubberless versions (BTA/BTB...W and T25 series) are especially recommended for use on inductive loads, due to their high commutation performances. The BTA series provides an insulated tab (rated at 2500 V
RMS
).
Description
Available either in through-hole or surface-mount packages, the BTA24, BTB24, BTA25, BTA26, BTB26 and T25 triac series is suitable for general purpose mains power AC switching.

Table 1. Device summary

Symbol Parameter BTA24
I
T(RMS)
V
DRM/VRRM
I
(Snubberless)
GT
(Standard)
I
GT
1. Insulated packages
2. 600 V version available only with IGT = 50 mA (Snubberless and Standard)
RMS on-state current
Repetitive peak off-state voltage
Triggering gate current
Triggering gate current
(1)
25 25 25 25 25 25 A
600 / 800 600 / 800 600 / 800 600
35 / 50 35 / 50 50 35 / 50 - 35 mA
-50505050-mA
BTB24 BTA25
A1
A2
G
(BTA24)
G
(BTA25)
A1
D2PAK
(1)
A1
RD91
A2
G
(T25)
BTA26
(2)
A2
A2
(1)
/ 800
A2
G
A1
A1
A2
G
TO-220AB
(BTB24)
A1
A2
G
TOP3 Insulated
(BTA26)
A1
A2
G
TOP3
(BTB26)
BTB26 T25 Unit
600 600 / 800 V
A2
A2
TM: Snubberless is a trademark of STMicroelectronics
July 2007 Rev 10 1/12
www.st.com
12
Characteristics BTA24, BTB24, BTA25, BTA26, BTB26, T25

1 Characteristics

Table 2. Absolute maximum ratings

Symbol Parameter Value Unit
TOP3 Tc = 105° C
2
D
I
T(RMS)
PAK /
TO-220AB
RMS on-state current (full sine wave)
RD91 Ins/ TOP3 Ins.
= 100° C
T
c
= 100° C
T
c
25 A
TO-220AB Ins. Tc = 75° C
I
TSM
²
I
dI/dt
V
DSM/VRSM
I
GM
P
G(AV)
T
stg
T
Table 3. Electrical characteristics (Tj = 25° C, unless otherwise specified), Snubberless and
Non repetitive surge peak on-state current (full cycle, T
tI
²
t Value for fusing tp = 10 ms 340 A²s
initial = 25° C)
j
Critical rate of rise of on-state current I
= 2 x IGT , tr 100 ns
G
Non repetitive surge peak off-state voltage
Peak gate current tp = 20 µs Tj = 125° C 4 A
Average gate power dissipation Tj = 125° C 1 W
Storage junction temperature range Operating junction temperature range
j
F = 50 Hz t = 20 ms 250
F = 60 Hz t = 16.7 ms 260
F = 120 Hz T
= 10 ms Tj = 25° C
t
p
= 125° C 50 A/µs
j
V
DRM/VRRM
+ 100
- 40 to + 150
- 40 to + 125
A
V
° C
logic level (3 quadrants) T25, BTA/BTB24...W, BTA25...W, BTA26...W
Symbol Test Conditions Quadrant
(1)
I
GT
V
GT
V
GD
(2)
I
H
I
L
dV/dt
(dI/dt)c
1. minimum IGT is guaranted at 5% of IGT max.
2. for both polarities of A2 referenced to A1.
VD = 12 V RL = 33 Ω
VD = V
= 125° C
T
j
RL = 3.3 kΩ
DRM
IT = 500 mA MAX. 50 50 75 mA
IG = 1.2 I
(2)
VD = 67 %V
(2)
Without snubber Tj = 125° C MIN. 13 13 22 A/ms
GT
gate open Tj = 125° C MIN. 500 500 1000 V/µs
DRM
I - II - III MAX. 35 35 50 mA
I - II - III MAX. 1.3 V
I - II - III MIN. 0.2 V
2/12
T25 BTA/BTB
T2535 CW BW
I - III
70 70 80
MAX.
II 80 80 100
Unit
mA
BTA24, BTB24, BTA25, BTA26, BTB26, T25 Characteristics
Table 4. Electrical characteristics (Tj = 25° C, unless otherwise specified),
standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B, BTB26...B
Symbol Test Conditions Quadrant Value Unit
(1)
I
GT
I
V
GT
V
GD
(2)
H
VD = 12 V RL = 33 Ω
VD = V
RL = 3.3 kΩ Tj = 125° C ALL MIN. 0.2 V
DRM
)IT = 500 mA MAX. 80 mA
I - II - III
MAX.
IV 100
ALL MAX. 1.3 V
I - III - IV
I
L
dV/dt
(dV/dt)c
1. minimum IGT is guaranted at 5% of IGT max.
2. for both polarities of A2 referenced to A1.

Table 5. Static characteristics

IG = 1.2 I
(2)
VD = 67 %V
(2)
(dI/dt)c = 13.3 A/ms Tj = 125° C MIN. 10 V/µs
GT
II 160
gate open Tj = 125° C MIN. 500 V/µs
DRM
MAX.
Symbol Test Conditions Value Unit
(1)
V
TM
V
t0
R
d
I
DRM
I
RRM
1. for both polarities of A2 referenced to A1.
ITM = 35 A tp = 380 µs Tj = 25° C MAX. 1.55 V
(1)
Threshold voltage Tj = 125° C MAX. 0.85 V
(1)
Dynamic resistance Tj = 125° C MAX. 16 mΩ
Tj = 25° C
V
DRM
= V
RRM
= 125° C 3 mA
T
j
MAX.
50
70
A
mA
mA

Table 6. Thermal resistance

Symbol Parameter Value Unit
TOP 3 0.6
2
D
R
th(j-c)
Junction to case (AC)
PAK / TO-220AB 0.8
RD91 Insulated / TOP3 Insulated 0.9
TO-220AB Insulated 1.7
R
th(j-a)
Junction to ambient
(1)
S = 1 cm
²
D2PA K 4 5
TO-220AB / TO-220AB Insulated 60
1. S = Copper surface under tab.
3/12
° C/W
° C/WTOP3 / TOP3 Insulated 50
Characteristics BTA24, BTB24, BTA25, BTA26, BTB26, T25
Figure 1. Maximum power dissipation versus
RMS on-state current (full cycle)
P(W)
30
25
20
15
10
5
0
0 5 10 15 20 25
I (A)
T(RMS)
Figure 3. D2PAK RMS on-state current versus
ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle)
I (A)
T(RMS)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0 0 25 50 75 100 125
T (°C)
amb
2
DPAK
(S=1cm )
2
Figure 2. RMS on-state current versus case
temperature (full cycle)
I (A)
T(RMS)
30
25
T (°C)
C
BTA24
BTB24 / T25xx /
BTA25 / BTA26
20
15
10
5
0
0 25 50 75 100 125
BTB26
Figure 4. Relative variation of thermal
impedance versus pulse duration
K=[Z /R
1E+0
1E-1
1E-2
1E-3
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
th th
Z
th(j-c)
]
Z
th(j-a)
BTA / BTB24 /T25
Z
th(j-a)
BTA26
t (s)
p
Figure 5. On-state characteristics
(maximum values)
I (A)
TM
300
T max.
j
V = 0.85V
to
R = 16 m
d
100
10
1
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
4/12
T=jT max.
j
Ω
T = 25°Cj.
V (V)
TM
Figure 6. Surge peak on-state current
versus number of cycles
I (A)
TSM
300
250
200
150
100
50
0
Repetitive T =75°C
1 10 100 1000
Non repetitive T initial=25°C
j
C
Number of cycles
t=20ms
One cycle
BTA24, BTB24, BTA25, BTA26, BTB26, T25 Characteristics
Figure 7. Non-repetitive surge peak on-state
current for a sinusoidal pulse with width t value of I
TSM
dI/dt limitation:
22
50A/µs
I (A), I t (A s)
3000
1000
100
0.01 0.10 1.00 10.00
< 10 ms and corresponding
p
2
t
T initial=25°C
j
I
TSM
2
I t
t (ms)
p
Figure 9. Relative variation of critical rate of
decrease of main current versus (dV/dt)c (typical values)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.4
2.2
2.0
1.8
1.6
1.4
B
1.2
1.0
0.8
0.6
0.4
0.1 1.0 10.0 100.0
(dV/dt)c (V/µs)
T2535/CW/BW
Figure 8. Relative variation of gate trigger
current, holding current and latching current versus junction temperature (typical values)
I,I,I[T] /
GT H L j
2.5
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100 120 140
I ,I ,I [T =25°C]
GT H L j
I
GT
IH& I
L
T (°C)
j
Figure 10. Relative variation of critical rate of
decrease of main current versus T
(dI/dt)c [T ] / pecified]
6
5
4
3
2
1
0
0 25 50 75 100 125
(dI/dt)c [T s
j
j
T (°C)
j
j
Figure 11. D2PAK thermal resistance junction to
ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm)
R (°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
0 4 8 12 16 20 24 28 32 36 40
S(cm²)
2
DPAK
5/12
Ordering information scheme BTA24, BTB24, BTA25, BTA26, BTB26, T25

2 Ordering information scheme

Figure 12. BTA and BTB series

BT A 24 - 600 BW RG
Triac series
Insulation
A = insulated B = non insulated
Current
24 = 25 A in TO-220AB 25 = 25 A in RD91 26 = 25 A in TOP3
Voltage
600 = 600 V 800 = 800 V
Sensitivity and type
B = 50 mA Standard BW = 50 mA Snubberless CW = 35 mA
Packing mode
RG = Tube
Snubberless

Figure 13. T25 series

Triac series
Current
25 = 25 A
Sensitivity
35 = 35 mA
Voltage
600 = 600 V 800 = 800 V
Package
2
G = D PAK
Packing mode
Blank = Tube
-TR = Tape and Reel
T 25 35 - 600 G (-TR)
6/12
BTA24, BTB24, BTA25, BTA26, BTB26, T25 Package information

3 Package information

Epoxy meets UL94,V0
Cooling method: C
Recommended torque value: 0.4 - 0.5 Nm (TO-220AB), 0.9 - 1.2 Nm (TOP3 and RD91)
Maximum torque value for BTB24 is 0.5 Nm
Table 7. D
2
PAK dimensions
DIMENSIONS
REF.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A
L2
E
C2
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
L
L3
G
B2
B
A1
2mm min. FLAT ZONE
C
A2
D
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
R
C2 1.21 1.36 0.047 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
V2
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
R 0.40 0.016
V2

Figure 14. D2PAK footprint dimensions (in millimeters)

16.90
10.30
1.30
8.90
7/12
3.70
5.08
Package information BTA24, BTB24, BTA25, BTA26, BTB26, T25

Table 8. RD91 dimensions

DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
L2
A2
L1
A 40.00 1.575
A1 29.90 30.30 1.177 1.193
A2 22.00 0.867
B2
C
C2 C1
A1
B1
B 27.00 1.063
B1 13.50 16.50 0.531 0.650
B2 24.00 0.945
C 14.00 0.551
N2
E3
A
N1
B
F
I
C1 3.50 0.138
C2 1.95 3.00 0.077 0.118
E3 0.70 0.90 0.027 0.035
F 4.00 4.50 0.157 0.177
I 11.20 13.60 0.441 0.535
L1 3.10 3.50 0.122 0.138
L2 1.70 1.90 0.067 0.075
N1 33° 43° 33° 43°
N2 28° 38° 28° 38°
8/12
BTA24, BTB24, BTA25, BTA26, BTB26, T25 Package information

Table 9. TOP3 (insulated and non_insulated) dimensions

DIMENSIONS
REF.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
H
R
ØL
K
G
F
A
B
A 4.4 4.6 0.173 0.181
B 1.45 1.55 0.057 0.061
C 14.35 15.60 0.565 0.614
D 0.5 0.7 0.020 0.028
E 2.7 2.9 0.106 0.114
F 15.8 16.5 0.622 0.650
P
C
G 20.4 21.1 0.815 0.831
H 15.1 15.5 0.594 0.610
JJ
D
E
J 5.4 5.65 0.213 0.222
K 3.4 3.65 0.134 0.144
ØL 4.08 4.17 0.161 0.164
P 1.20 1.40 0.047 0.055
R 4.60 0.181
9/12
Package information BTA24, BTB24, BTA25, BTA26, BTB26, T25

Table 10. TO-220AB (insulated and non-insulated) dimensions

DIMENSIONS
REF.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
B
Ø I
L
A
I4
l3
a1
l2
a2
C
b2
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
F
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
c2
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 2.40 2.70 0.094 0.106
M
b1
e
c1
F 6.20 6.60 0.244 0.259
ØI 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M 2.60 0.102
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
10/12
BTA24, BTB24, BTA25, BTA26, BTB26, T25 Ordering information

4 Ordering information

Table 11. Ordering information

Ordering type Marking Package Weight Base qty Delivery mode
BTA/BTB24-xxxyzRG BTA/BTB24 xxxyz TO-220AB 2.3 g 50 Tube
BTA25-xxxyz BTA25xxxyz RD91 20 g 25 Bulk
BTA26-xxxyRG BTA26xxxyz TOP3 Ins. 4.5 g 30 Tube
BTB26-600BRG BTB26600B TOP3 4.5 g 30 Tube
T2535-xxxG T2535 xxxG
T2535-xxxG-TR T2535 xxxG 1000 Tape and reel
Note: xxx = voltage, y = sensitivity, z = type

5 Revision history

Table 12. Revision history

Date Revision Description of changes
Oct-2002 6A Previous update.
13-Feb-2006 7
31-May-2006 8 Reformatted to current standard. T
31-Jul-2006 9 Typing error corrected on page 1 (BTB124 instead of BTB24)
05-Jul-2007 10
2
PAK 1.5 g
D
50 Tube
TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added.
in figure 3 changed to T
c
amb
Added BTB26-600BRG. Restructured cover page and section 2:
Ordering information scheme on page 6 to simplify product selection.
Thermal resistance values updated in Ta b le 6 and Figure 2. Graphic for I2t updated in Figure 7.
11/12
BTA24, BTB24, BTA25, BTA26, BTB26, T25
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