ST BTA08, BTB08 User Manual

BTA08, BTB08
T810, T835
Snubberless™, logic level and standard 8 A Triacs
Features
On-state rms current, I
Repetitive peak off-state voltage, V
600 to 800 V
Triggering gate current, I
T(RMS)
GT (Q1)
DRM/VRRM
5 to 50 mA
Description
Available either in through-hole or surface-mount packages, the BTA08, BTB08 and T8 triac series is suitable for general purpose AC switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase control operation in light dimmers, motor speed controllers,...
The snubberless versions (BTA/BTB...W and T8 series) are specially recommended for use on inductive loads, thanks to their high commutation performances.
Logic level versions are designed to interface directly with low power drivers such as microcontrollers.
By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500 V
) complying with UL standards (file ref.:
RMS
E81734).
A2
A2
A1
A2
G
D2PAK
(T8-G)
G
A1
A2
A1
A2
G
IPAK
(T8-H)
A2
A1
A2
G
DPAK
(T8-B)
A2
A1
A2
G
TO-220AB Insulated
(BTA08)
A1
A2
G
TO-220AB
(BTB08)
March 2010 Doc ID 7472 Rev 7 1/12
www.st.com
12
Characteristics BTA08, BTB08 and T8 Series

1 Characteristics

Table 1. Absolute maximum ratings

Symbol Parameter Value Unit
I
T(RMS)
On-state rms current (full sine wave)
IPAK/D2PAK/DPAK/ TO-220AB
= 110 °C
T
c
8A
TO-220AB Ins. Tc = 100 °C
I
dI/dt
Non repetitive surge peak on-state current
TSM
(full cycle, T
²
tI²t value for fusing tp = 10 ms 36 A²s
I
Critical rate of rise of on-state current I x I
GT
,
initial = 25 °C)
j
G
F = 50 Hz t = 20 ms 80
F = 60 Hz t = 16.7 ms 84
= 2
F = 120 Hz Tj = 125 °C 50 A/µs
tr 100 ns
I
Peak gate current tp = 20 µs Tj = 125 °C 4 A
GM
P
T
Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified)
Average gate power dissipation Tj = 125 °C 1 W
G(AV)
Storage junction temperature range
stg
T
Operating junction temperature range
j
- 40 to + 150
- 40 to + 125
Snubberless and logic level (3 quadrants)
T8 BTA08 / BTB08
Symbol Test conditions Quadrant
(1)
I
GT
V
V
I
H
VD = 12 V RL = 30 Ω
GT
VD = V
GD
= 125 °C
T
j
(2)
IT = 100 mA MAX. 15 35 10 15 35 50 mA
DRM RL
= 3.3 kΩ
I - II - III MAX. 10 35 5 10 35 50 mA
I - II - III MAX. 1.3 V
I - II - III MIN. 0.2 V
I - III
I
IG = 1.2 I
L
GT
II 30 60 15 30 60 80
T810 T835 TW SW CW BW
25 50 10 25 50 70
MAX.
Unit
A
°C
mA
dV/dt
(dI/dt)c
(2)
VD = 67 %V
(2)
Tj = 125 °C
(dV/dt)c = 0.1 V/µs Tj = 125 °C
Without snubber T
gate open
DRM
MIN. 40 400 20 40 400 1000 V/µs
5.4 - 3.5 5.4 - -
= 125 °C 2.8 - 1.5 2.98 - -
j
= 125 °C - 4.5 - - 4.5 7
j
MIN.
2/12 Doc ID 7472 Rev 7
A/ms(dV/dt)c = 10 V/µs T
BTA08, BTB08 and T8 Series Characteristics

Table 3. Standard (4 quadrants)

BTA08 / BTB08
Symbol Test conditions Quadrant
Unit
CB
(1)
I
GT
V
V
I
H
dV/dt
(dV/dt)c

Table 4. Static characteristics

VD = 12 V, RL = 33 Ω
GT
VD = V
GD
(2)
IT = 500 mA MAX. 25 50 mA
I
IG = 1.2 I
L
(2)
VD = 67 %V
(dI/dt)c = 5.3 A/ms Tj = 125 °C MIN. 5 10 V/µs
(2)
, RL = 3.3 kΩ, Tj = 125 °C ALL MIN. 0.2 V
DRM
GT
gate open Tj = 125 °C MIN. 200 400 V/µs
DRM
I - II - III
IV
MAX.
ALL MAX. 1.3 V
I - III - IV
MAX.
II 80 100
25 50
50
100
40 50
Symbol Test conditions Value Unit
(1)
V
TM
V
R
I
DRM
I
RRM
1. minimum IGT is guaranted at 5% of IGT max.
2. for both polarities of A2 referenced to A1.

Table 5. Thermal resistance

ITM = 11 A, tp = 380 µs Tj = 25 °C MAX. 1.55 V
(2)
Threshold voltage Tj = 125 °C MAX. 0.85 V
t0
(2)
Dynamic resistance Tj = 125 °C MAX. 50 mΩ
d
Tj = 25 °C
V
DRM
= V
RRM
= 125 °C 1 mA
T
j
MAX.
A
mA
mA
Symbol Parameter Value Unit
2
PAK / DPAK / TO-220AB 1.6
°C/W
°C/W
R
R
Junction to case (AC)
th(j-c)
Junction to ambient
th(j-a)
S = 1 cm
S = 0.5 cm
IPAK / D
TO-220AB Insulated 2.5
²
D2PA K 4 5
²
DPAK 70
TO-220AB / TO-220AB Insulated 60
IPAK 100
S = Copper surface under tab.
Doc ID 7472 Rev 7 3/12
Characteristics BTA08, BTB08 and T8 Series
Figure 1. Maximum power dissipation versus
rms on-state current (full cycle)
P(W)
10
9
8
7
6
5
4
3
2
1
0
012345678
I (A)
T(RMS)
Figure 3. On-state rms current versus
ambient temperature (full cycle)
I (A)
T(RMS)
3.5
3.0
2.5
2.0
1.5
DPAK
(S=0.5CM )
1.0
0.5
0.0 0 25 50 75 100 125
printed circuit board FR4, copper thickness: 35 µm
2
DPAK
2
(S=1CM )
2
T (°C)
C
Figure 2. On-state rms current versus case
temperature (full cycle)
I (A)
T(RMS)
10
9
8
7
6
5
4
3
2
1
0
0 25 50 75 100 125
T (°C)
C
BTB / T8
BTA
Figure 4. Relative variation of thermal
impedance versus pulse duration
K=[Z /R
1E+0
1E-1
1E-2
1E-3
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
th th
Z
th(j-c)
]
DPAK/IPAK
Z
th(j-a)
2
TO-220AB/D PAK
Z
th(j-a)
t (s)
p
Figure 5. On-state characteristics
Figure 6. Surge peak on-state current
(maximum values)
I (A)
TM
100
T max.
j
V = 0.85V
to
Ω
R = 50 m
d
10
1
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
T=jT max.
T = 25°Cj.
j
V (V)
TM
4/12 Doc ID 7472 Rev 7
I (A)
TSM
90
80
70
60
50
40
30
20
10
0
1 10 100 1000
versus number of cycles
Non repetitive T initial=25°C
j
Repetitive T =110°C
C
Number of cycles
t=20ms
One cycle
BTA08, BTB08 and T8 Series Characteristics
Figure 7. Non-repetitive surge peak on-state
current for a sinusoidal
I (A), I t (A s)
1000
100
10
0.01 0.10 1.00 10.00
22
TSM
dI/dt limitation:
50A/µs
360°
α
pulse with width t < 10 ms and corresponding value of I t
p
T initial=25°C
j
I
TSM
2
I t
2
t (ms)
p
Figure 9. Relative variation of critical rate of
decrease of main current versus (dV/dt)c (typical values)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.2
TW
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1 1.0 10.0 100.0
Snubberless and Logic level types
T835/CW/BW
T810/SW
(dV/dt)c (V/µs)
Figure 8. Relative variation of gate trigger
current
I,I,I[T] /
GTHL j
2.5
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100 120 140
IH& I
I
GT
L
I ,I ,I [T =25°C]
GTHL j
holding current and latching current
versus junction temperature (typical values)
T (°C)
j
Figure 10. Relative variation of critical rate of
decrease of main current versus (dV/dt)c (typical values)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.1 1.0 10.0 100.0
C
B
(dV/dt)c (V/µs)
Standard types
Figure 11. Relative variation of critical rate of
decrease of main current versus junction temperature
(dI/dt)c [T ] / pecified]
6
5
4
3
2
1
0
0 25 50 75 100 125
(dI/dt)c [T s
j
j
T (°C)
j
Doc ID 7472 Rev 7 5/12
Figure 12. DPAK and D2PAK thermal resistance
junction to ambient versus copper surface under tab
R (°C/W)
th(j-a)
100
90
80
70
60
50
40
2
30
DPAK
20
10
0
0 4 8 1216202428323640
printed circuit board FR4, copper thickness: 35 µm
DPAK
S(cm²)
Package information BTA08, BTB08 and T8 Series
D

2 Package information

Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK
Table 6. D
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
2
PAK dimensions
.
Dimensions
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.30 4.60 0.169 0.181
A
L2
E
C2
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
L
L3
G
B2
B
A1
2mm min. FLAT ZONE
C
R
A2
V2
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069

Figure 13. Footprint (dimensions in mm)

16.90
10.30
8.90
6/12 Doc ID 7472 Rev 7
R 0.40 0.016
V2
5.08
1.30
3.70
BTA08, BTB08 and T8 Series Package information

Table 7. DPAK dimensions

Dimensions
E
B2
L2
H
L4
B
G
0.60 MIN.
A1
A2
V2
A
C2
R
D
R
C

Figure 14. Footprint (dimensions in mm)

Ref.
Millimeters Inches
Min. Max. Min. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2
6.7
6.7 3 3
1.6
2.3
2.3
1.6
Doc ID 7472 Rev 7 7/12
Package information BTA08, BTB08 and T8 Series

Table 8. IPAK dimensions

Dimensions
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A3 0.70 1.30 0.027 0.051
A
E
B2
L2
C2
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
B3 0.95 0.037
B5 0.30 0.035
D
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.019 0.023
H
L1
L
B3
B
V1
A1
D 6 6.20 0.236 0.244
E 6.40 6.60 0.252 0.260
e2.28 0.090
B5
e
G
C
A3
G 4.40 4.60 0.173 0.181
H 16.10 0.634
L 9 9.40 0.354 0.370
L1 0.8 1.20 0.031 0.047
L2 0.80 1 0.031 0.039
8/12 Doc ID 7472 Rev 7
V1 10° 10°
BTA08, BTB08 and T8 Series Package information
TO-220AB (NIns. and Ins. 20-up) dimensions
Dimensions
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
B
Ø I
C
b2
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
L
A
I4
l3
a1
l2
e
a2
b1
F
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
c2
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 2.40 2.70 0.094 0.106
M
F 6.20 6.60 0.244 0.259
c1
ØI 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M2.60 0.102
Doc ID 7472 Rev 7 9/12
Ordering information BTA08, BTB08 and T8 Series

3 Ordering information

Figure 15. Ordering information scheme (BTA08 and BTB08 series)

BT A 08 - 600 BW (RG)
Triac series
Insulation
A = insulated B = non insulated
Current
08 = 8A
Voltage
600 = 600V 800 = 800V
Sensitivity and type
B = 50mA Standard BW = 50mA Snubberless C = 25mA Standard CW = 35mA SW = 10mA Logic Level TW = 5mA Logic Level
Packing mode
RG = Tube

Figure 16. Ordering information scheme (T8 series)

Triac series
Current
8 = 8A
Sensitivity
10 = 10 mA 35 = 35 mA
Voltage
600 = 600 V 800 = 800 V
Packag e
B = DPAK
H = IPAK
2
G = D PAK
2
R = I PAK
Packing mode
Blanck = Tube
-TR = Tape and reel
Snubberless
T 8 10 - 600 B (-TR)

Table 9. Product Selector

Voltage (xxx)
Part Number
600 V 800 V
BTA/BTB08-xxxB X X 50 mA Standard TO-220AB
BTA/BTB08-xxxBW X X 50 mA Snubberless TO-220AB
BTA/BTB08-xxxC X X 25 mA Standard TO-220AB
BTA/BTB08-xxxCW X X 35 mA Snubberless TO-220AB
BTA/BTB08-xxxSW X X 10 mA Logic level TO-220AB
BTA/BTB08-xxxTW X X 5 mA Logic Level TO-220AB
T810-xxxG X X 10 mA Logic Level D
T810-xxxH X X 10 mA Logic Level IPAK
T835-xxxB X X 35 mA Snubberless DPAK
T835-xxxG X X 35 mA Snubberless D
T835-xxxH X X 35 mA Snubberless IPAK
BTB: non insulated TO-220AB package
10/12 Doc ID 7472 Rev 7
Sensitivity Type Package
2
PA K
2
PA K
BTA08, BTB08 and T8 Series Ordering information

4 Ordering information

Table 10. Ordering information

Order code Marking Package Weight Base qty Delivery mode
BTA/BTB08-xxxyzRG BTA/BTB08-xxxyz TO-220AB 2.3 g 50 Tube
T8yy-xxxG T8yyxx
T8yy-xxxG-TR T8yyxx 1000 Tape and reel
T8yy-xxxB T8yyxx
T8yy-xxxB-TR T8yyxx 2500 Tape and reel
T8yy-xxxH T8yyxx IPAK 0.4 g 75 Tube
xxx = voltage, yy = sensitivity, z = type

5 Revision history

Table 11. Document revision history

Date Revision Changes
Apr-2002 5A Last update.
13-Feb-2006 6
10-Mar-2010 7 Updated ECOPACK statement and Figure 16.
D2PAK 1.5 g
50 Tube
75 Tube
DPAK 0.3 g
TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added.
Doc ID 7472 Rev 7 11/12
BTA08, BTB08 and T8 Series
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12/12 Doc ID 7472 Rev 7
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