Low capacitance small signal Schottky diodes
Main product characteristics
I
F
V
RRM
(typ) <1 pF
C
(max) 150° C
T
j
10 mA
15 V
BAS69 Series
BAS69KFILM
(Single)
SOD-523
Features and benefits
■ Low diode capacitance
■ Designed for RF applications
■ Low profile packages
■ Very low parasitic inductor and resistor
Description
The BAS69 series use 15V barrier, with extremely
low junction capacitance, suitable for the
detection of an RF signal and the compensation
of the voltage drift with the temperature. The
presented packages make the device ideal in
applications where space saving is critical.
The low junction capacitance will reduce the
disturbance on the RF signal.
Order codes
Part Number Marking
BAS69WFILM 23
BAS69-04WFILM 24
BAS69-05WFILM 25
BAS69-06WFILM 26
BAS69KFILM 65
BAS69-09P6FILM 69
BAS69-07P6FILM 67
SOT-323
SOT-666
BAS69WFILM
(Single)
BAS69-05WFILM
(Common cathode)
BAS69-06WFILM
(Common anode)
BAS69-04WFILM
(Series)
BAS69-07P6FILM
(2 parallel diodes)
BAS69-09P6FILM
(2 opposite diodes)
Configurations in top view
July 2006 Rev 1 1/9
www.st.com
Characteristics BAS69 Series
1 Characteristics
Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Symbol Parameter Value Unit
V
RRM
I
I
FSM
T
T
1. Pulse test: tp = 380 µs, δ < 2 %
Table 2. Thermal parameters
Repetitive peak reverse voltage 15 V
Continuous forward current 10 mA
F
Surge non repetitive forward current Half wave, single phase 60 Hz 2 A
Storage temperature range -65 to +150
stg
Maximum operating junction temperature
j
Maximum soldering temperature
L
(1)
(1)
150
260
Symbol Parameter Value Unit
R
th(j-a)
1. Epoxy printed circuit board with recommended pad layout
Table 3. Static electrical characteristics
Junction to ambient
(1)
SOT-323 550
° C/W
SOD-523, SOT-666 600
Symbol Parameter Test conditions Min. Typ Max. Unit
° CT
(1)
I
R
V
F
1. Pulse test: tp ≤ 250 ms, δ ≤ 2 %
Table 4. Dynamic characteristics
Reverse leakage current
(1)
Forward voltage drop
Symbol Parameter
C Diode capacitance V
R
Forward resistance IF = 5 mA, F = 100 MHz 15 Ω
F
L
Series inductance 1.5 nH
S
T
= 25° C
j
= 125° C 6 30
T
j
T
= 25° C
j
T
= 125° C 10 100
j
T
= 25° C
j
T
= 125° C 230 260
j
T
= 25° C
j
= 125° C 460 510
T
j
= 0 V, F = 1 MHz 1.0 pF
R
V
= 1 V
R
= 15 V
V
R
= 1 mA
I
F
I
= 10 mA
F
Test conditions
350 380
500 570
Min. Typ Max. Unit
0.035
0.23
µA
mV
2/9
BAS69 Series Characteristics
Figure 1. Forward voltage drop versus
forward current (typical values)
I (mA)
FM
1.E+02
1.E+01
Tj=125°CTj=125°C
1.E+00
1.E-01
Tj=85°CTj=85°C
Tj=25°CTj=25°C
Tj=-40°CTj=-40°C
V (V)
FM
0.0 0.2 0.4 0.6 0.8 1.0 1.2
Figure 3. Differential forward resistance
versus forward current (typical
values)
R( )FΩ
100
10
I (mA)
1
1.0 10.0 100.0
F
F=10kHz
Tj=25°C
Figure 2. Reverse leakage current versus
reverse voltage applied (typical
values)
I (µA)
R
1.E+02
Tj=125°C
1.E+01
1.E+00
Tj=85°C
1.E-01
1.E-02
Tj=25°C
V (V)
1.E-03
R
0.0 2.5 5.0 7.5 10.0 12.5 15.0
Figure 4. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.0 2.5 5.0 7.5 10.0 12.5 15.0
V (V)
R
F=1MHz
Vosc=30mV
Tj=25°C
RMS
Figure 5. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOT-323)
Z
th(j-a)/Rth(j-a)
1.E+00
1.E-01
1.E-02
1.E-03
Single pulse
SOT-323
Epoxy FR4
=2.25 mm²
S
CU
=35 µm
e
(s)t
P
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
CU
Figure 6. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOT-666)
Z
th(j-a)/Rth(j-a)
1.E+00
Single pulse
SOT-666
1.E-01
Epoxy FR4
e
=35 µm
(s)t
1.E-02
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
P
3/9
CU
Ordering information scheme BAS69 Series
Figure 7. Relative variation of thermal
Figure 8. Thermal resistance junction to
impedance junction to ambient
versus pulse duration (SOD-523)
Z
th(j-a)/Rth(j-a)
1.E+00
Single pulse
SOD-523
1.E-01
1.E-02
Epoxy FR4
=35 µm
e
(s)t
1.E-03
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
P
CU
R (j-a)
th
600
550
500
450
400
350
300
0 5 10 15 20 25 30 35 40 45 50
2 Ordering information scheme
ambient versus copper surface
under each lead (printed circuit
board, epoxy FR4 - SOT-323)
S (mm²)
CU
Signal Schottky diodes
V= 15V
RRM
Configuration
No letter = Single diode
Series diodes
04 =
05 = Common cathode
Common anode
06 =
07 = Parallel diodes
09 = Opposite diodes
Package
W = SOT-323
K = SOD-523
P6 = SOT-666
Packing
FILM = Tape and reel
BAS69 xx xx FILM
4/9
BAS69 Series Package information
3 Package information
Epoxy meets UL94, V0
Table 5. SOD-523 dimensions
Dimensions
Ref.
A 0.50 0.60 0.70 0.020 0.024 0.028
E 1.50 1.60 1.70 0.059 0.063 0.067
E1 1.10 1.20 1.30 0.043 0.047 0.051
D 0.70 0.80 0.90 0.028 0.031 0.035
b 0.25 0.35 0.010 0.014
SEATING PLANE
0.15
M
E
E1
2xb
0.20CCAABB
M
A
C
B
D
A
R0.1
L
c
8°
7°
c 0.07 0.20 0.003 0.008
L1
L 0.15 0.20 0.25 0.006 0.008 0.010
L1 0.10 0.20 0.004 0.008
Figure 9. SOD-523 footprint (dimensions in mm)
0.7
0.3
2
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
5/9
Package information BAS69 Series
Table 6. SOT-323 dimensions
Dimensions
Ref.
A
E
Min. Typ. Max. Min. Typ. Max.
A 0.8 1.1 0.031 0.043
e
b
A1
A1 0.0 0.1 0.0 0.004
D
b 0.25 0.4 0.010 0.016
c 0.1 0.26 0.004 0.010
D 1.8 2.0 2.2 0.071 0.079 0.086
E 1.15 1.25 1.35 0.045 0.049 0.053
c
θ
L
H
e 0.65 0.026
H 1.8 2.1 2.4 0.071 0.083 0.094
L 0.1 0.2 0.3 0.004 0.008 0.012
q 0 30° 0 30°
Figure 10. SOT-323 footprint (dimensions in mm)
0.95
Millimeters Inches
1.0
0.500.8
2.9
6/9
BAS69 Series Package information
Table 7. SOT-666 dimensions
Dimensions
b1
L1
L3
Ref.
A 0.45 0.60 0.018 0.024
A3 0.08 0.18 0.003 0.007
b
b 0.17 0.34 0.007 0.013
D
A
E1
b1 0.19 0.27 0.34 0.007 0.011 0.013
D 1.50 1.70 0.059 0.067
L2
E
A3
E 1.50 1.70 0.059 0.067
E1 1.10 1.30 0.043 0.051
e 0.50 0.020
L1 0.19 0.007
L2 0.10 0.30 0.004 0.012
e
L3 0.10 0.004
Figure 11. SOT-666 footprint (dimensions in mm)
0.50
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
0.62
2.60
0.99
0.30
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
7/9
Ordering information BAS69 Series
4 Ordering information
Part Number Marking Package Weight Base qty Delivery mode
BAS69WFILM 23 SOT-323 Single 6 mg 3000 Tape and reel
BAS69-04WFILM 24 SOT-323 Series 6 mg 3000 Tape and reel
BAS69-05WFILM 25
BAS69-06WFILM 26
BAS69KFILM 65 SOD-523 Single 1.4 mg 3000 Tape and reel
BAS69-09P6FILM 69 SOT-666 Opposite 2.9 mg 3000 Tape and reel
BAS69-07P6FILM 67 SOT-666 Parallel 2.9 mg 3000 Tape and reel
5 Revision history
Date Revision Description of Changes
24-Jul-2006 1 First issue
SOT-323
Common cathode
SOT-323
Common anode
6 mg 3000 Tape and reel
6 mg 3000 Tape and reel
8/9
BAS69 Series
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9/9
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