ST AN3302 Application note

AN3302

Application note

Monolithic power management for high definition ODD with true shutdown, reset, and programmable step-up voltage

Introduction

Blu-ray disc players have grown rapidly in popularity due to the increasing availability of digital services and high definition digital media content.

This application note describes how to use STODDO1, a complete power management for BIu-ray disc players, based on high density optical storage devices. It integrates two stepdown converters and one step-up.

The step-down converters are optimized for powering Iow-voltage digital core, up to 0.8 A, in ODD applications and, generally, to replace a high current linear solution when the power dissipation may cause an overheating of the application environment.

The step-up provides the needed voltage for supplying the blue laser in mobile applications where only 5 V is available. The output voltage is programmable, by using S-wire protocol, in the range of 6.5 V to 14 V, with a current capability of 0.7 A.

Figure 1. Blu-ray disc player power management architecture based on STODD01

 

 

 

BLUE Laser Driver

 

 

 

 

 

 

6 to 12 V

 

 

 

 

Reset

Reset IC

 

 

with

 

 

 

 

 

 

DSP

 

 

 

 

 

1.2 V

Step Down

Step Up

 

Connector

 

 

5 V

Power

 

 

 

 

ADJ 700 mA

ADJ 800mA

 

 

 

DRAM

3.3 V

Step Down

5 V

 

 

 

 

 

 

 

 

 

3.3 V 700 mA

 

 

Flash

 

STODD01

 

ATA

 

 

 

 

 

5 V

 

 

 

 

 

Motor

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Motors

 

Control IC

 

 

AM07854v1

 

 

 

 

 

The integrated low RDSon, for N-channel and P-channel MOSFET switches, contributes to obtaining high efficiency.

The enable function for the step-up section, and reset function for monitoring the input voltage, make the device particularly suitable for optical storage applications.

The high switching frequency (1.2 MHz typ.) allows the use of tiny surface-mounted components. Furthermore, a low output ripple is guaranteed by the current mode PWM topology and by the use of X7R or X5R and low ESR SMD ceramic capacitors.

The device includes soft-start control, thermal shutdown, and peak current limit, to prevent damage due to accidental overload.

January 2011

Doc ID 18163 Rev 1

1/13

www.st.com

Contents

AN3302

 

 

Contents

1

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3

2

Recommended PCB Iayout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4

 

2.1

Layout considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4

 

2.2

Programming the output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5

3

Test results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6

3.1 S-wire protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 Inductor selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.3 Input and output capacitor selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12

2/13

Doc ID 18163 Rev 1

AN3302

Block diagram

 

 

1 Block diagram

Figure 2. Block diagram and reference circuit

C1

L1

 

 

 

 

VIN

 

 

 

 

 

 

STODD01

 

SW1

Out1

 

 

 

 

 

 

 

 

 

VIN_A

 

 

 

R1

 

VOUT1

C3

Step Up

FB1

C4

 

 

6.5V-14V

 

 

 

 

 

 

 

R2

 

 

EN

 

 

SW2

L2

 

 

S-Wire

 

 

FB2

 

 

VOUT2

 

 

 

C5

3.3V

 

Step Down

 

TX

 

 

 

 

 

VIN_P

 

 

SW3

 

 

 

 

 

 

L3

 

 

C2

 

 

 

R3

 

VOUT3

R5

 

 

FB3

 

 

 

 

 

Reset

 

 

 

 

 

 

Step Down

 

0.8V-0.94*Vin

Reset

 

 

 

 

C6

 

Reset

 

 

 

 

 

GND

GND

GND

R4

 

 

GND

 

 

 

 

 

 

 

 

 

 

AM07856v1

Table 1. List of external components (1)

Component

Manufacturer

Part number

Value

Size

 

 

 

 

 

C1, C2, C3

Murata

GRM21BR61A1O6KE19L

10 µF

0805

 

 

 

 

 

C4, C5, C6

Murata

GRM32ER61C226KE2OL

22 µF

1210

 

 

 

 

 

L1

Coilcraft

LPS6225-472MLB

4.7 µH

6 x 6 x 2.5

 

 

 

 

 

L2, L3

Coilcraft

LPS4O18-332MLB

3.3 µH

4.1 x 4.1 x 1.8

 

 

 

 

 

R1

 

33 kΩ (VOUT1 = 8.8 V)

(2)

0603

R2

 

3.3 kΩ

 

0603

 

 

 

 

 

R3

 

27 kΩ (VOUT3 = 1.2 V)

(3)

0603

R4

 

47 kΩ

 

0603

 

 

 

 

 

R5

 

100 kΩ

(4)

0603

 

 

 

 

 

If the S-wire function Is not used, the TX pin must be connected to GND. List of external components (1)

1.Components listed above refer to a typical application. Operation of the STODD01 is not limited to the choice of these external components.

2.R1 and R2 are calculated according to the following formula: R1 = R2 (VOUT1 / VFB1-1)

It is recommended to use resistors with values in the range of 1 kΩ to 50 kΩ.

3.R3 and R4 are calculated according to the following formula: R3 = R4 (VOUT3 / VFB3-1) It is recommended to use resistors with values in the range of 1 kΩ to 50 kΩ.

4.It is recommended to use resistors with values in the range of 100 kΩ to 1 MΩ.

Doc ID 18163 Rev 1

3/13

ST AN3302 Application note

Recommended PCB Iayout

AN3302

 

 

2 Recommended PCB Iayout

Figure 3. Recommended PCB layout

AM07857v1

2.1Layout considerations

The layout is an important design step for all switching power supplies due to the high switching frequency and peak current. If the layout is not performed carefully, important parameters such as efficiency and output voltage ripple may be out of specification.

Short, wide traces must be implemented for the main current and for power ground paths. The input capacitor must be placed as close as possible to the IO pins as well as the inductor and output capacitor.

The feedback pin (FB) connection to the external resistor divider is a high impedance node, so interference can be minimized by placing the routing of the feedback node as far as possible from the high current paths. To reduce pick-up noise, the resistor divider must be placed very close to the device.

A common ground node minimizes ground noise. The exposed pad of the package must be connected to the common ground node.

4/13

Doc ID 18163 Rev 1

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