ST AN2684 APPLICATION NOTE
AN2684
Application note
STEVAL-IFP006V1: designing with VNI4140K quad high-side
smart power solid-state relay ICs
Introduction
The STEVAL-IFP006V1 demonstration board has been developed to show the new
VNI4140K device functionalities within industrial applications such as PLCs (programmable
logic controllers) which drive lamps, valves, relays, and similar loads.
This tool allows evaluating VNI4140K features, in particular all kinds of embedded selfprotections, power-handling capabilities, operation and diagnostic feedback, thermal
behavior and conformity to inherent IEC standards.
Figure 1. STEVAL-IFP006V1
A double-sided PCB allows obtaining the best trade-off between a routing solution and
thermal management results.
The main features of the demonstration board are:
■ Four output channels (4 x 0.7 A)
■ Four input channels
■ Four feedback channels for diagnostic purposes
■ Bidirectional opto-isolated interface for MCU safe connection
■ TTL/CMOS compatible signals for MCU direct connection
■ LEDs to indicate output state
■ Compliance to IEC61000-4-4 and IEC61000-4-5
May 2009 Doc ID 14266 Rev 1 1/21
■ Compatibility with existing STMicroelectronics tools (IBU communication board,
CANIC10…)
■ 10.5 V to 36 V DC power supply voltage range
www.st.com
Contents AN2684
Contents
1 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Safety precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 VNI4140K quad high-side smart power solid-state relay IC
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 IFP006V1 demonstration board description . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 IFP006V1 schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.3 IFP006V1 connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.4 IFP006V1 thermal management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.5 EMC immunity test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.5.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.5.2 Test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.5.3 Burst immunity test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.5.4 Surge test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Appendix A Bill of material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Appendix B PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Appendix C References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2/21 Doc ID 14266 Rev 1
AN2684 List of figures
List of figures
Figure 1. STEVAL-IFP006V1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. IFP006V1 top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. IFP006V1 bottom view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 5. IFP006V1 schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 6. J1 connector pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 7. J5 connector pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 8. IFP006V1 PCB copper heatsink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 9. Thermal map in steady state condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 10. Thermal map in demagnetization condition (1 Hz repetitive cycling on 48 W 1.2 H load) . 11
Figure 11. Steady state thermal behavior 3D simulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 12. Repetitive demagnetization thermal behavior 3D simulation (1 Hz repetitive cycling on
48 W 1.2 H load) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 13. Burst timing waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 14. Surge standard timing waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 15. IFP006V1 component layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 16. IFP006V1 copper top layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 17. IFP006V1 copper bottom layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Doc ID 14266 Rev 1 3/21
Electrical characteristics AN2684
1 Electrical characteristics
The electrical characteristics of the VNI4140k demonstration board (STEVAL-IFP006V1)
are given in Tab l e 1 .
Table 1. STEVAL-IFP006V1 electrical characteristics
Parameter Value Notes
Min Typ Max
Operating conditions
Ambient operating temperature 85 °C
If the VNI4140K junction temperature
exceeds 180 °C, device shuts down
Power supply
Vcc supply voltage 10.5 V 24 V 36 V
Vdd logic supply voltage 5 V From eval communication board
250 µA All channels in OFF state
Supply current on Vdd
2.4 mA 4.8 mA ON state with V
= 5 V
in
Output stage
Output channel ON current limitation 0.7 A 1.7 A
IC internally limited
V
CC = 24 V; RLOAD < 10 mΩ
Maximum DC output current 1.4 A Dynamic load
dV/dt(ON) turn-on voltage slope 0.7 V/µs IOUT = 0.5 A, resistive load
(off) turn-off voltage slope 1.5 V/µs IOUT = 0.5 A, resistive load
dV/dt
Demagnetization protection
Output voltage on inductive turn-off V
CC-41 VCC-45 VCC-50 IOUT = 0.5 A; LLOAD >= 1 mH
4/21 Doc ID 14266 Rev 1
AN2684 Safety precautions
2 Safety precautions
The board must be used only by expert technicians. The copper areas around the
VNI4140K device have a heat sink function, visible in the top layer layout view, refer to
Figure 8. In case of short-circuit, current limiting or hard demagnetization, the STEVAL-
IFP006V1 board, or part of it, might reach a very high temperature with consequent danger.
No specific protections are implemented for reverse DC accidental connection. Remember
that an electrolytic capacitor is connected to the supply bus, therefore a reverse continuous
DC voltage applied to it may produce a dangerous explosion.
Warning: ST assumes no responsibility for any consequences which
may result from the improper use of this tool.
Doc ID 14266 Rev 1 5/21
VNI4140K quad high-side smart power solid-state relay IC description AN2684
3 VNI4140K quad high-side smart power solid-state
relay IC description
The VNI4140k is a monolithic 4-channel driver featuring a very low supply current. The IC,
which uses STMicroelectronics VIPower technology, is intended for driving loads with one
side connected to ground.
Active channel current limitation, combined with thermal shutdown (independent for each
channel) and automatic restart, protect the device against overload.
The main features of the VNI4140K IC are:
● Output current: 0.7 A per channel
● Shorted load protections for each channel
● Junction overtemperature protection
● Case overtemperature protection for thermal independence of the channels
● Thermal case shutdown and restart not simultaneous for the various channels
● Protection against ground disconnection
● Current limitation
● Undervoltage shutdown
● Open drain diagnostic outputs
● 3.3 V CMOS/TTL compatible inputs
● Fast demagnetization of inductive loads
● Conforms to IEC 61131-2
Figure 2. Block diagram
Active current limitation avoids that the system power supply drops in case of shorted load.
In overload condition, the channel turns OFF and back ON automatically after the IC
temperatures decrease below a threshold fixed by a temperature hysteresis so that junction
6/21 Doc ID 14266 Rev 1
AN2684 VNI4140K quad high-side smart power solid-state relay IC description
temperature is controlled. If this condition makes the case temperature reach the case
temperature limit (T
has exceeded the junction protection threshold, T
protection reset threshold, T
only when the case temperature decreases below the case protection reset threshold (T
), overloaded channels (i.e. the ones for which junction temperature
CSD
) are turned OFF. These channels restart, non-simultaneously,
jR
, and has not fallen below the junction
jSD
CR
).
Non-overloaded channels continue to operate normally.
The open drain diagnostic outputs indicate related channel overtemperature conditions.
Doc ID 14266 Rev 1 7/21
Loading...