ST AN2684 APPLICATION NOTE

AN2684

Application note

STEVAL-IFP006V1: designing with VNI4140K quad high-side smart power solid-state relay ICs

Introduction

The STEVAL-IFP006V1 demonstration board has been developed to show the new VNI4140K device functionalities within industrial applications such as PLCs (programmable logic controllers) which drive lamps, valves, relays, and similar loads.

This tool allows evaluating VNI4140K features, in particular all kinds of embedded selfprotections, power-handling capabilities, operation and diagnostic feedback, thermal behavior and conformity to inherent IEC standards.

Figure 1. STEVAL-IFP006V1

A double-sided PCB allows obtaining the best trade-off between a routing solution and thermal management results.

The main features of the demonstration board are:

■Four output channels (4 x 0.7 A)

■Four input channels

■Four feedback channels for diagnostic purposes

■Bidirectional opto-isolated interface for MCU safe connection

■TTL/CMOS compatible signals for MCU direct connection

■LEDs to indicate output state

■Compliance to IEC61000-4-4 and IEC61000-4-5

■Compatibility with existing STMicroelectronics tools (IBU communication board, CANIC10…)

■10.5 V to 36 V DC power supply voltage range

May 2009

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www.st.com

Contents	AN2684

Contents

1	Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		. 4
2	Safety precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		. 5
3	VNI4140K quad high-side smart power solid-state relay IC
	description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		6
4	IFP006V1 demonstration board description . . . . . . . . . . . . . . . . . . . . . .		8
	4.1	Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	8
	4.2	IFP006V1 schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	9
	4.3	IFP006V1 connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	10
	4.4	IFP006V1 thermal management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	11
	4.5	EMC immunity test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	12

4.5.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.5.2 Test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.5.3 Burst immunity test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.5.4 Surge test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Appendix A Bill of material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Appendix B PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Appendix C References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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AN2684	List of figures

List of figures

Figure 1. STEVAL-IFP006V1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 2. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. IFP006V1 top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 4. IFP006V1 bottom view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 5. IFP006V1 schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 6. J1 connector pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 7. J5 connector pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 8. IFP006V1 PCB copper heatsink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 9. Thermal map in steady state condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 10. Thermal map in demagnetization condition (1 Hz repetitive cycling on 48 W 1.2 H load) . 11 Figure 11. Steady state thermal behavior 3D simulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 12. Repetitive demagnetization thermal behavior 3D simulation (1 Hz repetitive cycling on

48 W 1.2 H load). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 13. Burst timing waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 14. Surge standard timing waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 15. IFP006V1 component layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 16. IFP006V1 copper top layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 17. IFP006V1 copper bottom layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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Electrical characteristics	AN2684

1 Electrical characteristics

The electrical characteristics of the VNI4140k demonstration board (STEVAL-IFP006V1) are given in Table 1.

Table 1.	STEVAL-IFP006V1 electrical characteristics
	Parameter			Value			Notes
			Min	Typ		Max
			Operating conditions
Ambient operating temperature						85 °C	If the VNI4140K junction temperature
							exceeds 180 °C, device shuts down
			Power supply
	Vcc supply voltage		10.5 V	24 V		36 V
	Vdd logic supply voltage			5 V			From eval communication board
	Supply current on Vdd			250 µA			All channels in OFF state
				2.4 mA		4.8 mA	ON state with Vin = 5 V
			Output stage
Output channel ON current limitation			0.7 A			1.7 A	IC internally limited
							VCC = 24 V; RLOAD < 10 mΩ
Maximum DC output current				1.4 A			Dynamic load
dV/dt(ON) turn-on voltage slope				0.7 V/µs			IOUT = 0.5 A, resistive load
dV/dt(off) turn-off voltage slope				1.5 V/µs			IOUT = 0.5 A, resistive load
		Demagnetization protection
Output voltage on inductive turn-off			VCC-41	VCC-45		VCC-50	IOUT = 0.5 A; LLOAD >= 1 mH

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AN2684	Safety precautions

2 Safety precautions

The board must be used only by expert technicians. The copper areas around the VNI4140K device have a heat sink function, visible in the top layer layout view, refer to Figure 8. In case of short-circuit, current limiting or hard demagnetization, the STEVALIFP006V1 board, or part of it, might reach a very high temperature with consequent danger.

No specific protections are implemented for reverse DC accidental connection. Remember that an electrolytic capacitor is connected to the supply bus, therefore a reverse continuous DC voltage applied to it may produce a dangerous explosion.

Warning: ST assumes no responsibility for any consequences which may result from the improper use of this tool.

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VNI4140K quad high-side smart power solid-state relay IC description	AN2684

3VNI4140K quad high-side smart power solid-state relay IC description

The VNI4140k is a monolithic 4-channel driver featuring a very low supply current. The IC, which uses STMicroelectronics VIPower technology, is intended for driving loads with one side connected to ground.

Active channel current limitation, combined with thermal shutdown (independent for each channel) and automatic restart, protect the device against overload.

The main features of the VNI4140K IC are:

●Output current: 0.7 A per channel

●Shorted load protections for each channel

●Junction overtemperature protection

●Case overtemperature protection for thermal independence of the channels

●Thermal case shutdown and restart not simultaneous for the various channels

●Protection against ground disconnection

●Current limitation

●Undervoltage shutdown

●Open drain diagnostic outputs

●3.3 V CMOS/TTL compatible inputs

●Fast demagnetization of inductive loads

●Conforms to IEC 61131-2

Figure 2. Block diagram

Active current limitation avoids that the system power supply drops in case of shorted load. In overload condition, the channel turns OFF and back ON automatically after the IC temperatures decrease below a threshold fixed by a temperature hysteresis so that junction

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AN2684	VNI4140K quad high-side smart power solid-state relay IC description

temperature is controlled. If this condition makes the case temperature reach the case temperature limit (TCSD), overloaded channels (i.e. the ones for which junction temperature has exceeded the junction protection threshold, TjSD, and has not fallen below the junction protection reset threshold, TjR) are turned OFF. These channels restart, non-simultaneously, only when the case temperature decreases below the case protection reset threshold (TCR). Non-overloaded channels continue to operate normally.

The open drain diagnostic outputs indicate related channel overtemperature conditions.

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