ST AN2479 APPLICATION NOTE

AN2479
Application note
STA333ML demo board application note
Introduction
The purpose in this document is:
to describe how to connect the STA333ML demo board,
how to evaluate the demo board performance with electrical curve data,
Application note can be configured to the 2.0 channels only. Both of the 2 channels are in BTL mode. Each channel can deliver 20 W @ THD = 10% when Vcc = 18V and 8 load. It is a total solution for the digital audio power amplifier in a TV application.
All the test items and graph data in this document are measured by audio precision equipment. The test data shown in this document contains, for example, output power versus Vcc, frequency response, THD+N versus frequency, THD+N versus output power, FFT.
December 2006 Rev 1 1/42
www.st.com
Contents AN2479
Contents
1 Test condition and connection of demo board . . . . . . . . . . . . . . . . . . . 3
1.1 Test condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1.1 Jumper, power supply, signal and interface setting . . . . . . . . . . . . . . . . . 3
1.1.2 Output configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Equipment requirement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Connection method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.3.1 Speaker jack connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.3.2 Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.4 PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.4.1 Top view of PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.4.2 Bottom view of PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.5 BOM list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.5.1 Test connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2 Test curve report . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Frequency Response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2 THD versus frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.2.1 THD versus output power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3 FFT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.4 Cross talk . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3 Design guideline for PCB schematic and layout . . . . . . . . . . . . . . . . . 28
3.1 Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.1.1 Main driver for components selection . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.2 Decoupling capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.2.1 Output filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.3 Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
2/42
AN2479 Test condition and connection of demo board

1 Test condition and connection of demo board

1.1 Test condition

1.1.1 Jumper, power supply, signal and interface setting

1. JP1: format selection. 0
2. JP2: oversampling selection. 0 = 256 Fs, 1 = 384 Fs.
3. JP3: gain selection. 0 = 0 dB, 1 = +24 dB.
4. +3.3 V selection. Outer side = external +3.3 V, inner side = internal +3.3 V
5. Connect + voltage of 12 V DC power supply to +Vcc pin and negative to GND.
6. Connect + voltage of 3.3 V DC power supply to +3.3 V pin and negative to GND. If the +3.3 V selection is set to the inner side, do not connect this wire.
7. Connect GUI AP interface board to the J3 connector of STA333ML demo board.
8. Connect the S/PDIF signal cable to the RCA jack on the interface board, The input coming from the signal source such as Audio precision or DVD player.
9. The voltage range of the DC power supply for Vcc is from 5 V to 18 V.
(a)
= I2S, 1
(a.)
= left justified.

1.1.2 Output configuration

STA333ML demo board can be configured to 2.0 channels and do not require software control. It is not necessary to connect the AP interface to the PC. When the power supply, signal, interface and output have been setup, push the RESET button which allows the STA333ML demo board to function.

1.2 Equipment requirement

Audio Precision (System 2700) by AP Co., USA)
DC power supply (With 5V to 18V)
Digital oscilloscope (TDS3034B) by Tektronix
PC
a. 0: connect to outer side, 1: connect to inner side.
3/42
Test condition and connection of demo board AN2479

1.3 Connection method

Top view of demo board.

Figure 1. Block diagram

External 3.3 V (not required if +3.3 V selection is set to internal)
+3.3 V selection
Vcc (5-18 V)
L_CH output
Connect to interface board
Oversampling selection
Gain selection

1.3.1 Speaker jack connection

Figure 2. Block diagram
R_CH output
Format selection
L_CH outputR_CH output
4/42
AN2479 Test condition and connection of demo board

1.3.2 Schematic

Figure 3. Schematic diagram

1.4 PCB Layout

1.4.1 Top view of PCB layout

Figure 4. Top layout
5/42
Test condition and connection of demo board AN2479

1.4.2 Bottom view of PCB layout

Figure 5. Bottom layout

1.5 BOM list

Table 1. BOM

Item
no.
1 CCAP CCAP0603 100 n, 50 V, +/- 10 % 18
2 CCAP CCAP0603 1 n, 50 V, +/- 10 % 1 C5 Murata
3 CCAP CCAP0603 4.7 n, 50 V, +/- 10 % 1 C8 Murata
4 CCAP CCAP0603 680 p, 50 V, +/- 5 % 1 C9 Murata
5 CCAP CCAP0603 330 p, 50 V, +/- 10 % 2 C15, C21 Murata
6 CCAP CCAP0603 10 n, 50 V, +/- 10 % 6 C27, C28, C29, C30, C31, C32 Murata
7 CCAP CCAP1206 1 µ, 50 V 2 C13, C14 Murata
8 ECAP D = 10 mm 1000 µ, 25 V 1 C10 Rubycon
9ECAP D = 7mm22µ, 16 V 1 C33 Rubycon
10 ECAP D = 5 mm 2.2 µ, 25 V 1 C36 Rubycon
11 Chip bead L0805 600 ohm @ 100 MHz 2 BD1, BD2 Murata
12 CRES R0603 10 k +/- 5 % 2 R1, R3 Murata
13 CRES R0603 0 ohm +/- 5 % 1 R2 Murata
14 CRES R0603 2.2 k +/- 5 % 1 R4 Murata
15 CRES R1206 22 ohm +/- 5 % 2 R5, R8 Murata
Type Package Description Qty Reference code Manufacturer
C1, C2, C3, C4, C6, C7, C11, C12, C16, C17, C18, C19, C22, C23, C24, C25, C34, C35
Murata
16 CRES R1206 6.2 ohm +/- 5 % 4 R6, R7, R9, R10 Murata
6/42
AN2479 Test condition and connection of demo board
Table 1. BOM
Item
no.
17 Test point Through hole 1 x 5 2.54 mm pitch 1 J2 Any source
18 Connector Through hole
19 Jumper Through hole 1 x 3 2.54 mm pitch 4 JP1, JP2, JP3, JP4 Any source
20 IC Through hole STA333ML 1 U1 ST
21 CAP Through hole 470 n 2 C20, C26
22 Connector Through hole WP4-15 1 J1 Song Cheng
23 Connector Through hole FFKDS/H1-5.08 3 J5, J6, J7
24 Connector Through hole FFKDSA1/H1-7.62 1 J4
25 COIL Through hole 22 µH 4 L1, L2, L3, L4 Kwang Sung
26
Type Package Description Qty Reference code Manufacturer
Ta c t switch
2 x 8 2.54 pitch male connector
Through hole 6 x 6 Tact switch 1 SW
1 J3 Any source
Phoenix contact
Phoenix contact

1.5.1 Test connection

Figure 6. Block diagram of test equipment
Output
to AP
STA333ML
demo board
From 5 V to 18 V
Audio precision equipment
S/PDIF
signal
2
I
S signal
Digital oscilloscope
TDS3034B Tektronix
(DC3V3)
(DC7V)
7V for LPT B’D
DC power supply
Monitor
AP interface
7/42
Test curve report AN2479

2 Test curve report

Figure 7. Efficiency versus output power

Efficiency
100.00
90.00
80.00
70.00
60.00
η(%)
50.00
40.00
30.00
20.00
10.00
0.00 1 2 3 4 5 6 7 8 9 1011121314151617181920
Condition: R LOAD =8 ohm; VCC=18 V

Figure 8. Output power versus Vcc

Output Power@1%THD vs. Vcc
30 25 20 15 10
5
Output Power (W)
0
5 6 7 8 9 10 11 12 13 14 15 16 17 18
Vcc (V)
Output Power (W)
Rl=8 Ohm Rl=6 Ohm Rl=4 Ohm
8/42
AN2479 Test curve report
A
k
k

Figure 9. Output power@10% THD vs. supply voltage

Output Power@10%THD vs. Vcc
35 30 25 20 15 10
5
Output Power (W)
0
5 6 7 8 9 101112131415161718
Vcc (V)
Rl=8 Ohm Rl=6 Ohm Rl=4 Ohm

2.1 Frequency Response

Figure 10. 18 V 4 ohm 0 dB: Pout = 1 W@ 1 KHz filter: L = 10 uH, C = 1 uF

+3
+2
+1
d B
+0
r
-1
-2
-3 20
50 100 200 500 1k 2k 5k 10
20
Hz
9/42
Test curve report AN2479
r
A
k
k5k10k
z
+3
A
k

Figure 11. 18 V 6 Ohm 0 dB: Pout = 1 W @ 1 KHz filter: L = 15 uH, C = 680 nF

+3
+2
+1
d B
+0
-1
-2
-3 20 20
50 100 200 500 1k2
H

Figure 12. 18 V 8 Ohm 0 dB: Pout = 1 W @ 1 KHz filter: L = 22 uH, C = 470 nF

+2
+1
d B
+0
r
-1
-2
-3 20
50 100 200 500 1k 2k 5k 10k
20
10/42
AN2479 Test curve report
020k
k2k5k10k
k

Figure 13. 6 Ohm Pout = 1 W

10
5
2 1
0.5
%
0.2
0.1
0.05
0.02
0.01 2
50 100 200 500 1
Vcc=5 V
Vcc=18 V Vcc=12 V

2.2 THD versus frequency

Figure 14. 4 Ohm Pout = 1 W

10
5
2 1
0.5
%
0.2
0.1
0.05
0.02
0.01 20 20
50 100 200 500 1k 2k 5k 10k
Vcc=5 V
Vcc=18 V
11/42
Test curve report AN2479
0
5
20.5125%
m30
m
51020
W

Figure 15. 8 Ohm Pout = 1 W

10
5 2
1
0.5
Vcc=5 V
%
0.2
0.1
0.05
0.02
Vcc=12 V
0.01 20 20k50 100 200 500 1k 2k 5k 10k

2.2.1 THD versus output power

Figure 16. 4 Ohm (1/2)
1
5V
0.
0.1
0.0
0.02
0.01 100
200
8V
500m12
Vcc=18 V
12V
16V
12/42
AN2479 Test curve report
0
2
5
20.51 2 5
%
m30
m
m12
51020
W
0
2
5
20.51 2 5
%
m
m
2
51020
W
0
0
2
5
20.51 2 5
%
m30
m
m12
51020
W
Figure 17. 4 Ohm (2/2)
1
6V
10V
0.
0.1
0.0
0.0
0.01 100
14V
500
18V
200
Figure 18. 6 Ohm (1/2)
1
5V
0.
0.1
0.0
0.0
0.01 100m200
Figure 19. 6 Ohm (2/2)
1
0.
0.1
0.0
0.0
0.01 100
6V
200
500
10V
8V
500
12V
1
14V
16V
18V
3
13/42
Test curve report AN2479
0
2
5
20.51 2 5
%
m30
m
m12
51020
W
0
2
5
20.51 2 5 %
m30
m
m12
51020
W
A
Figure 20. 8 Ohm (1/2)
1
5V
0.
0.1
0.0
0.0
0.01 100
Figure 21. 8 Ohm (2/2)
1
0.
0.1
0.0
0.0
0.01 100
200
6V
200
8V
500
10V
500
12V
14V
16V
18V

2.3 FFT

Figure 22. 0 dBFS@ 1 KHz 5 V 4 ohm

+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-10 0
-11 0
-12 0
-13 0
-14 0
-15 0
20 20k50 100 200 500 1k 2k 5k 10k
14/42
AN2479 Test curve report
A
10
A
A

Figure 23. -60 dBFS@ 1 KHz 5 V 4 ohm

+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20 20k50 100 200 500 1k 2k 5k 10k

Figure 24. 0 dBFS@ 1 KHz 5 V 6 ohm

+
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20 20k50 100 200 500 1k 2k 5k 10k

Figure 25. -60 dBFS@ 1 KHz 5 V 6 ohm

+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20 20k50 100 200 500 1k 2k 5k 10k
15/42
Test curve report AN2479
A
A

Figure 26. 0 dBFS@ 1 KHz 5 V 8 ohm

+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20 20k50 100 200 500 1k 2k 5k 10k

Figure 27. -60 dBFS@ 1 KHz 5 V 8 ohm

+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20 20k50 100 200 500 1k 2k 5k 10k
16/42
AN2479 Test curve report
A
10
A

Figure 28. 0 dBFS@ 1 KHz 12 V 4 ohm

+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-15 0
20
Hz
20k50 100 200 500 1k 2k 5k 10k

Figure 29. -60 dBFS@ 1 KHz 12 V 4 ohm

+
+0
-10
-20
-30
-40
-50
-60
d
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
20k50 100 200 500 1k 2k 5k 10k
17/42
Test curve report AN2479
A
A

Figure 30. 0 dBFS@ 1 KHz 12 V 6 ohm

+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-10 0
-11 0
-12 0
-13 0
-14 0
-15 0
20 50 1 00 200 500 1k 2k 5k 10k
Hz
20k

Figure 31. -60 dBFS@ 1 KHz 12 V 6 ohm

+10
+0
-10
-20
-30
-40
-50
-60
d
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-15 0
20
Hz
20k50 100 200 500 1k 2k 5k 10k
18/42
AN2479 Test curve report
A
10
A

Figure 32. 0 dBFS@ 1 KHz 12 V 8 ohm

+10
+0
-10
-20
-30
-40
-50
-60
d
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20 20k50 100 200 500 1k 2k 5k 10k
Hz

Figure 33. -60 dBFS@ 1 KHz 12 V 8 ohm

+
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
Hz
20k50 100 200 500 1k 2k 5k 10k
19/42
Test curve report AN2479
A
10
A

Figure 34. 0 dBFS@ 1 KHz 18 V 4 ohm

+10
+0
-10
-20
-30
-40
-50
-60
d
B
-70
r
-80
-90
-100
-
110
-120
-130
-140
-150
20
Hz
20k50 100 200 500 1k 2k 5k 10k

Figure 35. -60 dBFS@ 1 KHz 18 V 4 ohm

+
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
Hz
20k50 100 200 500 1k 2k 5k 10k
20/42
AN2479 Test curve report
A
A

Figure 36. 0 dBFS@ 1 KHz 18 V 6 ohm

+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
Hz
20k50 100 200 500 1k 2k 5k 10k

Figure 37. -60 dBFS@ 1 KHz 18 V 6 ohm

+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
Hz
20k50 100 200 500 1k 2k 5k 10k
21/42
Test curve report AN2479
A
A

Figure 38. 0 dBFS@ 1 KHz 18 V 8 ohm

+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
Hz
20k50 100 200 500 1k 2k 5k 10k

Figure 39. -60 dBFS@ 1 KHz 18 V 8 ohm

+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
Hz
20k50 100 200 500 1k 2k 5k 10k
22/42
AN2479 Test curve report
r
A
k
k5k10k
r
A
k
k
k

2.4 Cross talk

Figure 40. 5 V 4 ohm 1 W @ 1 KHz

+0
-10
-20
-30
-40
d
B
-50
-60
-70
-80
-90
-100
20 20
50 100 200 500 1k2

Figure 41. 12 V 4 ohm 1 W @ 1 KHz

Hz
d B
-100
+0
-10
-20
-30
-40
-50
-60
-70
-80
-90 20
50 100 200 500 1k2
Hz
5k 10
20
23/42
Test curve report AN2479
A
k
r
A
k
k5k

Figure 42. 18 V 4 ohm 1 W @ 1 KHz

+0
-10
-20
-30
-40
d B
-50
r
-60
-70
-80
-90
-100
20
50 100 200 500 1k 2k 5k 10k
Hz
20

Figure 43. 5 V 6 ohm 1 W @ 1 KHz

+0
-10
-20
-30
-40
d B
-50
-60
-70
-80
-90
-100
20
50 100 200 500 1k 2
Hz
10k
20
24/42
AN2479 Test curve report
r
A
k
k5k
r
A
k
k5k

Figure 44. 12 V 6 ohm 1 W @ 1 KHz

+0
-10
-20
-30
-40
d B
-50
-60
-70
-80
-90
-100
20
50 100 200 500 1k 2
Hz
10k
20

Figure 45. 18 V 6 ohm 1 W @ 1 KHz

+0
-10
-20
-30
-40
d B
-50
-60
-70
-80
-90
-100
20
50 100 200 500 1k 2
Hz
10k
20
25/42
Test curve report AN2479
r
A
k
k5k
r
A
k
k5k

Figure 46. 5 V 8 ohm 1 W @ 1 KHz

+0
-10
-20
-30
-40
d B
-50
-60
-70
-80
-90
-100
20
50 100 200 500 1k 2
Hz
10k
20

Figure 47. 12 V 8 ohm 1 W @ 1 KHz

+0
-10
-20
-30
-40
d B
-50
-60
-70
-80
-90
-100
20
50 100 200 500 1k 2
Hz
10k
20
26/42
AN2479 Test curve report
r
A
k
k5k

Figure 48. 18 V 8 ohm 1 W @ 1 KHz

+0
-10
-20
-30
-40
d B
-50
-60
-70
-80
-90
-100
20
50 100 200 500 1k 2
Hz
10k
20
27/42
Design guideline for PCB schematic and layout AN2479

3 Design guideline for PCB schematic and layout

3.1 Schematic

3.1.1 Main driver for components selection

Absolute maximum rate: 20 V.
Bypass capacitor 100 nF in parallel to 1 µF for each power Vcc branch. Preferable
dielectric is X7R.
Vdd and ground for PLL filter separate of the power supply.
Coil saturation current compatible with the peak current of the application.

3.2 Decoupling capacitors

There are two different ways to use the decoupling capacitors:
shared among the channels: the best practise layout route must be used for the board,
one decoupling system per channel: it is mandatory that the decoupling capacitor must
be as close as possible to the IC pins.

3.2.1 Output filter

Figure 49. Output filter
INxA
INxB
The key function of a snubber network is to absorb energy from the reactance in the
power circuit. The purpose of the snubber RC network is in order to avoid the high pulse energy (such as spikes) in the power circuit which can be dangerous to the system. When using the snubber network, the energy is be transferred to and from the snubber network, ensuring the system can work safely.
L11
C90 330p
R36 20
L13 22u
22u
C89 100n
C95 100n
C101 100n
C105 100n
R34
6.2
R37
6.2
C98
470n
Damping networkMain filterSnubber
C91 1000p
C103 1000p
C99 1000p
J7
1 2
CON2
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AN2479 Design guideline for PCB schematic and layout
The purpose of the main filter is to remove frequency higher than audible range of
20 KHz. The main filter uses the Butterworth formula to define the cut off frequency, which must be higher than 20 KHz, otherwise the frequency response is affected.
The purpose of the damping network is to avoid high frequency oscillation on the output
circuit. After using the damping network the THD can be improved, and can also avoid the inductive copper on the PCB route when the system is working in high frequency with PWM or PCM.
Snubber filter
The snubber circuit must be optimized for the application. Starting values are 330 pF in series to 22 ohm. The power can be defined by the following formula which considers the power supply, frequency and capacitor value:
P=C*f*(2*V)^2
This power is dissipated in series resistance.
Figure 50. Snubber filter
INxA
C126 330p
R44 22
INxB
Damping network
The C-R-C is a damping network. It is mainly intended for high inductive loads.
Figure 51. Damping filter
C du mp - S
C du mp - P
C du mp - P
C du mp - S
R dump
Rdump
Main filter
The main filter is an L and C based Butterworth filter. The cut-off frequency must be chosen between the upper limit of the audio band (20 KHz) and the carrier frequency (384 KHz).
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Design guideline for PCB schematic and layout AN2479
d
Figure 52. Main filter
C
load
-----------------------------------------------------------------=
22 Π f
L
load
---------------------------------------------------=
2 Π 2× f
F
cutoff
---------------------------------------------------------------------- -=
2 Π× 2C
Recommended values
Rload
Lload
Cload
C dump-S
C dump-P
R dump
8 ohm 4 ohm
22 µH10µH
470 nF 1 µH
100 nF 220 nF
220 nF 220 nF
6.2 2.7
1
cutoff
1
R
load
load
×××
××
×××
R
load
cutoff
L
load
Lload
INxA
C load
Rlo a
INxB
Lload
Recommended power up and power down sequence
Figure 53. Main filter
Vcc
5 V 0V
Vlogic
0V
Reset
0V
Play
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AN2479 Design guideline for PCB schematic and layout

3.3 Layout

1. Solder snubber network as close as possible to the IC related pin.

Figure 54. Snubber network

Snubber network
2. Use electrolytic capacitor first to separate the Vcc branches.

Figure 55. Separate the Vcc branches

Separate from the E-cap
3. Minimize the path between Vcc pins and ground pin in order to avoid inductive paths.

Figure 56. Minimized paths between Vcc and GND

GND
Vcc
4. To dissipate the thermal with a ground plane.
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Design guideline for PCB schematic and layout AN2479

Figure 57. Dissipate thermal

GND
Big ground plane
5. Solder PLL filter as close as possible to the FILT pin.

Figure 58. PLL filter

6. For differential application create symmetrical paths for the output stage.
PLL filter
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AN2479 Design guideline for PCB schematic and layout

Figure 59. Dissipate thermal

Symmetrical output paths
7. Separate the coil and the neighboring coil are vertical to avoid crosstalk.
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Design guideline for PCB schematic and layout AN2479

Figure 60. Avoiding crosstalk

Ver t ical
Ver t ical
8. It is better to use a polyester filter capacitor.

Figure 61. Filter capacitor

Separate the coils to avoid crosstalk
Filter capacitors should be metal or polyester
9. Consider ground layout. To avoid interference between ground power and small signal ground, it is necessary to divide the grounding as shown in Figure 62.
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AN2479 Design guideline for PCB schematic and layout

Figure 62. Ground layout

Channel ground plane
Power ground plane
10. Thermal layout with large ground (1 of 2 for top and bottom layers).

Figure 63. Thermal layout (1 of 2)

Thermal layout on the top layer
Thermal layout on the bottom layer
11. Thermal layout with big ground (2 of 2 for thermal and soldering holes). The thermal resistance junction at the bottom of the STA333ML to the ambient obtainable with a ground copper area of 4 x 4 cm and with 35 via holes (see Figure 64).

Figure 64. Thermal layout (2 of 2)

35 via holes ϕ:1.0 mm
12. VCC routing. The best route for the Vcc supply is one which avoids interference between different signals (for example, part A is idle whilst part B is working at full load).
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Design guideline for PCB schematic and layout AN2479

Figure 65. Vcc routing

Best method to isolate the two channels
amplifiers are isolated from each other
Good Vcc routing
13. Vcc filter for high frequency. The PWM system works with a fast switch (frequency of 340 KHz approximately) which means the copper wire works as a coil. In order to avoid this, a ceramic capacitor should be used to balance resistance. It is a mandatory requirement that ceramic capacitors are placed as close as possible to the related pins. The distance between the capacitor and their respective pins should be less then 5 mm in order to minimize inductive coil effect generated by the copper wire.
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two amplifiers are daisy chained
Bad Vcc routing
AN2479 Design guideline for PCB schematic and layout

Figure 66. Vcc filter

Vcc capacitor filter as close to the related pins as possible. The ceramic capacitors on the bottom of the PCB close to the IC due to SMD mounting limitations.
14. Decoupling capacitors. Solder decoupling capacitors as close as possible to their respective IC pin. This reduces the inductive coil effect.

Figure 67. Decoupling capacitors

Good amplifier bypassing
capacitors are properly placed
Bad amplifier bypassing, capacitors are
out of order and ground connection is indirect
15. Snubber filters for high frequency spike protection on the PWM.
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Design guideline for PCB schematic and layout AN2479

Figure 68. Snubber filter placement

Place snubber circuit as close as possible to the appropriate IC pins, and the - and + for each channel.

Figure 69. Examples of snubber filter placement

Good common mode snubber placement
Good differential snubber placement
Caution: A spike can occur if there > 3 mm distance between the snubber network and the pins. This
can cause damage to the IC. Therefore the distance must be kept below 3 mm.
16. Output routing
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AN2479 Design guideline for PCB schematic and layout

Figure 70. Output routing

Good output routing
traces grow wider as space allows
Good output routing
area between outputs is small
Bad output routing
area between outputs is large
17. Thermal layout
Note: The thermal pad must be connected to ground in order to properly set the IC references. It is
necessary to allow the heat to flow freely to all sides of the board including top and bottom. For optimum heat dissipation it is recommended that the PCB has some solder via holes.
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Design guideline for PCB schematic and layout AN2479

Figure 71. Output routing

Good thermal layout (top)
heat can flow freely to the sides
Good thermal layout (bottom)
plenty of copper area
Bad thermal layout (top)
heat flow cut off by the snubbers
Bad output routing (bottom) little copper area on 3 sides
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AN2479 Revision history

4 Revision history

Table 2. Document revision history

Date Revision Changes
06-Dec-2006 1 Initial release.
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AN2479
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