■ to describe how to connect the STA333ML demo board,
■ how to evaluate the demo board performance with electrical curve data,
■ how to avoid critical board and layout issues.
Application note can be configured to the 2.0 channels only. Both of the 2 channels are in
BTL mode. Each channel can deliver 20 W @ THD = 10% when Vcc = 18V and 8 load. It is
a total solution for the digital audio power amplifier in a TV application.
All the test items and graph data in this document are measured by audio precision
equipment. The test data shown in this document contains, for example, output power
versus Vcc, frequency response, THD+N versus frequency, THD+N versus output power,
FFT.
4. +3.3 V selection. Outer side = external +3.3 V, inner side = internal +3.3 V
5. Connect + voltage of 12 V DC power supply to +Vcc pin and negative to GND.
6. Connect + voltage of 3.3 V DC power supply to +3.3 V pin and negative to GND. If the
+3.3 V selection is set to the inner side, do not connect this wire.
7. Connect GUI AP interface board to the J3 connector of STA333ML demo board.
8. Connect the S/PDIF signal cable to the RCA jack on the interface board, The input
coming from the signal source such as Audio precision or DVD player.
9. The voltage range of the DC power supply for Vcc is from 5 V to 18 V.
(a)
= I2S, 1
(a.)
= left justified.
1.1.2 Output configuration
STA333ML demo board can be configured to 2.0 channels and do not require software
control. It is not necessary to connect the AP interface to the PC. When the power supply,
signal, interface and output have been setup, push the RESET button which allows the
STA333ML demo board to function.
1.2 Equipment requirement
●Audio Precision (System 2700) by AP Co., USA)
●DC power supply (With 5V to 18V)
●Digital oscilloscope (TDS3034B) by Tektronix
●PC
a. 0: connect to outer side, 1: connect to inner side.
3/42
Test condition and connection of demo boardAN2479
1.3 Connection method
Top view of demo board.
Figure 1.Block diagram
External 3.3 V
(not required if +3.3 V
selection is set to internal)
Figure 10. 18 V 4 ohm 0 dB: Pout = 1 W@ 1 KHz filter: L = 10 uH, C = 1 uF
+3
+2
+1
d
B
+0
r
-1
-2
-3
20
50100 2005001k2k5k10
20
Hz
9/42
Test curve reportAN2479
r
A
k
k5k10k
z
+3
A
k
Figure 11. 18 V 6 Ohm 0 dB: Pout = 1 W @ 1 KHz filter: L = 15 uH, C = 680 nF
+3
+2
+1
d
B
+0
-1
-2
-3
2020
501002005001k2
H
Figure 12. 18 V 8 Ohm 0 dB: Pout = 1 W @ 1 KHz filter: L = 22 uH, C = 470 nF
+2
+1
d
B
+0
r
-1
-2
-3
20
501002005001k2k5k10k
20
10/42
AN2479Test curve report
020k
k2k5k10k
k
Figure 13. 6 Ohm Pout = 1 W
10
5
2
1
0.5
%
0.2
0.1
0.05
0.02
0.01
2
501002005001
Vcc=5 V
Vcc=18 V Vcc=12 V
2.2 THD versus frequency
Figure 14. 4 Ohm Pout = 1 W
10
5
2
1
0.5
%
0.2
0.1
0.05
0.02
0.01
2020
501002005001k2k5k10k
Vcc=5 V
Vcc=18 V
11/42
Test curve reportAN2479
0
5
20.5125%
m30
m
51020
W
Figure 15. 8 Ohm Pout = 1 W
10
5
2
1
0.5
Vcc=5 V
%
0.2
0.1
0.05
0.02
Vcc=12 V
0.01
20 20k50100 200500 1k2k5k10k
2.2.1 THD versus output power
Figure 16. 4 Ohm (1/2)
1
5V
0.
0.1
0.0
0.02
0.01
100
200
8V
500m12
Vcc=18 V
12V
16V
12/42
AN2479Test curve report
0
2
5
20.51 2 5
%
m30
m
m12
51020
W
0
2
5
20.51 2 5
%
m
m
2
51020
W
0
0
2
5
20.51 2 5
%
m30
m
m12
51020
W
Figure 17. 4 Ohm (2/2)
1
6V
10V
0.
0.1
0.0
0.0
0.01
100
14V
500
18V
200
Figure 18. 6 Ohm (1/2)
1
5V
0.
0.1
0.0
0.0
0.01
100m200
Figure 19. 6 Ohm (2/2)
1
0.
0.1
0.0
0.0
0.01
100
6V
200
500
10V
8V
500
12V
1
14V
16V
18V
3
13/42
Test curve reportAN2479
0
2
5
20.51 2 5
%
m30
m
m12
51020
W
0
2
5
20.51 2 5 %
m30
m
m12
51020
W
A
Figure 20. 8 Ohm (1/2)
1
5V
0.
0.1
0.0
0.0
0.01
100
Figure 21. 8 Ohm (2/2)
1
0.
0.1
0.0
0.0
0.01
100
200
6V
200
8V
500
10V
500
12V
14V
16V
18V
2.3 FFT
Figure 22. 0 dBFS@ 1 KHz 5 V 4 ohm
+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-10 0
-11 0
-12 0
-13 0
-14 0
-15 0
2020k50100 200500 1k2k5k10k
14/42
AN2479Test curve report
A
10
A
A
Figure 23. -60 dBFS@ 1 KHz 5 V 4 ohm
+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
2020k50100 200500 1k2k5k10k
Figure 24. 0 dBFS@ 1 KHz 5 V 6 ohm
+
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
2020k50100 200500 1k2k5k10k
Figure 25. -60 dBFS@ 1 KHz 5 V 6 ohm
+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
2020k50100 200500 1k2k5k10k
15/42
Test curve reportAN2479
A
A
Figure 26. 0 dBFS@ 1 KHz 5 V 8 ohm
+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
2020k50100 200500 1k2k5k10k
Figure 27. -60 dBFS@ 1 KHz 5 V 8 ohm
+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
2020k50100 200500 1k2k5k10k
16/42
AN2479Test curve report
A
10
A
Figure 28. 0 dBFS@ 1 KHz 12 V 4 ohm
+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-15 0
20
Hz
20k50100 200500 1k2k5k10k
Figure 29. -60 dBFS@ 1 KHz 12 V 4 ohm
+
+0
-10
-20
-30
-40
-50
-60
d
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
20k50100 200500 1k2k5k10k
17/42
Test curve reportAN2479
A
A
Figure 30. 0 dBFS@ 1 KHz 12 V 6 ohm
+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-10 0
-11 0
-12 0
-13 0
-14 0
-15 0
20 501 00 200500 1k2k5k10k
Hz
20k
Figure 31. -60 dBFS@ 1 KHz 12 V 6 ohm
+10
+0
-10
-20
-30
-40
-50
-60
d
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-15 0
20
Hz
20k50100 200500 1k2k5k10k
18/42
AN2479Test curve report
A
10
A
Figure 32. 0 dBFS@ 1 KHz 12 V 8 ohm
+10
+0
-10
-20
-30
-40
-50
-60
d
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20 20k50100 200500 1k2k5k10k
Hz
Figure 33. -60 dBFS@ 1 KHz 12 V 8 ohm
+
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
Hz
20k50100 200500 1k2k5k10k
19/42
Test curve reportAN2479
A
10
A
Figure 34. 0 dBFS@ 1 KHz 18 V 4 ohm
+10
+0
-10
-20
-30
-40
-50
-60
d
B
-70
r
-80
-90
-100
-
110
-120
-130
-140
-150
20
Hz
20k50100 200500 1k2k5k10k
Figure 35. -60 dBFS@ 1 KHz 18 V 4 ohm
+
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
Hz
20k50100 200500 1k2k5k10k
20/42
AN2479Test curve report
A
A
Figure 36. 0 dBFS@ 1 KHz 18 V 6 ohm
+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
Hz
20k50100 200500 1k2k5k10k
Figure 37. -60 dBFS@ 1 KHz 18 V 6 ohm
+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
Hz
20k50100 200500 1k2k5k10k
21/42
Test curve reportAN2479
A
A
Figure 38. 0 dBFS@ 1 KHz 18 V 8 ohm
+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
Hz
20k50100 200500 1k2k5k10k
Figure 39. -60 dBFS@ 1 KHz 18 V 8 ohm
+10
+0
-10
-20
-30
-40
-50
d
-60
B
-70
r
-80
-90
-100
-110
-120
-130
-140
-150
20
Hz
20k50100 200500 1k2k5k10k
22/42
AN2479Test curve report
r
A
k
k5k10k
r
A
k
k
k
2.4 Cross talk
Figure 40. 5 V 4 ohm 1 W @ 1 KHz
+0
-10
-20
-30
-40
d
B
-50
-60
-70
-80
-90
-100
2020
50100 200500 1k2
Figure 41. 12 V 4 ohm 1 W @ 1 KHz
Hz
d
B
-100
+0
-10
-20
-30
-40
-50
-60
-70
-80
-90
20
50100 200500 1k2
Hz
5k10
20
23/42
Test curve reportAN2479
A
k
r
A
k
k5k
Figure 42. 18 V 4 ohm 1 W @ 1 KHz
+0
-10
-20
-30
-40
d
B
-50
r
-60
-70
-80
-90
-100
20
50100 200500 1k2k5k10k
Hz
20
Figure 43. 5 V 6 ohm 1 W @ 1 KHz
+0
-10
-20
-30
-40
d
B
-50
-60
-70
-80
-90
-100
20
50100 200500 1k2
Hz
10k
20
24/42
AN2479Test curve report
r
A
k
k5k
r
A
k
k5k
Figure 44. 12 V 6 ohm 1 W @ 1 KHz
+0
-10
-20
-30
-40
d
B
-50
-60
-70
-80
-90
-100
20
50100 200500 1k2
Hz
10k
20
Figure 45. 18 V 6 ohm 1 W @ 1 KHz
+0
-10
-20
-30
-40
d
B
-50
-60
-70
-80
-90
-100
20
50100 200500 1k2
Hz
10k
20
25/42
Test curve reportAN2479
r
A
k
k5k
r
A
k
k5k
Figure 46. 5 V 8 ohm 1 W @ 1 KHz
+0
-10
-20
-30
-40
d
B
-50
-60
-70
-80
-90
-100
20
50100 200500 1k2
Hz
10k
20
Figure 47. 12 V 8 ohm 1 W @ 1 KHz
+0
-10
-20
-30
-40
d
B
-50
-60
-70
-80
-90
-100
20
50100 200500 1k2
Hz
10k
20
26/42
AN2479Test curve report
r
A
k
k5k
Figure 48. 18 V 8 ohm 1 W @ 1 KHz
+0
-10
-20
-30
-40
d
B
-50
-60
-70
-80
-90
-100
20
50100 200500 1k2
Hz
10k
20
27/42
Design guideline for PCB schematic and layoutAN2479
3 Design guideline for PCB schematic and layout
3.1 Schematic
3.1.1 Main driver for components selection
●Absolute maximum rate: 20 V.
●Bypass capacitor 100 nF in parallel to 1 µF for each power Vcc branch. Preferable
dielectric is X7R.
●Vdd and ground for PLL filter separate of the power supply.
●Coil saturation current compatible with the peak current of the application.
3.2 Decoupling capacitors
There are two different ways to use the decoupling capacitors:
●shared among the channels: the best practise layout route must be used for the board,
●one decoupling system per channel: it is mandatory that the decoupling capacitor must
be as close as possible to the IC pins.
3.2.1 Output filter
Figure 49. Output filter
INxA
INxB
●The key function of a snubber network is to absorb energy from the reactance in the
power circuit. The purpose of the snubber RC network is in order to avoid the high
pulse energy (such as spikes) in the power circuit which can be dangerous to the
system. When using the snubber network, the energy is be transferred to and from the
snubber network, ensuring the system can work safely.
L11
C90
330p
R36
20
L1322u
22u
C89
100n
C95
100n
C101
100n
C105
100n
R34
6.2
R37
6.2
C98
470n
Damping networkMain filterSnubber
C91
1000p
C103
1000p
C99
1000p
J7
1
2
CON2
28/42
AN2479Design guideline for PCB schematic and layout
●The purpose of the main filter is to remove frequency higher than audible range of
20 KHz. The main filter uses the Butterworth formula to define the cut off frequency,
which must be higher than 20 KHz, otherwise the frequency response is affected.
●The purpose of the damping network is to avoid high frequency oscillation on the output
circuit. After using the damping network the THD can be improved, and can also avoid
the inductive copper on the PCB route when the system is working in high frequency
with PWM or PCM.
Snubber filter
The snubber circuit must be optimized for the application. Starting values are 330 pF in
series to 22 ohm. The power can be defined by the following formula which considers the
power supply, frequency and capacitor value:
P=C*f*(2*V)^2
This power is dissipated in series resistance.
Figure 50. Snubber filter
INxA
C126
330p
R44
22
INxB
Damping network
The C-R-C is a damping network. It is mainly intended for high inductive loads.
Figure 51. Damping filter
C du mp - S
C du mp - P
C du mp - P
C du mp - S
R dump
Rdump
Main filter
The main filter is an L and C based Butterworth filter. The cut-off frequency must be chosen
between the upper limit of the audio band (20 KHz) and the carrier frequency (384 KHz).
29/42
Design guideline for PCB schematic and layoutAN2479
AN2479Design guideline for PCB schematic and layout
3.3 Layout
1.Solder snubber network as close as possible to the IC related pin.
Figure 54. Snubber network
Snubber network
2. Use electrolytic capacitor first to separate the Vcc branches.
Figure 55. Separate the Vcc branches
Separate from the E-cap
3. Minimize the path between Vcc pins and ground pin in order to avoid inductive paths.
Figure 56. Minimized paths between Vcc and GND
GND
Vcc
4. To dissipate the thermal with a ground plane.
31/42
Design guideline for PCB schematic and layoutAN2479
Figure 57. Dissipate thermal
GND
Big ground plane
5. Solder PLL filter as close as possible to the FILT pin.
Figure 58. PLL filter
6. For differential application create symmetrical paths for the output stage.
PLL filter
32/42
AN2479Design guideline for PCB schematic and layout
Figure 59. Dissipate thermal
Symmetrical
output paths
7. Separate the coil and the neighboring coil are vertical to avoid crosstalk.
33/42
Design guideline for PCB schematic and layoutAN2479
Figure 60. Avoiding crosstalk
Ver t ical
Ver t ical
8. It is better to use a polyester filter capacitor.
Figure 61. Filter capacitor
Separate the coils to avoid
crosstalk
Filter capacitors should be metal or polyester
9. Consider ground layout. To avoid interference between ground power and small signal
ground, it is necessary to divide the grounding as shown in Figure 62.
34/42
AN2479Design guideline for PCB schematic and layout
Figure 62. Ground layout
Channel ground plane
Power ground plane
10. Thermal layout with large ground (1 of 2 for top and bottom layers).
Figure 63. Thermal layout (1 of 2)
Thermal layout on
the top layer
Thermal layout on
the bottom layer
11. Thermal layout with big ground (2 of 2 for thermal and soldering holes).
The thermal resistance junction at the bottom of the STA333ML to the ambient
obtainable with a ground copper area of 4 x 4 cm and with 35 via holes (see Figure 64).
Figure 64. Thermal layout (2 of 2)
35 via holes ϕ:1.0 mm
12. VCC routing.
The best route for the Vcc supply is one which avoids interference between different
signals (for example, part A is idle whilst part B is working at full load).
35/42
Design guideline for PCB schematic and layoutAN2479
Figure 65. Vcc routing
Best method to isolate the two channels
amplifiers are isolated from each other
Good Vcc routing
13. Vcc filter for high frequency.
The PWM system works with a fast switch (frequency of 340 KHz approximately) which
means the copper wire works as a coil. In order to avoid this, a ceramic capacitor
should be used to balance resistance. It is a mandatory requirement that ceramic
capacitors are placed as close as possible to the related pins. The distance between
the capacitor and their respective pins should be less then 5 mm in order to minimize
inductive coil effect generated by the copper wire.
36/42
two amplifiers are daisy chained
Bad Vcc routing
AN2479Design guideline for PCB schematic and layout
Figure 66. Vcc filter
Vcc capacitor filter as close to the related pins as
possible. The ceramic capacitors on the bottom
of the PCB close to the IC due to SMD mounting
limitations.
14. Decoupling capacitors.
Solder decoupling capacitors as close as possible to their respective IC pin. This
reduces the inductive coil effect.
Figure 67. Decoupling capacitors
Good amplifier bypassing
capacitors are properly placed
Bad amplifier bypassing, capacitors are
out of order and ground connection is indirect
15. Snubber filters for high frequency spike protection on the PWM.
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Design guideline for PCB schematic and layoutAN2479
Figure 68. Snubber filter placement
Place snubber circuit as close
as possible to the appropriate
IC pins, and the - and + for
each channel.
Figure 69. Examples of snubber filter placement
Good common mode snubber placement
Good differential snubber placement
Caution:A spike can occur if there > 3 mm distance between the snubber network and the pins. This
can cause damage to the IC. Therefore the distance must be kept below 3 mm.
16. Output routing
38/42
AN2479Design guideline for PCB schematic and layout
Figure 70. Output routing
Good output routing
traces grow wider as space allows
Good output routing
area between outputs is small
Bad output routing
area between outputs is large
17. Thermal layout
Note:The thermal pad must be connected to ground in order to properly set the IC references. It is
necessary to allow the heat to flow freely to all sides of the board including top and bottom.
For optimum heat dissipation it is recommended that the PCB has some solder via holes.
39/42
Design guideline for PCB schematic and layoutAN2479
Figure 71. Output routing
Good thermal layout (top)
heat can flow freely to the sides
Good thermal layout (bottom)
plenty of copper area
Bad thermal layout (top)
heat flow cut off by the snubbers
Bad output routing (bottom)
little copper area on 3 sides
40/42
AN2479Revision history
4 Revision history
Table 2.Document revision history
DateRevisionChanges
06-Dec-20061Initial release.
41/42
AN2479
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