ST AN2169 Application note

AN2169
Application note
Porting an application
from the ST10F168 to the ST10F276
Introduction
The ST10F276 is a new derivative of the STMicroelectronics ST10 family of 16-bit single-chip CMOS microcontrollers. This document aims to describe the differences between the ST10F168 and ST10F276 and is intended for hardware or software designers who are adapting existing applications based on the ST10F168 to the ST10F276.
This document will present the modified functionalities of the ST10F276, then the new ones before looking at the modified and new registers. For each part, the differences with the ST10F168 that have an impact will be shown and some advice on the way they can be handled will be given.
July 2006 Rev 1 1/33
www.st.com
33
AN2169
Contents
1 Modified features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1 Pin-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1.1 Pin-out modification summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1.2 Pin 99 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1.3 Pins 143 & 144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1.4 Pin 84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1.5 Pin 56 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.2 Maximum CPU frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.2.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.2.2 software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.3 XRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.3.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.3.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.4 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.4.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.4.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.5 A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.5.1 Hardware / Software impact: conversion timing control . . . . . . . . . . . . . . . . . 10
1.5.2 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.5.3 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.6 PLL and on-chip main oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2 New functionalities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.1 CAN module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.1.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.1.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.2 Real time clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.2.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.2.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.3 MAC unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.3.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.3.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.4 Additional X-peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2/33
AN2169
2.4.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.5 New multiplexer for X-interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.5.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.5.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.6 Programmable divider on CLKOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.6.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.6.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3 Modified registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1 WDTCON register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2 PICON register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.2.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.3 IDCHIP register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.3.1 Hardware Impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.3.2 Software Impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4 New registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.1 XPERCON register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.1.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.1.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.2 XPEREMU register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.2.1 Hardware Impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.2.2 Software Impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.3 EXISEL register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.4 Additional Ports Input Control: XPICON register . . . . . . . . . . . . . . . . . . . . . 26
4.4.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.4.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.5 XMISC register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.5.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.5.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.6 Emulation dedicated registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.6.1 Hardware impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3/33
AN2169
4.6.2 Software impact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.1 DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.1.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.1.2 DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4/33
AN2169 Modified features

1 Modified features

1.1 Pin-out

1.1.1 Pin-out modification summary

Ta bl e 1 below summarizes the modifications made in the pin-out.
Table 1. Pin-out modification summary
Pin no. ST10F276 pin function ST10F168 pin function
6 (P6.5)
7 (P6.6)
8 (P6.7)
9 (P8.0)
12
(P8.3)
15(P8.6)
16(P8.7)
89
(P4.4)
HOLD External Master Hold request Input SCLK1 SSC1 Master Clock Output SCLK1 SSC1 Slave Clock Input
HLDA Hold Acknowledge Output MTSR1 SS1 Master Transmit MTSR1 SS1 Slave Receive O/I
BREQ Bus Request Output MRST1 SSC1 Master receive MRST1 SSC1 Slave Transmit I/O
CC16IO: CAPCOM2 CC16 Capture-In CC16IO: CAPCOM2 CC16 Compare-Out XPWM0: PWM1 Channel0 Output
CC19IO: CAPCOM2 CC19 Capture-In CC19IO: CAPCOM2 CC19 Compare-Out XPWM3: PWM1Channel3 Output
CC22IO: CAPCOM2 CC22 Capture-In CC22IO: CAPCOM2 CC22 Compare-Out RXD1: ASC1 Data Input(Asynch) or I/O(Synch)
CC23IO: CAPCOM2 CC23 Capture-In CC23IO: CAPCOM2 CC23 Compare-Out TXD1: ASC1Clock/Data output(Asyn/Syn)
A20 segment address line CAN2_RxD CAN2 Receive Data Input SCL I2C Interface Serial Clock
HOLD External Master Hold request Input
HLDA Hold Acknowledge Output
BREQ Bus Request Output
CC16IO: CAPCOM2 CC16 Capture-In CC16IO: CAPCOM2 CC16 Compare-Out
CC19IO: CAPCOM2 CC19 Capture-In CC19IO: CAPCOM2 CC19 Compare-Out
CC22IO: CAPCOM2 CC22 Capture-In CC22IO: CAPCOM2 CC22 Compare-Out
CC23IO: CAPCOM2 CC23 Capture-In CC23IO: CAPCOM2 CC23 Compare-Out
A20 segment address line
90
(P4.5)
91(P4.6)
92
(P4.7)
99
143 XTAL3
A21 segment address line CAN1_RxD CAN1 Receive Data Input CAN2_RXD CAN2 Receive Data Input
A22 segment address line CAN1_TxD CAN1 TransmitData Output CAN2_TXD CAN2 TransmitData Output
A23 segment address line CAN2_TxD CAN2 TransmitData Output SDA I2C Interface Serial Data
& V
EA
STBY
5/33
A21 segment address line CAN_RxD CAN Receive Data Input
A22 segment address line CAN_TxD CAN TransmitData Output
A23 segment address line
EA
V
ss
Modified features AN2169
Pin no. ST10F276 pin function ST10F168 pin function
V
144 XTAL4
84 RPD Vpp / RPD
56 V18 1.8v decoupling pin
Digital supply voltage
DD
V
digital supply voltage
DD

1.1.2 Pin 99

On the ST10F168, pin 99 is EA and used upon reset to select the start from internal flash or external memory.
Now, on the ST10F276, it has an the additional function of providing the 5V power supply to the device in standby mode (new power saving mode) and is therefore named EA
Hardware impact
For an application not using the Stand by mode, no change is required on the PCB. However, for the application to use it , the EA
- V
pin must be separated from the common 5v and
STBY
have a specific supply path.
Software impact
- V
STBY
.
None.

1.1.3 Pins 143 & 144

These pins were a Vss-VDD pair in the ST10F168. Now, on the ST10F276, they are used as XTAL3-XTAL4 pair for connection to an optional 32Khz crystal to clock the device during power­down.
Hardware impact
PCB must be redesigned. In case the optional 32Khz is not used, XTAL3 must be linked to ground as it was in the ST10F168 but XTAL4 shall be left open.
Software impact
In case the optional 32Khz is not used, the bit OFF32 of the RTCCON register shall be set. Prior to setting the OFF32 bit in RTCCON register, the RTC must be enabled by setting RTCEN, bit 4 of XPERCON, and XPEN, bit3 of SYSCON.

1.1.4 Pin 84

This pin was named Vpp/RPD on the ST10F168 and was the 12v input pin Flash programming. In the ST10F276, it is now only used as RPD.
Hardware impact
This pin is no longer designed to accept 12V inputs. Its ratings are the same as any other pin: -
0.5V to V
+ 0.5V.
DD
Software impact
None.
6/33
AN2169 Modified features

1.1.5 Pin 56

For the ST10F168, this is VDD pin connected to 5Volts.
For the ST10F276, it is a 1.8V decoupling pin and named V18. A decoupling capacitor must be connected between this pin and the nearest V
ss
pin.
Hardware impact
The application board should be re-designed in order to introduce the decoupling capacitor.
Software impact
None

1.2 Maximum CPU frequency

ST10F168 ST10F276
Maximum CPU Frequency (MHz) 25 64

1.2.1 Hardware impact

None.

1.2.2 software impact

None.

1.3 XRAM

The ST10F168 has only 6Kbytes of extension RAM while the ST10F276 has 66Kbytes.
The XRAM address range in the ST10F168 is 00’D000h-00’E7FFh and is enabled if XPEN (bit 2 of SYSCON register) is set.
The XRAM of the ST10F276 is divided into 2 ranges named XRAM1 of 2Kbytes and XRAM2 of 64 Kbytes:
The XRAM1 address range is 00’E000h - 00’E7FFh if enabled (XPEN set -bit 2 of
SYSCON register and XRAM1EN set -bit 2 of XPERCON register.
The XRAM2 address range is 0F’0000h - 0F’FFFFh if enabled (XPEN set -bit 2 of
SYSCON register and XRAM2EN set -bit 3 of XPERCON register).

1.3.1 Hardware impact

None

1.3.2 Software impact

The memory mapping of the application will be impacted by the difference in XRAM size and by the location of XRAM2 in the segment 15 while in the ST10F168, the whole XRAM is in page 3 of segment 0.
7/33
Modified features AN2169
Variables and PEC transfers
For architecture reasons, the PEC destination and source pointers must be in the segment 0. Therefore all RAM variables and arrays that will be PEC addressed must be located within either the DPRAM (00’F600h - 00’FDFFh) or the XRAM1 (00’E000h - 00’E7FFh).
About Toolchain memory model
A change in the Toolchain configuration will be needed to take into account the XRAM2 new location. In the ST10F168, all the XRAM is in page 3 and is then automatically addressed using DPP3 that points to the page 3 (in order to access the DPRAM and the SFR/ESFR). For the ST10F276, it will be necessary to dedicate a DPP to access some of the XRAM2.
Example for ST10F276 in case of Small Memory Model with Tasking toolchain:
The Small memory model allows to have a total code size up to 16M, up to 64K of fast accessible 'normal user data' in three different memory configurations and the possibility to access far/huge data, if more than 64K of data is needed.
The three memory configurations possible for this 64K of 'normal user data' are:
Default
The four DPP registers are assumed to contain their system startup value (0-3), providing one linear data area of 64K in the first segment (00’0000h - 00’FFFFh).
Addresses Linear
DPP3 contains page number 3, allowing access to SYSTEM (extended) SFR registers and bit addressable memory. DPP0 - DPP2 provide a linear data area of 48K anywhere in memory.
Paged
DPP3 contains page number 3, allowing access to SYSTEM (extended) SFR registers and bit addressable memory. DPP0, DPP1 and DPP2 contain the page number of a data area of 16K anywhere in memory.
The Default configuration can no longer be used. The other configurations offer the following possibilities:
with Addresses Linear configuration nearly all the XRAM2 block is covered with DPPs but
then accesses to constants must be made via EXTP instructions
Paged configuration allows to assign up to two DPPs to XRAM2 and one DPP for
constants.

1.4 Flash memory

Table 2. Flash Memories key characteristics
ST10F168 ST10F276
Flash Size 256K Bytes 832K Bytes
Flash Organization
Programming voltage
8/33
4 banks 4 banks, 17 blocks
12V 5 Volts
AN2169 Modified features
ST10F168 ST10F276
Programming method
Program/Erase cycles
10 Kcycles, 20 years data retention 100 Kcycles, 20 years data retention

1.4.1 Hardware impact

The 12 volts input on pin 84 is no longer needed.

1.4.2 Software impact

The mapping of the application and the programming and erasing routines are impacted.
Figure 1. ST10F168 & ST10 F276 Flash Memories’ Mapping
Segment number
14 13 12
11 10
9
8
7
6 5
4 3 2
1
0
STEAK TM Write/Erase Controller
ST10F168 mapping
03’8000 - 04’FFFF
02’0000 - 03’7FFF
01’8000 - 01’FFFF 01’4000 - 01’7FFF
01’0000 - 01’3FFF
00’0000 - 00’3FFF
Bank 3 : 96 Kbytes
Bank 2 : 96 Kbytes
Bank 1 H : 32 Kbytes
Alternate Flash Area Alternate Flash Area
External memory+IRAM
Bank 1L : 16 Kbytes
Bank 0 : 16 Kbytes
0E’0000 - 0E’FFFF 0D’0000 - 0D’FFFF 0C’0000 - 0C’FFFF 0B’0000 - 0B’FFFF
0A’0000 - 0A’FFFF 09’0000 - 09’FFFF
08’0000 - 08’FFFF 07’0000 - 07’FFFF 06’0000 - 06’FFFF 05’0000 - 05’ FFFF 04’0000 - 04’FFFF
03’0000 - 03’FFFF
02’0000 - 02’FFFF 01’8000 - 01’FFFF
01’0000 - 01’7FFF
00’8000 -00’FFFF 00’8000 -00’FFFF 00’4000 - 00’7FFF00’4000 - 00’7FFF
00’2000 - 00’3FFF 00’0000 - 00’1FFF
ST10F276 Mapping
Reserved for Flash registers
B3F0 : 64KB
B2F1 : 64KB
B2F0 : 64KB B1F1 : 64KB
B1F0 : 64KB
B0F9 : 64KB
B0F8: 64KB
B0F7: 64KB
B0F6: 64KB
B0F5: 64KB B0F4: 32KB
Alternate Flash Area
External memory + IRAM
B0F2:8KB & B0F3: 8KB
B0F1:8KB
B0F0:8KB
B3F1: 64KB
B2F2: 64KB
Note: On the ST10F168, Bank 0 and Bank 1L may be remapped from segment 0 to segment 1 by
setting SYSCON.ROMS1.
On the ST10F276, sectors in segment 0 may be remapped to segment 1 by setting SYSCON.ROMS1.
9/33
Modified features AN2169

1.5 A/D converter

The Analog Digital converter has been re-designed between the ST10F168 and ST10F276. The ST10F276 still provides an Analog / Digital Converter with 10-bit resolution and a sample & hold circuit on-chip.

1.5.1 Hardware / Software impact: conversion timing control

The A/D converter is not fully compatible versus ST10F168 (timing and programming model). As for the ST10F168, the sample time ( for loading the capacitors) and the conversion time are programmable and can be adjusted to the external circuitry. The total conversion time is compatible with the formula used for ST10F168, while the meaning of the bit fields ADCTC and ADSTC is no longer compatible.
Table 3. ST10F276 Conversion timing table
ADCTC ADSTC Sample Comparison Extra Total Conversion
00 00 TCL * 120 TCL * 240 TCL * 28 TCL * 388
00 01 TCL * 140 TCL * 280 TCL * 16 TCL * 436
00 10 TCL * 200 TCL * 280 TCL * 52 TCL * 532
00 11 TCL * 400 TCL * 280 TCL * 44 TCL * 724
11 00 TCL * 240 TCL * 120 TCL * 52 TCL * 772
11 01 TCL * 280 TCL * 560 TCL * 28 TCL * 868
11 10 TCL * 400 TCL * 560 TCL * 100 TCL * 1060
11 11 TCL * 800 TCL * 560 TCL * 52 TCL * 1444
10 00 TCL * 480 TCL * 960 TCL * 100 TCL * 1540
10 01 TCL * 560 TCL * 1120 TCL * 52 TCL * 1732
10 10 TCL * 800 TCL * 1120 TCL * 196 TCL * 2116
10 11 TCL * 1600 TCL * 1120 TCL * 164 TCL * 2884

1.5.2 Hardware impact

Table 4. ADC differences
Parameter Symbol
Analog Reference voltage
Reference supply current
running mode power-down mode
V
AREF
I
AREF
Limit values for
ST10F168
min. max. min. max.
+ 0.1
4.0
-
-
V
DD
Limit values for ST10F276
4.5
-
-
VDD + 0.1
5000
1
Unit
V
µA
10/33
AN2169 Modified features
Parameter Symbol
ADC Input capacitance
Not sampling P5 Sampling P5 Not sampling P1 Sampling P1
Sample time
Total Unadjusted Error
Por t5 Port1 - No overload Port1 - Overload
Differential Nonlinearity DNL -1 +1 LSB
Integral Nonlinearity INL -1.5 +1.5 LSB
Offset Error OFS -1.5 +1.5 LSB

1.5.3 Software impact

Self-calibration and ADC initialization routine
C
AIN
t
S
TUE
Limit values for
ST10F168
min. max. min. max.
-
-
-
-
48 TCL 1536 TCL 120 TCL 1600 TCL us
-2.0 +2.0
33 33
-
-
Limit values for ST10F276
+ CP2 +C
C
P1
-
-
-
-
-2.0
-5.0
+7.0
7
10.5 9
12.5
+2.0 +5.0 +7.0
Unit
S
pF
LSB
An automatic self-calibration adjusts the ADC module to process parameter variations at each reset event. After reset, the busy flag (read-only) ADBSY is set because the self-calibration is ongoing. The duration of self-calibration depends on the CPU clock: it takes up to 40.629 ± 1 clock pulses. The user shall poll this bit to know when the self-calibration is done and then initialize the ADC module.
This self-calibration is seen by the ST10F276 as a conversion and thus bit ADCIR is set. The software should perform a dummy read of the ADDAT register and clear the ADCIR and ADCEIR flag before configuring the ADC module and starting the first conversion.
New bit ADOFF, bit 6 of ADCON register
ADCON (FFA0h / A0h)
SFR
Reset Value: 0000h
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
ADCTC ADSTC ADCTC ADCIN ADWR ADBSY ADST ADOFF ADM ADCH
RW RW RW RW RW RW RW R RW RW RW RW RW RW RW RW
Bit Function Comment
ADOFF: ADC Disable
6
0: Analog circuitry of A/D converter is on
1: Analog circuitry of A/D converter is turned off (no consumption)
New bit only for the ST10F276. Reserved for the ST10F168.
11/33
Modified features AN2169
The bit 6 of ADCON register, reserved in the previous ST10 devices, has now the function of enabling or disabling the ADC. By default this bit is cleared and the ST10F276 is compatible with the ST10F168.
Additional analog channels on Port1
A new multiplexer selects between up to 16 or 8 analog input channels (alternate functions of Port 5 and Port1). The selection of the Port1 or Port5 as input of the ADC is made via bit ADCMUX, bit 0 of XMISC register.
XMISC (EB46h)
XREG
Reset Value: --00h
1514131211109876543210
VREG
------------
Bit Function
ADCMUX
0
0: default configuration, analog inputs on port P5.y can be converted
1: analog inputs on port P1.z can be converted, only 8 channel can be managed
CANCK2CANPARADCM
OFF
rw rw rw rw
UX
By default the multiplexer selects the Port5, so there is no impact on the software with regard to a ST10F168 implementation.

1.6 PLL and on-chip main oscillator

In order to reach the new frequency range, the PLL multiplication factors have been changed.
Table 5. ST10F168 vs ST10F276 PLL ratio
ST10F168 ST10F276 ST10F276 ST10F276
P0.15-13
(P0H.7-5)
111
110
101
100
011
010
PLL factor
f
= f
CPU
F
XTAL
F
XTAL
F
XTAL
F
XTAL
F
XTAL
F
XTAL
* F
XTAL
f
CPU
* 4 F
* 3 F
* 2 F
* 5 F
* 1 F
* 1.5 F
PLL factor
= f
XTAL
* 4
XTAL
* 3
XTAL
* 8
XTAL
* 5
XTAL
* 1
XTAL
* 10
XTAL
* F
Input Frequency Range
(MHz)
Low Power
Oscillator
Wide Swing
Oscillator
Notes
4 to 8 4 to 8 Default configuration
5.3 to 8 5.3 to 10.6
4 to 8 4 to 8
6.4 to 8 6.4 to 12
1 to 64 1 to 64 Direct Drive
4 to 6.4 4 to 6.4
12/33
AN2169 Modified features
ST10F168 ST10F276 ST10F276 ST10F276
P0.15-13
(P0H.7-5)
001
000
PLL factor
f
= f
CPU
F
XTAL
F
XTAL
* F
XTAL
f
CPU
/ 2 F
* 2.5 F
PLL factor
= f
XTAL
/ 2
XTAL
* 16
XTAL
Input Frequency Range
* F
Low Power
Oscillator
4 to 8 4 to 12
44
(MHz)
Wide Swing
Oscillator
Notes
CPU clock via pre­scaler
13/33
New functionalities AN2169

2 New functionalities

2.1 CAN module

The ST10F168 has only one CAN module of the B-CAN type.
The ST10F276 has two CAN modules of the C-CAN type.
The C-CAN cells provide additional Message Objects and new functionalities like Time Triggered Protocol capability. The main difference is that the Message Objects are no longer directly accessed as memory but are available through a Message Interface. This changes the programming model of the modules.

2.1.1 Hardware impact

None.

2.1.2 Software impact

Re-write the CAN Drivers

2.2 Real time clock

This is a new functionality of the ST10F276.
The Real Time Clock is an independent timer. Its clock is directly derived from the clock oscillator so that it can keep on running even in idle or power down mode (if enabled).

2.2.1 Hardware impact

None

2.2.2 Software impact

None. By default, this peripheral is disabled.

2.3 MAC unit

This Multiply and Accumulate Unit is a feature added on the ST10F276.

2.3.1 Hardware impact

None

2.3.2 Software impact

None
14/33
AN2169 New functionalities

2.4 Additional X-peripherals

Some peripherals have been added on the ST10F271-B. They are mapped on the X-Bus and are linked to additional alternate functions of some ports of the ST10F271-B.
The additional X-Peripherals are the following:
An additional SSC called XSSC.
An additional ASC called XASC.
An additional 4-channel PWM called XPWM .
An I2C interface
An additional C-CAN Interface
Note: Some restrictions and functional differences between the original peripherals and XASC, XSSC
and XPWM exist. Those differences impact interrupts management, related IO configuration and peripherals activation.

2.4.1 Hardware impact

None if the additional peripherals are not used.

2.4.2 Software impact

None if the additional peripherals are not used. As they are X-peripherals, they can be enabled / disabled via the XPERCON and the SYSCON registers.

2.5 New multiplexer for X-interrupts

The limited number of X-Bus interrupt lines of the present ST10 architecture, imposes some constraints on the implementation of the new functionalities. In particular, the additional X­Peripherals XSSC, XASC, XI2C and XPWM need some resources to implement interrupt and PEC transfer. For this reason, a complex but very flexible multiplexed structure for the interrupt is proposed. In next figure, the principle is represented through a simple diagram, which shows the basic structure replicated for each of the four X-interrupt vectors (XP0INT, XP1INT, XP2INT and XP3INT).
It is based on a new 16-bit register XIRxSEL (x=0,1,2,3), divided in two portions:
Byte High (XIRxSEL[15:8]) Interrupt Enable bits
Byte Low (XIRxSEL[7:0]) Interrupt Flag bits
When different sources submit an interrupt request, the enable bits (Byte High of XIRxSEL register) define a mask which controls which sources will be associated with the unique available vector. If more than one source is enabled to issue the request, the service routine will have to take care to identify the real event to be serviced. This can easily be done by checking the flag bits (Byte Low of XIRxSEL register). Note that the flag bit can provide information about events which are not currently serviced by the interrupt controller (when masked through the enable bits), allowing an effective software management also in absence of the possibility to serve the related interrupt request: a period polling of the flag bits may be implemented inside the user application.
15/33
New functionalities AN2169
Figure 2. X-Interrupt basic structure
70
Flag[7:0]
IT Source 7
IT Source 6
IT Source 5
IT Source 4
IT Source 3
IT Source 2
IT Source 1
IT Source 0
XIRxSEL[7:0] (x = 0, 1, 2, 3)
XPxIC.IR (x = 0, 1, 2, 3)
Enable[7:0]
15 8
XIRxSEL[15:8] (x = 0, 1, 2, 3)
Table 6. X-Interrupt detailed mapping
XP0INT XP1INT XP2INT XP3INT
CAN1 Interrupt X X
CAN2 Interrupt X X
I2C Receive X X X
I2C Transmit X X X
I2C Error X
SSC1 Receive X X X
SSC1 Transmit X X X
SSC1 Error X
ASC1 Receive X X X
ASC1 Transmit X X X
ASC1 Transmit Buffer X X X
ASC1 Error X
PLL Unlock / OWD X
PWM1 Channel 3...0 X X

2.5.1 Hardware impact

None.

2.5.2 Software impact

The XIRxSEL registers must be configured.
If none of the new X-Peripherals are used, i.e. only the X-Peripherals that were already present on the ST10F168 are used, the following configuration can be used:
16/33
AN2169 New functionalities
XIR0SEL = 0x0100, only CAN1 interrupt is enabled and will generate an interrupt to the
ST10 through XP0IC
XIR2SEL = 0x0, not used
XIR3SEL = 0x2000, only PLL unlock interrupt is enabled and will generate an interrupt to
the ST10 through XP3IC.
Then, in the interrupt routines associated to the XPxIC, the respective flag in XIRxSEL register must be cleared. Since the XIRxSEL registers are not bit addressable, a pair of registers (a pair for each XIRxSEL) is provided to allow setting and clearing the bits of XIRxSEL without risking to overwrite requests coming after reading the register and before writing it. Therefore the following registers must be written to clear the flags:
in the CAN1 interrupt routine, XIR0CLR (@ EB14h) = 0x0001
in the PLL unlock interrupt routine, XIR3CLR (@ EB44h) = 0x0020
Additional information on the X-Interrupt multiplexer structure
Figure 2 shows that the X-Interrupt sources are connected to the interrupt request flag of the
XIRxSEL registers and to the XPxIR request flag via an AND gate with the enable bit. This AND gate is activated by a transition on the Interrupt source line and not by the latched value in the XIRxSEL register meaning:
A transition on the IT source line will generate an interrupt to the ST10 core if the source is
enabled.
Writing to an interrupt request flag in a XIRxSEL register will not generate an interrupt to
the ST10 core.
Example: If XIR0SEL = 0x0100: CAN1 interrupt enabled on XP0IC interrupt
To trigger by software the CAN1 interrupt routine with XP0IC register, the following code must be used:
XIR0SET = 0x0001;/* Set CAN1 interrupt request Flag in XIR0SEL register */ XP0IC = XP0IC | 0x0080;/* Set XP0IR flag and generate an interrupt routine to the ST10 */
Executing only the first line will only set the flag in the XIR0SEL register but will not be seen by the AND gate and can not set the XP0IR flag.

2.6 Programmable divider on CLKOUT

A specific register mapped on the XBUS allows to choose the division factor on the CLKOUT signal (P3.15).
XCLKOUTDIV (E902h)
XBUS
Reset Value: --00h
1514131211109876543210
-------- DIV rw rw rw rw rw rw rw rw
17/33
New functionalities AN2169
Bit Function
7:0
DIV
Fclkout = Fcpu / (DIV + 1)

2.6.1 Hardware impact

None.

2.6.2 Software impact

None if only CLOCKOUT is needed.
When CLKOUT function is enabled by setting the bit CLKEN of register SYSCON, by default the CPU clock is output on P3.15. To have access to XCLKOUTDIV register, and thus program the clock pre-scaling factor, the bit XMISCEN of XPERCON and XPEN of SYSCON registers must be set.
18/33
AN2169 Modified registers

3 Modified registers

3.1 WDTCON register

Some bits have been added for the ST10F276. Each of the different reset sources is indicated in the WDTCON register of the ST10F276. The indicated bits are cleared with the EINIT instruction. It is thus possible to identify the reset during the initialization phase.
ST10F168: WDTCON (FFAEh / D7h)
SFR
Reset Value: --05h
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
WDTREL
-
RW RW RW RW RW RW RW RW --- RRW
ST10F276: WDTCON (FFAEh / D7h)
SFR
- - - WDTR WDTIN
Reset Value: -005h
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
WDTREL PONR LHWR SHWR SWR WDTR WDTIN
RW RW RW RW RW RW RW RW RW RW HR HR HR HR HR RW
Bit Function
15:8 WDTREL: Watchdog Timer Reload Value (for the high byte)
5
(ST10F276)
4
(ST10F276)
3
(ST10F276)
2
(ST10F276)
PONR: Power-on (Asynchronous) Reset Indication Flag
Set by the Input RSTIN if a power-On condition has been detected.
Cleared by the EINIT instruction
LHWR: Long Hardware Reset indication Flag
Set by the input RSTIN
Cleared by the EINIT instruction
SHWR: Short Hardware Reset indication Flag
Set by the input RSTIN
Cleared by EINIT instruction
SWR: Software Reset Indication Flag
Set by the SRST execution
Cleared by the EINIT instruction
19/33
Modified registers AN2169
Bit Function
WDTR: Watchdog Timer Reset Indication Flag
1
0
Set by the watchdog timer on an overflow.
Cleared by a hardware reset or by the SRVWDT instruction.
WDTIN: Watchdog Timer Input Frequency Selection
0:Input frequency is Fcpu /2
1:Input frequency is Fcpu /128
Note: 1 More than one RESET indication flag may be set. After EINIT, all flags are cleared.
2 Power-on is detected when a rising edge from VDD=0 V to VDD<2.0 V is recognized.

3.1.1 Hardware impact

None.

3.1.2 Software impact

None if the ST10F168 software was masking the non-implemented bits.

3.2 PICON register

Some bits have been added, and some suppressed in this register for the ST10F276.
The port Input Control register PICON is used to select between TTL and CMOS-like input thresholds.
The CMOS-like input thresholds are defined above the TTL levels and feature a defined hysteresis to prevent the inputs from toggling while the respective input signal level is near the thresholds.
On the ST10F168, this functionality is available for pins of port 2, port3, port7 and port8 and the hysteresis level is 300 mV for CMOS levels.
In the ST10F276, this functionality has been added for the pins of port 4 and port 6.
Moreover the default hysteresis is now 500 mV for TTL levels and is 800 mV for CMOS levels.
ST10F168: PICON (F1C4h /E2h)
ESFR
Reset Value: 0000h
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
P8LOUT P7LOUT - P3HOUT P3LOUT P2HOUT P2LOUT P8LIN P7LIN P3HIN P3LIN P2HIN P2LIN
RW RW RW RW RW RW RW RW RW RW RW RW
ST10F276: PICON (F1C4h / E2h)
ESFR
20/33
AN2169 Modified registers
Reset Value: 0000h
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
- - - - - - - - P8LIN P7LIN P6LIN P4LIN P3HIN P3LIN P2HIN P2LIN
RW RW RW RW RW RW RW RW
Bit Name Function
Port x Low Byte Input Level Selection
PxLIN
PxHIN
PxLOUT
PxHOUT
0: Pins Px.7..0 switch on standard TTL input levels
1: Pins Px.7..0 switch on CMOS input levels
Port x High Byte Input Level Selection
0: Pins Px.15..8 switch on standard TTL input levels
1: Pins Px.15..8 switch on CMOS input levels
Port x Low Byte Output Driver Characteristic selection
0: Pins Px.7...0 output driver strength is reduced after reaching VOL or VOH
1: Pins Px.7...0 output drive is not reduced after reaching VOL or VOH
Port x High Byte Output Driver Characteristic selection
0: Pins Px.15...8 output driver strength is reduced after reaching VOL or VOH
1: Pins Px.15...8 output drive is not reduced after reaching VOL or VOH
Only for ST10F168
Only for ST10F168

3.2.1 Hardware impact

The CMOS levels of the 2 devices are slightly different, therefore the circuitry must be checked to verify that the new levels can still match the requirements.

3.2.2 Software impact

The high byte of the PICON register is reserved on the ST10F276. Check that the ST10F168 was not writing in bits P4LIN and P6LIN of PICON which are no longer reserved on the ST10F276.

3.3 IDCHIP register

A new field has been added inside the IDCHIP register to distinguish the different peripheral options.
ST10F168: IDCHIP (F07Ch)
ESFR
Reset Value: 10DXh
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
CHIPID REVID
RRRR R R R R R R RRRRRR
21/33
Modified registers AN2169
ST10F276: IDCHIP (F07Ch)
ESFR
Reset Value: 114Xh
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
PCONF CHIPID REVID
RRRR R R R R R R RRRRRR
Bit Name Function
ST10 Module Revision Identifier (Full Mask Set revision)
01h: Rev. A (First main revision)
REVID
CHIPID
PCONF
02h: Rev. B (Second main revision)
:
0Fh: Rev. P
ST10 Module Identifier
0A8: ST10F168 identifier (168d = 0A8h)
114h: ST10F276 identifier (276d = 114h)
Peripheral Configuration
00: (E) Enhanced (ST10F276)
01: (B) Basic
10: (D) Dedicated
11: reserved

3.3.1 Hardware Impact

None.

3.3.2 Software Impact

None.
22/33
AN2169 New registers

4 New registers

This section presents new registers that have to be considered when porting an application running on the ST10F168 onto the ST10F276.

4.1 XPERCON register

The ST10F276 has a new register named XPERCON that allows the XBUS peripherals to be separately selected for being visible to the user by means of corresponding bits. If not selected (not activated with a bit of XPERCON) before the XPEN bit in SYSCON is set, the corresponding address space, port pins and interrupts are not occupied by the peripheral, and thus this peripheral is not visible and not available.
ST10F276: XPERCON (F024h / 12h)
SFR
Reset Value: -005h
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
---- -XMISCENXI2CENXSSCENXASCENXPWMENXFLASHENRTCENXRAM2ENXRAM1ENCAN2ENCAN1
RW RW RW RW RW RW RW RW RW RW RW
EN
Bit Function
15:11 Reserved
XMISCEN: XBUS Additional Features Enable Bit
10
9
8
7
6
5
0: Accesses to the Additional Miscellaneous Features is disabled.
1: The Additional Features are enabled and can be accessed.
XI2CEN: XI 2 C Enable Bit
0: Accesses to the on-chip XI 2 C are disabled, external access performed.
1: The on-chip XI 2 C is enabled and can be accessed.
XSSCEN: XSSC Enable Bit
0: Accesses to the on-chip XSSC are disabled, external access performed.
1: The on-chip XSSC is enabled and can be accessed.
XASCEN: XASC Enable Bit
0: Accesses to the on-chip XASC are disabled, external access performed.
1: The on-chip XASC is enabled and can be accessed.
XPWMEN: XPWM Enable
0: Accesses to the on-chip XPWM module are disabled, external access performed.
1: The on-chip XPWM module is enabled and can be accessed.
XXFLASHEN: FLASH Enable Bit
0: Accesses to the on-chip XFLASH are disabled, external access performed.
1: The on-chip XFLASH is enabled and can be accessed.
23/33
New registers AN2169
Bit Function
RTCEN: RTC Enable Bit
4
3
2
1
0
0: Accesses to the on-chip Real Time Clock are disabled, external access performed.
1: The on-chip Real Time Clock is enabled and can be accessed.
XRAM2EN: XRAM2 Enable Bit
0: Accesses to the on-chip XRAM2 block are disabled, external access performed.
1: The on-chip XRAM2 is enabled and can be accessed.
XRAM1EN: XRAM1 Enable Bit
0: Accesses to the on-chip XRAM1 block are disabled, external access performed.
1: The on-chip XRAM1 is enabled and can be accessed.
CAN2EN: CAN2 Enable Bit
0: Accesses to the CAN2 XPeripheral and its functions are disabled (P4.4 and P4.7 pins can be used as general purpose IOs)
1: The CAN2 X-Peripheral is enabled and can be accessed.
CAN1EN: CAN1 Enable Bit
0: Accesses to the CAN1 XPeripheral and its functions are disabled (P4.5 and P4.6 pins can be used as general purpose IOs)
1: The CAN1 X-Peripheral is enabled and can be accessed.

4.1.1 Hardware impact

None.

4.1.2 Software impact

The value has to be changed from its default reset one to match XRAM size compatibility. Refer to XRAM section for more details.

4.2 XPEREMU register

This register has been added as a write-only register.
ST10F276: XPEREMU (EB7Eh)
XREG
Reset Value: XXXXh
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
---- -XMISCENXI2CENXSSCENXASCENXPWMENXFLASHENXRTCENXRAM2ENXRAM1ENCAN2ENCAN1
---- - W W W W W W W W W WW
The bit description is exactly the same as XPERCON.
EN

4.2.1 Hardware Impact

None.
24/33
AN2169 New registers

4.2.2 Software Impact

Once the XPEN bit of SYSCON register is set and at least one of the X-peripherals (except memories) is activated, the register XPEREMU must be written with the same content of XPERCON: this is mandatory in order to allow a correct emulation of the new set of features introduced on X-BUS for the new ST10 generation. The following instructions must be added inside the initialization routine:
if (SYSCON.XPEN && (XPERCON & 0x07D3)) then { XPEREMU = XPERCON }
Of course, XPEREMU must be programmed after XPERCON and after SYSCON, in such a way the final configuration for X-Peripherals is stored in XPEREMU and used for the emulation hardware setup.

4.3 EXISEL register

This register, standing for External Interrupt source selection, has been added in the ST10F276.
The purpose of this new register is to select the interrupt sources of the fast external interrupts among the other peripherals. For example, the CANy controller receive signal (CANy_RxD) can be used to interrupt the system(y=1,2).
ST10F276: EXISEL (F1DAh / EDh)
SFR
Reset Value: -005h
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
EXI7SS EXI6SS EXI5SS EXI4SS EXI3SS EXI2SS EXI1SS EXI0SS
RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW
Bit name Function
External Interrupt x source Selection (x=7..0)
00: Input from associated Port 2 pin.
EXIxSS
EXIxSS Port 2 pin Alternate source
01: Input from "alternate source".
10:Input from associated Port 2 pin logically ORed with "alternate source".
11:Input from associated Port 2 pin logically ANDed with "alternate source".
0 P2.8 CAN1_RxD P4.5
1 P2.9 CAN2_RxD / SCL P4.4
2 P2.10 RTC_secIT Internal MUX
3 P2.11 RTC_alarmIT Internal MUX
4..7 P2.12..P2.15 Not used (zero) -
25/33
New registers AN2169

4.4 Additional Ports Input Control: XPICON register

The possibility to select between TTL and CMOS-like input thresholds has been extended to the Ports 0, 1 and 5.
ST10F276: XPICON (EB26h)
XREG
Reset Value: --00h
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
- - - - - - - - - - P5HIN P5LIN P1HIN P1LIN P0HIN P0LIN
RW RW RW RW RW RW
Bit Function
P5HIN: Port 5 High Byte Input Level Selection
5
4
3
2
1
0
0: Pins P5.15..8 switch on standard TTL input levels
1: Pins P5.15..8 switch on CMOS input levels
P5LIN: Port 5 Low Byte Input Level Selection
0: Pins P5.7..0 switch on standard TTL input levels
1: Pins P5.7..0 switch on CMOS input levels
P1HIN: Port 1 High Byte Input Level Selection
0: Pins P1.15..8 switch on standard TTL input levels
1: Pins P1.15..8 switch on CMOS input levels
P1LIN: Port 1 Low Byte Input Level Selection
0: Pins P1.7..0 switch on standard TTL input levels
1: Pins P1.7..0 switch on CMOS input levels
P0HIN: Port 0 High Byte Input Level Selection
0: Pins P0.15..8 switch on standard TTL input levels
1: Pins P0.15..8 switch on CMOS input levels
P0LIN: Port 0 Low Byte Input Level Selection
0: Pins P0.7..0 switch on standard TTL input levels
1: Pins P0.7..0 switch on CMOS input levels
Reset Val ue
0
0
0
0
0
0

4.4.1 Hardware impact

None.

4.4.2 Software impact

None.
26/33
AN2169 New registers

4.5 XMISC register

ST10F276: XMISC (EB46h)
XREG
Reset Value: 0000h
151413121110987654 3 2 1 0
------------VREG
------------RWRWRWRW
Bit Function
15:4 Reserved
VREGOFF: Main Voltage Regulator disable in Power-Down mode
3
2
1
0
0: On-chip Main Regulator is held active when Power-Down mode is entered
1: On-chip Main Regulator is turned off when Power-Down mode is entered
CANCK2: CAN Clock divider by 2 disable
0: Clock provided to CAN modules is CPU clock divided by 2 (mandatory when F higher than 40MHz)
1: Clock provided to CAN modules is directly CPU clock
CANPAR: CAN Parallel Mode Selection
0: CAN2 is mapped on P4.4/P4.7, while CAN1 is mapped on P4.5/P4.6
1: CAN1 and CAN2 are mapped in parallel on P4.5/P4.6. This is effective only if both CAN1 and CAN2 are enabled through setting of bits CAN1EN and CAN2EN in XPERCON register. If CAN1 is disabled, CAN2 remains on P4.4/P4.7 even if bit CANPAR is set.
ADCMUX: Port1L ADC Channels Enable
0: Analog inputs on port P5.y can be converted (default configuration)
1: Analog inputs on port P1.z can be converted. Only 8 channels can be managed
OFF
CAN CK2
CAN PAR
CPU
ADC MUX
is

4.5.1 Hardware impact

None.

4.5.2 Software impact

None.

4.6 Emulation dedicated registers

A set of additional four registers are implemented for emulation purpose only. Similarly to XPEREMU, they are write only registers.
XEMU0 (00’EB76h)
XEMU1 (00’EB78h)
XEMU2 (00’EB7Ah)
XEMU3 (00’EB7Ch)
27/33
New registers AN2169
These registers are used by emulators. They have no user action on the ST10F276.

4.6.1 Hardware impact

None.

4.6.2 Software impact

None.
28/33
AN2169 Electrical characteristics

5 Electrical characteristics

5.1 DC characteristics

5.1.1 Absolute maximum ratings

They are the same.

5.1.2 DC characteristics

Overview of the DC characteristics
The pads of the ST10F276 have been redesigned according to the new technology and therefore the characteristics are different. Users should verify the DC characteristics.
The table below lists the parameters that might have the biggest impact.
ST10F168 Limit Values ST10F276 Limit Values
Parameter Symbol
min. max. min. max.
Unit
Input low voltage
Input low voltage (RSTIN, EA, NMI, and RPD)
Input low voltage (XTAL1 and XTAL3)
Input high voltage
Input high voltage (RSTIN, EA, NMI, and RPD)
Input high voltage XTAL1
Input Hysteresis HYS
Input Hysteresis RSTIN, EA, NMI
Output low voltage
Output low voltage (all other outputs)
Output high voltage
Output high voltage (all other outputs)
VIL SR VILS SR
VIL1 SR N.A. N.A. -0.3 0.3 VDD V
VIL2 SR -0.3 0.3 VDD V
VIH SR VIHSSR
VIH1SR 0.6 VDD
VIH2SR 0.7 VDD VDD + 0.5 0.7 VDD VDD + 0.3 V
VHYS1CC 800 mV
VOL C C
VOL1CC 0.45 / Iol = 1.6mA
VOH CC
VOH1CC
-0.5
-0.5
0.2 VDD + 0.9
0.8 VDD - 0.2
N.A. 300, special threshold
PORT0, PORT1, Port 4, ALE, RD, WR, BHE, CLKOUT, RSTOUT
0.9VDD / Ioh = -0.5 mA
2.4 / Ioh = -2.4 mA
0.9VDD / Ioh = -0.25 mA
2.4 / Ioh = -1.6 mA
0.2 VDD - 0.1
2.0, (special threshold)
VDD + 0.5 VDD + 0.5,( special
threshold )
VDD + 0.5, (special threshold)
-
0.45 / Iol = 2.4mA
PORT0, PORT1, Port 4, ALE, RD, WR, BHE, CLKOUT, RSTOUT
-0.3
-0.3
2.0
0.7 VDD
0.7 VDD VDD + 0.3 V
400 750
PORT6, ALE, CLKOUT, WR, READY, BHE, RD, RSTOUT, RSTIN
VDD - 0.8 / Ioh = -8 mA
VDD -0.08 / Ioh = -1 mA
VDD - 0.8 / Ioh = -4 mA VDD -0.08 / Ioh = -0.5 mA
0.8
0.3 VDD
VDD + 0.3 VDD + 0.3
-mV
0.4 / Iol = 8mA
0.05 / Iol = 1mA
0.4 / Iol = 4 mA
0.05 / Iol = 0,5 mA
PORT6, ALE, CLKOUT, WR, READY, BHE, RD, RSTOUT, RSTIN
–V
V
V
V
V
V
29/33
Electrical characteristics AN2169
ST10F168 Limit Values ST10F276 Limit Values
Parameter Symbol
Unit
min. max. min. max.
Input leakage current (Port 5)
Input leakage current (all other)
Input leakage current (P2.0)
Input leakage current (RPD)
Overload current (P2.0)
IOZ1CC
IOZ2CC ±1 / 0 V <VIN< VDD – ±0.5 uA
IOZ3CC -
IOZ4CC - ±3 uA
IOV2CC -
± 500 / 0 V <VIN< VDD
–± 200nA
-0.5 +1
-1 +5
uA
mA
30/33
AN2169 References

6 References

The following documents were used to write this application note:
ST10F168 Datasheet
ST10F276 Datasheet
AN1313 Application Note "Porting an application from the ST10F168 to the ST10F269"
31/33
Revision history AN2169

7 Revision history

Table 7. Document revision history
Date Revision Changes
3-Jul-2006 1 Initial release.
32/33
AN2169 Revision history
r
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST fo the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore
- Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
33/33
Loading...