TS4962M using the mono class D demonstration board
Introduction
The mono class D demo board STEVAL-CCA001V1 is designed for the TS4962M class D
audio amplifier. The TS4962M device, in a Flip-Chip package, is mounted on an adapter
board with DIP connectors (see Section 6) which is, in turn, mounted on the demonstration
board. Figure 1 shows the schematic diagram of the demonstration board, including the
Flip-Chip to DIP adapter.
Figure 1.Schematic diagram of mono class D demonstration board
Low voltage class D differential audio power amplifier with standby mode
●
Operating range from VCC=2.4 V to 5.5 V
●
2.3 W output power @ VCC=5 V, THD=1%, F=1 kHz, with 4 Ω load
●
1.4 W output power @ VCC=5 V, THD=1%, F=1 kHz, with 8 Ω load
●
Ultra low power consumption in standby mode (10 nA)
●
63 dB PSRR @ 217 Hz in grounded mode (Av=2 V/V)
●
Low pop and click noise
●
Fast startup time 5 ms
●
Module gain set at 2 V/V
●
Thermal and short-circuit protection.
4/11Doc ID 11283 Rev 5
AN2134Description of the demonstration board
2 Description of the demonstration board
Figure 2 shows the top view of the demo board STEVAL-CCA001V1, with the location of all
connectors
Figure 2.Mono class D demonstration board - top view
A list of components mounted on the demonstration board is given in Ta bl e 1 .
Table 1.Mono class D demonstration board bill of material
NameQuantityDescription
C112.2 µF/10 V, electrolytic capacitor
C21100 nF/63 V
C31100 nF/63 V
Cn113-pin header 2.54 mm pitch
Cn212-pin header 2.54 mm pitch
Cn312-pin header 2.54 mm pitch
Cn412-pin header 2.54 mm pitch
Cn512-pin header 2.54 mm pitch
Cn613-pin header 2.54 mm pitch
J1 to J34Jumper, 2.54 mm pitch
R11150 kΩ, 1/4 W 1% resistor
R21150 kΩ, 1/4 W 1% resistor
U11TS4962M Flip-Chip to DIP adapter
Tab l e 2 gives the list of the connectors on the demonstration board, with a description and
configuration information for each one.
Doc ID 11283 Rev 55/11
Demonstration board connectorsAN2134
3 Demonstration board connectors
Table 2.Demonstration board connectors
ConnectorsDescription
Cn3Input signal connector (active input signal positive and negative)
Cn4 and Cn5
Cn6Output signal connector (Vo+ and Vo-)
Cn1Standby control connector (GND, standby, V
Cn2Power connector (VCC and GND). Power supply voltage from 2.4 V to 5.5 V.
U1Socket connector for Flip-Chip to DIP adapter
Connectors to modify input configuration (from capacitor-coupled = no jumper
to common mode feedback = short-circuit)
).
CC
Caution:When the power is supplied through Cn2, do not invert the polarity as it can destroy the
amplifier U1.
4 Demonstration board layout
Figure 3 and Figure 4 show the bottom and top layers of the demonstration board PCB.
Figure 3.PCB bottom layerFigure 4.PCB top layer
6/11Doc ID 11283 Rev 5
AN2134Configuring the demonstration board characteristics
A
v
300kΩ
R1
------------- ----- or =
A
v
300kΩ
R2
------------ ------=
1
2πR1×C2×
---------------------------------- -
1
2πR2×C3×
---------------------------------- -=
5 Configuring the demonstration board characteristics
5.1 Differential gain
The demonstration board is set up with the differential gain, AV, set to 2 V/V.
If necessary, the differential gain may be adapted by modifying the values of resistors R1
and R2, in accordance with the following relation:
Equation 1
where R1=R2 in kΩ.
5.2 Input configuration
On the demonstration board, the Cn4 and Cn5 jumpers allow you to change the input
configuration. You can select either capacitor-coupled or common-mode feedback.
In the capacitor-coupled configuration, the -3 dB cutoff frequency in Hz is:
Equation 2
with R in Ohms, C in Farads and where C2=C3.
More information about component calculations is available in the TS4962M datasheet.
Doc ID 11283 Rev 57/11
Flip-Chip to DIP adapterAN2134
In-
Stdby
In+
Out-
Out+
Vcc
C2
C1
A1
A2
A3
B1B2
B3
C3
GND
Internal
Bias
PWM
Output
Bridge
H
Oscillator
150k
150k
+
-
300k
TS4962
R1
OR
R2
OR
C1
100nF
+
C2
1uF
Pin4
Pin5
Pin1
Pin6
Pin10
Pin3
pin8
Pin2
Pin9
6 Flip-Chip to DIP adapter
The TS4962M is available in a Flip-Chip package which, while offering the advantages of
excellent thermal dissipation and maximum space-savings, is difficult to manipulate for test
or evaluation purposes.
For this reason, the TS4962M device is pre-mounted onto a Flip-Chip to DIP adapter, shown
schematically in Figure 5.
Figure 5.Schematic diagram of the Flip-Chip to DIP adapter
A component list for this adapter is given in Ta b le 3 below. The top-view of the adapter is
shown in Figure 6.
Table 3.Flip-Chip to DIP adapter bill of material
DesignationQuantityDescription
C11100 nF/10 V, ceramic capacitor, 0603
C211 µF/6.3 V, Tantalum capacitor, 0805
R110R resistor, 0603
R210R resistor, 0603
8/11Doc ID 11283 Rev 5
U11TS4962M
AN2134Flip-Chip to DIP adapter
4962
C2
Pin1
Pin5Pin6
Pin10
Figure 6.Adapter top view
Doc ID 11283 Rev 59/11
Revision historyAN2134
7 Revision history
Table 4.Document revision history
DateRevisionChanges
1-Mar-20051Initial release.
1-Dec-20052Format updated.
6-Feb-20073Updated document structure and format.
27-Feb-20074Removed draft banner, added this revision history.
28-Mar-20125Tab l e 3 modified.
10/11Doc ID 11283 Rev 5
AN2134
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