AN2118
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Application note
STLC3075 single supply SLIC for
WLL application in buck-boost configuration
Introduction
The STLC3075 is a SLIC device specially designed for WLL (Wireless Local Loop) and
ISDN terminal adapters.
This document contains a description of the device functions in buck-boost configuration,
and provides some application hints. The device data sheet is an essential complement to
this application note, providing important reference information that will simplify
understanding of the content.
February 2007 Rev 3 1/21
www.st.com
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Content AN2118
Content
1 Wireless local loop system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 TQFP 10 mm x 10 mm x 1.4 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 VBAT voltage generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.2 Operati on in off-hook condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.3 VPOS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.4 Start-up and DC-DC converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.5 Input curr ent limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.6 VPOS current capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.7 RSENSE settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.8 Trapezoidal ringing signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.9 Ringer load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.9.1 With European REN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.9.2 With USA REN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.10 Functioning at low VPOS (5.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.11 Effici ency and power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.12 Micro interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.13 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.14 Ring trip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.15 PCB precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.16 Ground configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.17 Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.18 On-hook transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.19 Phone detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.20 ESD immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.21 Setting resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2/21
3.22 Longitudinal balance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.23 TTX filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.24 Gain settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
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AN2118 Content
3.25 Complex impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4 Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3/21
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Wireless local loop system AN2118
WLL
SLIC
WLL
SLIC
WLL
SLIC
1 Wireless local loop system
Figure 1. Wireless central office to premises diagram
WLL
SLIC
☎
WLL
SLIC
WLL
SLIC
☎
☎
Central
office
Local loop
SLIC
Base station
transceiver
Final connection
by radio link
=
wireless
local loop
☎
PC00335
The main characteristics of this device consist in the capability to:
● operate with a single supply voltage in Buck-Boost or Fly-Back configuration (see
AN2132 for information on Fly-Back configuration).
● In Buck-Boost configuration, it can operate as in the standard STLC3055N
application, with a VPOS voltage in a range from +5.5 V to +12 V.
● generate negative battery voltage
● generate a ring signal (trapezoidal wave form)
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AN2118 Packaging
2 Packaging
The STLC3075 is housed in standard TQFP package plastic with copper lead frame. No
copper slugs protrude from the plastic body. STLC3075 uses the “standard” package option.
The thermal resistances, shown in
junction and the ambient still air, and are calculated or measured in ° C/W.
Table 1. Thermal resistance versus package size
Symbol Parameter Value Unit
Rth j-amb
Rth j-amb
Thermal resistance junction ambient
(Full plastic TQFP on single layer board)
Thermal resistance junction ambient
(Full plastic TQFP on four layer board)
Table 1
and
2.1 TQFP 10 mm x 10 mm x 1.4 mm
Theta (j-a) on boards, in still air.
Figure 2. Thermal resistance versus board structure
Figure 2
, are considered between the
70 ° C/W
45 ° C/W
5/21
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Typical application schematic AN2118
3 Typical application schematic
Figure 3. Typical application schematic
VPOS
CVCC
CVPOS
RSENSE
VPOS
RSENSE
GATE
VBAT
CVB
VF
CLK
CLK
RP
TIP
RREF
RP
CREV
RLIM
RING
CSVR
CREV
RTH
RLIM
IREF
RD
RD
CRD
RING
D00TL489B
Q1
P-ch
D1
RF1
L
CV
RF2
TIP
CSVR
RTH
CCOMP
DET
CONTROL
D0
INTERFACE
D1
D2
PD
TTX CLOCK
SUGGESTED GROUND LAY-OUT
SYSTEM GND
TX
RX
RRX
AGND
TX
RX
RS
RS
ZAC
ZAC1
ZAC
ZA
CH
VDD
RDD
RLV
RLV
CFL
ZB
ZB
GAIN SET
DET
D0
D1
D2
PD
CKTTX
CTTX1
CS
CTTX2
FTTX
RTTX
RTTX
AGND
BGND
PGND
CTTX
BGND
CAC
CVCC
ILTF
CAC
3.1 VBAT voltage generation
When operated with a positive supply voltage VPOS and a correctly set clock signal
(typically 125 kHz), the SLIC generates a VBAT voltage for the active and ring operations.
The VBAT voltage level, with a 10% spread, is defined by the voltage divider RF1 / RF2 and
can be set by choosing an RF1 value from a recommended set of values (see
Table 2. VBAT voltage values
RF1 (kΩ) VBAT (Active mode) VBAT (Ring mode)
270 -45.8 V -64.0 V
285 -48.2 V -67,4 V
300 -51.2 V -71.8 V
315 -54.0 V -75.3 V
330 -56.0 V -78.2 V
These values are referred to the device in active mode, on-hook condition (IL = 0 mA), and
in ring mode without load.
The VBAT value must be chosen taking into account the absolute maximum ratings of the
device (VBtot = 90 V). VBtot = (VBAT + VPOS) = 90 V must not be exceeded.
When ring mode is selected through the control interface, the VBAT voltage is increased by
an internal circuit from it’s active level to a predetermined value for ring mode. These two
Table 2
):
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AN2118 Typical application schematic
voltage levels (VBAT active and VBAT ring) are hence correlated. When one is set, (ring or
active), the other is also set at the same time.
3.2 Operation in off-hook condition
A major feature of this device is that when changing from on-hook to off-hook conditions
(IL >0 mA), the VBAT voltage is automatically adjusted depending on the loop resistance
and on the programmed current limitation value (ILIM).
It should be noted that the device is optimized to operate on short loop applications
(RLOOP ≤ 500 Ω) in order to obtain the correct ring-tr i p detec ti on.
In these conditions, with line current reaching the programmed constant current feed value
(ILIM), the STLC3075 works like a current generator with a fixed DC current.
A fixed voltage drop, 4 V on TIP/GND and approximately 6 V on RING/VBAT, assures the
DC functionality and the proper swing for the AC signal.
When the line is set off-hook, the STLC3075 automatically adjusts the generated battery
voltage (VBAT) to feed the line with a fixed DC current (programmable via RLIM), and so
optimizes power dissipation.
Considering maximum and minimum values for RLOOP ranging from 500 to100 Ω, and with
fixed parameters ILIM = 25 mA and 2Rp = 100 Ω, the battery voltage (VBAT) will be equal to:
1. VBAT = 25 mA x (500+100) + 10 V = - 25 V
2. VBAT = 25 mA x (100+100) + 10 V = - 15 V
A correctly set current threshold (typically 9 mA), programmable by external resistor RTH,
allows the correct on/off hook transition function.
During the off-hook dynamic transition, the CAC capacitor is charged. The line current
regulator system senses the current flowing into RD and reduces the ILOOP current to the
programmed ILIM value, set by RLIM.
The settling time of the ILIM current is about 150 ms, and it is a function of the CAC splitter
capacitor (min . value allowed is 22 µF).
3.3 VPOS characteristics
The input voltage VPOS can change slowly within the data sheet range (5.5 V - 12 V)
without any effect on the VBAT voltage.
The STLC3075 can continue to operate correctly even if the VPOS voltage occasionally
goes below 5.5 V (instantaneous value, not steady-state). The only limitation is the minimum
voltage required on the external PMOS to keep it in a linear area.
Fast transients, ripples and spikes on the supply voltage V
a reduced amplitude, depending upon the voltage supply rejection of the device.
Bench measurements on SVRR give -35 dB @ f = 50 Hz and -47 dB @ f = 4 kHz, using the
test circuit configuration with the device in active mode, loaded with an RLOOP = 500 Ω,
and ILIM = 25 mA.
will appear on TIP/RING with
POS
7/21
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Typical application schematic AN2118
3.4 Start-up and DC-DC converter
In order to prevent problems during start-up, an internal circuit turns-on the gate of the
MOSFET only when VPOS reaches 4 V and turns it off for VPOS lower than 3 V.
For VPOS voltage higher than 4 V the DC/DC converter power-on is controlled by a soft
start circuit embedded on the devices.
Figure 4. DC-DC converter circuit
The DC\DC converter works in Buck-Boost configuration and its operation can be described
as a two step process.
MOSFET in turn-on condition : energy from VPOS is stored in the inductor, diode is reverse
biased, and the load on VBAT is powered by the energy stored in the output capacitors CV.
MOSFET in turn-off condition : energy stored in the inductor is delivered to the output
capacitor and hence on the load, by the forward biased diode.
An internal circuit controls the duty-cycle of the gate signal so that the output current of the
DC\DC converter can be proportional to the load. If a higher power is required for a short
time, an embedded circuit fixes the maximum duty-cycle to about 95%. In this case,
RSENSE guarantees the maximum value of the limited current.
3.5 Input current limitation
In WLL applications, the power supply usually does not have high-power current capability.
Therefore when a ring trip occurs, the status of the SLIC changes from ring mode to offhook condition. As the loop current control does not react immediately, the line current
reaches the output stages current limitation value of about 80 mA. As a consequence, a
high peak current is sunk from VPOS which could be higher than its maximum current
capability. In this case, if no limiting current circuit is used, (RSENSE = 0), the VPOS voltage
would drop.
To prevent this, the STLC3075 incorporates a circuit to limit peak current on the VPOS input.
The peak current value is defined by the formula:
This input current limitation circuit operates during all transients caused by changes in the
line current conditions.
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IPEAK
100mV
------------------------- -=
RSENSE
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AN2118 Typical application schematic
3.6 VPOS current capability
The table below summarizes the value of the current drawn from VPOS supply vs. REN @
20 Hz conditions. (For REN definition see
Table 3. Ivpos average current
1REN (Europe) 3REN (Europe) 5REN (USA)
VPOS (V)
Ivpos (mA Tot) Ivpos (mA Tot) Ivpos (mA Tot)
5.5 130 420 590
6.0 120 280 520
9.0 90 180 360
12.0 60 140 270
When the power supply voltage cannot feed the maximum current (that is, it hasn't got
enough current capability), the VPOS voltage will be impacted.
Section 3.9
.)
3.7 RSENSE settings
The RSENSE resistor sets the input peak current value, which must be lower than the power
supply current capability limit.
In a typical application, the input peak current is fixed at 900 mApK (100 mV / 110 mΩ) in
order to guarantee optimum performance in the total range of the current loop (20 to 40 mA)
and the VPOS supply (5.5 to 12 V), driving up to 3REN of load.
If the device has to drive up to 5REN, the value of RSENSE must be reduced to between
100 and 90 mΩ. This increases the input peak current to between 1 Apk and 1.1 Apk, which
guarantees correct operation at low VPOS voltage conditions (5.5 to 6 V) using a ringing
frequency of 20 to 25 Hz.
If the device has to work with a limited input peak current of about 0.6 Apk, setting the
RSENSE resistor value in the range of 170 to 180 mΩ, it is mandatory to use a VPOS
voltage of 12 V.
3.8 Trapezoidal ringing signal
In the application domain targeted for this product (Integrated Access Device, Set Top Box,
Small Office Home Office etc...) non sinusoidal ring waveforms are accepted. Therefore the
STLC3075 generates ringing signals with a trapezoidal waveform.
This type of waveform is very similar to a sine wave whose distortion can be kept lower than
5% and crest factors have a value of 1.2, just by correct selection of the external CREV
capacitor.
Because the value of CREV is a function of the ringing frequency, this value has to be
adapted to the ringing frequency used.
A CREV in the range 18 to 22 nF gives a trapezoidal ringing signal and correct shaping with
20 to 25 Hz ringing frequency. To increase the ringing frequency to 68 Hz, the value of
CREV should be chosen in the range of 6.8 to 8.2 nF.
9/21
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Typical application schematic AN2118
3.9 Ringer load
3.9.1 With European REN
In a typical application the STLC3075 can drive up to 3REN european standard
(1REN = 1800 Ω + 1 µF), @ f = 20 Hz, with crest factor (VppK / Vrms) = 1.22. The levels
measured at the ringer terminal are summarized in the following tables.
Table 4. Ringer load (VPOS = 6 V) with European REN
CREV Crest factor
22nF 1.22 62.5V 51.2V 61.8V 50.2V
Table 5. Ringer load (VPOS = 12 V) with European REN
CREV Crest factor
22nF 1.22 63.2V 51.8V 62.8V 50.8V
3.9.2 With USA REN
If the device has to drive up to 5REN, as requested by USA specifications (1REN = 8 µF +
6930 Ω), it is necessary to modify some external components as follows:
RSENSE = 90 mΩ to increase the current capability in order to guarantee this performance
@ VPOS = 5.5 V.
RD = 2.2 kΩ in order to avoid false off-hook detection (IRTH = 100 / RD).
The following tables summarize the results @ 20 Hz ringing frequency:
Table 6. Ringer load (VPOS= 6 V) with USA REN
CREV Crest factor
1 REN
Vppk Vrms
1 REN
Vppk Vrms
1 REN
Vppk Vrms
3 REN
Vppk Vrms
3 REN
Vppk Vrms
3 REN
Vppk Vrms
5 REN
Vppk Vrms
22nF 1.22 62.0V 50.6V 59.6V 48.7V 57.8V 47.0V
Table 7. Ringer load (VPOS=12 V) with USA REN
CREV Crest factor
22nF 1.22 63.0V 51.3V 60.8V 49.3V 58.6V 47.5V
1 REN
Vppk Vrms
3 REN
Vppk Vrms
5 REN
Vppk Vrms
3.10 Functioning at low VPOS (5.5 V)
When the device is working to VPOS = 5.5 V, good efficiency can be reached if the P-MOS
works in the linear region with a series resistance equal to Ron. This gives a proper ID
10/21
current with Vgs (about VPOS) generated by the driver.
The IRF9510S assures the correct operation in a linear region starting from a minimum
VPOS voltage of 5.5 V.
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AN2118 Typical application schematic
Figure 5
shows that the MOSFET can guarantee a minimum current value of 700 mA with a
Vthmax = 4 V, in the condition of Vgs = 5 V and Vds = 1 V.
In the application Vgs = VPOS. Considering the RSENSE drop to be negligible, the value of
Vgs-Vth = 1.5 V allows to the MOSFET to work in a linear region.
Linear region is obtained for Vds < Vgs-Vth.
Figure 5. Typical output characteristics Tcase = 25°C
3.11 Efficiency and power dissipation
At the fixed CLK frequency, the best DC/DC converter efficiency can be obtained with:
● a good compromise between RDS(ON) and the parasitic input/output capacitances
value of the PchMOSFET. For this reason the IRF9510/20 has been chosen
(VDSS = -100 V, RDS(ON) =1.2 Ω, ID = -4.0 A).
● a coil inductor for DC/DC applications, like the SMD coil made by Sumida (type
CDRH125, 100 µH), with a high efficiency fast recovery diode like the SMBYW01-200
showing a Trr max=35 ns @ VF = 1 A.
Note: Note that efficiency (η) is also influenced by the value of VPOS.
Table 8
on an ST board.
Figure 6. Circuit configuration for DC/DC converter efficiency measurements
and
Table 9
VPOS
summarize the measurements of the DC/DC converter efficiency, made
AGND
IVPOS Tot
BGND
VPOS
R
SENSE
GATE
VBAT
IVPOSslic
R
Idc/dc
SENSE
D1
CV
CVPOS
L
D05tl633
11/21
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Typical application schematic AN2118
The efficiency parameter η is calculated with the following formula:
Idc
------- -
VBAT⋅
dc
------------ ------------ ------------- ------------- -------------
η
IVPOStot IVPOSslic–
VPOS⋅=
Measurement conditio n s:
● external switch PchMOS IRF9510
● SLIC status considered: High impedance; Active with ILOOP=25 mA, RLOOP = 500 Ω.
● SMD power inductor, SUMIDA, type CDRH125, typical value 100 µH, Rs = 2.5 Ω,
permissible DC current 1.3 A.
Table 8. H.I. feeding @ open circuit
Idc/dc
(mA)
3 REN
Vppk
Vrms
Vbat (V)
CREV Crest factor
6 13.15 3.75 0.17 -50.80 56.40 8.6
12 17.70 4.40 0.20 -51.20 160.00 10.25
Table 9. Active mode @ RLOOP = 500 ohms
VPOS (V)
5.5 177 7.0 29.5 24.8 935.00 731.60 78%
6 160 7.2 29.5 24.8 916.80 731.60 80%
9 111 8.0 29.8 24.8 927.00 739.04 80%
12 86 8.3 29.8 24.8 932.40 739.04 79%
Ivpos
(mA Tot)
1 REN Vppk
Vrms
Ivpos
(mA pin25)
5 REN
Vppk
Vrms
Pvpos
(mW)
CREV Crest factor
Pvbat
(mW)
Eff (%)
For a given value of supply voltage VPOS, the current consumption from the VPOS supply
will be influenced by the electrical characteristics of the selected coil
In order to highlight the power consumption advantages of the STLC3075 compared to the
first generation product STLC3055Q,
Table 10
details the H.I. feeding @ open circuit
measurements for that first generation device.
Table 10. STLC3055Q H.I. feeding @ open circuit
VPOS (V)
6 32 4.6 2.3 -52.2 164.4 120.0
12 22 4.6 2.5 -52.7 208.8 131.7
Ivpos
(mA Tot)
Ivpos
(mA pin25)
Idc/dc (mA) Vbat (V) Pvpos (mW) Pvbat (mW)
12/21
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AN2118 Typical application schematic
3.12 Micro interface
The input levels are interpreted as TTL levels, therefore both 3.3 or 5 V CMOS input signals
can be accepted by the STLC3075.
The output DET signal is an open drain (needing an external pull-up resistor to VCC),
therefore both 3.3 and 5 V logic levels can be generated, depending on the value of VCC.
3.13 Protection
Different circuit configurations can be used to protect the device from overvoltages.
The best solution to use depends on the specified overvoltage and on whether or not the
environment where the STLC3075 has to work is defined by the K20 requirements.
If K20 is requested, a solution that includes a transient voltage suppressor LCP1521, PTC
resistors, and two transils has to be used (see
Two diodes inside the LCP1521 will clamp to ground any positive lightning, power cross and
voltage overstress.
For negative overvoltages, the device will fire because of the gate triggered on the voltage
VBAT. A series of two transils (2 x SM6T39A), to best fit the voltage clamp (typically 78 V),
will avoid exceeding the total voltage (Vbtot) applied to the device supply pins.
Figure 7
).
Note: Vbtot = VPOS + VBAT = 90V according to the absolute maximum rating of the STLC3075.
PTC resistors like the Raychem TR250/80T series will prevent damaging during power
cross conditi ons.
Figure 7. Standard overvoltage protection configuration for K20 compliance
BGND
STLC3055N
RP1
TIP
RP1
LCP1521
RP1 = 30ohm:
RP2 =Fuse or PTC > 18ohm
2 x
SM6T39A
RING
VBAT
RP2
RP2
TIP
RING
RP1 = 30 Ω and RP2 ≥18 Ω
When K20 requirements are not necessary, a simpler solution consists in the adoption of
diodes between VBAT/TIP, RING, TIP, and RING/GND. Suggested diodes are:
● BYT 11-600 or BYW 100-200 for through hole assembly
● STTB 106U or STPR 120A for SMD assembly.
Also in this case, 2 x SM6T39A transils must be used (see
Figure 8
).
13/21
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Typical application schematic AN2118
Figure 8. Simplified configuration for indoor overvoltage protection
RP1 = 30 Ω and RP2 ≥18 Ω.
3.14 Ring trip
In this SLIC, the ring trip detection is performed by sensing the average current (an image of
the line current) injected in the RD resistor, rectified by a dedicated circuit.
It is then filtered by a CAC capacitor and compared to the internally programmed ring trip
threshold (IRTH) by the RD resistor itself. Do not confuse this with the RTH resistor which
sets the off-hook threshold for active and H.Z. modes.
If the average of the trapezoidal AC current changes in the transition from higher ring
impedance (On-hook condition) to low impedance (Off-hook condition), the voltage on the
RD resistor increases.
BGND
STLC3055N
2 x
SM6T39A
RING
VBAT
RP1
TIP
RP1 RP2
STPR120A
RP2
STPR120A
RP1 = 30ohm:
RP2 =Fuse or PTC > 18ohm
TIP
RING
As soon as this voltage goes over the programmed threshold (IRTH), the ring trip will be
detected.
In ring mode there is no DC current into the RD resistor, but only the rectified average
current. It is clear that the previously described ring trip method is optimized to operate in
short loop (<500 Ω) applications and not in the presence of a very long line.
The ring-trip detection threshold is programmed by the formula: IRTH = 100/RD.
With 20 Hz of ring frequency, CAC=22 µF, and RD=4 kΩ, the pin DET goes low about
100 ms after the off-hook transition.
When the SLIC is in ring mode, the maximum average current depends of the REN load.
During normal functioning, this current must be lower than the IRTH threshold.
Typical applications can guarantee up to 3REN of load. By increasing the REN number up to
5REN, the AC load will increase. The average current l can then become higher than IRTH
and a ring trip will be detected. It is possible to readjust this situation by reducing the value
of RD. Alternatively, increasing the IRTH threshold will also increase the ring trip time.
In summary, the ring trip is a function of:
● the load (REN number)
● the value of the ring trip rectified average threshold current "IRTH"
● the value of the maximum peak current sunk from VPOS "Ipk" - higher the REN number
lower the value of RSENSE
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AN2118 Typical application schematic
3.15 PCB precautions
Figure 9. Layout reference
Good PCB layout is a basic requirement to avoid noise problems that can have a negative
impact on the device operating conditions.
In practice, noise can come from grounding, power supply, parasitic coupling between PCB
tracks, and from high impedance points.
The PCB layout should prevent any coupling between the DC/DC converter components
and analog pins that are referred to AGND (for example: RD, IREF, RTH, RLIM, VF).
As a first recommendation, the components CV, L1, D1,CVPOS, and RSENSE should be
kept as close as possible to each other and isolated from the other components.
Noise could be produced by ripple on the CVBAT capacitor and in particular across its
equivalent series resistor value (ESR). The lower this value, the lower the ripple that can be
present on VBAT.
Particular care has to be taken on the tracks used for connection between VPOS and the
DC/DC converter, which must be low impedance tracks due to the high current flowing in
them.
Noise can also be prevented by connecting RREF (26K1) as close as possible to the IREF
pin.
3.16 Ground configuration
Another important point is the ground connection: a star configuration is suggested (see
Figure 10
Figure 10. Suggested ground layout
).
GND
System GND
AGND
BGND
PGND
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Typical application schematic AN2118
It is important to create a specific P-GND area on the layout, with connections to:
● the GND of the CV electrolytic capacitor,
● the GND of the CVPOS electrolytic capacitor,
● the GND of the inductor.
This P-GND area has to be connected to the center of the star via a dedicated track.
In this way, any disruptions from the peak current produced by the switching transistor will
be cooled by the center of the GND star (system GND), without any disturbance on the
other GND (AGND/BGND).
All the other components have to be connected on the GND (AGND/BGND) area.
3.17 Capacitor
Ceramic capacitors CVB and C14 may be used to filter the high frequency ripple and noise
that electrolytic capacitors CV and CVPOS respectively are unable to reject.
It is also advisable to connect a 100 nF capacitor from VPOS and GND in order to cancel
any high frequency noise on the VPOS pin. This capacitor may not be required, depending
on the high frequency sensitivity of the apparatus that the STLC3075 device is included in.
CRD avoids noise coupling on the RD pin, which is a high impedance input.
3.18 On-hook transmission
Voice transmission performances are guaranteed in the complete range of loop currents
down to 0 mA, when setting the SLIC in active mode, and receiving data on the RX pin
during ringing pause.
The maximum output voltage is correlated to the 2 wires overload voltage parameter (see
datasheet).
3.19 Phone detection
The pin DET can also be used to detect the load status of the line.
When the loop is in on-hook condition with a typical telephone connected, setting the SLIC
in active reverse polarity and then changing its status to H.I. feeding, pin DET will go to low
level for a time of about 1.5 ms. If the line is open, this time is reduced to about 2 µs.
16/21
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AN2118 Typical application schematic
3.20 ESD immunity
The ESD protection in this device withstands a discharge of 2kV with the Human Body
Model. If the STLC3075 must operate in sensitive apparatus where equipment tests against
ESD immunity are required (4kV, 8kV), some precautions have be taken.
During these tests, where the device is usually powered, ESD transients can put the internal
ESD protection diodes (connected on VPOS and RSENSE pins) into the ON condition.
When the transient disappears and the VPOS supplied is higher than 9 V, the internal ESD
diodes are not able to recover back to the OFF condition.
Using a VPOS supply of less than 9 V, the recovery of the ESD diodes is guaranteed and
the equipment will be able to pass the ESD immunity tests. When it is not possible to use a
reduced VPOS voltage, a solution can be found using the schematic configuration shown in
Figure 11
Figure 11. Circuit configuration for VPOS>9V
.
VPOS
CVPOS
RSENSE
470mΩ
CVCC
Since this solution has an impact on the threshold of the input limitation circuit, it is
necessary to increase the RSENSE resistor up to 470 mΩ to restore the previous situation.
3.21 Setting resistor
The following current is flowing into the resistor of the STLC3075 application:
● IRLIM, IRTH, IRREF = 1.3 V/R
● IRD = Iline/100
● IRSENSE = 100 mV/RSENSE
● IRF1, IRF2 can be considered around 300 µA
● No DC current flows into RS, ZAC, ZA, ZB, RLV, RTTX.
CVCC
100Ω
VPOS
RSENSE
GATE
VBAT
100Ω
Q1
P-ch
D1
CVB
VF
D05th625
RF1
RF2
L
CV
3.22 Longitudinal balance
To avoid degradation on this parameter, it is very important to use Rp resistors with 1%
tolerance, and (if used) PTC resistors with 1% matching.
Low longitudinal balance rejection, caused by the mismatching of the resistors or PTC, can
generate noise problems. For example in a GSM based WLL, noise can be generated from
the 25 Hz produced by the 4 ms burst of the antenna transmission.
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Typical application schematic AN2118
3.23 TTX filter
A dedicated metering pulse low pass filter (12 kHz to 16 kHz), with 3rd order filtering can be
obtained by choosing the following values for the external components:
RLV=16K2//16K2 =8.1K, CFL=1.5 nF, R1=1.3 MΩ, R2=180K, C1=47 pF, C2=6.8 pF.
If the TTX is not requested, the components RLV, CS, CFL, RTTX, CTTX can be removed.
In addition, the pins CKTTX, CTTX1, CTTX2, FTTX have to be connected to GND, and the
pin RTTX open.
3.24 Gain settings
In order to adapt the SLIC versus the 3.3 V low supply voltage CODEC, the device provides
the possibility to change the TX and RX gains by the gain set control pin.
Table 11. Gain settings
Gain set RX gain TX gain Impedance synthesis scale factor
0 0dB - 6dB X 50
1 + 6 dB - 12dB X 25
3.25 Complex impedance
Most countries (administration) adopt complex impedance for both the “Exchange
Impedance” (Zexch) and the “Balance impedance”, instead of a 600 Ω purely resistive
impedance. As a consequence, the AC input impedance that the SLIC plus protection
resistor shows at its line terminals (Zs), has to be calculated in order to correctly match the
Zexch, to obtain good performance on the return loss parameter.
When Zexch is a complex impedance, the synthesized impedance Zs will be calculated as:
where 50 is a fixed scale factor. (For ZAC definition see datasheet.)
For gain set = 1 the scale factor is 25.
Considering, for example, the ETSI 2 complex impedance Zexch = 270 + (750//150nF)
An AC input impedance has to be synthesized on Pins TIP/RING of the SLIC (ZAC). To do
so, considering the line terminal, the correct Zs must be calculated as:
● ZAC=(Zs-2Rp)*50 because 2Rp = 100 Ω
● ZAC= (270-100)*50 + [(750*50)//(150 nF/50)] = ZAC = 8.5K + (37.5K//3 nF)
In this way the SLIC will synthesize Zs impedance matching correctly the Zexch.
Also for the 2 to 4 wire conversion, the administration defines an AC terminal balance
impedance Zb properly used to obtain the THL performance.
Zs
ZAC
------------ 2Rp+=
50
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Good trans-hybrid loss performance, and therefore a proper echo cancellation, can be
obtained by correctly matching the two external impedances, ZA and ZB, which can also be
complex impedances.
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AN2118 Typical application schematic
ZA = 50 x Zexch
ZB = 50 x Zb
For gain set = 1 the scale factor is 25
In the case of Zb=Zexch, the impedances ZA and ZB can be replaced by two resistors
calculating their value as:
ZA = ZB = 50 x |Zexch|. For gain set = 1 the scale factor is 25.
Where |Zexch| is the modules @ 1 kHz.
For ETSI 2 the value |Zexch| = 842 Ω
ZA = ZB = 50 x 842 Ω = 42.1 k Ω
A typical value of 120 pF (with gain set = 0) for the capacitors CComp and CH guarantee
both loop stability and good THL performance.
For gain set = 1 the capacitor value is doubled.
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Support AN2118
4 Support
Please contact your local ST sales office for details of the STLC3075 firmware.
5 Revision history
Table 12. Document revision history
Date Revision Changes
15-May-2005 1 Initial release.
15-Nov-2005 2 Modified
16-Feb-2007 3 Updated
Figure 11
Figure 3
.
.
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AN2118
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