ST AN2027 APPLICATION NOTE
AN2027
Application note
Mounting recommendations for ceramic DMOS packages
Introduction
This application note provides mounting recommendations for ceramic packages used in the assembly of DMOS radio frequency transistors suitable for applications such as ISM and FM broadcasting.
June 2011 |
Doc ID 10738 Rev 2 |
1/5 |
www.st.com
Mounting recommendations for M174, M177 and M244 |
AN2027 |
|
|
1Mounting recommendations for M174, M177 and M244
1.1Mounting recommendations
●Ensure holes in heatsinks are free from burrs
●Minimum depth of tapped holes in heatsinks is 6 mm
●Use 4-40 UNC-2A cheese-head screws with a flat washer to spread the joint pressure
●The minimum flatness of the mounting area is 0.02 mm
●Mounting area roughness should be less than 0.5 µm (micro)
●Avoid, as much as possible, use of flux or flux solutions because flux can penetrate even when hermetically sealed ceramic-capped transistors. Tin and wash the printedcircuit board BEFORE mounting the power transistors, then solder the transistor leads without using flux
●Transistor leads may be tinned by dipping them full-length into a solder bath at a temperature of about 230°C. No flux should be used during tinning
●Recommended heatsink compounds : WPSII (silicon free) from Austerlitz Electronics, 340 from Dow Corning etc.
1.2Mounting sequence
●Apply a thin layer of evenly distributed heatsink compound to the flange
●Position the device with flat washers in place
●Tighten the screws until finger tight (0.05 Nm)
●Further tighten the screws until the specified torque is reached
●For M174, M177 & M244 type of packages, torque should be minimum 0.6 Nm and 0.75 Nm max.
Table 1. |
DMOS packages - list of materials |
|
|
|
|
|
|||
Package |
|
|
|
Ceramic |
Plating |
Torque |
|||
Description |
Flange |
Leadframe |
(Nm) |
||||||
|
|
||||||||
type |
|
|
|
insulator |
|
|
|
|
|
|
|
|
Leads |
Flange |
Min. |
Max. |
|||
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
0.500 DIA 4L |
|
ALLOY 42 |
BeO |
Au (100µ min) |
Ni (100µ min) + |
|
|
|
M174 |
non herm |
Cu |
(Fe58 / |
(99.5% |
over Ni (100µ |
0.6 |
0.75 |
||
Pd (10µ min) |
|||||||||
|
w/flange |
|
Ni42) |
min) |
min / 350µ max) |
|
|
||
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
0.500 DIA 4L |
|
ALLOY 42 |
BeO |
Au (100µ min) |
|
|
|
|
M174 |
non herm |
|
Ni (100µ min) + |
|
|
||||
Cu-Mo-Cu |
(Fe58 / |
(99.5% |
over Ni (100µ |
0.6 |
0.75 |
||||
(Moly disk) |
w/flange |
Pd (10µ min) |
|||||||
|
Ni42) |
min) |
min / 350µ max) |
|
|
||||
|
(moly disk |
|
|
|
|
||||
|
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
2/5 |
Doc ID 10738 Rev 2 |
Loading...