The TD350 is an advanced Insulated Gate Bipolar Transistor (IGBT) driver with integrated
control and protection functions. The TD350 is especially adapted for driving 1200V IGBTs
with current ratings from 15 to 75A in Ecopak-like modules.
Main features are:
●Minimum1.2A sink / 0.75A source peak output current over full temperature range
(-20°C to 125°C)
●Desaturation protection with adjustable blanking time and fault status signal
●Active Miller clamp function to reduce the risk of induced turn-on in high dV/dt
conditions without the need of negative gate drive in most cases
●Optional 2-step turn-off sequence to reduce over-voltage in case of over-current or
short-circuit event to protect IGBT and avoid RBSOA problems
●Input stage compatible with both optocouplers and pulse transformers
Applications include a three-phase full-bridge inverter used for motor speed control and
UPS systems.
Figure 1 shows an example of a TD350 application where the device is supplied by a
+16V/-10V isolated voltage source, but a single voltage source can also be used. A pulse
transformer is used for input signal galvanic isolation. Gate resistors at OUTH and OUTL
pins (here 47 Ohms) are to be chosen depending on the IGBT specifications and the
manufacturer recommendations. Sink and source resistor values can be independently
tuned to optimize the turn-on and turn-off behaviors and can help to solve EMI issues.
The pull-down resistor (10kOhms in this example) connected between gate and emitter of
the external IGBT ensures that the external IGBT remains OFF during the TD350 power-up
sequence.
As the driver may be used in a very noisy environment, care should be taken to decouple
the supplies. The use of 100nF ceramic capacitors connected from VH to GND (and from VL
to GND if applicable) is recommended. The capacitors should be located as close as
possible to the TD350 and the ground loops should be reduced as much as possible.
Figure 1.TD350 application example showing all the features
VH
10K
11V
VH
10K
10K
10K
VREF
10K
4,7K
470pF
10nF
100pF
1kV
diode
1K
TD350
IN
1
VREF
2
FAULT
3
NC
4
COF F
5
NC
6
LVOFF
7
DESAT
VH
OUTH
OUT
CLAMP
GND
VL
14
16V
13
100nF
12
11
10
9
8
100nF
-10V
47R
47R
10K
3/21
Input stageAN1944
2 Input stage
The TD350 is compatible with both pulse transformers or optocouplers. The schematic
diagram shown in Figure 2 can be considered as example of use with both solutions.
When using an optocoupler, the IN input must be limited to approximately 5V. The pull-up
resistor to VH must be between 5kOhms and 20kOhms, depending on optocoupler
characteristics. An optional filtering capacitor can be added in the event of a highly noisy
environment, although the TD350 already includes a filtering on input signals and rejects
signals smaller than 100ns (t
When using a pulse transformer, a 2.5V reference point can be built from the 5V VREF pin
with a resistor divider. The capacitor between the VREF pin and the resistor divider middlepoint provides decoupling of the 2.5V reference, and also ensures a high level on the IN
input pin at power-up to start the TD350 in OFF state.
specification).
ONMIN
The waveform from the pulse transformer must comply with the t
ONMIN
and V
tON/VtOFF
specifications. To turn ON the TD350 outputs, the input signal must be lower than 0.8V for at
least 220ns. Conversely, the input signal must be higher than 4.2V for at least 200ns to turn
OFF TD350 outputs. A pulse width of about 500ns at these threshold levels is
recommended. In all cases, the input signal at the IN pin must be between 0 and 5V.
Figure 2.Application schematic (pulse transformer: left / optocoupler: right)
VH
10K
10K
10K
10nF
10nF
TD350
IN
1
VREF
2
4K7
47pF
5,1V
TD350
IN
1
Figure 3.Typical input signal waveforms with pulse transformer (left) or
optocoupler (right)
4/21
AN1944Output stage
3 Output stage
The output stage is able to sink/source about 2A/1.5A typical at 25°C with a voltage drop
V
OL/VOH
range (-20°C/+125°C) are 1.2A sink and 0.75A source. V
are guaranteed to 3V and 4V maximum respectively, over the temperature range (Figure 5).
This current capability sets the limit of IGBT driving, and the IGBT gate resistor should not
be lower than approximately 15Ω.
The TD350 uses separate sink and source outputs (OUTL/OUTH) for easy gate driving.
Output current capability can be increased by using an external buffer with two low-cost
bipolar transistors.
Figure 4.Typical output stage current capability at 25°C (VH = 16V, VL = -10V)
of 5V (Figure 4). The minimum sink/source currents over the full temperature
and VOH voltage drops at 0.5A
OL
OUT source curr ent versus voltage (turn -on)
3
2,5
2
1,5
Iout (A)
1
0,5
0
-10-5 0 5 101520
Vout (V)
OUT sink c urrent ver sus voltage (turn-off)
3
2,5
2
1,5
Iout (A)
1
0,5
0
-10-5 0 5 101520
Vout (V)
Figure 5.Typical VOL and VOH voltage variation with temperature
3.0
3.0
2.0
2.0
Iosink=500mA
Iosink=500mA
VOL-VL (V)
VOL -VL ( V)
1.0
1.0
0.0
0.0
-50-250255075100125
-50-250255075100 125
Temp (°C)
Temp (°C)
Iosink=200mA
Iosink=200mA
Iosink=20mA
Iosink=20mA
4.0
4.0
3.0
3.0
2.0
2.0
VH-VOH (V)
VH- VOH ( V)
1.0
1.0
0.0
0.0
-50-250255075100125
-50-250255075100125
Temp (°C)
Temp (°C)
Iosource=500mA
Iosource =500mA
Iosource=200mA
Iosource=2 00mA
Iosource=20mA
Iosource =20mA
During the power-on sequence, it is not guaranteed that the Goff signal, which controls the
OUTL-MOS (see TD350 output stage schematic diagram in Figure 6), stays HIGH. In this
case when TD350 goes out from UVLO condition, the OUTL-MOS is turned off and OUTL is
in High-Impedance state until the first IN transition occurs. In these conditions some leakage
effects might slowly charge the external IGBT gate-emitter capacitance.
5/21
Output stageAN1944
Thus, it is recommended the use of a pull-down resistor of 10 kOhm or less (R3 in Figure 6)
connected between the gate and emitter of the external IGBT.
Figure 6.TD350 output stage schematic
6/21
AN1944Active Miller clamp
4 Active Miller clamp
The TD350 offers an alternative solution to the problem of the Miller current in IGBT
switching applications. Instead of driving the IGBT gate to a negative voltage to increase the
safety margin, the TD350 uses a dedicated CLAMP pin to control the Miller current. When
the IGBT is off, a low impedance path is established between IGBT gate and emitter to carry
the Miller current, and the voltage spike on the IGBT gate is greatly reduced (see Figure 7).
The CLAMP switch is opened when the input is activated and is closed when the actual gate
voltage goes close to the ground level. In this way, the CLAMP function doesn’t affect the
turn-off characteristic, but only keeps the gate to the low level throughout the off time. The
main benefit is that negative voltage can be avoided in many cases, allowing a bootstrap
technique for the high side driver supply.
The waveform shown in Figure 8 proves how using the Active Miller clamp provides a
consistent reduction of the voltage spike on IGBT gate.
Figure 7.Active Miller clamp: principle of operation
TD350
Miller currentMiller current
high dV/ dt !
active clamp
vol tage spi ke on IGB T gat e !
high dV/ dt !
reduce d volt age spik e
7/21
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