This application note is intended for system designers who require a hardware implementation overview
of the development board features such as the power supply, the clock management, the reset control,
the boot mode settings and the debug management. It shows how to use the STR71x product family and
describes the minimum hardware resources required to develop an STR71x application.
Detailed reference design schematics are also contained in this document with descriptions of the main
components, interfaces and modes.
The chip is powered by an external 3V3 supply(V33: 2.7 to 3.6 V, AVDD: 3.0 to 3.6 V).
All I/Os are 3V3-capable. An internal Voltage Regulator generates the supply voltage for core
logic (~=1.8V). The two V
following figure indicates the recommended configuration for the power supply pins:
Figure 1.STR71x power supply pins
pins must be connected to external stabilization capacitors. The
18
3V3
10µF
33nF
GND
1µF
GND
1.2 Power management block
The following figure describes the power management block implemented on the STR71x
devices.
Figure 2.Power Management Block
3V3
V
33nF
10µF
33
V
18
Main Voltage
Regulator (MVR)
1.8 V
V
33
V
33IO-PLL
V
18
V
18BKP
3.3 V
STR71x
V
SSIO-PLL
V
SSBKP
Low Power Voltage
Regulator (LPVR)
V
SS
GND
I/O circuitry
CORE
GND
V
18BKP
1µF
switch
see note 1
GND
The STR71x power management block has two regulators:
●The Main Voltage Regulator MVR.
●The Low Power Voltage Regulator LPVR.
Note the following remarks about the two regulators:
●Both regulators can be switched-off by software
4/27
Backup block
AN17751 Power management
●V18 can be used to supply an externally regulated 1.8V, but V33 must supply the IOs
●V18BKP pin can be used to externally supply the backup logic, but V33 must supply the
IOs
●The switch in Figure 2, opened only during STANDBY mode, disconnects the V
from the V
18BKP
domain
It is possible to switch-off the MVR and keep LPVR on when the device is in low-power mode
(SLOW, WFI, LPWFI, STOP or STANDBY). The LPVR has a different design from the main VR
and generates a non-stabilized and non-thermally-compensated voltage of approximately 1.6V.
In STANDBY mode the Low Power VR can be switched off when an external regulator provides
a 1.8V supply to the chip through the V
18BKP pin for use by RTC and Wake-Up block.
In this case we must to keep the 3.3V on pin V33 even if the two regulators are switch off to
keep stable state on the I/Os.
Remark:The PLL is automatically disabled (PLL off) when the MVR is switched off and the
maximum allowed operating frequency is 1 MHz. This is due to the limitation imposed by the
LPVR which is not able to generate sufficient current to operate in run mode.
domain
18
The MAIN DEVICE CORE is powered from an external 3V3 power supply pin (V
main regulator.
For more details on the power regulators, refer to the STR71x Reference Manual.
) through the
33
5/27
2 Clock managementAN1775
2 Clock management
The STR71x offers a flexible way for selecting core and peripherals clocks, the devices have up
to 3 external clock sources:
●The PRCCU generates the internal clocks for the CPU and for the on-chip peripherals.
The PRCCU may be driven by an external pulse generator, connected to the CK pin.
●The Real time Clock 32kHz oscillator is connected to the internal CK_AF signal (if present
on the application), and this clock source may be selected when low power operation is
required.
●USB clock source available only with devices with USB feature.
2.1 Clock control unit
The STR71x clock control unit must be driven by an external oscillator, connected to the CK
pin, at a frequency of up to 16 MHz. It generates the clocks for the CPU and for the on-chip
peripherals. A range of available multiplication and division factors allows for a large number of
operating clock frequencies to be driven from the input frequency. However, great care must be
taken to respect the recommendations for allowed frequency limits. For more details on allowed
operating frequencies for each clock, refer to the Reference Manual.
The following diagram shows the basic implementation of the main external clock.
Figure 3.Main clock oscillator
10K
3V3
The following table gives frequency range examples of the Main clock for some input clock
values:
Input ClockMCLK (Main Clock) Range
4 MHz[15625 Hz, 50 MHz]
8 MHz[31250 Hz, 50 MHz]
16 MHz[62500 Hz, 50MHz]
2.2 Real Time Clock
The Real Time Clock operates at a speed of 32 kHz. This clock must be provided by an
external resonator circuitry.
OSCILLATOR
GND
STR71x
33
CK
VSS
GND
The RTC is used to generate a time base, and can be selected when low power operation is
needed. Refer to the Reference Manual for more details.
6/27
AN17752 Clock management
Figure 4.RTC oscillator
STR71x
32kHz CRYSTAL
15pF*
GND
* these values are given only as examples, refer to the crystal manufacturer for more details
15pF*
GND
RTCXTI
RTCXTO
V
SS
2.3 USB clock
STR710 and STR711 series microcontrollers contain a USB 2.0 Full Speed device module
interface that operates at a precise frequency of 48 MHz. This clock is usually provided by an
external oscillator connected to the USB clock pin USBCLK. However, to save the board’s
space and cost, the 48MHz USB clock can also be generated by the internal PLL2 using one
single external oscillator for both system and USB module.
This part of the application note describes the hardware and software reference
implementation. USB Full Speed signal quality and jitter results can be measured using a
single external oscillator to generate not only the System PLL clock and Peripheral’s clocks, but
also the 48MHz USB clock.
2.3.1 Hardware implementation
The hardware implementation guidelines are described in the figure below.
7/27
2 Clock managementAN1775
Figure 5.USB clock and pins implementation
V
33
47K
USB Indicate
56K
BC547E
GND
USB connector
V
33
STR710/STR711
GPIO
GPIO
DP
DM
USB CLK
1K5
0 Ohm
0 Ohm
GND
GND
15pF
15pF
GND
56K
GND
Vbus
D+
D-
V
SS
56K
48MHz Oscillator
GND
USB full speed interface device supported via type B connector. The USB clock uses a
separate 48 MHz oscillator.
Transistor circuit used to indicate the cable status (Cable connected USB/IND pin = 0 logic,
Cable deconnected = USB/IND pin = 1 logic).
8/27
AN17753 Reset management
3 Reset management
Both the Main Voltage Regulator and the Low Power Voltage Regulator contain an LVD.
They keep the device under reset when the corresponding controlled voltage value (V
V
falls below 1.35V±10%).
18BKP
The LVDs do not monitor V33 which supplies the I/O and analog parts of the device.
Note:During power-on, a reset must be provided externally.
At power on, the nRSTIN pin must be held low by an external reset circuit until V
Figure 6 gives an example of the hardware implementation of the RESET circuit for STR71x
devices.
●The STM1001 low-power CMOS microprocessor supervisory circuit is used to assert a
reset signal whenever the V
voltage falls below a preset threshold or a manual reset is
33
asserted.
Figure 6.Hardware reset implementation
STR71x
V
nRSTIN
V
* these values are given only as typical example
+3V3
33
SS
GND
+3V3
Reset_PB
GND
2K2
1
not Reset VCC
1nF
+3V08
STM1001T
GND
or
18
.
33
+3V3
2
3
GND
9/27
4 Boot managementAN1775
4 Boot management
Three different boot modes are available and can be enabled by means of three input pins:
BOOTEN, BOOT0 and BOOT1.
The following table describes the different boot mode configurations.
BOOTENBOOT0BOOT1BOOT Mode
0xx
100
110Reserved
101RAM: boot from internal RAM memory
111
USER: boot from internal FLASH memory
EXTMEM: boot from external memory mapped on the EMI interface
at 0000 0000h address.
The following figure gives an implementation example of boot management for STR71x
devices. BOOT0 and BOOT1 are alternate function pins used for boot configuration during the
RESET phase (floating-input configuration), so they can be used afterwards in the application
as standard I/Os. For more details concerning boot configuration, refer to the device reference
manual.
Figure 7.Boot mode selection implementation example
3V3
GND
* these values are given only as typical example
10K*
3V3
10K*
GND
3V3
10K*
GND
STR71x
BOOTEN
BOOT0
BOOT1
3V3
10K*
nSTDBY
TEST
GND
Note: 1 As the nSTDBY pin has a floating input configuration, an external pull-up has to be provided to
avoid remaining in stand-by mode.
2 The TEST pin of the STR71x must always be forced to ground (ST reserved test pin)
10/27
AN17755 Debug management
5 Debug management
The Host/Target interface is the hardware equipment that connects the Host to the application
board. This interface is made of three components: a hardware debug tool, such as Micro-ICE
from ARM, a JTAG connector and a cable connecting the host to the debug tool.
Figure 8 shows the connection of the host to the STR71x board.
Figure 8.Host to board connection
ICE Debug tool
ICE connector
HOST PC
5.1 ICE debug tool
ICE Debug tool is a host interface that connects a PC to an STR71x development board
featuring a debug interface as shown in Figure 8. The Embedded ICE is an intelligent host
interface that provides fast access to host services, access to on-chip emulation and debug
facilities. When you are using the ST7R71x board as stand-alone system, the ICE Debug tool
can be used to download programs.
The STR71x development kit supports the ARM RealView ICE Micro Edition. The Micro-ICE is
plugged in to the host via a USB cable.
5.2 JTAG / ICE connector
The ICE connector enables JTAG hardware debugging equipment, such as RealView-ICE, to
be connected to the ST7R71x board. It is possible to both drive and sense the system-reset
line, and to drive JTAG reset to the core from the ICE connector. The Figure 9 shows the ARM
ICE connector pin-out.
The STR71x has a user debug interface. This interface contains a five-pin serial interface
conforming to JTAG, IEEE standard 1149.1-1993, “Standard Test Access Port-Scan Boundary
Architecture”. JTAG allows the ICE device to be plugged to the board and used to debug the
software running on the STR71x.
STR71x BOARD
Power
Supply
JTAG emulation allows the core to be started and stopped under control of the connected
debugger software. The user can then display and modify registers and memory contents, and
set break and watch points.
11/27
5 Debug managementAN1775
Figure 9.Ice connector implementation
3V3
STR71x
nJTRST
JTDI
JTMS
JTCK
JTDO
nRSTIN
DBGRQS
10K*
10K*
GND
GND
* these values are given only as typical example
** The Debug acknowledge to JTAG equipment (DBGACK pin) is not used.
Note: 1 In order for JTAG and Chip Reset to be synchronized the J4 jumper must be fitted.
2 STR71x has a Debug Request (DBGRQS) pin, on 144-pin packages only. This active high
signal can be used to force the core to enter Debug Mode, giving the Emulation system access
to internal resources (code, registers, memory, etc). This pin must be kept LOW when
emulation is not being used.
The following table describes the JTAG connector pins:
Std Name STR71xDescriptionFunction
nTRSTJTRST
TDIJTDI
TMSJTMS
TCKJTCK
Test Reset
(from JTAG
equipment)
Test data in
(from JTAG
equipment)
Test mode
select (from
JTAG
equipment)
Test clock (from
JTAG
equipment)
This active LOW open-collector is used to reset the JTAG port
and the associated debug circuitry. It is asserted at power-up
by each module, and can be driven by the JTAG equipment.
TDI goes down the stack of modules to the motherboard and
then back up the stack, labelled TDO, connecting to each
component in the scan chain.
TMS controls transitions in the tap controller state machine.
TMS connects to all JTAG components in the scan chain as
the signal flows down the module stack.
TCK synchronizes all JTAG transactions. TCK connects to all
JTAG components in the scan chain. Series termination
resistors are used to reduce reflections and maintain good
signal integrity. TCK flows down the stack of modules and
connects to each JTAG component. However, if there is a
device in the scan chain that synchronizes TCK to some other
clock, then all down-stream devices are connected to the
RTCK signal on that component.
12/27
AN17755 Debug management
Std Name STR71xDescriptionFunction
Some devices sample TCK (for example a synthesizable core
with only one clock), and this has the effect of delaying the
RTCK
TDOJTDO
nSRSTnRSTIN
DBGRQ
DBGACK
GND
(not used)
DBGRQS
(not used
w/ 64pin)
GND
(not used)
Return TCK (to
JTAG
equipment)
Test data out (to
JTAG
equipment)
System reset
(bidirectional)
Debug request
(from JTAG
equipment)
Debug
acknowledge
(to JTAG
equipment)
time that a component actually captures data. Using a
mechanism called adaptive clocking, the RTCK signal is
returned by the core to the JTAG equipment, and the clock is
not advanced until the core had captured the data. In adaptive
clocking mode, the debugging equipment waits for an edge on
RTCK before changing TCK.
TDO is the return path of the data input signal TDI.
nSRST is an active LOW open-collector signal that can be
driven by the JTAG equipment to reset the target board. Some
JTAG equipment senses this line to determine when a board
has been reset by the user.
When the signal is driven LOW by the reset controller on the
core module, the motherboard resets the whole system by
driving nSYSRST low.
DBGRQ is a request for the processor core to enter debug
state.
DBGACK indicates to the debugger that the processor core
has entered debug mode.
For more details on the JTAG port refer to the IEEE standard 1149.1-1993, “Standard Test
Access Port-Scan Boundary Architecture” specification.
13/27
6 Reference DesignAN1775
6 Reference Design
6.1 Main
This reference design is based on the STR710FZ2T6, a highly integrated microcontroller,
running at 48 MHz that combines the popular ARM7TDMI
of embedded flash, 64 Kbytes of high speed SRAM, and numerous on-chip peripherals
6.1.1 Clock
●+3.3 V surface mounted 16 MHz oscillator provides the main clock source: S113, please
refer to Section 2.1 on page 6 for more details.
●RTC real-time clock for wakeup from standby mode with 32 KHz crystal: Y101, please
refer to Section 2.2 on page 6for more details.
6.1.2 Reset
One push button S112 is used to generate a hardware reset, please refer to Section 3 on page
9 for more details.
6.1.3 Boot mode
Three switches S108, S109 and S110 are used to select the boot Mode, please refer to
Section 4 on page 10
6.1.4 Wake-Up
S111 push button is used to exit from STANDBY mode (power supply voltage removed except
Real time Clock).
for more details.
TM
32-bit RISC CPU with 256 Kbytes
.
For more details, please refer to the STR71x reference manual.
6.2 Power supplies
Power to the board is supplied using a power supply providing 5 V DC to the board. All other
required voltages are provided by the on-board voltage regulator 3V3 LD1085V33 and Zener
Diode LM4040 for ADC input voltage.
For more details, refer to LD1085V33, LM4040 datasheets and Section 1 on page 4.
6.3 USB full speed interface
USB full speed interface device supported via type B connector. The USB clock uses a
separate 48 MHz oscillator.
A transistor circuit is used to indicate the cable status (Cable connected USB/IND pin = 0 logic,
Cable deconnected = USB/IND pin = 1 logic).
14/27
AN17756 Reference Design
6.4 CAN interface
A general purpose, asynchronous serial I/O data port connected through a 9-pin D-type male
connector with micro switches selectable between High or Low bus output S702, and between
Standby or Slope control S700.
For more details, refer to CAN transceiver SN65HVD230D datasheet.
6.5 RS232 serial interface
A general purpose, asynchronous serial I/O data ports is connected through 9-pin D-type male
connectors.
RS232 connects directly to UART0, transmit and receive only (null modem).
RTS is shorted to CTS and DTR is shorted to DSR at the connector.
For more details, refer to RS232 transceiver ST3232 datasheet.
6.6 Serial ROM
6.6.1 SPI Flash
1-Mbit SPI serial flash connected to the buffered serial peripheral interface (BSPI). Switch S603
is used to enable or disable write protect (pull down = Write protect, pull up = Write enabled).
For more details, refer to SPI Flash M25P10-A datasheet.
6.6.2 I2C EEPROM:
8-kbit EEPROM connected to the I2C0 interface, Switch S600 is used to enable or disable write
protect (pull down = Write protect, pull up = Write enabled).
For more details, refer to I2C Eeprom M24C08 datasheet.
The values R614 and R616 are dependent on the I2C communication speed.
For more details on theses values, please refer to the STR71x reference manual.
6.7 JTAG interface
Refer to the section Section 5 on page 11.
6.8 SRAM
Two SRAM 2M byte are connected to External Interface Memoy EMI and mapped from 0x6200
0000 to 0x623F FFFF.
For more details, refer to the SRAM memory TC55V8200FT-12 datasheet.
15/27
6 Reference DesignAN1775
6.9 Flash
One Flash 2M word is connect to External Interface Memoy EMI and mapped from 0x6000
0000 to 0x603F FFFF (boot bank).
For more details, refer toFlash memory M28W320ECB datasheet.
6.10 LCD interface
LCd 2 * 16 is connected to external interface memory EMI.
Address 2 A2 is used as the LCD register address signal.
Region space available from 0x6400 0000 to 0x65FF FFFF
6.11 Conclusions and recommendations
●System clock jitter values decrease when the system clock is delivered by STR71x internal
PLL1 (comparing to the jitter values on the external oscillator inputs), because the noise
injected in the CLK pin input was filtered by the internal PLL.
●It is possible to use one single external 4MHz oscillator to generate both core, peripheral’s
clocks and 48MHz USB clock to minimize and save board cost and space.
●With this single external oscillator generating both the system clock using PLL1 and the
48Mhz USB clock using PLL2, the STR710/STR711 has all the characteristics to pass the
requirements for USB revision 2.0 full speed device test and get the USB certification.
Particular care must be taken to decrease external oscillator noise while routing its clock on
board.
* For not used pins set to logic level by software
17/27
7 SchematicsAN1775
Figure 11. LCD interface
B
15K16
A
C
0.1uF
C204
+5
C203
10uF 16V
R203
10K
2
1VO3
GND
VCC5V
D
654321
4K7
R200
+5
A
1.0
10
Drawn By:
LCD
2
NumberRevisionSize
B
Title
Date: 22- Jun-2005Sheet 2 of
File:
DB18DB29DB3
DB0
R202
7
2A23A34A45A56A67A78A89
A1
B1
R201
18B217B316B415B514B613B712B811
DATA0
DATA1
DATA (7:0)
10
DATA2
DATA3
DATA4
DB411DB512DB613DB714R/W
DATA5
DATA6
DATA7
5E6RS4
1G19
LCD LWM 1602 B-BG/SYN
100pF
C205
DIR
U200A
VCC +3V3
74LCX245
RnotW
1K
VCC +3V3
74LCX14
R209
12
notE
RS
D
C
18/27
123456
B
A
AN17757 Schematics
Figure 12. EMI Flash
D
654
C
+3V3
B
R308
10K
A
Text
10
RevisionS
Sheet 3 of
3
FLASH
Number
B
ize
File:Drawn By:
Title
Date: 22-Jun-2005
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
DATA7
DATA8
DATA9
DATA10
DATA11
DATA12
DATA13
DATA14
30
32
DQ8
DQ9
DQ1034DQ1136DQ1239DQ1341DQ1443DQ15
A106A115A124A133A142A151A16
ADD10
ADD11
ADD12
ADD13
+3V3 +3V3
DATA15
45
13
VPP
A20
A1717A1816A19
not CE
not OE28not WP
not RP
not WE
48
15
10
26
11
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
R307
10K
R306
10K
not WRvpp
not CS_FLASH
VCC +3V3
FLASH M28W320ECB
14
12
not OE
not RESET
DATA0
29
31
38
40
44
DQ0
DQ233DQ335DQ4
DQ642DQ7
DQ1
DQ5
A0
R305
25A124A223A322A421A520A619A718
321
DATA (15:0)
ADD1
ADD2
ADD (23:0)
ADD3
ADD4
ADD5
ADD6
ADD7
ADD8
A8
8A97
ADD9
123456
D
C
B
A
19/27
7 SchematicsAN1775
Figure 13. EMI SRAM
D
654321
C
DATA8
DATA9
DATA10
DATA11
DATA12
DATA13
IO_122IO_224IO_331IO_433IO_549IO_651IO_74IO_8
DATA14
DATA15
6
B
A
1.0
Revision
10
Drawn By:
RAM
S
4
10
Number
22-Jun-2005Sheet 4 of
Title
SizeBDate:
File:
A5
A2
A0
R402
9A38A47
11A110
48A647A746A845A944
ADD2
ADD3
ADD4
ADD5
ADD6
ADD7
ADD8
ADD1
DATA0
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
IO_122IO_224IO_331IO_433IO_549IO_651IO_74IO_8
A0
A29A38A4
R401
ADD (23:0)
DATA (15:0)
A5
7
11A110
48A647A746A845A944
ADD1
ADD2
ADD3
ADD4
ADD5
ADD6
ADD7
ADD8
ADD9
DATA7
6
ADD9
A1038A1137A1236A13
ADD10
ADD11
A1038A11
ADD10
ADD11
A14
A19
A1521A1620A1719A18
A2039not WE15not CE13N_CE216not OE
35
34
18
17
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
10K
R405
+3V3
A1236A1335A14
A1620A1719A1818A1917A20
A15
37
34
21
39
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
R404
10K
R403
10K
+3V3 +3V3
not WR1
not WE15not CE13N_CE216not OE
RAM
_S
not WR0
not CS
SRAM TC55V8200FT-12
VCC +3V3VCC +3V3
42
SRAM TC55V8200FT-12
42
not OE
D
C
20/27
123456
B
A
AN17757 Schematics
Figure 14. RS232 interface
D
654321
C
J500
162738495
B
DB9 male
A
1.0
10
Drawn By:
5
RS232
NumberRevisionSize
B
Title
Date: 22-Jun-2005Sheet 5 of
File:
0.1uF 25V
C503
14
7
8
5
4
C502
0.1uF 25V
2
+3V3
6
C501
0.1uF 25V
C2-
C2+
V+
V-
C1+
1
C500
C1-3T2IN
0.1uF 25V
R1IN13R2IN
T2OUT
T1OUT
T1IN
R1OUT12R2OUT
VCC +3V3
R510
ST3232
9
10
11
RX
TX
123456
D
C
B
A
21/27
7 SchematicsAN1775
Figure 15. Serial ROM interface
D
C
B
A
1.0
654321
R619
MISOMOSI
2
Q
H M25P10-A
D
not HOLD7not W3not S1C
SP I_FLAS
5
6
VCC +3V3
R620
10K
+3V3
SDA
4K7
R614
+3V3
5
SDA
ROM M24C08
E1
1E22E33
SCL6not WC
I2C_EEP
VCC +3V3
7
R603
10K
R602
+3V3+3V3+3V3
R601
10K
R600
10K
10
Drawn By:
6
SERIAL MEMORY
NumberRevisionSiz e
B
Title
Date: 22-Jun-2005Sheet 6 of
File:
4K7
R616
+3V3
SCL
PDT
S600
SW S
* connect to pull-up by default
R615
10K
+3V3
D
C
+3V3
+3V3
R617
R618
10K
CLK
not S
S
10K
S603
SW SPDT
* connect to pull-up by default
B
SN
S
123456
A
22/27
AN17757 Schematics
Figure 16. CAN interface
D
C
B
A
654321
7
6
CANL
CANH
GND2VCC3R
5
Vref
4
DB9
R702
10K
120
R704
VCC +3V3
SN65HVD230D
S702
ST
SW-SP
J701
162738495
10K
R703
+3V3
R701
10K
+3V3
PDT
S700
SW S
8
RS
R700
1
+3V3
10
Drawn By:
71.0
NumberRevisionSiz e
CAN
B
Title
Date: 22-Jun-2005Sheet 7 of
File:
CAN_RX
CAN_TXD
123456
D
C
B
A
23/27
7 SchematicsAN1775
Figure 17. JTAG interface
D
654321
JP801
+3V3
R802
10K
+3V3
R801
10K
10K
R800
C
*Switch closed by default
12
34
56
78
9 10
11 12
13 14
15 16
17 18
19 20
HEADER 10X2
R805
10K
R803
10K
10K
R804
B
C800
0.01uF
Q803
SW SPST
S801
R817
+3V3
BC846
R818
10K
Q800
22K
BC846
47K
R807
A
10
81.0
NumberRevisi onSize
JTAG
B
Title
Date: 13-Sep-2005Sheet 8 of
File:Drawn By:
JTDI
JTDO
JTCK
JTMS
not JTRst
DBGRQS
D
C
24/27
not Reset
123456
B
A
AN17757 Schematics
Figure 18. USB interface
D
C
B
A
654321
USBV_IND
BC547E
Q900
R900
47K
+3V3
R907
10K
USB_CON
56K
R905
R904
56K
R906
VBUS
GND
1DN2DP3
4
0
0
+3V3
J900
C
48MHz OS
1
3
EN
OUT
VCC +3V3
10
Sheet 9 of
Drawn By:
91.0
NumberR evisionSiz e
22-Jun-2005
USB
B
File:
Title
Date:
R903
R902
C901
15pF
1K5
R901
B_PULL_UP
US
D
C
USBDN
USBDP
C900
15pF
USBCLK
123456
B
A
25/27
7 SchematicsAN1775
Figure 19. Power schematics
D
654321
C
B
A
10
6
Drawn By:
+2V5AN
+3V3AN
+5V
+3V3
3
R1000
1SG2
+5V
J1000
Title
101.0
POWER
NumberRevisionSiz e
B
Date: 22-Jun-2005Sheet 10 of
File:
2345
1
D1002
LM4040
R1001
1K
C1047
10nF 50v
C1046
0.1uF 25V
C1045
10uF 16V
L1001
FBEAD
C1004
100nF 25V
C1020
C1003
100nF 25V
C1002
100nF 25V
C1001
100nF 25V
47uF 16V
C1000
6
CV
CG14CG25CG3
V
S
2
BNX002
1
JACK +5V
10nF 50V
+3V3
C1018
10uF 10V
3
Vout
GND
Vin
U1001
VOLT_REG_3V3
1
C1014
10nF 50V
C1011
10uF 10V
+5V
+3V3
+5V
C1023
100nF 25v
C1022
100nF 25V
100nF 25v
C1021
C1019
10nF 50V
C1017
10nF 50V
C1016
2
100uF 10V
C1015
100uF 10V
C1013
10uF 10V
10uF 10V
C1012
+3V3
D1001
R1003
R1002
LED
560
D1000
LED
1K
C1044
100nF 25V
C1042
100nF 25V
C1040
100nF 25V
100nF 25V
C1038
100nF 25V
C1036
C1034
100nF 25V
C1032
100nF 25V
C1030
100nF 25V
C1028
100nF 25V
C1026
100nF 25V
C1024
100nF 25V
+3V3
C1043
100nF 25V
C1041
100nF 25V
100nF 25V
C1039
100nF 25V
C1037
C1035
100nF 25V
C1033
100nF 25V
C1031
100nF 25V
C1029
100nF 25V
C1027
100nF 25V
100nF 25V
C1025
+3V3
D
C
26/27
B
A
AN17757 Schematics
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