AN1696
APPLICATION NOTE
L6615, LOAD SHARE CONTROLLER FOR N+1 REDUNDANT, HOT-SWAPPABLE APPLICATION
by Luca Salati
Power supply systems are often designed by paralleling converters in order to improve performance or reliability. To ensure uniform distribution of stresses, the total load current should be equally shared among the converters.
This application note describes a redundant system (a demo board is available) composed by three paralleled DC-DC converter modules (synchronous buck topology, managed by ST L6910) whose output currents are shared through the new ST current sharing controller (L6615).
In this application it is shown the innovative use of a MOSFET as both OR-ing element (replacing ORing diode) and sensing element (Rds(ON)).
Introduction
Load sharing is a technique commonly used when powering loads requiring low voltage and high current; for this reason a modular power system is built where two (or more) power supplies or DC-DC converters are paralleled and supply the load.
Sharing the output currents is useful to equalize the thermal stress of the different modules providing an advantage in terms of electronic components reliability (mean time between failure roughly doubles every 10°C decrease in operating temperature).
April 2003 |
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AN1696 APPLICATION NOTE
In this application, load sharing control is entrusted to ST's L6615 [1] that features automatic master-slave current sharing control [2] [3]: the supply that delivers the highest current (sensed by means of an external resistor) acts as the master and drives a common reference (share bus) to a voltage proportional to its output current; the feedback voltage of the others paralleled power supplies (slaves) is then trimmed by an "adjustment" network so that they can support their amount of load current. The slave supplies work as current-controlled current sources.
Moreover a paralleled supply architecture allows achieving redundancy (a system of paralleled power supplies, each delivering a current lower than its nominal capability); the failure of one of the modules can be tolerated until the capability of the remaining power supplies is enough to provide the required load current. In this way an interruptible power supply will be designed, reducing the failure rate of the output bus.
In hot-swappable applications, whenever a section fails, it has to be removed and replaced without turning off the system and causing significant perturbation to both input and output system buses.
At insertion, each section exhibits a certain amount of discharged capacitance between the input terminals: if no inrush current limiting protection is implemented, this will cause a large negative drop on the input bus voltage (the analysis of this issue is beyond the purpose of this document).
The same problem occurs on the output side whenever the load is already supplied by other running sections: the discharged output capacitors of the inserted section are a very low impedance that can generate a negative drop on the load bus. This could trigger the UV/OC protection or cause a false value if a logic circuit reads the power supply output voltage at its input.
Figure 1. System architecture
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POWER |
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SUPPLY #1 |
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CURRENT |
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SHARING |
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CONTROL |
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OUTPUT |
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POWER |
VOLTAGE |
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SUPPLY #2 |
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INPUT |
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CURRENT |
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VOLTAGE |
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SHARING |
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CONTROL |
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A |
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POWER |
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SUPPLY #N |
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CURRENT |
SHARE |
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SHARING |
BUS |
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CONTROL |
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This is way an isolating element is introduced on each of the lines connecting the power output of each section with the load; often an OR-ing diode is used for this purpose but the latest trend is to use an OR-ing FET to save some points in efficiency.
This, combined with the capability of ST's L6615 load share controller to perform high side sensing, allows the use of the RDS(ON) of this FET as a sensing element as well.
System Description
The system (fig. 2) is composed of:
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AN1696 APPLICATION NOTE
–three identical sections (daughter boards) able to perform DC-DC conversion starting from +5VDC; each of them is designed to deliver 3.3V/5A to the load. They must be inserted in the motherboard;
–a motherboard whose input terminals will be connected to a +5VDC external source and output terminals to the load. This board can accommodate up to three DC-DC converters.
On the motherboard there is the circuitry necessary to perform current sharing (L6615) and to isolate a failed section from the load; it is designed to be adaptable to all power supplies (whose rating are compatible with L6615 absolute maximum ratings) having remote sense pins; in fact only changing few components it can be rearranged for new specs.
It is so possible to build a system to supply a 10A load at +3.3V in 2+1 redundant configuration. That is, whenever three sections are running, each of them supplies 3.33A, a value lower than its nominal capability.
If one of them is switched off, the system is however able to supply the load and each section will carry 5A.
The DC-DC conversion management is entrusted to the L6910 [4].
It is possible to verify that disabling one section (through the relevant switch on the motherboard) does not cause either overvoltage on the output or overcurrent in other sections.
At the same way, enabling one section (with other two already running) does not cause output voltage negative drop or even short to ground and current sharing is established.
Figure 2. System overview
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motherboard |
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VSENSE |
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DC-DC |
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RSENSE |
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CONVERSION |
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CURRENT SHARING (L6615), |
sh bus |
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ORING FET and |
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AUX. CIRCUITRY |
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+5V |
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VSENSE |
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DC-DC |
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RSENSE |
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10A@+3.3V |
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CONVERSION |
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CURRENT SHARING (L6615) |
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ORING FET and |
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GND |
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GND |
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AUX. CIRCUITRY |
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VSENSE |
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DC-DC |
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RSENSE |
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CONVERSION |
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CURRENT SHARING (L6615) |
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ORING FET and |
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AUX. CIRCUITRY |
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1.0 DAUGHTER BOARD
The L6910 controller drives a synchronous step-down stage at 200KHz; the internal reference is used for the regulation. The external power mosfet's are included in one SO8 package to save space and increase power density.
Fig. 3 shows the schematic of each daughter board and in table 1 the part list is indicated (for the description of this section see [4]).
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AN1696 APPLICATION NOTE
Figure 3. Daughter board schematic
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VCC |
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D1 |
R2 |
C7 |
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D3 |
D4 |
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C8 |
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PUMP |
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BOOT |
OCSET |
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C12 |
R11 |
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R1 |
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Q1 |
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C13 |
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UGATE |
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VCC |
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15 |
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R4 |
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L1 |
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PHASE |
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C4 |
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OUT |
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GND |
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14 |
LGATE |
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D2 |
C11 |
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R9 |
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C3 |
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L6910 |
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R5 |
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SS |
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PGND |
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4 |
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+SOUT |
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PGOOD |
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EAREF |
8 |
5 |
1 |
VREF |
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R7 |
C10 |
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6 |
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C9 |
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COMP |
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VFB |
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C5 |
R3 |
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R6 |
R8 |
SGND |
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C6 |
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R10 |
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PGND |
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SS |
Table 1. Part list board L6910
RESISTORS
R1, R9, R10 |
10 |
SMD 0805 |
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R2 |
1K5 |
SMD 0805 |
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R3 |
2K7 |
SMD 0805, 1% |
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R4, R5 |
2.2 |
SMD 0805 |
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R6 |
3K75 |
SMD 0805, 1% |
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R7 |
1K2 |
SMD 0805 |
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R8 |
10K |
SMD 0805 |
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R9 |
82 |
SMD 0805 |
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R10 |
39 |
SMD 0805 |
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R11 |
680 |
SMD 0805 |
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CAPACITORS
C1, C2 |
10μF |
(TOKIN) |
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C34Y5U1E106ZTE12 |
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C3, C4, |
100nF |
SMD0805, Ceramic |
C8, C13 |
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C5 |
47nF |
SMD0805, Ceramic |
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C6 |
N.C. |
SMD0805, Ceramic |
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C7, C12 |
1nF |
SMD0805, Ceramic |
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C9, C10 |
10nF |
SMD0805, Ceramic |
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C11 |
330 μF – |
(POSCAP) |
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6.3V |
6TPB330M |
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INDUCTOR |
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L1 |
10μH |
T50-52B Core 12T |
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IC’s |
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U1 |
L6910 |
(ST) SO16 NARROW |
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Q1 |
STS8DNF3L |
(ST) SO8 |
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L |
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DIODES |
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D1, D3, D4 |
1N4148 |
SOT23 |
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D2 |
STP130A |
SMA |
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4/11