ST AN1499 Application note

AN1499

APPLICATION NOTE

DESIGNING A LOW COST POWER BOARD FOR THE

ST92141 MOTOR CONTROL MCU WITHOUT USING IPMs

By Motor Control Competence Center

INTRODUCTION

Power Modules ha ve been i n use for t wenty year s in industr ial m otor drive a pplicati ons. F or
power stage designs, they give the advantages of compactness and good thermal behavior.

Over the last few years a new family of Power Modules, called Intelligent Power Modules
(IPM), have tried to take the integration of motor drive power stages a step further.

These IPMs target lower power and lower cost motor drive system s compared to those tar­geted by standard Power Modules.

However it is an open question whether these IPMs suit high volume and very co st-sensitive
applications, such as the household appliance market.

Figure 1. General System View

AN1499/0202 1/21

1

Table of Contents

INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1 INTELLIGENT POWER MODUL ES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1 ADVANTAGES OF IPMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1.1 Assembly cost . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1.2 Co mpo nent coun t . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1.3 Reduction i n time to market . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1.4 Higher reliabi lity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

1.1.5 Product compactness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

1.1.6 Package ind uc tance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

1.2 DRAWBACKS OF IPMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.2.1 Lead fram e . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.2.2 He atsink planarity and stiffness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.2.3 Embedded gate drive & filter cost . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.2.4 Ext ernal bootstrap diodes and temperature pro tection neede d . . . . . . . . . . . . . . . . . 5

1.2.5 Co mpo nent choice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 AN ALTERNATIVE SOLUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1 ADVANTAGES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1.1 Assem bly & m ounting cons iderations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1.2 Reduction i n time to market . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1.3 Reliability considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1.4 Therm al management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1.5 Gate drive optimization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.2 DRAWBACKS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.2.1 Co mpo nent coun t . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.2.2 PCB connec tions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3 CONCLUSION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

4 MECHANICAL DATA: ST92141-PLATFO RM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5 CONTROL BOARD LAYOUT (ORCAD FILES AVAILABLE) . . . . . . . . . . . . . . . . . . 20

2/21

1

21

DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...

1 INTELLIGENT POWER MODULES

These products integrate in a single transfer molded package, six IGBTs, six free wheeling di­odes and the interfacing circuits needed to enable direct control from a microcontroller.

In their low cost version they do not include the front-end rectification diodes, nor do they have
a switch or diode for active power factor correction.

External circuits are still needed, such as bootstrap supplies, current sensing and filtering, and
auxiliary supply decoupling.

This applic ation n ote a naly zes the a dvant age s an d d raw back s o f this p ower in tegr ation ap ­proach with regard to the constraints of cost sensitive motor drives.

An alternative solution is proposed that fits better to appliance and large volume applications
in term of optimization and cost.

1.1 ADVANTAGES OF IPMS

Out of all the advantages that are claimed, the major ones seem to be the following:

– Less assembly cost
– Lower component count
– Reduction in time to market
– Higher reliability
– Product compactness
– Low inductance package

These are general claims that need to be confronted with reality.

1.1.1 Assembly cost

Assembling an IPM requires placing it on the PCB, wave soldering and later on fixing the heat­sink with s crew s. Th ese o perat ions ar e inde ed less exp ensive th an ass embli ng six d iscre te
components. You should note how ever that if an active power fac tor corrector is needed, ex­ternal discrete power components are required.

1.1.2 Component count

This is a clear advantage because nine components are replaced by each IPM. However the
need for microcontroller and passive component assembly remains and IPMs do not r em o ve
any major manufacturing step.

1.1.3 Reduction in time to market

Layout of IGBT and MO SFET gate drives requires special expertise. U sing an IPM does not
require all this expertise, but a good understanding of EMI and parasitic inductance effects is
still strongly recommended!

3/21

2

DESIGNING A LOW COST POWER BOARD F OR ST92141 MOTOR CONTROL MC U ...

Assuming this expertise is available, the estimated saving will be hardly be more than the time
it takes to have a coffee break!

1.1.4 Higher reliability

From a silicon point of view , there are still about 1 5 dice inside the modu le with th eir own
MTBFs rela ted to j unction te mpe rature as well as m ore than 40 wire bo nds. So th e syst em
MTBF may increase because the connection and assembly count decreases. However it may
decrease if the heatsink is not perfectly flat below the whole IPM surface.

1.1.5 Product compactness

When just com paring power switches, IP Ms br ing c omp actnes s. But when ta lking ab out the
whole system, the difference i s negligible. Passive c omponents , heatsink, PCB and c onnec­tors are by far the most bulky parts.

1.1.6 Package inductance

The only circuit area where IPMs reduce the parasitic inductance is located between the gate
drivers and the pow er sw itches. T his is true for the h igh side g ate dri vers but not f or the low
side drivers.

Figure 2 shows that during turn-on, the low side gate drive current loop (B) is not internal to the

module but goes outside. In this case, IPMs do not have a significant advantage over discrete
solutions.

Figure 2. Low side gate drive current loop

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4/21

DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...

1.2 DRAWBACKS OF IPMS

Counterbalancing the advant ages listed above , IPMs have m ajor draw backs that m ake their
use in cost sensitive applications rather questionable.

Let’s review these drawbacks:

1.2.1 Lead frame

Due to manufacturing constraints, an IPM has leads on both sides of the pac kage. This means
that the PCB must be installed parallel to the pack age. So the heatsink must have its contact
base parallel to th e IPM and th e PCB. Whe n you are lo oking for a v ery cheap so lution, this
makes the choice of heatsink difficult.

1.2.2 Heatsink planarity and stiffness

Inside the IPM, power switches are soldered directly on a long and thin lead frame. Then this
lead frame is fully molded for isolation between the heatsink and the active parts. As a result,
these IPMs have a low stiffness and need to be assembled on a good quality heatsink to avoid
internal cracks. As a consequence, cheap heatsinks made of metal sheet are not recom­mended. This may lead to additional cost.

1.2.3 Embedded gate drive & filter cost

One sensitive parameter, in terms of optimizing the motor drive cost, is gate drive impedance.
By adjusting this imped anc e properly, you can find th e ri ght c ompr omis e b etwee n f ilter cos t
and heatsink cost. As IPMs do not give access to the gate drive impedance, you cannot adjust
the dV/dt commutation which may lead to additional filter cost.

1.2.4 External bootstrap diodes and temperature protection needed

Most IPMs available today do not hav e over-temperature protec tion. This requires additional
external circuits.

As bootstrap diodes are not integrated in the module, they need to be added externally. This
leads to additional cost.

1.2.5 Component choice

Needless to say the choice of IPMs today is very scarce and does not match the broad range
of power switch and interface circuits. This is a real drawback when cost is all-important.

5/21

DESIGNING A LOW COST POWER BOARD F OR ST92141 MOTOR CONTROL MC U ...

2 AN ALTERNATIVE SOLUTION

The basic idea behind the IPM solution consists of reducing the component count, simplifying
assembly and making board layout easier. However it has been shown that the cost benefit is
not always easy to determine when you calculate at system level.

Another way to split the system consists of grouping all the system SMD components on a
small size FR4 board, called the Control Board, and keeping all the power sw itches and dis­crete components on a mother board called the Power Board.

Figure 5, Figure 6 & Figure 7 show an AC motor drive application using this partitioning. An ex -

ample layout and parts list are given in Appendix 2.
It is worthwhile to review the advantages and drawbacks of this new partitioning.

2.1 ADVANTAGES

2.1.1 Assembly & mounting considerations

Figure 6 shows a contr ol bo ard s chem atic im plem enting a m icrocon troller, i ts pe ripheral c ir-

cuits and three High Voltage Integrated Circuits for interfacing directly to the Power Board
schem atic show n in Figure 7. This microcontroller is dedicated to AC motor control and is
housed in a shrink SO34 package (refer to the parts list in Appendix 2 and ST92141 and
L6386 datasheet on http:\\www.st.com).

The size of this type of control board is about 26mm by 87mm. This makes use of available
FR4 hardware . This board can be plugged into the Power Boar d next t o the discrete power
switches. T he Power Board layout is very easy and simple, even if low cost materials like
CEM1 are used. This makes the size of the Power Board smaller even if single side copper is
used.

The total volume of the Control Board and the power switches is very compact.
Moreover, the discrete Power switches can fit many different heatsink configurations, parallel

or perpendicular, with no planarity and stiffness constraints.
Another ad vantag e co mes f rom the s olderi ng proces s d ifferen ti ation: SM D com pon ents are

soldered using a reflow process, discrete components go through solder waves. This im­proves the production yield.

Finally, if an active power factor is needed, it is easy to add another switch to the power stage.

2.1.2 Reduction in time to market

The physical spli t between co ntrol circuits and power parts make the system easy to layo ut
and quick to debug. T he system power r ange or the input front end can be adapted w ithout af­fecting the Control Board and v ice versa. Any change of microcontroll er package or i ts periph­eral circuits does not interfere with the power stage.

6/21

DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...

In other words, the same Control Board can fit different Power Boards.
This makes the first design shorter and the future re-design even faster.

2.1.3 Reliability considerations

The reflo w proces s u s ed to sold er the Co nt rol B oa rd is prov en to be m ore rel iable t han the
wave process.

The connection between both boards is done during the wave process. Figure 5 shows a typ­ical implementation and Appendix 1 gi ves the results of the v ibration test performed on this as­sembly.

2.1.4 Thermal management

Assembling the d iscr ete comp onen ts b y c lips e nab les the d issip ation to b e spre ad ov er t he
whole heatsink surface. This avoids concentrating the losses on a small ar ea and allows you
to use cheap heatsink technology made of metal sheet.

2.1.5 Gate drive optimization

Figure 8 shows the influence of the gate drive impedance on the conducted noise. As the

whole gate drive is available on the Control Board, it is easy to adapt the noise level according
to the filter attenuation at any time. This noise level optimization can save time and cost.

Moreover the Control Board design allows t he use of ad vanced High Voltage Integrated Cir­cuits that integrate a bootstrap diode and comparators (refer to L6386 on http:\\www.st.com).

The is true for power switch selection (see the fully insulated TO220 products like
STGP7NB60HDFP on http:\\www.st.com).

2.2 DRAWBACKS

The main drawbacks relate to:

2.2.1 Component count

Compared to the IPM solution, both the Control Board and the Power Board each implement
about six components more.

2.2.2 PCB connections

The double sided Control Board soldering totals 68 contacts that are processed during wave
soldering.

7/21

DESIGNING A LOW COST POWER BOARD F OR ST92141 MOTOR CONTROL MC U ...

3 CONCLUS ION

This comparison between two different system partitioning methods has shown that the Intel­ligent Module approach is not the most flexible and cheap solution when designing c ost sen­sitive motor control applications.

The alternative solution that is presented gives several advantages that are decisive when
cost is the overriding factor:

– Access to low cost heatsink technology and better thermal management
– Use of different processes for SMD and through-hole components to improve the production

yield
– Fexibility to adapt the Power Board with no impact on the Control Board and vice versa
– Access to gate drive impedance to optimize the EMI level at any time
– Choice of a large portfolio of interface ICs and power switches

For further details about the Control Board hardware and software features, refer to AN1498.

Figure 3. Control Board high voltage in ter facing side

8/21

DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...

Figure 4. Control Board microcontroller side

Figure 5. Control Board plugged into the Power Board next to the discrete parts

9/21

DESIGNING A LOW COST POWER BOARD F OR ST92141 MOTOR CONTROL MC U ...

Figure 6. Typical Control Board circuit for AC motor control applications

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DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...

Figure 7. Typical Power Board circuit fo r A C m otor control applications

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J26

J27

J25

J23

J24

J21

J22

TP4

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L78L05ACZ

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Vout

GND

2

J1

STGP7NB60HDFP

T1

STGP7NB60HDFP

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2XTP15

STGP7NB60HDFP

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STGP7NB60HDFP

T4

STGP7NB60HDFP

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STGP7NB60HDFP

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Title:

Organisation name:
Size

Document Number
<Doc>

Date: Sheet

J7

TP14

R72

0.047R

2W

MCCC Rousset

R70
1M

R71
12K

2XTP5

2XTP17

2XTP7

C74

47nF

400V

2XTP19

J18

Drawn by:
Approved by:

11Wednesday, November 21, 2001

H1

1
2
3
4
5

H2

1

2

2XTP10

2XTP2

F1

5A Slow

SUP FUSE 3527

TP27

R77

4.7K

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11/21

DESIGNING A LOW COST POWER BOARD F OR ST92141 MOTOR CONTROL MC U ...

Figure 8. Conducted noise depending on gate drive impedance

On the left: Rg = 220R on the right: Rg = 82R

12/21

DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...

APPENDIX 1: Vibration test results of Control Board and Power Board assembly

VIBRATIONS, SINUSOIDAL

(Stantard: IEC 68-2-6, test Fc)

Electrical limits were tested on two modules after a Vibrations, sinusoidal as below

specified:

Puma Sine Test Synopsis

Test Results:

Reason For Shutdown: Normal Test Completion

Elasped Test Time: 0002:052:054

Elasped Sweeps: 20.00
Remaining Sweeps: 0.00

Points Per Sweep: 800

Test Range: 5.00(Hz) to 2000.00(Hz)

Control Parameters

Control Strategy: Average

Filter Type: Proportional

Filter Specification: 80.00%

Sweep Mode: LOG

Sweep Rate: 1.00 (Oct/Min)

Shaker Limits

Acceleration: 45.0000

Velocity: 59.0551

Displacement: 0.9843

Velocity: 12.0000

Symetric Limits: Yes

Resonance Search And Dwell Setup

Max Resonances: 10

Hysteresis: 3

Minimum Q Value: 1.00

Smoothing: Low

Channel Number: Control

Profile Settings

Status Frequency Type Acceleration Velocity Displacement

#00 On 5.0 Displacement 0.0755 0.023562 1.500000 3.0 3.0 6.0 6.0
#01 On 57.6 Displacement 10.0001 0.271203 1.500000 3.0 3.0 6.0 6.0
#02 On 2000.0 Acceleration 10.0000 0.007804 0.001242 3.0 3.0 6.0 6.0

Sample N. Visual Inspection

At 25 C (Before and after test)

Lo
Alarm

Electrical Test

Hi
Alarm

Lo
Abort

Hi
Abort

1 Passed Passed
2 Passed Passed

13/21

DESIGNING A LOW COST POWER BOARD F OR ST92141 MOTOR CONTROL MC U ...

Figure 9. Sinusoidal profile

14/21

DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...

ANNEX 2: Contro l Board parts list

Bill Of Materials October 17,2001 11:46:37P age1

Item Quantity Re ference Value Voltage % Footprint

1 6 C1 470nF 16V X7R 0805

C8 470nF 16V X7R 0805
C22 470nF 16V X7R 0805
C40 470nF 16V X7R 0805
C41 470nF 16V X7R 0805
C42 470nF 16V X7R 0805

2 5 C2 100nF Y5V 0603

C3 100nF Y5V 0603
C33 100nF Y5V 0603
C39 100nF Y5V 0603
C46 100nF Y5V 0603

3 6 C4 100pF 0603

C7 100pF 0603

C9 100pF 0603
C18 100pF 0603
C30 100pF 0603
C37 100pF 0603

4 3 C5 470nF 25V Y5V 0805

C19 470nF 25V Y5V 0805
C34 470nF 25V Y5V 0805

5 5 C6 1nF 0603

C20 1nF 0603
C35 1nF 0603
C36 1nF 0603
C45 1nF 0603

6 11 C10 10nF 63V 0603

C11 10nF 63V 0603
C12 10nF 63V 0603
C13 10nF 63V 0603
C23 10nF 63V 0603
C24 10nF 63V 0603
C25 10nF 63V 0603
C26 10nF 63V 0603
C27 10nF 63V 0603
C28 10nF 63V 0603
C29 10nF 63V 0603

7 1 C14 47pF 63V 0603
8 3 C15 470nF Y5V 0805

C21 470nF Y5V 0805
C32 470nF Y5V 0805

15/21

DESIGNING A LOW COST POWER BOARD F OR ST92141 MOTOR CONTROL MC U ...

Item Quantity Re fe rence Value Voltage % Footprint

9 3 C16 10nF 0603

C31 10nF 0603
C43 10nF 0603

10 1 C17 2.2nF 0603
11 1 C38 1uF X7R 0805
12 1 C44 1uF 16V Y5V 0805
13 10 D1 BAS16 SOT-23

D2 BAS16 SOT-23

D3 BAS16 SOT-23
D20 BAS16 SOT-23
D21 BAS16 SOT-23
D22 BAS16 SOT-23
D23 BAS16 SOT-23
D24 BAS16 SOT-23
D25 BAS16 SOT-23
D26 BAS16 SOT-23

14 3 IC1 L6386D SO-14

IC2 L6386D SO-14

IC4 L6386D SO-14
15 1 IC3 ST92T141K4M6 SO-34/P1.016
16 2 U1 LM358D SO-8

IC5 LM358D SO-8
17 6 Q1 BC807-25 SOT-23

Q2 BC807-25 SOT-23
Q3 BC807-25 SOT-23
Q4 BC807-25 SOT-23
Q5 BC807-25 SOT-23

Q6 BC807-25 SOT-23
20 1 Q7 BC817-25 SOT-23
21 4 R1 10K 0603

R2 10K 0603

R4 10K 0603

R17 10K 0603

22 12 R3 82R 0603

R15 82R 0603
R24 82R 0603
R36 82R 0603
R46 82R 0603
R81 82R 0603
R82 82R 0603
R83 82R 0603
R84 82R 0603
R85 82R 0603

16/21

DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...

Item Quantity Reference Value Voltage % Footprint

R86 82R 0603

23 7 R5 220R 0603

R8 220R 0603

R16 220R 0603
R25 220R 0603
R37 220R 0603
R45 220R 0603

R47 220R 0603
24 1 R6 100R 0603
25 1 R9 0R 0603
26 26 R10 100K 0603

R11 100K 0603

R12 100K 0603

R13 100K 0603

R14 100K 0603

R19 100K 0603

R20 100K 0603

R21 100K 0603

R22 100K 0603

R23 100K 0603

R28 100K 0603

R29 100K 0603

R30 100K 0603

R31 100K 0603

R32 100K 0603

R33 100K 0603

R35 100K 0603

R38 100K 0603

R39 100K 0603

R40 100K 0603

R41 100K 0603

R42 100K 0603

R43 100K 0603

R44 100K 0603

R50 100K 0603
27 2 R27 1K 0603

R18 1K 0603
28 1 R26 2.7K 0603
29 1 R48 820R 1% 0603
30 1 R49 1M 0603
31 1 R51 4.7K 1% 0603
32 1 R52 33.2K 1% 0603
33 1 R53 750R 1% 0603

17/21

DESIGNING A LOW COST POWER BOARD F OR ST92141 MOTOR CONTROL MC U ...

Item Quantity Reference Value Voltage % Footprint

34 1 R54 47K 0603
35 2 R56 1.5K 1% 0603

R55 1.5K 1% 0603
36 1 R63 390R 0603
37 1 R80 6.8K 1% 0603
38 6 TP1 TPshort PAD

TP2 TPshort PAD

TP3 TPshort PAD

TP4 TPshort PAD

TP5 TPshort PAD

TP6 TPshort PAD
39 2 TP8 TP0 PAD

TP7 TP0 PAD
40 1 U2 M95040 SO-8
41 1 XT1 CSTCC-MG 5MHz (XT_CSTCCMG)

18/21

DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...

4 MECHANICAL DATA: ST92141-PLATFOR M

Figure 10. Mechanical Data

19/21

DESIGNING A LOW COST POWER BOARD F OR ST92141 MOTOR CONTROL MC U ...

5 CONTROL BOARD LAYOUT (ORCAD FILES AVAILABLE)

Figure 11. Microcontroller side

C21

C32

XT1

R35

C31

R32

R42

R41

C27

TP8

R31

R30

R29

R28

R14

R40

R39

R38

R23

C26

C25

C24

C23

U1

C33

R45

D3

R50

R49

C38

C14

R82

ST92141-ENG3

C41

R83

R84

C42

R85

D24D23D22D21

Figure 12. High voltage interfacing side

TP5TP6

C15

R17

Q7

R12

R13

R6R4R2

C2

R1

D2

D1

R22

R21

C3

C13

C12

TP1TP2

TP3TP4

IC3

R34

R33

R11

R10

R44

R43

R20

R19

C10

C11

C29

C28

C44

R54

R56

C46

D26

ST92141-ENG3

TP7

C20

R18

R16

R9

C8

R8

R7

C9

Q3

R86

D25

C34

C36

C35

R48

R51

R46

R47

Q6

C22

IC4

C30

R37

R24

Q5

R36

C37

C43

R80

U2

C39

R63

C19

C17

R26

C16

R27

IC2 IC1

C18

R15

R25

Q4

1

C5

C6

C1

R5

R3

C7

Q2

C4

Q1

20/21

DESIGNING A LOW COST POWER BOARD FOR ST92141 MOTOR CONTROL MCU ...

“THE PRESENT NOTE WHICH IS FOR GUIDANCE ONLY AIMS AT PROVIDING CUSTOMERS WITH INFORMATION
REGARDING THE IR PRO DUCT S IN OR DER FO R THEM TO SAV E TIME . AS A RES ULT, STMIC ROEL ECTR ONI CS
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implic ation or otherwise under any patent or p atent rights of STMi croelectr oni cs. Spec i fications mentioned i n this publicatio n are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as cri tical comp onents in life support dev i ces or systems wi t hout the exp ress written approval of STM i croelectronics.

The ST logo is a registered trademark of STMicroelectronics

2002 STMicroelectronics - All Rights Reserved.

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Purchase of I

2

C Components by STMicroelectronics conveys a license under the Philips I2C Patent. Rights to use the se components in an

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C system i s granted pro vided that th e sy stem confo rm s to the I2C Standard Specification as defined by Philips.

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21/21