High-performance ultra low-power 3-axis accelerometer with digital
output for automotive applications
Datasheet — production data
Features
■ Wide supply voltage range: 2.4 V to 3.6 V
■ Low voltage compatible IOs: 1.8 V
■ Ultra low-power mode consumption: down to
10 µA
■ ±2g/±4g/±8g dynamically selectable full-scale
■ SPI / I
■ 16-bit data output
■ 2 independent programmable interrupt
■ System sleep/wakeup function
■ Extended temperature range: -40 °C to 105 °C
■ Embedded self-test
■ High shock survivability: up to 10000 g
■ ECOPACK
■ AEC-Q100 qualification
Applications
■ Telematics and black boxes
■ In-dash car navigation
■ Tilt / inclination measurement
■ Anti-theft devices
■ Intelligent power saving
■ Impact recognition and logging
■ Vibration monitoring and compensation
■ Motion-activated functions
Table 1.Device summary
2
C digital output interface
generators
®
RoHS and “Green” compliant
Description
The AIS328DQ is an ultra low-power high
performance 3-axis linear accelerometer with a
digital serial interface SPI standard output. An I
compatible interface is also available. The device
features ultra low-power operational modes that
allow advanced power saving and smart sleep-towakeup functions. The AIS328DQ has dynamic
user-selectable full-scales of ±2g/±4g/±8g and is
capable of measuring accelerations with output
data rates from 0.5 Hz to 1 kHz. The self-test
capability allows the user to check the functioning
of the sensor in the final application. The device
may be configured to generate an interrupt signal
through inertial wakeup events, or by the position
of the device itself. Thresholds and the timing of
interrupt generators are programmable by the end
user on-the-fly. Available in a small quad flat pack
no-lead package (QFPN) with a 4x4 mm footprint,
the AIS328DQ is able to respond to the trend
towards application miniaturization, and is
guaranteed to operate over a temperature range
from -40 °C to +105 °C.
2
C
Order codesTemperature range [°C]PackagePackaging
AIS328DQ-40 to +105QFPN 4x4x1.8 24LTray
AIS328DQTR-40 to +105QFPN 4x4x1.8 24LTape and reel
April 2012Doc ID 18160 Rev 31/43
This is information on a product in full production.
SPI serial data output (SDO)
I²C less significant bit of the device address (SA0)
Internal active pull-up
SPI serial data input (SDI)
3-wire interface serial data output (SDO)
I²C serial data (SDA)
Internal active pull-up
15
16
SDO
SA0
SDI
SDO
SDA
17-24NCNot internally connected
8/43Doc ID 18160 Rev 3
AIS328DQMechanical and electrical specifications
2 Mechanical and electrical specifications
2.1 Mechanical characteristics
@ Vdd=3.3 V, T=-40 °C to +105 °C unless otherwise noted
Table 3.Mechanical characteristics
SymbolParameterTest conditionsMin.Typ.
FS bit set to 00±2.0
FSMeasurement range
SoSensitivity
Off
Ty Of f
TCOff
Zero-g level offset
accuracy
Ty p i c a l z e ro - g level offset
accuracy
(3),(4),(5)
(5),(6)
Zero-g level change vs.
temperature
AnAcceleration noise densityFS bit set to 00100218600µg/
CrAxCross-axis
Vst
Self-test output
change
(7)
(8),(9),(10)
WhProduct weight60mgram
TopOperating temperature range-40+105°C
1. Typical values are not guaranteed.
2. Verified by wafer level test and measurement of initial offset and sensitivity.
3. Zero-g level offset value after MSL3 preconditioning.
4. Zero-g level offset at the FS bit set to 01 and 11 is guaranteed by design.
(2)
FS bit set to 11±8.0
FS bit set to 00
12-bit representation
FS bit set to 01
12-bit representation
FS bit set to 11
12-bit representation
X,Y axes-200200
Z-axis-300300
FS bit set to 00-30±2030mg
Excursion from 25 °C (X, Y
axes)
Excursion from 25 °C (Zaxis)
FS bit set to 00
X-axis
FS bit set to 00
Y- a x i s
FS bit set to 00
Z-axis
(a)
.
(1)
Max.Unit
gFS bit set to 01±4.0
0.900.981.06
1.811.952.12
mg/digit
3.623.914.25
mg
-2±0.22
mg/°C
-3±0.83
√Hz
-5+5%
-500-800-1100LSb
5008001100LSb
400600800LSb
a. The product is factory calibrated at 3.3 V. Operational power supply (Vdd) over 3.6 V is not recommended.
Doc ID 18160 Rev 39/43
Mechanical and electrical specificationsAIS328DQ
5. Offset can be eliminated by enabling the built-in high-pass filter.
6. Typical zero-g level offset as per factory calibration @ T = 25
7. Guaranteed by design.
8. The sign of “Self-test output change” is defined by a sign bit, for all axes. Values in Table 3 are defined with the STsign bit
in the CTRL_REG4 register equal to logic “0” (positive self-test), at T = 25 °C.
Self-test output changes with the power supply. “Self-test output change” is defined as
9.
OUTPUT[LSb]
scale.
10. Output data reaches 99% of final value after 3/ODR when enabling self-test mode, due to device filtering.
(CTRL_REG4 ST bit=1)
- OUTPUT[LSb]
(CTRL_REG4 ST bit=0)
°C.
. 1LSb=4g/4096 at 12-bit representation, ±2 g full-
2.2 Electrical characteristics
@ Vdd = 3.3 V, T = -40 °C to +105 °C unless otherwise noted
Table 4.Electrical characteristics
SymbolParameterTest conditionsMin.Typ
VddSupply voltage2.43.33.6V
Vdd_IOI/O pins supply voltage
Idd
Current consumption
in normal mode
(2)
1.8Vdd+0.1V
2.4 V to 3.6 V200450µA
(b)
.
(1)
.Max.Unit
IddLP
IddPdn
VIH
Current consumption
in low-power mode
Current consumption in
power-down mode
Digital high level input
voltage
ODR=1 Hz, BW=500
Hz, T=25 °C
81012µA
0.112µA
0.8*Vdd_IOV
VILDigital low level input voltage0.2*Vdd_IOV
VOHHigh level output voltage0.9*Vdd_IOV
VOLLow level output voltage0.1*Vdd_IOV
DR bit set to 0050
ODR
Output data rate
in normal mode
DR bit set to 01100
DR bit set to 10400
DR bit set to 111000
PM bit set to 0100.5
PM bit set to 0111
ODR
Output data rate
LP
in low-power mode
PM bit set to 1002
PM bit set to 1015
PM bit set to 11010
Hz
Hz
b. The product is factory calibrated at 3.3 V. Operational power supply (Vdd) over 3.6 V is not recommended.
10/43Doc ID 18160 Rev 3
AIS328DQMechanical and electrical specifications
Table 4.Electrical characteristics (continued)
SymbolParameterTest conditionsMin.Typ
BWSystem bandwidthODR/2Hz
(1)
.Max.Unit
TonTurn-on time
(3)
ODR = 100 Hz
0.9/ODR
+1 ms
1/ODR+1 ms
1.1/ODR
+1 ms
TopOperating temperature range-40+105
1. Typical values are not guaranteed.
2. It is possible to remove Vdd maintaining Vdd_IO without blocking the communication busses; in this condition the
measurement chain is powered off.
3. Time to obtain valid data after exiting power-down mode.
2.3 Communication interface characteristics
2.3.1 SPI - serial peripheral interface
Subject to general operating conditions for Vdd and Top.
Table 5.SPI slave timing values
(1)
Val ue
SymbolParameter
Min.Max.
tc(SPC)SPI clock cycle100ns
fc(SPC)SPI clock frequency10MHz
tsu(CS)CS setup time6
th(CS)CS hold time8
s
°C
Unit
tsu(SI)SDI input setup time5
th(SI)SDI input hold time15
tv(SO)SDO valid output time50
th(SO)SDO output hold time9
tdis(SO)SDO output disable time50
Doc ID 18160 Rev 311/43
ns
Mechanical and electrical specificationsAIS328DQ
SPC
CS
SDI
SDO
t
su(CS)
t
v(SO)
t
h(SO)
t
h(SI)
t
su(SI)
t
h(CS)
t
dis(SO)
t
c(SPC)
MSB IN
MSB OUT
LSB OUT
LSB IN
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(2)
Figure 3.SPI slave timing diagram
1. Values are guaranteed at 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not
tested in production.
2. Measurement points are made at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output ports.
3. When no communication is ongoing, data on CS, SPC, SDI and SDO are driven by internal pull-up resistors.
2.3.2 I²C - inter IC control interface
Subject to general operating conditions for Vdd and top.
Table 6.I²C slave timing values
SymbolParameter
f
(SCL)
t
w(SCLL)
t
w(SCLH)
t
su(SDA)
t
h(SDA)
t
h(ST)
t
su(SR)
t
su(SP)
t
w(SP:SR)
1. Data based on standard I²C protocol requirement, not tested in production.
SCL clock frequency01000400KHz
SCL clock low time4.71.3
SCL clock high time4.00.6
SDA setup time250100ns
SDA data hold time0.013.450.010.9µs
START condition hold time40.6
Repeated START condition
setup time
STOP condition setup time40.6
Bus free time between STOP
and START condition
I²C standard mode
Min.Max.Min.Max.
4.70.6
4.71.3
(1)
I²C fast mode
(1)
Unit
µs
µs
12/43Doc ID 18160 Rev 3
AIS328DQMechanical and electrical specifications
SDA
SCL
t
f(SDA)
t
su(SP)
t
w(SCLL)
t
su(SDA)
t
r(SDA)
t
su(SR)
t
h(ST)
t
w(SCLH)
t
h(SDA)
t
r(SCL)
t
f(SCL)
t
w(SP:SR)
START
REPEATED
START
STOP
STAR
T
Figure 4.I²C slave timing diagram
2.4 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 7.Absolute maximum ratings
(c)
SymbolRatingsMaximum valueUnit
VddSupply voltage-0.3 to 4V
Vdd_IOI/O pin supply voltage-0.3 to 4V
Input voltage on any control pin
(CS, SCL/SPC, SDA/SDI/SDO, SDO/SA0)
Acceleration (any axis, powered, Vdd = 2.5 V)
(1)
-0.3 to Vdd_IO +0.3V
3000 g for 0.5 ms
10000 g for 0.1 ms
Acceleration (any axis, unpowered)
(1)
3000 g for 0.5 ms
10000 g for 0.1 ms
Operating temperature range-40 to +105°C
OP
Storage temperature range-40 to +125°C
A
A
T
Vin
POW
UNP
T
STG
4 (HBM)kV
ESDElectrostatic discharge protection
1.5 (CDM)kV
200 (MM)V
c. Measurement points are made at 0.2·Vdd_IO and 0.8·Vdd_IO, for both ports.
Doc ID 18160 Rev 313/43
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