ST ACS108-6S User Manual

Overvoltage protected AC switch (ACS™)
Features
Needs no external protection snubber or
Enables equipment to meet IEC 61000-4-5
Reduces component count by up to 80%
Interfaces directly with the micro-controller
Common package tab connection supports
connection of several alternating current switches (ACS) on the same cooling pad
Integrated structure based on A.S.D.
technology
Overvoltage protection by crowbar technology
High noise immunity - static dV/dt > 500 V/µs
®
ACS108-6S
Datasheet production data
COM
OUT
G
SMBflat-3L
ACS108-6SUF
Applications
Alternating current on/off static switching in
appliances and industrial control systems
Drive of low power high inductive or resistive
loads like: – relay, valve, solenoid, – dispenser, door lock – pump, fan, low power motor
Description
The ACS108-6S belongs to the AC line switch family. This high performance switch can control a load of up to 0.8 A.
The ACS108-6S switch includes an overvoltage crowbar structure to absorb the overvoltage energy, and a gate level shifter driver to separate the digital controller from the main switch. It is triggered with a negative gate current flowing out of the gate pin.

Figure 1. Functional diagram

OUT
G
COM Common drive reference to connect
OUT Output to connect to the load. G Gate input to connect to the controller

Table 1. Device summary

to the mains
through gate resistor
Symbol Value Unit
I
T(RMS)
V
DRM/VRRM
I
GT
COM
0.8 A
600 V
10 mA
®: A.S.D. is a registered trademark of STMicroelectonics
TM: ACS is a trademark of STMicroelectronics
June 2012 Doc ID 11962 Rev 4 1/12
This is information on a product in full production.
www.st.com
12
Characteristics ACS108-6S

1 Characteristics

Table 2. Absolute maximum ratings (T
Symbol Parameter Value Unit
I
T(RMS)
I
dI/dt
V
V
P
T
1. according to test described by IEC 61000-4-5 standard and Figure 19
Table 3. Electrical characteristics (Tj = 25 °C, unless otherwise specified)
On-state rms current (full sine wave)
Non repetitive surge peak on-state current
TSM
(full cycle sine wave, T
2
t I²t Value for fusing tp = 10 ms 0.38 A2s
I
initial = 25 °C)
j
Critical rate of rise of on-state current
= 2xIGT, tr 100 ns
I
G
Non repetitive line peak mains voltage
PP
I
Peak gate current tp = 20 µs Tj = 125 °C 1 A
GM
Peak positive gate voltage Tj = 125 °C 10 V
GM
Average gate power dissipation Tj = 125 °C 0.1 W
G(AV)
Storage junction temperature range
stg
T
Operating junction temperature range
j
= 25 °C, unless otherwise specified)
amb
T
= 62 °C 0.45 A
amb
T
= 113 °C 0.8 A
tab
F = 60 Hz t = 16.7 ms 7.6
F = 50 Hz t = 20 ms 7.3
F = 120 Hz T
(1)
= 125 °C 100 A/µs
j
Tj = 25 °C 2 kV
-40 to +150
-30 to +125
A
°C
Symbol Test conditions Quadrant Value Unit
(1)
I
GT
V
V
IH
I
dV/dt
(dI/dt)c
V
1. Minimum IGT is guaranteed at 10% of IGT max
2. For both polarities of OUT referenced to COM
V
= 12 V, RL = 33 Ω
GT
GD
(2)
L
)
CLICL
OUT
V
(2)
(2)
(2
= V
OUT
I
= 100 mA Max. 25
OUT
IG = 1.2 x I
V
= 67% V
OUT
, RL =3.3 kΩ, Tj = 125 °C II - III Min. 0.15
DRM
GT
gate open, Tj = 125 °C Min. 500
DRM,
Without snubber (15 V/µs), turn-off time 20 ms, Tj = 125 °C Min. 0.3
= 0.1 mA, tp = 1 ms, Tj = 125 °C Min. 650
II - III Max. 10
II - III Max. 1
Max. 30
mA V V mA mA V/µs A/ms
V
2/12 Doc ID 11962 Rev 4
ACS108-6S Characteristics

Table 4. Static electrical characteristics

Symbol Test conditions Value Unit
(1)
V
I
TM
(1)
V
TO
(1)
R
D
I
DRM
I
RRM
1. For both polarities of OUT referenced to COM

Table 5. Thermal resistance

Symbol Parameter Value Unit
= 1.1 A, tp = 500 µs Tj = 25 °C Max. 1.3 V
TM
Threshold voltage Tj = 125 °C Max. 0.90 V
Tj = 125 °C Max. 300 mΩ
V
OUT
= 600 V
Tj = 25 °C
Max.
= 125 °C 0.2 mA
T
j
A
R
R
th (j-t)
th (j-a)
Junction to tab (AC) Max. 14 °C/W
Junction to ambient S = 5 cm² Max. 75
Doc ID 11962 Rev 4 3/12
Characteristics ACS108-6S
Figure 2. Maximum power dissipation
versus on-state rms current
Figure 3. On-state rms current versus tab
temperature (full cycle)
(full cycle)
P(W)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
180°
I (A)
T(RMS)
Figure 4. On-state rms current versus
ambient temperature (free air convection)
I (A)
T(RMS)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0 0 25 50 75 100 125
T (°C)
a
I (A)
T(RMS)
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00 0 25 50 75 100 125
T (°C)
C
Figure 5. Relative variation of thermal
impedance junction to ambient versus pulse duration
K = [Z /R ]
1.E+00
1.E-01
1.E-02
th(j-a) th(j-a)
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
t (s)
p
Figure 6. Relative variation of, holding and
Figure 7. Releative variation of IGT and VGT latching current versus junction temperature
I , V [T ] / I , V [T = 25 °C]
GT GT j GT GT j
I , [T] / I , I [T = 25 °C]
I
HjHLj
L
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
I
H
I
L
T (°C)
j
4/12 Doc ID 11962 Rev 4
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
versus junction temperature
I
GT
V
GT
T (°C)
j
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