Features
■ 5 V tolerant inputs
■ High speed: t
■ Low power dissipation:
–I
■ Power down protection on inputs and outputs
■ Operating voltage range:
–V
■ Latch-up performance exceeds 300 mA
=1μA (max.) at TA=25°C
CC
(opr) = 1.65 to 5.5 V
CC
(JESD 17)
■ ESD performance
– 2000-V human body model
(JESD 22 A114-A)
– 200-V machine model
(JESD 22 A115-A)
– 1000-V charge device model
(JESD 22 C101)
= 4.2 ns (max.) at VCC= 3.3 V
PD
74LX1G07
Single buffer/driver with open drain
SOT23-5L
Flip-chip 4
Description
SOT323-5L
Applications
■ Mobile phones
Table 1. Device summary
Order code Package Packaging
74LX1G07STR SOT23-5L Tape and reel
74LX1G07CTR SOT323-5L Tape and reel
74LX1G07BJR Flip-chip 4 Tape and reel
The 74LX1G07 is a low voltage CMOS single
buffer/driver (open drain) fabricated with submicron silicon gate and double-layer metal wiring
2
C
MOS technology.
The internal circuit composed of 2 stages
including buffer output, provides high noise
immunity and stable output.
Power down protection is provided on input and 0
to 7 V can be accepted on input with no regards
to the supply voltage. This device can be used to
interface 5to3V.
April 2008 Rev 9 1/20
www.st.com
20
Contents 74LX1G07
Contents
1 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2/20
74LX1G07 Pin connection
1 Pin connection
Figure 1. Pin connection and IEC symbols
V
CC
5
1
NC 1A
SOT package
Top view
1Y
4
2
3
GND
Table 2. Pin assignments
Pin number
Flip-chip 4 SOT
− 1 NC No connection
1 2 1A Data input
3 4 1Y Data output
2 3 GND Ground (0V)
GND
1A
3
2
1
Flip-chip 4
Bottom view
Symbol Name and function
1Y
4
V
CC
1A
GND
1
2
Flip-chip 4
Top view
4
V
CC
3
1Y
CS00012
45V
Table 3. Truth table
AY
LL
HZ
Z: High impedance
CC
3/20
Positive supply voltage
Pin connection 74LX1G07
Figure 2. Input and output equivalent circuit
V
CC
Overvoltage
control
Input
Output
ESD
protection
GND GND GND
ESD
protection
GND
GND
CS08973
4/20
74LX1G07 Maximum rating
2 Maximum rating
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 4. Absolute maximum ratings
Symbol Parameter Value Unit
V
V
V
V
I
I
OK
I
I
CC
I
GND
T
T
Supply voltage -0.5 to +7.0 V
CC
DC input voltage -0.5 to +7.0 V
I
DC output voltage (VCC= 0 V) -0.5 to +7.0 V
O
DC output voltage (high or low state) -0.5 to VCC + 0.5 V
O
DC input diode current - 50 mA
IK
DC output diode current - 50 mA
DC output current ± 50 mA
O
DC supply current per supply pin ± 100 mA
DC ground current per supply pin ± 100 mA
Storage temperature -65 to +150 °C
stg
Lead temperature (10 sec) 300 °C
L
5/20
Maximum rating 74LX1G07
2.1 Recommended operating conditions
Table 5. Recommended operating conditions
Symbol Parameter Value Unit
V
V
V
I
I
I
I
I
T
Supply voltage 1.65 to 5.5 V
CC
V
Input voltage 0 to 5.5 V
I
Output voltage (VCC= 0 V) 0 to 5.5 V
O
Output voltage (high or low state) 0 to V
O
High or low level output current (VCC= 4.5 to 5.5 V) + 32 mA
OL
High or low level output current (VCC= 3.0 to 3.6 V) +24 mA
OL
High or low level output current (VCC= 2.7 to 3.0 V) +12mA
OL
High or low level output current (VCC= 2.3 to 2.7 V) +8mA
OL
High or low level output current (VCC= 1.65 to 2.3 V) +4mA
OL
Operating temperature -40 to 85 °C
op
CC
V
dt/dv Input rise and fall time 0 to 10 ns/V
6/20
74LX1G07 Electrical characteristics
3 Electrical characteristics
Table 6. DC specifications
Test condition Value
Symbol Parameter
V
V
V
High level input
IH
voltage
Low level input
IL
voltage
Low level output
OL
voltage
High impedance
I
OZ
output leakage
current
Input leakage
I
I
current
I
I
CC
Power off leakage
off
current
Quiescent supply
current
V
CC
(V)
1.65 − 1.95 0.65 V
3.0 − 5.5 0.7 V
1.65 − 1.95 0.35 V
3.0 −5.5 0.3 V
− 4.5 I
1.65
1.65 I
2.3 I
3.0
4.5 I
= 100 μA0.1
O
= 4 mA 0.45
O
=8mA 0.3
O
I
=16mA 0.4
O
=24mA 0.55
I
O
=32mA 0.55
O
-40 to 85 °C
Min Max
CC
CC
CC
CC
CC
CC
3.6 VI= 5.5 V ±10 μA
− 5.5 V
1.65
0V
1.65
− 5.5 V
3.6
=0−5.5 V ±5 μA
I
or VO=5.5V 10 μA
I
or GND 10
I=VCC
or VO= 3.6 to
V
I
5.5 V
±10
Unit
V2.3 −2.7 0.7 V
V2.3 −2.7 0.3 V
V
μA
7/20
Electrical characteristics 74LX1G07
Table 7. AC electrical characteristics
Test conditions Value
Symbol Parameter
V
CC
(V)
1.65
− 1.95 30 1000 2.0 1.8 8.3
2.3
− 2.7 30 500 2.0 1.2 5.5
t
PLZ
Propagation delay
time
2.7 50 500 2.5 1 5
3.0 − 3.6 50 500 2.5 0.8 4.2
− 5.5 50 500 2.5 0.5 3.5
4.5
− 1.95 30 1000 2.0 1.8 8.3
1.65
2.3
− 2.7 30 500 2.0 1.2 5.5
t
PZL
Propagation delay
time
2.7 50 500 2.5 1 5
3.0 − 3.6 50 500 2.5 0.8 4.2
−5.5 50 500 2.5 0.5 3.5
4.5
Table 8. Capacitive characteristics
Symbol Parameter
V
C
L
(pF)
R
(Ω)
t
= t
1
s
(ns)
-40 to 85 °C
r
Min Max
Test conditions Value
CC
(V)
T
Min Typ Max
=25 °C
A
Unit
ns
ns
Unit
C
C
C
Input capacitance 3.3 VIN=0 or V
IN
Output capacitance 3.3 VIN=0 or V
OUT
1.8
Power dissipation
PD
capacitance
(1)
=10MHz
f
IN
CC
CC
2.5 pF
4pF
8
3.3 8
1. CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the
operating current consumption without load. (Refer to test circuit). Average operating current can be
obtained by the following equation: I
CC(opr)=CPDxVCCxfIN+ICC
pF2.5 8
8/20
74LX1G07 Electrical characteristics
Figure 3. Test circuit
V
V
CC
CC
R
1
Pulse generator
D.U. T
R
T
C
L
Table 9. Test circuit and waveform symbol value
V
CC
Symbol
1.65 − 1.95 V 2.3 −2.7 V 2.7 − 5.5 V
C
L
30 pF 30 pF/ 50 pF 50 pF
R1 1000 Ω 500 Ω 500 Ω
V
V
t
r =tf
IH
M
V
CC
V
CC
VCC/2 VCC/2 VCC/2
<2.0ns <2.0ns <2.5ns
Figure 4. Waveform: propagation delay (f = 1 MHz; 50% duty cycle)
V
CS07201
CC
9/20
Package mechanical data 74LX1G07
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 5. SOT23-5L package outline
.
Table 10. SOT23-5L mechanical data
millimeters mils
Symbol
Typ Min Max Typ Min Max
A 0.90 1.45 35.4 57.1
A1 0.00 0.10 0.0 3.9
A2 0.90 1.30 35.4 51.2
b 0.35 0.50 13.7 19.7
C 0.09 0.20 3.5 7.8
D 2.80 3.00 110.2 118.1
E 1.50 1.75 59.0 68.8
e 0.95 37.4
H 2.60 3.00 102.3 118.1
L 0.10 0.60 3.9 23.6
10/20
7049676C
74LX1G07 Package mechanical data
Figure 6. SOT323-5L package outline
Table 11. SOT323-5L mechanical data
millimeters mils
Symbol
Typ Min Max Typ Min Max
A 0.80 1.10 31.5 43.3
A1 0.00 0.10 0.0 3.9
A2 0.80 1.00 31.5 39.4
b 0.15 0.30 5.9 11.8
C 0.10 0.18 3.9 7.1
D 1.80 2.20 70.9 86.6
E 1.80 2.20 70.9 94.5
E1 1.15 1.35 45.3 53.1
e 0.65 25.6
e1 1.3 51.2
L 0.10 0.30 3.9 11.8
11/20
Package mechanical data 74LX1G07
Figure 7. Flip-chip 4 package outline
12/20
74LX1G07 Package mechanical data
Table 12. Flip-chip 4 mechanical data
millimeters
Symbol
Min Typ Max
A 0.535 0.58 0.625
A1 0.18 0.205 0.23
A2 0.355 0.375 0.395
b 0.215 0.255 0.295
D 0.84 0.87 0.9
D1 0.5
E 0.84 0.87 0.9
E1 0.5
SD 0.25
SE 0.25
f 0.175 0.185 0.195
ccc 0.080
13/20
Package mechanical data 74LX1G07
Figure 8. Flip-chip 4 recommended footprint
14/20
74LX1G07 Package mechanical data
Figure 9. SOT23-xL tape and reel
Table 13. SOT23-xL tape and reel mechanical data
millimeters inches
Symbol
Typ Min Max Typ Min Max
A 180 7.086
C 12.8 13.0 13.2 0.504 0.512 0.519
D 20.2 0.795
N 60 2.362
T 14.4 0.567
Ao 3.13 3.23 3.33 0.123 0.127 0.131
Bo 3.07 3.17 3.27 0.120 0.124 0.128
Ko 1.27 1.37 1.47 0.050 0.054 0.058
Po 3.9 4.0 4.1 0.153 0.157 0.161
P 3.9 4.0 4.1 0.153 0.157 0.161
15/20
Package mechanical data 74LX1G07
Figure 10. SOT323-xL tape and reel
1. Drawing not to scale.
Table 14. SOT323-xL tape and reel mechanical data
millimeters inches
Symbol
Typ Min Max Typ Min Max
A 175 180 185 6.889 7.086 7.283
C 12.8 13 13.2 0.504 0.512 0.519
D 20.2 0.795
N 59.5 60 60.5 2.362
T 14.4 0.567
Ao 2.25 0.088
Bo 2.7 0.106
Ko 1.2 0.047
Po 3.9 4 4.1 0.153 0.157 0.161
P 3.8 4 4.2 0.149 0.157 0.165
16/20
74LX1G07 Package mechanical data
Figure 11. Flip-chip 4 reel information - back side
Figure 12. Flip-chip 4 reel information - front side
17/20
Package mechanical data 74LX1G07
Figure 13. Flip-chip 4 carrier tape information
Figure 14. Flip-chip 4 tape orientation
- Top view of package
- Balls underneath
- Pin A1 marked from target spec
Tape and reel
A1
direction of flow
18/20
74LX1G07 Revision history
5 Revision history
Table 15. Document revision history
Date Revision Changes
04-Sept-2004 4 Document change.
03-May-2006 5 Data reel updating.
17-Jan-2008 6
29-Jan-2008 7
21-Feb-2008 8
23-Apr-2008 9 Modified: Table 12 on page 13 and Figure 13 on page 18.
Document restructured and converted to new ST template.
Added 74LX1G07BJR and related package information.
Flip-Chip 4 replaced with Flip-chip 4 and updated Ta bl e 1 2 o n
page 13.
Replaced Flip-Chip 4 package name with Flip-chip 4, latch-up and
ESD performance among the specifications in the cover page and
updated Table 6 on page 7, Table 8 on page 8, and Table 12 on
page 13, replaced Figure 13 on page 18 and Figure 14 on page 18
19/20
74LX1G07
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